PN7160 Antenna Design and Matching Guide
PN7160 Antenna Design and Matching Guide
Document information
Information Content
Keywords NFC, PN7160, antenna design, antenna matching/tuning
Abstract This application note is intended to provide some guidelines regarding
the way to design an NFC antenna for the PN7160 chip. It also provides
guidelines on how to properly match this antenna to PN7160. Standalone
antenna performances evaluation and final RF system validation (PN7160 +
tuning/matching network + NFC antenna within its final environment) are also
covered by this document.
NXP Semiconductors
AN13219
PN7160 antenna design and matching guide
Revision history
Rev Date Description
1.4 20221109 Symmetrical tuning, card mode, RF Field detector updated
1.3 20220427 Editorial updates
1.2 20210913 Security status changed into "Company public", no content change
1.1 20210820 Security status changed into "Company restricted"
1.0 20210412 Initial version
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
1 Introduction
PN7160 is a highly integrated NFC transceiver IC for contactless communication at
13.56 MHz. This transceiver IC utilizes an outstanding modulation and demodulation
concept completely integrated for different kinds of contactless communication methods
and protocols at 13.56 MHz.
It is able to operate both in reader mode (RM) and in card mode (CM).
PN7160 is intended to be connected to an external coil antenna through a specific
matching/tuning network.
The purpose of this document is first to provide some guidelines regarding the design
of an NFC antenna intended to be connected to PN7160 (recommended antenna
characteristics).
It then depicts a measurement method to evaluate the performances of the antenna
before it is connected to NXP NFC chips.
The next chapter explains how to determine the tuning/matching network to be placed
between a given antenna and PN7160 (based on the antenna electrical equivalent
circuit).
In this document, the main focus is on the asymmetrical antenna tuning. This tuning
requires the DPC (Dynamic Power Control) to be disabled.
For the DPC enabled, the symmetrical antenna tuning should be used, refer to the
dedicated application note [1].
The procedure for the asymmetrical antenna tuning described in this document is valid
for the symmetrical antenna tuning as well. It differs only in cut-off frequency value of
the EMC filter.
RF performance validation procedure is finally proposed.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Heading
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
2.1.1 40 mm x 40 mm
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
(*) It is important that antenna characteristics (inductance and parasitic) are kept within
a certain tolerance in production as they impact the system characteristics (i.e. esp.
impedance matching) and thus performances.
Please note that those characteristics can still be changed.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Figure 4. Inductance examples versus square coil size, N-number of turns, a-coil side
The antenna resistance is a parasitic parameter which mostly depends on the track
length, track width and copper thickness. Ideally, this parameter should be as small as
possible. It minimizes heat losses in the antenna. The antenna resistance is directly
related to the antenna quality factor described below.
The expected antenna resistance is obtained as the output from the NFC Antenna
Design Hub calculator.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The quality factor declares the number of losses inside the inductor. For the NFC reader
antennas, this parameter is not so strict. In practice, the Q-factor of the antenna itself
should be higher than 20. The antenna quality factor is typically adapted (reduced) during
the impedance matching process to have a proper bandwidth.
The Q factor can be calculated over the following equation:
Where:
La - NFC Antenna Inductance
Ra - NFC Antenna Resistance
ω - Angular frequency (2*π*f) where f is typically 13.56 MHz
The self-resonance frequency should be higher than 25 MHz. It ensures that the antenna
can be comfortably tuned.
The expected antenna self-resonance frequency is obtained as the output from the NFC
Antenna Design Hub calculator.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The second picture shows the field distribution of the same antenna but with a metal
plane near to it. The magnitude of the field strength has significantly decreased
compared to the open-air case which leads to a decreased operating distance.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Field strength
color map
5 cm
6 4 2 0
|H| [A/m]
The last figure shows the effect of adding a ferrite plane (µR=40) between the metal plane
and the antenna coil itself. The field distribution is still modified but the operating distance
recovers its original open-air level.
Field strength
color map
7.5 cm
6 4 2 0
Figure 7. Field distribution of a circular antenna with a metal plane and a ferrite sheet
The simulation shows that the use of a ferrite reduces the generated eddy currents in a
metal plane. The ferrite sheet changes the antenna environment characteristics, which
result in a fixed detuning of the antenna itself.
This shielding will significantly impact the antenna electrical equivalent model so it is
key that when doing PN7160 tuning/matching network calculation, the antenna model is
measured with the ferrite already in place (when applicable).
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The Ferrite quality is also a key parameter which must be considered to assess the
effectiveness of the shielding.
A high relative permeability is recommended because it allows to achieve a good
shielding with a lower thickness.
The material must be specified for a high magnetic permeability in the frequency range
that is involved in NFC operation, that is, 13.56 MHz.
The relative magnetic permeability of a material is made of two parts: µr’ is the real part
of relative permeability and µr’’ is the imaginary part. µr’’ is reflecting the magnetic losses
in the material.
Recommended values are:
µr’ between 40 and 150 at 13.56 MHz and µr’’ as low as possible: < 3 at 13.56 MHz.
Please note that the level of shielding not only depends on the material used but also on
the thickness of the ferrite sheet. For a given permeability, the thickest sheet provides the
strongest shielding.
Note: Consider that the added ferrite sheet can increase the antenna inductance
and resistance significantly and must be considered for the matching! See the
example below.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The target of this modeling step is to get the L, R, C equivalent of the antenna.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Ra
Ca Antenna
La
The antenna must be connected to the VNA by using an appropriate test fixture that does
not influence any antenna parameters.
The analyzer must be calibrated (open, short and load compensation at the calibration
plane) and the test fixture (for example, additional wire length) must be compensated
(open, short compensation at the connection points) before each measurement.
A high-end 50 Ω calibration kit for the used connector types (N-connector or SMA) does
not help much, since the measurement itself must be done at the antenna terminals.
Therefore, the calibration must be done as close at these points as possible. So, the
better solution is to create a simple connection, that is, using a standard 2.54 mm pin
row connector (male and female) to connect the VNA. This can be used to measure the
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
antenna impedance at the correct points, but also to calibrate the VNA. A very simple but
highly efficient homemade connector and tool are shown in Figure 14.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
4.4 Step 3: Matching calculation and its implementation for reader mode
(RM)
In this chapter, we show the different blocks in order to do the antenna matching for
reader mode.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Asymmetrical tuning
• More robust against detuning and loading → tuning increases under detuning and
loading conditions
• Cut off frequency ≈ 20 MHz - 22 MHz
• No need to use DPC function
• Potentially lower operating distance
• Typically lower output power (Due to the higher target impedance, typically 20 Ω)
Symmetrical tuning
• More detuning and loading sensitive → tuning decreases under detuning and loading
conditions
• Cut off frequency ≈ 14.4 MHz -14.7 MHz
• DPC function is required
• Increases the operating distance
• Allows to use smaller antennas
• Typically higher output power (Due to the lower target impedance, typically 16 -17 Ω)
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
• Get approx. the same antenna inductance and resistance (Lant) by changing the
Length (amax), Width (bmax) and Track Thickness as measured in Section 4.3.2.1.
The recommended value for most application using asymmetrical tuning function is 20 Ω. for
VTVDD= 5 V respectively 13 Ω for VTVDD=3.3 V
The graph below shows the TX driver current ITVDD versus the target impedance.
• The green area shows the "optimal" operation of the NFC Transmitter.
– For symmetrical tuning, it is recommended to choose the target impedance
corresponding to the TX Driver current 210 mA - 230 mA
– For asymmetrical tuning, the target current of the TX driver is typically 160 mA - 180
mA
The antenna shall be tuned to never exceed the 250 mA maximum current.
In case one wants to use symmetrical tuning function + Dynamic Power Control (DPC). The
target impedance 16 Ω for VTVDD= 5 V respectively 11 Ω for VTVDD=3.3 V may be considered as a
target.
The available TVDD voltage settings for TX drivers are the followings:
To use the chip at its best, the typical matching impedances of the antenna versus TVDD
are given in the table below.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
4.4.6 Input parameter: EMC Filter cut-off frequency (fEMC cut off) and L0
The EMC filter contains an inductor (L0) and a capacitor (C0). The cut-off frequency
defines the overall detuning behavior as well as the transfer function of the antenna
circuit. The inductor L0 must be capable to drive the full power into the antenna without
going into saturation. The Q-factor of this inductor should be as high as possible.
L0 and C0 value definition:
L0 = 160 nH – 560 nH
Filter resonance frequency fr0 = 14.4 MHz ...22 MHz, => C0
The EMC filter resonance frequency fr0 must be higher than the upper sideband
frequency determined by the highest data rate (848 kHz sub carrier) in the system (i.e.
14.4 MHz)
The recommended values are 22 MHz for fEMC cut off and 160 nH for L0. This
ensures an asymmetrical transfer function (asymmetrical matching).
For the symmetrical transfer function (symmetrical matching which required DPC function
(see [1]), 14.6 MHz for fEMC cut off and 160 nH for L0 can be chosen as a starting
values.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
For the first matching iteration, the nearest components values within an E-series are
recommanded to use.
In this case:
• L0 = 160 nH
• C0 = 330 pF
• C1 = 68 pF
• C2 = 100 pF
• Rs = 2.7 Ω
The matching components have to meet the following requirements:
conditions, e.g, measurement in card mode by using the ISO10373-6 [1] assembly PCD
test bench to generate a field strength of 12 A/m.
The reason for the higher cut-off frequency of the EMC filter is a higher stability with close
coupling devices in reader mode: less impact of detuning effect on power consumption
increase.
Figure 24.
Note: The capacitance Ca can be chosen as 0.1 pF, which gives good starting value as
such.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The matching already looks promissing but a fine-tuning is required. The target is approx.
20 Ω. The fine-tuning shall be done using the tips described in the Section 5.1.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
In this specific case, the Cs has been increased by 8.2 pF (Overall 62 pF + 8.2 pF). This
helped to achieve the target impedance of 20 Ω (see Figure 27).
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
5 Matching/Tuning guide
The antenna has first to be matched to PN7160 as described in the previous chapter.
The rough matching values are provided by the NFC Matching Tool. Then the final
matching is typically required.
The steps described below shall be followed to fine-tune the antenna.
During the antenna matching process, PN7160 IC is not powered.
The value of C1 changes the magnitude of the matching impedance. After changing C1,
the imaginary part of Zmatch must be compensated by adjusting C2 as well.
C2 changes mainly the imaginary part of Zmatch.
C0 value shifts the EMC filter resonance frequency.
Here are some typical behaviors that can be observed on the network analyzer while
playing on C1, C2, and C0:
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Figure 29. Impact of C1
Figure 30. Impact of C2
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Figure 31. Impact of C0
Adding the tolerances of the antenna itself, the NFC performances can be significantly
impacted.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The following figure shows the antenna matching after the fine-tuning. The C1 and C2
have been adapted to achieve the 20 Ω target.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Both tools show more or less the same results. The advantage of the ADS tool is that it
can be used also for advanced transient signal analysis.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The oscilloscope snapshot gives the typical 13.56 MHz sine wave expected on the RX
pin (on a 0.9 V DC bias, called Vmid).
The orange curve shows the RX peak voltage (probed on the RX pin with a low
capacitance oscilloscope probe) when the device is placed on an ISO bench generating
the expected H field. We can see that above 1 A/m the RX voltage is regulated to
approximately 1.55 V (target is 1.6 Vpk). Below 1 A/m the signal received at the antenna
is not enough to be regulated up to this optimal value.
The gray curve gives the RX Vpeak value when the AGC is not regulating but fixed to
its minimum attenuation (code=0x000). It is not recommended to have a signal above
2Vpeak.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The blue curve gives the RX Vpeak value when the AGC is not regulating but fixed to its
maximum attenuation (code=0x3FF). Here the signal is too much attenuated and stays in
a 1 Vpk range.
Typically, the serial value resistor Rrx is in the range of 1…10kΩ. The value 2.2 kΩ can
be chosen, it gives good starting value as such.
The purpose of Crx capacitors is to provide an AC coupling of the RX signal. A value of 1
nF can generally be used.
6.2 RX connection
As shown at the beginning of this chapter, two configurations are possible for the RX path
components.
1. The first one consists of connecting an R, C serial network between the RX pins and
the EMC filters termination point. We generally say that RX tap point is at EMC filter.
2. The second connection path is a direct connection of the RX circuit at the antenna
pads, we generally say that RX tap point is at the antenna. In this case, the Crx AC
coupling capacitor can be removed but we advise keeping it connected to avoid
decreasing too much the Q factor of the antenna
The purpose of Crx capacitors is to provide an AC coupling of the RX signal. A value of 1
nF can generally be used.
Rrx resistor provides a voltage attenuator bridge (made of external Rrx series + internal
Ragc shunt) to adjust the RX voltage swing (or peal voltage).
• The first step of the RX path-tuning process is to define which RX path connection is
the best.
Direct RX connection at the antenna allows to reach a better sensitivity in card mode
but it tends to reduce the quality factor of the antenna which affects the reader mode
performances (due to larger transmission losses) and the transmission strength in card
mode. This is particularly the case when the value of the RX resistor is low.
To determine where to connect the RX path, the RX circuitry must be disconnected
and the voltage amplitude must be measured at the two possible connection points in
reader mode and under an external RF field of 1.5 A/m in card mode:
1. If the voltage at the EMC filter in card mode is large enough (@1.5 A/m ~ 1 V or
more), use the EMC filter as starting point for the RX path tuning.
2. If the voltage is not large enough, the RX path has to be connected to the antenna.
For small antennas, it is strongly advised connecting the RX Path directly to the
antenna since due to low antenna coupling the signal amplitude at the EMC filter is
likely to be smaller than 1 V.
• Once the RX connection point has been defined, Rrx value must be carefully adjusted
to be close to the edge of the allowed input range under worst case conditions.
Otherwise, the reception capabilities of the device could be reduced (if Rrx is too high,
Hmin field detection in card mode will be reduced).
For RX path tuning process, both reader mode and card mode must be considered and
Rrx value must be defined according to the highest voltage measured.
1. In card mode, the worst-case conditions are met when an external RF field of 7.5
A/m is applied on the device. These conditions can be easily obtained with an ISO
10373-6 [1] assembly PCD test bench.
2. In reader mode, the worst-case conditions are antenna-dependent and they are
linked to the tag load applied. Therefore, it is recommended to switch on the
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
PN7160 RF field and to try different tag load to determine the maximum amplitude
that can be reached on the RX connection point.
RX connected to Maximize the signal captured by the The RX resistor value impacts
Antenna RX path=> useful for clock recovery the Q factor
accuracy for ALM
NXP recommendation is to use antenna RX tap point for small antennas (typically
2
smaller than 800 mm ) and EMC filter tap point connection for large antenna
2
(typically larger than 800 mm ).
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
On the left graph, the red curve shows the 13.56 MHz voltage at the NFC chip antenna
which is induced by the reader field. The blue curve shows the modulation pattern. This
modulation pattern is generated by actively driving 13.56 MHz with TX1 or TX2 while the
other TX pin (TX2 or TX1) is kept silent. On the right, we can see the modulated reader
field.
In this mode, the modulation pattern is generated by actively driving 13.56 MHz with TX1
and TX2. The modulation depth observed is twice the modulation depth of mode 1.
The antenna design to support all NFC modes is done in the same way as described in
Section 4
Please note that in Active Load Modulation the matching is the same between Card mode
and Reader mode
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Optionally, the ANT1 and ANT2 pins of the PN7160 can be connected with the help of
CANT capacitors.
These two pins work as Very low-power RF field detector. The NFC controller can detect
the presence of an external magnetic field and notify the host system about its presence,
when the NFCC is in Power Off mode.
If an RF field is present. The voltage 2.7 V can be measured on the VDD(HF) pin (Monitor
rectifier output voltage).
The CANT can be chosen as 12 pF, which gives good starting value as such.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Figure 41 shows the output voltage on the VDD(HF) pin when the PN7160 is in Power Off
mode and the external magnetic field has been detected.
Figure 41. VDD(HF) when the NFCC is in Power Off mode + an external magnetic field
If you choose to use the Very low-power RF field detector feature. The reading range can
be reduced due to the additional antenna loading.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
CH1: Use a loop with the ground line shortcut at the probe to enable inductive signal
coupling. Hold the probe loop closely above the antenna. When the shaping compliance
to a given standard is verified, the corresponding reference PICC must be connected to
CH1.
CH2: Used as trigger if possible
The absolute measured voltage in CH1 depends on the coupling (= distance) between
the probe loop and the reader antenna. The influence of the coupling on the shape can
be neglected. The complete antenna tuning and Q checking should be done without any
card (or metal environment) at proximity of the PN7160 antenna.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The time t1-t2 describes the time span, in which the signal falls from 90 % down below
5 % of the signal amplitude. As the pulse length of the PN7160 is accurate enough, only
the time t2 has to be checked: the signal has to remain below 5 % for the time t2.
The most critical time concerning rising carrier envelope is t4. It must be checked that the
carrier envelope at the end of the pause reaches 60 % of the continuous wave amplitude
within 0.4 µs.
Please note that standard can evolve so the value mentioned in this tabled are
only shown for quick reference. Final value must be retrieved from the latest official
publication of the corresponding standard.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Figure 44. Pulse shape according to ISO/IEC18092 standard @212 and 424 kbit/s
Table 9. Pulse shape definitions according to ISO/IEC18092 standard @212 and 424 kbit/
s
212 kbit/s 424 kbit/s
tf 2.0 µs max 1.0 µs max
tr 2.0 µs max 1.0 µs max
y 0.1 (a-b) 0.1 (a-b)
hf, hr 0.1 (a-b) max 0.1 (a-b) max
Please note that standard can evolve so the value mentioned in this tabled are
only shown for quick reference. Final value must be retrieved from the latest official
publication of the corresponding standard.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The different standards define the amplitude of the load modulation in card mode. It
varies with the field strength of the reader/writer or the distance from its antenna.
The load modulation amplitude or sideband level amplitude has to be measured by using
a specific test bench which is different for each standard (ISO, EMVCo, NFC Forum).
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
The two following registers can be adjusted to fine-tune the load modulation amplitude
are CLOCK_CONFIG_DLL_ALM and CLIF_ANA_TX_AMPLITUDE_REG
CLOCK_CONFIG_DLL_ALM is the first register to use, to adjust the phase offset between
the received signal and the transmitted signal (by 45° steps).
Based on this offset, the signal emitted is more or less in phase with the emitted field
from the reader. Thus, its impact on the amplitude of the reader field is different, and can
drastically impact the corresponding load modulation.
The phase offset correspondence is given by the bits 2:0 as follows:
0x00 0x00 => 0° phase offset.
0x2D 0x00 => 45° phase offset
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
It is also possible to adjust the load modulation amplitude by choosing the amplitude
of the output signal generated at PN7160 TX pin. Mainly, the amplitude range is 0 V to
TVDD but a TVDD drop can be applied to reduce the amplitude.
This is done by modifying the TX_CW_AMPLITUDE_ALM_CM bits of the
CLIF_ANA_TX_AMPLITUDE_REG register.
The available drops are:
• Maximum amplitude – typically 150 mV
• Maximum amplitude – typically 250 mV
• Maximum amplitude – typically 500 mV
• Maximum amplitude – typically 1000 mV
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
When the difference between POWER distance and READING distance is too high (5
mm or more), it means that the RX path can be optimized thanks to the following register:
CLIF_ANA_RX_REG: to set the AGC gain
CLIF_SIGPRO_RM_CONFIG1_REG: to set the level detection threshold (MIN LEVEL)
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
10.5.1 Basics
The performance verification of the setup using PN7160 can be finalized by some
functional checks to evaluate the user experience.
Reader mode:
For instance, the communication distance in reader mode with some cards can be
verified:
• MIFARE Ultralight
• MIFARE DESFire
• Topaz 512
• FeliCa card
• ISO/IEC14443-B card
• Phone in P2P mode
Card mode:
The communication distance in card mode with some readers can be verified:
• Pegoda
• Omnikey 5321
• Vivopay 5000
• ACR122
• …
In case unsatisfying results are met during the performance verification step, the
tuning/matching circuit must be adjusted (fine-tuned) to improve.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
As observed on Figure 52, without DLMA (green curve) it would not be possible to use
mode 2 and mode 3 as at 0 cm these two modes exhibit too large LMA (over EMVCo
specification 80 mVpp). Using DLMA green curve, we can have an LMA optimized at all
distances, i.e. below max limit at short distances, and largest LMAs at high distances.
Figure 21 shows the POWER versus READING distances obtained with the setup
described above for different Type A cards.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
11 Abbreviations
Table 11. Abbreviations
Abbreviation Meaning
A/m Ampere per meter (magnetic field strength measurement unit)
AGC Automated Gain Control
AN Application Note
CH1 / CH2 Channel 1 / Channel 2
EMC ElectroMagnetic Compatibility
Hmin / Hmax Minimal and Maximum magnetic field strength
H-field Magnetic field
IC Integrated Circuit
ISO/IEC International Standard Organization / International Electrotechnical Community
mA milliampere
MHz Mega Hertz
NFC Near Field Communication
NFCC NFC Controller (i.e. PN7160)
PCB Printed-circuit board
PCD Proximity Coupling Device (Contactless reader)
PICC Proximity Integrated Circuit Card (Contactless card)
Q / Q-factor Quality Factor
RF Radiofrequency
TBD To Be Defined
V Voltage
Vpp Peak to peak voltage
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
12 References
[1] AN13224 - PN7160 Dynamic power control guide
[2] NFC Antenna Design Hub - Available via nxp.com
[3] ISO/IEC10373-6 standard – Identification cards – Test methods – Part 6: Proximity
cards – 2001 release
[4] ISO/IEC14443 standard – Identification cards - Contactless integrated circuit(s)
cards – Proximity cards – 2001 release
[5] NFC Forum – NFC Analog Specification
[6] UM11495 - PN7160 User manual, available on PN7160 product page (sign in is
required)
[7] AN13218 - PN7160 RF settings guide
[8] AN13223 - PN7160 Dynamic load modulation amplitude guide
[9] PathWave Advanced Design System (ADS)
[10] RFSim99
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
13 Legal information
13.1 Definitions Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Draft — A draft status on a document indicates that the content is still agreed in a valid written individual agreement. In case an individual
under internal review and subject to formal approval, which may result agreement is concluded only the terms and conditions of the respective
in modifications or additions. NXP Semiconductors does not give any agreement shall apply. NXP Semiconductors hereby expressly objects to
representations or warranties as to the accuracy or completeness of applying the customer’s general terms and conditions with regard to the
information included in a draft version of a document and shall have no purchase of NXP Semiconductors products by customer.
liability for the consequences of use of such information.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
13.2 Disclaimers authorization from competent authorities.
Limited warranty and liability — Information in this document is believed Evaluation products — This product is provided on an “as is” and “with all
to be accurate and reliable. However, NXP Semiconductors does not give faults” basis for evaluation purposes only. NXP Semiconductors, its affiliates
any representations or warranties, expressed or implied, as to the accuracy and their suppliers expressly disclaim all warranties, whether express,
or completeness of such information and shall have no liability for the implied or statutory, including but not limited to the implied warranties of non-
consequences of use of such information. NXP Semiconductors takes no infringement, merchantability and fitness for a particular purpose. The entire
responsibility for the content in this document if provided by an information risk as to the quality, or arising out of the use or performance, of this product
source outside of NXP Semiconductors. remains with customer.
In no event shall NXP Semiconductors be liable for any indirect, incidental, In no event shall NXP Semiconductors, its affiliates or their suppliers
punitive, special or consequential damages (including - without limitation - be liable to customer for any special, indirect, consequential, punitive
lost profits, lost savings, business interruption, costs related to the removal or incidental damages (including without limitation damages for loss of
or replacement of any products or rework charges) whether or not such business, business interruption, loss of use, loss of data or information, and
damages are based on tort (including negligence), warranty, breach of the like) arising out the use of or inability to use the product, whether or not
contract or any other legal theory. based on tort (including negligence), strict liability, breach of contract, breach
of warranty or any other theory, even if advised of the possibility of such
Notwithstanding any damages that customer might incur for any reason
damages.
whatsoever, NXP Semiconductors’ aggregate and cumulative liability
towards customer for the products described herein shall be limited in Notwithstanding any damages that customer might incur for any reason
accordance with the Terms and conditions of commercial sale of NXP whatsoever (including without limitation, all damages referenced above and
Semiconductors. all direct or general damages), the entire liability of NXP Semiconductors,
its affiliates and their suppliers and customer’s exclusive remedy for all of
the foregoing shall be limited to actual damages incurred by customer based
Right to make changes — NXP Semiconductors reserves the right to
on reasonable reliance up to the greater of the amount actually paid by
make changes to information published in this document, including without
customer for the product or five dollars (US$5.00). The foregoing limitations,
limitation specifications and product descriptions, at any time and without
exclusions and disclaimers shall apply to the maximum extent permitted by
notice. This document supersedes and replaces all information supplied prior
applicable law, even if any remedy fails of its essential purpose.
to the publication hereof.
Translations — A non-English (translated) version of a document, including
Suitability for use — NXP Semiconductors products are not designed,
the legal information in that document, is for reference only. The English
authorized or warranted to be suitable for use in life support, life-critical or
version shall prevail in case of any discrepancy between the translated and
safety-critical systems or equipment, nor in applications where failure or
English versions.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for Security — Customer understands that all NXP products may be subject to
inclusion and/or use of NXP Semiconductors products in such equipment or unidentified vulnerabilities or may support established security standards or
applications and therefore such inclusion and/or use is at the customer’s own specifications with known limitations. Customer is responsible for the design
risk. and operation of its applications and products throughout their lifecycles
to reduce the effect of these vulnerabilities on customer’s applications
and products. Customer’s responsibility also extends to other open and/or
Applications — Applications that are described herein for any of these
proprietary technologies supported by NXP products for use in customer’s
products are for illustrative purposes only. NXP Semiconductors makes no
applications. NXP accepts no liability for any vulnerability. Customer should
representation or warranty that such applications will be suitable for the
regularly check security updates from NXP and follow up appropriately.
specified use without further testing or modification.
Customer shall select products with security features that best meet rules,
Customers are responsible for the design and operation of their
regulations, and standards of the intended application and make the
applications and products using NXP Semiconductors products, and NXP
ultimate design decisions regarding its products and is solely responsible
Semiconductors accepts no liability for any assistance with applications or
for compliance with all legal, regulatory, and security related requirements
customer product design. It is customer’s sole responsibility to determine
concerning its products, regardless of any information or support that may be
whether the NXP Semiconductors product is suitable and fit for the
provided by NXP.
customer’s applications and products planned, as well as for the planned
application and use of customer’s third party customer(s). Customers should NXP has a Product Security Incident Response Team (PSIRT) (reachable
provide appropriate design and operating safeguards to minimize the risks at [email protected]) that manages the investigation, reporting, and solution
associated with their applications and products. release to security vulnerabilities of NXP products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default
in the customer’s applications or products, or the application or use by
customer’s third party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications
and the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Tables
Tab. 1. 40 mm x 40 mm antenna outlines .....................5 Tab. 7. RX connection pros and cons ......................... 34
Tab. 2. Recommended standard coil antenna Tab. 8. Pulse shape definitions according to ISO/
physical characteristics ..................................... 5 IEC18092 standard @106 kbit/s ..................... 42
Tab. 3. TVDD voltage settings .................................... 21 Tab. 9. Pulse shape definitions according to ISO/
Tab. 4. Target impedance ............................................22 IEC18092 standard @212 and 424 kbit/s ........43
Tab. 5. Components characteristics ............................ 23 Tab. 10. Load Modulation generation modes register
Tab. 6. Impact of C0, C1, and C2 component values .............................................................. 45
errors on matching impedance ........................29 Tab. 11. Abbreviations ...................................................53
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Figures
Fig. 1. Standard coil antenna example .........................4 Fig. 28. Measurement of the matching impedance .......27
Fig. 2. 40 mm x 40 mm antenna drawing .....................5 Fig. 29. Impact of C1 ................................................... 28
Fig. 3. Antenna model for single frequency ..................6 Fig. 30. Impact of C2 ................................................... 28
Fig. 4. Inductance examples versus square coil Fig. 31. Impact of C0 ................................................... 29
size, N-number of turns, a-coil side ...................7 Fig. 32. Impact of C0, C1, and C2 component
Fig. 5. Field distribution of a circular antenna with tolerance (error) on a 20 Ω impedance
open air environment ........................................ 9 matching .......................................................... 29
Fig. 6. Field distribution of a circular antenna with Fig. 33. Matching circuit simulation in ADS/
a metal plane .................................................. 10 RFSim99 ..........................................................30
Fig. 7. Field distribution of a circular antenna with Fig. 34. Matching circuit simulation in ADS/
a metal plane and a ferrite sheet .................... 10 RFSim99 - fine matching ................................ 31
Fig. 8. Ferrite sheet overlay recommendation ............ 11 Fig. 35. RX path ........................................................... 32
Fig. 9. Ferrite material influence on antenna Fig. 36. RX path ........................................................... 32
parameters ...................................................... 12 Fig. 37. Active Load Modulation Concept (Mode 1) ......35
Fig. 10. Antenna calculation using the NFC Fig. 38. Active Load Modulation Concept (Mode 2) ......35
Antenna Hub Tool ........................................... 13 Fig. 39. Very low-power RF field detector .................... 36
Fig. 11. OM27160 Development kit + Raspberry Pi Fig. 40. All NFC modes + Very low-power RF field
connected ........................................................ 14 detector ............................................................36
Fig. 12. Series equivalent circuit .................................. 15 Fig. 41. VDD(HF) when the NFCC is in Power Off
Fig. 13. Antenna parameters - measurement point ...... 15 mode + an external magnetic field .................. 37
Fig. 14. "Pin header" calibration kit .............................. 16 Fig. 42. Setup to check the Q-factor ............................ 41
Fig. 15. The 40 mm x 40 mm antenna Fig. 43. Pulse shape according to ISO/IEC18092
measurement ...................................................17 standard @106 kbit/s ...................................... 42
Fig. 16. PN7160 antenna matching/tuning circuit for Fig. 44. Pulse shape according to ISO/IEC18092
Reader Mode (RM) ......................................... 18 standard @212 and 424 kbit/s ........................ 43
Fig. 17. Asymmetrical vs symmetrical tuning ............... 19 Fig. 45. Modulation Index (m) calculation in Reader/
Fig. 18. Antenna inductance and resistance Writer mode .....................................................44
compensation .................................................. 20 Fig. 46. Card Emulation: EMVCo test bench
Fig. 19. Bandwidth ........................................................20 measurement ...................................................44
Fig. 20. Target impedance ............................................21 Fig. 47. Generating LMA mode 1, 2 and 3 ...................46
Fig. 21. Ztarget versus ITVDD current ......................... 21 Fig. 48. ALM – Phase offset adjustment ...................... 47
Fig. 22. EMC Filter cut-off frequency + L0 ................... 22 Fig. 49. Reader Mode: POWER distance and
Fig. 23. Matching values proposal ............................... 23 READING distance check ............................... 49
Fig. 24. .......................................................................... 24 Fig. 50. Type A card response captured with the
Fig. 25. Impedance matching measurement ................ 25 oscilloscope ..................................................... 50
Fig. 26. Matching suggested by NFC Antenna Tool ..... 25 Fig. 51. Oscilloscope capture with the 2 probes ...........50
Fig. 27. Matching after the fine-tuning (added 8.2 Fig. 52. Card mode LMA on EMVCo bench .................52
pF to C1) .........................................................26 Fig. 53. Reader mode distances for typical cards ........ 52
AN13219 All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
Contents
1 Introduction ......................................................... 3 10 Performance verification and fine-tuning ....... 40
2 Recommended NFC antenna 10.1 Field strength measurement ............................ 40
characteristics ..................................................... 4 10.2 Carrier envelop shape verification ................... 40
2.1 Standard coil antenna design ............................ 4 10.2.1 Pulse shape according to the ISO/IEC
2.1.1 40 mm x 40 mm ................................................ 5 18092 standard ................................................41
2.1.2 Recommended characteristics ...........................5 10.2.2 Pulse shape according to the ISO/
2.1.3 Antenna size ......................................................6 IEC14443 standard ..........................................43
2.1.4 Antenna system parameters ..............................6 10.3 Load modulation amplitude measurement ....... 44
2.1.4.1 Antenna inductance ........................................... 7 10.4 Fine-tuning through registers ...........................45
2.1.4.2 Antenna capacitance ......................................... 7 10.4.1 Card mode .......................................................45
2.1.4.3 Antenna resistance ............................................ 7 10.4.2 Reader mode ...................................................48
2.1.4.4 Antenna quality factor ........................................8 10.5 Functional performances ................................. 51
2.1.4.5 Antenna self-resonance frequency .................... 8 10.5.1 Basics .............................................................. 51
3 Shielding and environment impact ................... 9 10.5.2 Performances based on a PN7160 demo
3.1 Why is shielding important ................................ 9 board 50 mm x 30 mm antenna ...................... 51
3.2 Ferrite shielding recommendation ................... 11 11 Abbreviations .................................................... 53
4 Antenna tuning and matching to the 12 References ......................................................... 54
PN7160 ............................................................... 13 13 Legal information .............................................. 55
4.1 Antenna tuning/matching procedure
overview ...........................................................13
4.2 Step 1: Antenna calculation .............................13
4.3 Step 2: Antenna model measurement ............. 14
4.3.1 Electrical parameters overview ........................14
4.3.2 Measurement with vector network analyzer .....15
4.3.2.1 40 mm x 40 mm Antenna measurement ..........16
4.4 Step 3: Matching calculation and its
implementation for reader mode (RM) ............. 17
4.4.1 Default configuration for reader mode (RM) .....17
4.4.2 Asymmetrical versus symmetrical tuning ......... 18
4.4.3 Antenna parameters compensation ................. 19
4.4.4 Input parameter: Quality factor (Bandwidth
adjustment) ...................................................... 20
4.4.5 Input parameter: Target impedance .................20
4.4.6 Input parameter: EMC Filter cut-off
frequency (fEMC cut off) and L0 ......................22
4.4.7 Output parameters: C0, C1, C2, and Rs ..........22
4.4.8 Matching components calculation using the
Excel calculator ............................................... 24
4.4.9 Impedance matching measurement .................24
5 Matching/Tuning guide ..................................... 27
5.1 Matching impedance tuning guide ................... 27
5.2 Matching components tolerance ......................29
5.3 Impedance matching simulation ...................... 30
6 Rx path tuning (Rrx and Crx definition) .......... 32
6.1 Receiver block functionality ............................. 32
6.2 RX connection ................................................. 33
7 Antenna design/tuning for all NFC modes
(RM and CM) ......................................................35
7.1 Default configuration for reader and card
mode ................................................................ 35
8 Dynamic Load Modulation Amplitude
(DLMA) ................................................................38
9 Dynamic Power Control (DPC) .........................39
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section 'Legal information'.