Ps 1
Ps 1
Unless otherwise specified, use the 0.25 micron libraries for all HSPICE simulations.
The data from five measurements made on a short channel NMOS device appears in Table 1. Given that
VDSAT = 0.6 V and k’ = 100 µ A/V2, calculate VT0, γ , λ , 2| φ F|, and W/L.
2 2 1.8 0 1297
3 2 2.5 0 1361
4 2 1.8 -1 1146
5 2 1.8 -2 1039
The circuit in Fig. 1 is known as the source follower configuration. It achieves a DC level shift between the
input and the output. The value of this shift is determined by the current I0. Assume xd=0, γ=0.4, 2|φf|=0.6V,
VT0=0.43V, kn’=115µA/V2 and λ=0.
Io
Vi Vi M1 1um/0.25um
M1 1um/0.25um
Vo Vo
Vbias= 0.55V
M2 LD=1um
Io
(a) (b)
b) Now assume that an ideal current source replaces M2 (Figure 1(b)). The NMOS transistor M1 experi
ences a shift in VT due to the backgate effect. Find VT as a function of Vo for Vo ranging from 0 to 2.5V
with 0.5V intervals. Plot VT vs. Vo
c) Plot Vo vs. Vi as Vo varies from 0 to 2.5V with 0.5 V intervals. Plot two curves: one neglecting the back-
gate effect and one accounting for it. How does the backgate effect influence the operation of the level
converter?
At Vo(with backgate effect) = 2.5V, find Vo(ideal) and thus determine the maximum error introduced by
the backgate effect.
This problem explores the behavior of short-channel devices. For the HSPICE simulations of this problem
you will use the 0.18u model parameters. Use the HSPICE model parameters which can be found in “log018_1.l ”
a) Using HSPICE plot ID versus VDS, for the transistor of the following figure, with VGS (0.6V, 0.8V, 1V,
Vd
M1
Vg WD = 0.54um
LD = 0.18um
Vs
b) Calculate the effective resistance for a high to low transition, using the method described in slide 44
(Handout 2).
d) Repeat part c) sweeping the supply voltage VDD from 0.4V to 1.8V (sweep step 0.2V). Plot the propa
gation delay tPversus the supply voltage VDD in the same graph. Comment on the results.
VDD = 2.5V
M2 W/L=0.375/0.25
VOUT
VIN M1 W/L=0.75/0.25
c) Calculate VIH, VIL, and the noise margins and comment on the results. How can you increase the noise
margins and reduce the undefined region?
d) Comment on the differences in the VTCs, robustness and regeneration between this inverter and a stan
dard CMOS inverter.
The Figure 4 shows a piecewise linear approximation for the VTC. The transition region is approximated by a
straight line with a slope equal to the inverter gain at VM. The intersection of this line with the VOH and the VOL
lines defines VIH and VIL
Vout
VOH
VM
Vin
VOL
b) Section 5.3.2 of the text uses this piecewise linear approximation to derive simplified expressions for
NMH and NML in terms of the inverter gain. The derivation of the gain is based on the assumption that
both the NMOS and the PMOS devices are velocity saturated at VM . For what range of r is this assump
tion valid? What is the resulting range of VM ?
c) Use the method from section 5.3.2 to derive an expression for the inverter gain at VM for the case when
the sizing ratio is chosen to place VM just below limits of the range where both devices are velocity sat
urated. What are the operating regions of the NMOS and the PMOS?
VDD = 2.5V, WP/L = 1.25/0.25, WN/L = 0.375/0.25, L=Leff =0.25µm (i.e. xd= 0µm), CL=Cinv-gate, kn’ =
115µA/V2, kp’= -30µA/V2, Vtn0 = | Vtp0 | = 0.4V, λ = 0V-1, γ = 0.4, 2|φf|=0.6V, and tox = 58A. Use the Hspice
model parameters for parasitic capacitance given below (i.e. Cgd0, Cj, Cjsw), and assume that VSB=0V for all
problems except part (e).
VDD = 2.5V
L = LP = LN = 0.25µm
VOUT
VIN
CL = Cinv-gate
(Wp/Wn = 1.25/0.375)
-
+ VSB
NMOS
PMOS
b) What is the effective load capacitance CLeff of this inverter? (include parasitic capacitance, refer to notes
for Keq and m.) Hint: You must assume certain values for the source/drain areas and perimeters since
there is no layout. For our scalable CMOS process, λ = 0.125 µm, and the source/drain extensions are
5λ for the PMOS; for the NMOS the source/drain contact regions are 5λx5λ.
c) Calculate tPHL, tPLH assuming the result of (b) is ‘CLeff = 6.5fF’. (Assume ideal step input, i.e.
trise=tfall=0. Do this part by computing the average current used to charge/discharge CLeff.)
e) Suppose we increase the width of the transistors to reduce the tPHL, tPLH. Do we get a proportional
decrease in the delay times? Justify your answer.
f) Suppose VSB = 1V, what is the value of Vtn, Vtp, Vm? How does this qualitatively affect CLeff?
g) Use Magic to create a layout for this inverter. Extract the schematic, including parasitic capacitance,
from the layout and use HSPICE to simulate the circuit and measure tP and the average power for the
following input Vin: pulse(0 VDD 5n 0.1n 0.1n 9n 20n), as VDD varies from 1V - 2.5V with 0.25V inter
val. [tP = (tPHL + tPLH) / 2]. Using this data, plot ‘tP vs. VDD’, and ‘Power vs. VDD’.
The extracted layout will include parasitics so you need not manually include AS, AD, PS, PD in your
spice deck, but remember to manually add CL = 6.5fF. Set VSB = 0V for this problem. Use the HSPICE
model parameters which can be found in “ logic025.l ”.
h) Using HSPICE, simulate the circuit for a set of ‘pulse’ inputs with rise and fall times of tin_rise,fall =1ns,
2ns, 5ns, 10ns, 20ns. For each input, measure (1) the rise and fall times tout_rise and tout_fall of the
inverter output, (2) the total energy lost Etotal, and (3) the energy lost due to short circuit current Eshort.
For measuring short circuit power, use the technique discussed in class (slide 96, Handout 2). Use the
HSPICE model parameters which can be found in “ logic025.l ”
Using this data, prepare a plot of (1) (tout_rise+tout_fall)/2 vs. tin_rise,fall, (2) Etotal vs. tin_rise,fall, (3) Eshort
vs. tin_rise,fall and (4) Eshort/Etotal vs. tin_rise,fall.