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(UL ANSI: FR-4.0) Conventional FR-4: Features Applications

This document provides information about conventional FR-4 laminate and bonding prepreg for S1130 laminate. It lists the features, applications, general properties, and purchasing information for the materials.

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NOUREDDINE ELHAMRI
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61 views2 pages

(UL ANSI: FR-4.0) Conventional FR-4: Features Applications

This document provides information about conventional FR-4 laminate and bonding prepreg for S1130 laminate. It lists the features, applications, general properties, and purchasing information for the materials.

Uploaded by

NOUREDDINE ELHAMRI
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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S1130

(UL ANSI: FR-4.0) Conventional FR-4

FEATURES APPLICATIONS
● Natural color Communication equipment,
● DICY cured laminate Computer, VCR, TV,
● Non-UV Blocking/AOI properties Instrumentation, Game machine.
● Excellent mechanical process ability Not suitable for Anti-CAF application
Not suitable for ＞2oz copper, HDI,
and ≥12L application

GENERAL PROPERTIES

Test Items Test Method Test Condition Unit Typical Value

Tg IPC-TM-650 2.4.25D DSC ℃ 135


Td IPC-TM-650 2.4.24.6 TGA (5% W.L) ℃ 310
T288 IPC-TM-650 2.4.24.1 TMA min 1
T260 IPC-TM-650 2.4.24.1 TMA min 13
Thermal Stress IPC-TM-650 2.4.13.1 288℃, solder dip s >60
IPC-TM-650 2.4.24 Before Tg ppm/℃ 65
CTE (Z-axis) IPC-TM-650 2.4.24 After Tg ppm/℃ 310
IPC-TM-650 2.4.24 50-260℃ % 4.5
Permittivity (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 4.4
Loss Tangent (1GHz) IPC-TM-650 2.5.5.9 C-24/23/50 - 0.013
Volume Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ-cm 4.8×108
Surface Resistivity IPC-TM-650 2.5.17.1 C-96/35/90 MΩ 5.2×107
Arc Resistance IPC-TM-650 2.5.1 D-48/50+D-0.5/23 s 120
Dielectric Breakdown IPC-TM-650 2.5.6 D-48/50+D-0.5/23 kV >60
Peel Strength (1oz) IPC-TM-650 2.4.8 288℃/10s N/mm [lb/in] 1.8 [10.28]
Flexural Strength (LW/CW) IPC-TM-650 2.4.4 A Mpa 600/500
Water Absorption IPC-TM-650 2.6.2.1 D-24/23 % 0.15
Flammability UL94 C-48/23/50 Rating V-0
CTI IEC 60112 A Rating PLC 3

Remarks: 1. Specification sheet: IPC-4101/21, is for your reference only.


2. All the typical value is based on the 1.6mm (8*7628) specimen.
3. All the typical value listed above is for your reference only, please turn to Shengyi Technology Co., Ltd for detailed
information, and all rights from this data sheet are reserved by Shengyi Technology Co., Ltd.

CN-TDS-1810-02-S1130-S0101
S0101 PREPREG
(UL ANSI: FR-4.0) Bonding Prepreg For S1130
PREPREG PARAMETERS

Resin content Cured thickness Standard size


Glass fabric type
(%) (mm) (Roll type)
71 0.050
106/1037 74 0.057 1.260m×150m
76 0.062
64 0.078
1080/1078
68 0.090 1.260m×300m
2313/3313 55 0.100
50 0.114
52 0.120
2116 1.260m×250m
55 0.129
58 0.140
43 0.195
45 0.205
7628 1.260m×150m
48 0.220
50 0.230
Other type, resin content and size could be available upon request.

HOT PRESSING CYCLE

 The heat-up rate depends on the inner copper or the structure of multilayer PCB.
 Curing time: >30min (170~180℃).
 If you need any more detail information, please turn to Shengyi Technology Co., Ltd.

STORAGE CONDITION
 3 months when stored at < 23℃ and <50% RH.
 6 months when stored at <5℃. Normalize in room temperature for at least 4h before using.
 Beware of moisture, always keep wrapped in damp-proof material. Keeping in normal condition, prepreg
might absorb moisture and its bonding strength would be weakened.
 Avoid UV-rays and strong light.

PURCHASING INFORMATION
Thickness Copper foil Standard size
1,020mm ×1,220mm(40”×48”) 915mm ×1,220mm(36”×48”)
0.05mm to 3.2mm 12um to 70 um
1,070mm ×1,220mm(42”×48”)
Remarks: Other sheet size and thickness could be available upon request.

CN-TDS-1810-02-S1130-S0101

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