FRAUNHOFER-INSTITUT FÜR ZUVERLÄSSIGKEIT UND MIKROINTEGRATION IZM

Life Cycle Assessment of the

Framework Laptop 2022
LCA Report (ISO 14044 and ISO 14067)
Implementation On behalf

Fraunhofer IZM Framework Computer Inc

Gustav-Meyer-Allee 25, 1870 Ogden Dr
13355 Berlin, Germany Burlingame, CA 94010
Web: www.izm.fraunhofer.de Web: https://frame.work/

Contact Authors

Marina Proske Sarah-Jane Baur

Mail: [email protected] Marina Proske
Erik Poppe
Publication: Berlin, September 2023
Version: LCA-FW-NB2022/IZM2023-1.0

Declaration

This report is a deliverable from a study carried out by Fraunhofer IZM and commissioned by Framework
Computer Inc. The study was commissioned to reach objective and unbiased conclusions. Fraunhofer
IZM declares no conflict of interest.

Citation
Baur, S.-J., Proske, M., Poppe, E. (2023). Life Cycle Assessment of the Framework Laptop 2022. LCA
Report (ISO 14044 and ISO 14067). Berlin: Fraunhofer IZM.

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Content
1 Executive summary ....................................................................................... 9

2 Goal of the study ........................................................................................... 11

3 Scope of the study......................................................................................... 12

3.1 Functional Unit ................................................................................................. 12
3.2 Reference Service Life (RSL)............................................................................... 12
3.3 Product description ........................................................................................... 12
3.4 System boundaries ........................................................................................... 14
3.5 Power Mix ........................................................................................................ 22
3.6 Reference Year ................................................................................................. 23
3.7 Criteria for the exclusion of inputs and outputs ................................................ 23

4 Life cycle inventory ....................................................................................... 24

4.1 Data collection and calculation procedures ....................................................... 24
4.2 Background data .............................................................................................. 27
4.3 Data quality ...................................................................................................... 27
4.4 Allocations........................................................................................................ 28
4.5 Unit processes .................................................................................................. 29

5 Lifecycle impact assessment ......................................................................... 71

5.1 Indicators for Impact Assessment per Lifecyle Stage .......................................... 71
5.2 Indicators for Impact Assessment per components and modules....................... 73

6 Life cycle interpretation and sensitivity analysis ........................................ 78

6.1 Differences between LCA indicators ................................................................. 78
6.2 Integrated Circuits ............................................................................................ 78
6.3 Display.............................................................................................................. 81
6.4 Connectors ....................................................................................................... 82

7 Conclusions .................................................................................................... 83

8 Appendix ........................................................................................................ 84
8.1 Life cycle inventory ........................................................................................... 84
8.2 Life cycle impact assessment ............................................................................. 85

9 References ...................................................................................................... 87

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List of figures
Figure 1-1: Relative impact of life cycle phase to the total impact per impact category ....... 9
Figure 1-2: Relative impact per module to the production phase ........................................ 10
Figure 1-3: Relative impact of component types across modules ......................................... 10
Figure 3-1: Schematic image of the modular product approach (Framework 2022) ............ 13
Figure 3-2: System boundaries of the Lifecycle Modell (own illustration) ............................. 16
Figure 4-1: Data collection procedure for component specification at Fraunhofer IZM ........ 24
Figure 4-2: Teardown example of the keyboard module ..................................................... 25
Figure 4-3: Microscopic image and measurements of connectors ....................................... 26
Figure 4-4: X-ray scan of a RAM module ............................................................................ 26
Figure 4-5: Cross-section view of a grinded multilayer PCB and two ICs ............................. 26
Figure 4-6: Overview of the top-level plan for the lifecycle the product from gate to grave. 30
Figure 4-7: Overview of the cradle to gate model ............................................................... 31
Figure 4-8: Overview of the Cover assembly model on LCA FE ............................................ 32
Figure 4-9: Overview of the Bezel production model in LCA FE ........................................... 32
Figure 4-10: Overview of the PC-ABS model in LCA FE ....................................................... 33
Figure 4-11: Overview of the Top Cover model in LCA FE ................................................... 34
Figure 4-12: Overview of the Base Cover model in LCA FE .................................................. 35
Figure 4-13: Overview of the Palmrest Cover model ........................................................... 36
Figure 4-14: Overview of the Display hinge model in LCA FE .............................................. 37
Figure 4-15: Overview of the mainboard model in LCA FE .................................................. 37
Figure 4-16: Overview of the mainboard PCB model in LCA FE ........................................... 38
Figure 4-17: Overview of the heatsink and fan model in LCA FE ......................................... 39
Figure 4-18: Overview of the keyboard model in LCA FE .................................................... 40
Figure 4-19: Overview of the fingerprint model in LCA FE .................................................. 40
Figure 4-20: Overview of the fingerprint PCB model in LCA FE ........................................... 41
Figure 4-21: Overview of the touchpad model in LCA FE .................................................... 41
Figure 4-22: Overview LCA FE model Display ...................................................................... 42
Figure 4-23: LCA FE model of Display holders ..................................................................... 43
Figure 4-24: LCA FE model of the Display cable .................................................................. 43
Figure 4-25: Details of the Display cable modelling ............................................................. 44
Figure 4-26: Overview of the Display PCB model in LCA FE ................................................. 44
Figure 4-27: Overview of Display backlight modelling in LCA FE ......................................... 45
Figure 4-28: Details on the modelling of the Display backlight in LCA FE ............................ 45
Figure 4-29: Overview of the Display panel model in LCA FE .............................................. 46

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Figure 4-30: Overview of the model of the Display panel core ............................................ 47
Figure 4-31: Details on the inputs and outputs of the Display panel core model ................. 47
Figure 4-32: Overview of the storage model ....................................................................... 48
Figure 4-33: Overview of the RAM model ........................................................................... 49
Figure 4-34: Overview of the webcam model ..................................................................... 50
Figure 4-35: Overview of the webcam PCB model .............................................................. 51
Figure 4-36: Overview of the single speaker ....................................................................... 52
Figure 4-37: Overview of the speaker module..................................................................... 52
Figure 4-38: Overview of the WiFi module .......................................................................... 53
Figure 4-39: Overview of the WiFi PCB model..................................................................... 54
Figure 4-40: Overview of the audio jack model ................................................................... 55
Figure 4-41: Overview of the audio jack PCB model ........................................................... 55
Figure 4-42: Overview of the battery model........................................................................ 56
Figure 4-43: Overview of the expansion card model – USB-C.............................................. 56
Figure 4-44: Overview of the expansion card PCB model – USB-C ...................................... 57
Figure 4-45: Overview of the expansion card model – USB-A.............................................. 57
Figure 4-46: Overview of the expansion card PCB model – USB-A ...................................... 57
Figure 4-47: Overview of the expansion card model – USB-A connector ............................. 58
Figure 4-48: Overview of the antenna model ...................................................................... 58
Figure 4-49: Overview of the EPS model ............................................................................. 59
Figure 4-50: Overview of the EPS PCB model ...................................................................... 60
Figure 4-51: Model for packaging materials for the upstream components ........................ 62
Figure 4-52: Model for downstream packaging materials for the final Laptop .................... 63
Figure 4-53: Overview of the model for the production of the screw driver kit ................... 64
Figure 4-54: Overview of the transport model for upstream components ........................... 65
Figure 4-55: Overview of the model for intracontinental transports .................................... 65
Figure 4-56: Overview of the model for local transports ..................................................... 66
Figure 4-57: Overview of the model for assembly of Laptop (red frame) ............................. 67
Figure 4-58: EoL model for the upstream packaging as part of the assembly stage (A3) ..... 68
Figure 4-59: Overview of the distribution model and use phase .......................................... 68
Figure 4-60: Overview of the EoL of the Laptop .................................................................. 69
Figure 4-61: Overview of the EoL of the Screwdriver .......................................................... 70
Figure 5-1: Relative impact of life cycle phase to the total impact per impact category ....... 73
Figure 5-2: Relative impact per module to the production phase ........................................ 73
Figure 5-3: Contributions to GWP impact during the production phase of the display ........ 75
Figure 5-4: Contributions to ADPe impact during the production phase of the display........ 76

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Figure 5-5: Relative impact to the RAM module .................................................................. 76
Figure 5-6: Relative impact of component types across modules ......................................... 77
Figure 6-1: GWP and ADPe comparison of two different IC datasets from the LCA FE
database for the storage module ........................................................................ 79
Figure 6-2: GWP and ADPe comparison of two different IC datasets from the LCA FE
database for the RAM bar ................................................................................... 80
Figure 6-3: GWP of a die (225mm2) for different technology nodes .................................... 81
Figure 6-4: Impact of the assumed contact thickness of the RAM bar on the overall
production phase - GWP ..................................................................................... 82
Figure 6-5: Impact of the assumed contact thickness of the RAM bar on the overall
production phase - ADPe .................................................................................... 82

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List of tables
Table 3-1: Product configuration and specifications ............................................................ 13
Table 3-2: System boundaries and modules considered in the study ................................... 15
Table 3-3: Transport scenario to assembly site (A2) ............................................................. 17
Table 3-4: Mass inputs at assembly (A3) and est. upstream packaging waste (A1) .............. 18
Table 3-5: Waste transport scenario for gate to waste facility (A3)...................................... 19
Table 3-6: Transport scenarios from gate to point of sale (A4) ............................................ 19
Table 3-7: Modelling parameters for the energy consumption during use phase ................. 20
Table 3-8: Waste transport scenario for gate to waste facility (A3)...................................... 21
Table 3-9: Material fractions in EoL ..................................................................................... 21
Table 3-10: Material fractions in EoL for the External Power Supply .................................... 22
Table 3-11: Material fractions in EoL for the Screwdriver .................................................... 22
Table 3-12: Electricity mixes used for different processes and lifecycle stages ..................... 23
Table 4-1: Summary of used background datasets from secondary LCIA databases ............ 27
Table 5-1: Lifecycle stages and corresponding modules codes considered in the LCA ......... 71
Table 5-2: Impact contribution per lifecycle stage and process ............................................ 72
Table 5-3: Absolute impact per module .............................................................................. 74
Table 5-4: LCA Results of the Display.................................................................................. 75
Table 8-1: Display panel manufacturing data by AuO [2021] .............................................. 84
Table 8-2: Results of the LCA - Indicators according to PEF ................................................. 86

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Abbreviations
ADPe Abiotic resource depletion of elements
ALS Ambient light sensor
BID Bill of Material Identifier
BOM Bill of Material
CFP Carbon footprint of products (sometimes PCF)
CO2e Carbon dioxide equivalents
ei Ecoinvent Database
EOL End of life
EPD Environmental Product Declaration
EPS External power supply
EU European Union
FU Functional unit
GHG Greenhouse gases
GWP Global warming potential
IC Integrated circuit
ICT Information and communication technology
ISO International Organization for Standardization
LCA Life cycle assessment
LCA FE Sphera LCA for Experts
MWI Municipal Waste Incineration
NDA Non-disclosure agreement
OEM Original Equipment Manufacturer
PAIA Product Attribute to Impact Algorithm
PAS Publicly Available Specification
PCB Printed circuit board
PCR Product Category Rule
PEF Product environmental footprint
PEFCR Product environmental footprint category rules
PCF Product Carbon Footprint (sometimes CFP)
PSF Product Specific Rule

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1 Executive summary

A life cycle assessment of the Framework Laptop 2022 was conducted focusing on the two impact
categories:
 Climate change displayed as Global Warming Potential (GWP)
 Abiotic resource depletion as Abiotic Resource Depletion of elements (ADPe)
The Framework Laptop is a high-performance notebook that is designed to be upgradeable, repairable,
and customizable. The functional unit used in this study is the use of this notebook over 5 years.
Although the laptop is modular and repairable, no product failure and thus no repair was assumed.
The configuration was assumed to include 16 GB of memory, 256 GB of storage, and two expansion
cards with USB-A and USB-C connectors. In addition, an external power supply from Framework
Computer Inc. and the screwdriver kit shipped with each notebook were included in the model.
The inventory was based on the teardown of the notebook and the bill of materials provided by
Framework for most of the modules (especially the mainboard). The analysis and teardown was
supported by laboratory analysis: X-ray and grinding of the main ICs on the mainboard, RAM and
memory module, and microscopic analysis of the contact areas.
Results
The total impact for the Framework Laptop is estimated to be a GWP of 200 kg CO2e and an ADP of.
1.7E-02 kg Sb-e.
The cradle-to-gate, meaning the manufacturing and raw material acquisition phase, has the highest
impact in both impact categories. As shown in Figure 1-1 the resource use is almost exclusively caused
by the production phase. Use phase follows in its relative contribution, although this is only a relevant
order of magnitude for GWP. For EoL only impacts were considered and no credits were given for
recycling, so this phase also has a small contribution. Transportation has a smaller impact, mainly due
to distribution and less due to transportation during the manufacturing phase or to EoL treatment.

Figure 1-1: Relative impact of life cycle phase to the total impact per impact category

100%
90%
80%
70%
EoL
60%
Transport
50%
Use
40%
Production
30%
20%
10%
0%
GWP Resource use

The production causes 132 kg CO2e and 1.73E-02 kg Sb-e.

The relative impact of the production is displayed in the following Figure 1-2 (rest includes all modules
with an individual contribution <1.5% in both impact categories). The highest contribution to the GWP

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has the display module, whereas the ADPe is mainly influenced by the RAM (and thereby by the
assumed amount of gold on the connector of the RAM bar). Mainboard and storage have also a
significant impact in both impact categories.

Figure 1-2: Relative impact per module to the production phase

100%
Rest
90% Packaging
80% Assembly
EPS
70%
Touchpad
60% Storage
50% Ram
40% Mainboard
Keyboard
30%
Display
20% Cover assembly
10% Battery
Antenna
0%
GWP ADPe

Across the different modules, ICs cause the highest contribution to GWP, followed by the PCBs. The
ADPe is mainly caused by the connectors, followed by the ICs (see Figure 1-3, electronic components
incl. passive and active components on the printed circuit boards excl. ICs).

Figure 1-3: Relative impact of component types across modules

100%
90%
80%
Rest
70%
60% Connectors
50% Aluminium
40% Electronic components
30% PCBs
20% ICs
10%
0%
GWP ADPe

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2 Goal of the study

This document draws on principles, requirements and guidance from existing international standards
on life cycle assessment (LCA) and aims to assess the carbon footprint of the Framework Laptop 2022
covering the life cycle stages of production, distribution, use phase and end of life of the product.
The impact assessment is carried out according to the ISO 14044 and ISO 14067, so that the results
are directly usable for communicating the carbon footprint (CFP) of the mentioned product. This report
contains the impact assessment according to characterization factors of the Environmental Footprint
Reference Package 3.1 (abbreviated as EF 3.1) and gives a detailed analysis on the following impact
categories:
 Global Warming Potential (GWP100)
 Abiotic resource depletion of elements (ADPe)
This study does allow for the communication of the carbon footprint of the product. Due to the limited
scope of impact categories in this study it is not possible to make general statements on the
environmental performance of the product nor direct product comparison. The study was carried out
without a critical review by an independent party.

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3 Scope of the study

The project report and life cycle assessment (LCA) were prepared according to the following standards:
 ISO 14044:2021-02 – General principles and requirements for LCA
 ISO 14067:2019-02 – Requirement and guidelines for carbon footprints of products

In the absence of a unified approach for LCAs of ICT devices (cf., Schischke et al. 2023) and product-
specific rules (PSR) for notebooks and laptops, additional standards and guidelines have been applied
without claiming full conformity, as follows:
 EN 50963 – PCR for LCA of electronic and electrical products and systems, is used for setting
the system boundaries.
 PEFCR IT Equipment v1.2 is used for generic assumptions in the modelling of missing data in
the fore- and background system.
 Environmental Footprint Reference Package 3.1 is used to carry out the life cycle impact
assessment (LCIA)
Where necessary additional standards guidelines were applied and referenced in the study.

3.1 Functional Unit

The functional unit is defined as the use of the Framework Laptop over an average service life of 5
years. The reference flow is one Framework Laptop incl. two extension cards and a charger.

3.2 Reference Service Life (RSL)

The reference service life describes the expected service life of a product under a certain set of use
conditions (reference conditions), which can be used to estimate the service life under other use
conditions (EN50693, Ch. 3.36). This LCA study does not consider the use phase (Module B) in its
entirety (e.g. repair, refurbishment) and does not compare different use scenarios, so the RSL cannot
be adequately determined and is not declared at this point.
In the LCA, the energy consumption is considered for an exemplary service life of 5 years for the use
phase. However, in general it can be assumed that the typically RSL of a Framework Laptop exceeds 5
years.

3.3 Product description

3.3.1 Product description
The Framework Laptop is a high-performance notebook that is designed to be upgradeable, repairable,
and customizable. It is a thin and light notebook that comes with a 13.5-inch display and weighs
1.3 kilograms. The laptop is built with a modular design that allows users to easily swap out
components such as the mainboard, keyboard, and ports (see Figure 3-1). Framework Laptop’s
modular design also allows users to customize their laptop’s ports. The laptop comes with a USB-C
port that can be swapped out for other ports such as USB-A, HDMI, DisplayPort, and microSD.

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Figure 3-1: Schematic image of the modular product approach (Framework 2022 ) 1

3.3.2 Product configuration and specifications

The following product configuration the Framework Laptop is considered for the LCA study.

Table 3-1: Product configuration and specifications

Position Description
th
Product name Framework Laptop 13 (12 Gen Intel® Core™)
Modell year 2022

1
Images Source: https://frame.work/de/de/products/laptop-diy-13-gen-amd

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 Position Description
2
Typical Energy 15.4 kWh
Consumption (TEC)
per year
Processor i5-1240P, 4.4GHz, 4+8 cores
Display 13.5" diagonal, 2256x1504 resolution, > 400 nit max brightness
Memory 16GB (2 x 8GB) DDR4-3200
Graphics Iris Xe Graphics
Storage  256 SSD WD BLK SN770 NVME
Expansion Cards  USB-C
 USB-A
Connectivity WiFi 6E, Bluetooth 5.2
Audio  Stereo 2W speakers
 Dual MEMS microphones with hardware privacy switch
 3.5mm combo headphone jack

Battery 55Wh (80% capacity after 1000 cycles)

Camera 1080p 60fps
Power Adapter 60W USB-C
Keyboard Backlit
Material Aluminum CNC Top Cover
Aluminum formed Input Cover and Bottom Cover
Weight 1.3 kg

3.4 System boundaries

This study covers the whole life cycle of the laptop from raw material acquisition, manufacturing, use
and disposal incl. transport in the different phases.
The selected boundaries of the system are in accordance with the minimum requirements of EN 50693
and the draft version of an upcoming PSR on Electronic Equipment, and Electronic Components (Non-
Construction) by EPD International (EPD International 2023)3.
In the following, the declared modules within the system boundaries are shown in tabular form.

2
According to Framework Energy Star Datasheet: Framework - FRANPC0000 : FRANPC00N4, URL:
https://www.energystar.gov/productfinder/product/certified-computers/details/2401061 (retrieved on 2023-09-06).

3
EPD International (2023): Electronic and electric equipment and electronic components (non-construction). Product Category
Rules (PCR) – Draft. URL: https://www.datocms-assets.com/37502/1679565591-pcr-electronic-and-electric-equipment-and-
electronic-components-non-construction-draft-v1-for-open-consultation.pdf (retrieved on 2023-04-25).

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Table 3-2: System boundaries and modules considered in the study

BENEFITS AND
LOADS
PRODUCT
DISTRIBUTION USE PHASE END OF LIFE STAGE BEYOND THE
STAGE
SYSTEM
BOUNDARIES

Operational energy
Raw materials and

Installation at PoU

Operational water

Waste processing
Fulfillment center

De-installation at
Transport to PoS
Manufacturing/

Refurbishment
Maintenance
intermediary

Recycling-
Recovery-
Transport

Transport

potential
products

Disposal

Reuse-
Repair

Reuse

PoU
Use

use

use
A1 A2 A3 A4 A5 B1 B2 B3 B4 B5 B6 B7 C1 C2 C3 C4 D

X X X X X ND ND ND ND ND X ND X X X X ND

Legend: X = declared; ND = not declared

In this study one end-of-life scenario will be considered:

 Recycling scenario (100% recycling and disposal of the product, cut-off waste-content
approach)

3.4.1 Life cycle stages

This chapter describes the system boundaries, including all upstream, core and downstream processes
and activity data considered in this LCA. According to EN50693 and PCR Draft for EEE and electronic
components the life cycle inventory covers the following sections:
 Raw material acquisition and manufacturing (A1-3)
 Transports to Point of Sale (A4)
 Installation at Point of Usage (A5)
 Use phase (B6)
 Transports to End of Life (C2)
 End-of-life (C3-4)
An overview of the included processes and components and their attribution to the respective life cycle
stages can be found in Figure 3-2. A detailed description of each life stage can be found in the
following sections.

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Figure 3-2: System boundaries of the lifecycle modell (own illustration)

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 3.4.1.1 Material and components supply (A1)
The Framework Laptop and all accessories are designed by Framework Computer Inc. (Framework) in
the USA and Taiwan and manufactured by contract manufacturers mainly in Asia. Framework does
not have its own manufacturing facilities and fulfilment centres for shipping products. All components
and individual modules are manufactured by various contract manufacturers in Asia, which may include
further upstream suppliers of sub-components and modules. Most components are manufactured to
the specific requirements of Framework, while some components are available as commercial off-the-
shelf (COTS) components (e.g., memory storage, WiFi module, ICs, etc.).
In the lack of primary production data from OEMs and upstream suppliers all components were
specified, where possible, based on technical data sheets and specific bill of materials (BOMs) provided
by the contract manufacturers to Framework and the LCA practitioner (see Chapter 4.1). No specific
process and activity data from the production of single components or modules were obtained (e.g.,
direct emission in production of subcomponents, energy usage, use of secondary materials, material
losses due to manufacturing and processing, etc.). Missing activity and process data was modelled on
base of secondary LCIA databases (i.e., LCA FE, ecoinvent) which is described in detail in Chapter 4
and 4.5. In the lack of specific information on packaging materials for components in the upstream
supply chain, a packaging mix was estimated using a specific mass factor (see Table 3-4).
Where specific data was not available, individual components were identified through teardowns, desk
research or approximated using secondary data as described in Chapter 4.1.
3.4.1.2 Transports to assembly site (A2)
Individual components and packaging materials are purchased from different suppliers which mainly
operate in Asia and shipped to the main assembly site in Taiwan. As no specific transport data could
be obtained all transports are based on the default transport scenarios on a region level provided in
the Product Category Rule EN50693 Chapter 4.3.2 and described in detail in the table below.
All transports for upstream supplies and packaging material are modelled as one-ways distance with a
payload of 85%.

Table 3-3: Transport scenario to assembly site (A2)

Process Description Region Transport Background dataset

scenario from LCA FE
according EN
50693

Upstream 84 wt.-% of Intracontinental 3.500 km LKW GLO: Truck-trailer, Euro

modules and components transport (Asia) (85% Utilization) 5, 34 - 40t gross weight
components {RAS} / 27t payload capacity
from Asia Sphera <e-ep>;

Upstream 16 wt.-% of International Transport chain: GLO: FW_Transports

modules and components transport 19.000 km Intracontinental | Truck-
components (e.g., CPU, ICs., (Global) {GLO} Transport ship + trailer, Euro 5, 34-40t
from USA Memory, 1.000 km LKW (GLO) IZM <LZ>; based
Storage) (85% Utilization) on:

GLO: Truck-trailer, Euro

5, 34 - 40t gross weight
/ 27t payload capacity
Sphera <e-ep>;

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 Process Description Region Transport Background dataset
scenario from LCA FE
according EN
50693

FW_Container ship
ocean incl. fuel, 27,500
dwt payload capacity,
ocean going;

Packaging Packaging Local transport 1.000 km LKW GLO: Truck-trailer, Euro

materials materials for (Taiwan) {TW} (85% Utilization) 5, 34 - 40t gross weight
(Downstream) shipping to / 27t payload capacity
consumer Sphera <e-ep>;

3.4.1.3 Assembly and shipping preparation (A3)

Individual components are purchased from different suppliers and shipped to the main assembly site,
where they are then assembled into the Framework Laptop. The final assembly includes the
commissioning of components, the assembly of the components into a laptop, the packaging of the
final product and additional modules, and the preparation of the final product for shipment. The
assembly is carried out by a contract manufacturer of Framework in Taiwan. No specific activity data
(e.g., energy usage, intralogistics, etc.) could be obtained and was therefore estimated by the LCA
practitioner on base of industrial data from other LCA studies and public industry data.
During the assembly phase, there is a small amount of packaging waste from intermediate products
in the upstream supply chain that needs to be disposed of. In the absence of specific data, a packaging
mix was estimated using a mass factor of 1.12 (12%) of the total mass of all inputs and supplementary
modules.

Table 3-4: Mass inputs at assembly (A3) and est. upstream packaging waste (A1)

# Material BOM-ID Mass [g] Relative Description

(%)

1 Framework Laptop, incl. all - 1,302.97 100 Laptop with all

modules supplementary modules

1.1 Framework Laptop BID-115 1,262 96.86 Laptop with core modules
assembled

1.2 USB-A_EC Kit BID-672 7.19 0.55 Supplementary module

1.3 USB-C_EC Kit BID-692 6.97 0.53 Supplementary module

1.4 RAM BID-XXX 8.81 0.68 Supplementary module

1.5 Storage SSD BID-XXX 18 1.38 Supplementary module

2 External Power Supply - 113 100 Supplementary part

2 Upstream packaging - Estimated as 12% of

169.92 100
#1+#2

2.1 Cardboard Box - 135.93 80 Estimated as 80% of #3

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 # Material BOM-ID Mass [g] Relative Description
(%)

2.2 PE Foil - 33.98 20 Estimated as 20% of #2

For the disposal of upstream packaging waste, a generic municipal waste incineration process was
assumed, which is the common treatment practice in Taiwan for packaging waste.4 According to the
cut-off approach, no credits are given for energy recovery. Transports of upstream packaging waste
from the assembly stage to waste facility were estimated by the LCA practitioner and described in
Table 3-5. According to EN50693 Chapter 4.3.2 waste Transports include a full outward journey and
empty return journey by truck and thus modelled with a utilization of payload of 50% over a single
distance. The transport distance of 100km is estimated by the LCA practitioner based on the area
coverage and number of MWIs in Taiwan.5 The payload of the dataset from LCA FE was adjusted to
20t.

Table 3-5: Waste transport scenario for gate to waste facility (A3)

Process Region Transport scenario Background dataset

according EN 50693 from LCA FE

Transport of Local transport 100 km LKW (50% Truck-trailer, Euro 5, 34 -

upstream (Taiwan) {TW} Utilization), Payload 20t 40t gross weight / 27t
packaging waste to payload capacity
MWI

3.4.1.4 Transport from gate to point of sale (A4)

Due to a lack of information about the exact transport routes from the final assembly stage in Taiwan
(gate) to the US Market (point of sale) a default transport scenario was applied which is provided in
the Product Category Rule EN50693 Chapter 4.3.2 and described in detail in the table below. The
transports process included the final Laptop Device and its packaging. No additional transport
packaging or weights of additional transportation aids (e.g., palettes) are considered in the model.
Transport modelled as one-ways distance with a utilization of the payload of 85%.

Table 3-6: Transport scenarios from gate to point of sale (A4)

Process Region Transport scenario Background dataset from

according EN 50693 LCA FE

Framework Laptop, International Transport chain: 12.000 GLO: FW_Transports Chain

incl. packaging transport km Cargo plane + Global-Truck-Cargo plane IZM
(Global) {GLO} 1.000 km LKW (85% <LZ> based on:
Utilization)

https://english.dep.gov.taipei/News_Content.aspx?n=010EDE53B1F4A4AF&sms=85FBABE70858A8D4&s=98C0E979E64543
30#:~:text=Taipei%20currently%20has%20three%20municipal,incineration%20rate%20has%20been%2099.23%25.

5
Ebd.

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 Process Region Transport scenario Background dataset from
according EN 50693 LCA FE

Truck-trailer, Euro 5, 34 - 40t

gross weight / 27t payload
capacity;

GLO: Cargo plane, 113 t

payload Sphera <e-ep>;

3.4.1.5 Use phase (B6)

Energy consumption is calculated based on the laptop being used in the U.S. for a period of 5 years
on base of if its annual Typical Energy Consumption (TEC), which is derived from the Energy Star
Certification of the product.6
According to Energy Star Program Requirements for Computers (Version 5.0), the TEC is: “A method
of testing and comparing the energy performance of computers, which focuses on the typical electricity
consumed by a product while in normal operation during a representative period of time. For Desktops
and Notebooks, the key criterion of the TEC approach is a value for typical annual electricity use,
measured in kilowatt-hours (kWh), using measurements of average operational mode power levels
scaled by an assumed typical usage model (duty cycle).”7

Table 3-7: Modelling parameters for the energy consumption during use phase

Position Value

TEC of Model per year 15.4 kWh

Use time 5 years

Energy consumption over 5 years 77 kWh

Background Dataset from LCA FE US: grid mix Sphera

3.4.1.6 Transport to waste processing (C2)

According to EN50693 Chapter 4.3.2 waste Transports include a full outward journey and empty return
journey by truck and thus modelled with a Payload of 50% over a single distance.

6
Framework - FRANPC0000 : FRANPC00N4, URL: https://www.energystar.gov/productfinder/product/certified-
computers/details/2401061 (retrieved on 2023-09-06).

7
ENERGY STAR® Program Requirements for Computers Version 5.0, URL:
https://www.energystar.gov/ia/partners/prod_development/revisions/downloads/computer/Version5.0_Computer_Spec.pdf?0
f42-51d9

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Table 3-8: Waste transport scenario for gate to waste facility (A3)

Process Region Transport scenario Background dataset

according EN 50693 from LCA FE

Transport of Local transport 100 km LKW (50% Payload) GLO: Truck-trailer, Euro
downstream (USA) {US} 5, 34 - 40t gross weight /
packaging waste to 27t payload capacity
MWI Sphera <e-ep>;

Payload capacity adjusted

to 20t with 50%
utilization.

3.4.1.7 Waste processing (C3)

In EoL, the laptop, the external power supply (EPS) and the screwdriver are subject to 100% material
and thermal recycling. In this scenario, the device and its related supplies are shredded and sorted into
two material fractions. The total mass of the plastic and metal fractions is based on measurements and
approximations based on the detailed bill of materials. The proportion of unknown material
compositions was divided in the same ratio and assigned to the plastic and metal fractions (see Table
3-9). After shredding and sorting the plastic fraction will be incinerated. All burdens for the incineration
of plastic fractions are assigned to the product system and no credits for energy recovery are given
(cut-off, “polluter pays” principle). Shredded and sorted metal waste has a market value and will lose
its waste status after the sorting process and no additional waste processing is needed (e.g., melting).
The reuse of the recovered material in another product system is not part of the study and therefore
no credits for substitution are given.

Table 3-9: Material fractions in EoL

wt.-% tot.
# Position Material Mass [g] Data source
weight
Framework Laptop
A 1302.97 100% Measured
Enddevice
Separable metal
1 parts (e.g., cover, Metals 913.12 70% Measured
screws)
Separable plastic
2 parts (e.g., fan, Plastics 48.83 5% Measured
display bezel)
Unseparable metal
and plastic fractions
3 (e.g., PCBs, Compounds 341.02 26% Calculated
component
packages)
3a Metal Share Plastics 170.51 13% Estimated as 50% of #3
3b Plastic Share Metals 170.51 13% Estimated as 50% of #3
Metal (waste for
4 Metals 1083.63 83% Calculated as #1+#3a
recovery)
Plastic (waste
5 Plastics 219.34 17% Calculated as #2+#3b
incineration)

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Table 3-10: Material fractions in EoL for the External Power Supply

wt.-% tot.
# Position Material Mass [g] Data source
weight
External Power
A 112.61 100% Measured
Supply
Separable metal
1 Metals 3.2 2.84% Measured
parts
Separable plastic
2 Plastics 41.09 36.49% Measured
parts
Inseparable metal
and plastic fractions
3 (e.g., PCBs, Compounds 68.32 60.67% Measured
component
packages)
3a Metal Share Plastics 34.16 30.33% Estimated as 50% of #3
3b Plastic Share Metals 34.16 30.33% Estimated as 50% of #3
Metal (waste for
4 Metals 37.36 33.18% Calculated as #1+#3a
recovery)
Plastic (waste
5 Plastics 75.25 66.82% Calculated as #2+#3b
incineration)

Table 3-11: Material fractions in EoL for the Screwdriver

wt.-% tot.
# Position Material Mass [g] Data source
weight
A Screwdriver 12.4 100% Measured
Separable metal
1 Metals 1.984 16% Measured
parts
Separable plastic
2 Plastics 10.416 84% Measured
parts
Metal (waste for
3 Metals 1.984 16% Based on #1
recovery)
Plastic (waste
4 Plastics 10.416 84% Based on #2
incineration)

3.4.1.8 Disposal (C4)

In the applied EoL scenario, the product can be fully recycled and thermally recovered (module C3), so
there are no additional burdens for the final disposal (module C4).

3.5 Power Mix

The Framework Laptop consists of components and modules from different countries and where
possible the national electricity mixes for the reference year 2022 were applied accordingly. Most of
the electronic components are modelled using generic and aggregated data sets from Gabi LCA FE
and therefore power mixes could not be further specified directly in the upstream processes. Where
possible, generic datasets have been selected to match the target region.
The average national grid mix was used because more specific data on electricity consumption were
not available and most of the regionalised datasets in the background database LCA FE used are
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modelled based on the national grid mix and not based on the residual grid mix, contrary to EPA
recommendation.8
For the use phase, the residual electricity grid-mix for the US market and the reference year 2022 was
used.

Table 3-12: Electricity mixes used for different processes and lifecycle stages

Process Region Lifecycle Background dataset from LCA FE

stage

Laptop Assembly (Taiwan) {TW} A3 CN: Electricity grid mix Sphera

Use phase (USA) {US} B6 US: Electricity grid mix Sphera

End of Life USA {US}; B6 US: Electricity grid mix Sphera

3.6 Reference Year

The foreground system was modelled based on annual product data for the reference year 2022.

3.7 Criteria for the exclusion of inputs and outputs

The foreground system was modelled on base of a detailed bill of material (BOM) of the product,
containing all relevant physical specifications and other technical information for single components
and material fractions. Where necessary and appropriate further in-depth physical inspections (e.g., X-
ray, grinding) where carried out. Due to the complexity of the inventory, we assume measurement or
classification errors of single components and materials to be less than 1 wt.-% of total product
weight.
No primary process and manufacturing data could be obtained from the upstream supply chain and
assembly phase, so the completeness of the LCA model is based on the background data sets used
from secondary LCIA databases. Where possible, additional material inputs (e.g., material cut-offs in
the manufacture of the laptop covers) were accounted for by estimation and adjustment in the
background data sets.

8
Greenhouse Gas Inventory Guidance. Indirect Emissions from Purchased Electricity (S. 20). (2016). United States Environmental
Protection Agency (EPA).

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4 Life cycle inventory

4.1 Data collection and calculation procedures

Depending on availability and relevance, different data collection methods are used to specify the
product system and related processes, which is described as a multi-stage process in Figure 4-1. A
general and exemplary description can be found in the following sections, specific collection
procedures and assumptions for individual modules or components can be found in Chapter 4.5.

Figure 4-1: Data collection procedure for component specification at Fraunhofer IZM

The data collection has two main objectives: The first is to describe the product system as completely
as possible (e.g. mass, number of components, component types and materials, etc.). The second is to
collect as much primary data as possible on the origin and production methods of the various
components, or to make plausible approximations that will later allow modelling that is as granular
and accurate as possible. As the availability of primary data is relatively scarce or not always accessible
to the LCA practitioner or OEM (i.e. confidentiality, lack of supplier data, etc.), Fraunhofer IZM applies
a multi-stage collection procedure as visualized in Figure 4-1, which combines already available
information (e.g. technical datasheets, BOMs, FMDs, etc.) with dedicated technical analysis (e.g.
teardowns, IC grading, X-ray scans, etc.).
All data collection is consolidated into a comprehensive Bill of Material (BOM) for the entire product
system (including all components, packaging, etc.), where each data point is given a unique identifier
(BID) to ensure seamless documentation and appropriate modelling. The consolidated BOM list as part
of the LCA documentation is confidential and will not be published, but may be viewed by authorized
third parties upon request (see Appendix 8.1.1).

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The manufacturing phase was modelled on the basis of technical information from Framework and its
suppliers and an analysis of the actual hardware. For some modules, a bill of materials was provided
by Framework and the manufacturers of the various components. In addition, a complete teardown
of the product was undertaken to further specify components and fill data gaps. The product was first
disassembled into its various modules. Wherever possible, these modules were subsequently
disassembled into their different components and material fractions. If possible, all components and
materials where specified according to their type, quantity, material, mass, size, finishing and other
relevant information (e.g., part numbers or labels).

Figure 4-2: Teardown example of the keyboard module

When visual inspection was unclear or impossible for the LCA practitioner, expert judgment (i.e.,
internal expertise, external expertise) and additional literature searches were conducted to gather
modeling data.
Electronic components on the PCBAs were additionally investigated using microscopic imaging
techniques (see Figure 4-3), as well as x-rays (see Figure 4-5). For the biggest and most relevant ICs,
grinding techniques were used to further investigate the material structure and identify the die size
within the chips (Figure 4-5).
For the assessment, the life cycle assessment software Sphera LCA for Experts (LCA FE) with its own
database (at its 2023.1 version), the electronics extension as well as the ecoinvent 3.8 (ei3.8) database
was used. If data is used from additional sources, this is specifically mentioned in the description of the
unit processes in Chapter 4.5)

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Figure 4-3: Microscopic image and measurements of connectors

Figure 4-4: X-ray scan of a RAM module

Figure 4-5: Cross-section view of a grinded multilayer PCB and two ICs

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4.2 Background data
The LCA software Sphera LCA for Experts (version 10.7.0.183) and the corresponding database,
including the "Electronics" extension database (both in their version 2023.1), are used for modelling.
This is supplemented by the ecoinvent v3.8 (ei3.8) database and other databases for processes where
no suitable Sphera dataset is available.
Due to the complexity of the LCA model, which consists of 891 individual plans and processes, only
an aggregated summary of the data sets used from secondary LCIA databases can be presented in this
section (see Table 4-1).

Table 4-1: Summary of used background datasets from secondary LCIA databases

Database Process datasets total Process datasets unique

pcs. % pcs. %

Datasets from secondary 669 100% 187 100%

LCIA databases

Datasets from Sphera LCA 525 78% 133 71%

FE

Datasets from ecoinvent 101 15% 36 19%

Other databases 43 6% 18 10%

A detailed list of the background data used can be found in the appendix of this report (see Appendix
8.1.3).

4.3 Data quality

Due to the complexity of the inventory and the lack of specific primary data for upstream processes,
the assessment of overall data quality will be descriptive and qualitative.
Life cycle assessment (LCA) requires accurate, relevant, and representative data to ensure the credibility
of results. The quality of data used in an LCA can significantly influence the outcomes, making it crucial
to understand the sources, reliability, and appropriateness of the data employed.
 Primary Data: This refers to original data collected directly from the source, specific to the
processes or products being assessed, which includes the specific data for the energy intensity
of manufacturing or material used for a single process or component.
 Secondary Data: These are data obtained from existing sources, such as literature, LCIA
databases, and previous studies. While they might not be specific to the exact processes or
products in question, they can be adjusted and tailored to fit the requirements of the current
LCA.
The study faced challenges in accessing primary data for all upstream processes, particularly regarding
the specific energy intensity or material used to produce specific electronic components. However,
based on a comprehensive product teardown and other primary product data from Framework and
some suppliers (e.g. mainboard), an accurate and detailed bill of materials (BOM) could be compiled
(see Data collection and calculation procedures in Chapter 4.1.).
In the absence of primary process data, the following steps were taken to ensure the robustness of the
LCA model:

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 1. Use of secondary datasets: Secondary datasets were sourced from respected LCIA
databases. These databases contain aggregated data from multiple studies and are a credible
source of industry averages (see previous Section 4.2).
2. Adjustment to fit specifications: Recognizing that secondary data may not perfectly match
the component specifications, adjustments were made to these data sets and documented in
detail for the unit processes (see Chapter 4.5). Adjustments were based on known
relationships, scaling factors, or other relevant parameters to ensure that the data were as
close as possible to the specific components. Particularly dominant impact contributors, such
as ICs, were specified in detail through extensive physical inspection.
Using secondary data with adjustments offers a pragmatic approach to address data gaps. However,
it's important to recognize that:
 There's an inherent level of uncertainty associated with using adjusted secondary data.
 The results should be interpreted with caution, especially when making direct comparisons or
drawing definitive conclusions.
 Further studies or updates to this LCA could benefit from more specific primary data, if
available in the future.

4.4 Allocations
No co-product allocations had to be made in the model, but could be part of the background datasets
from LCA FE9 and ecoinvent.10 When possible, datasets where used that avoid allocation or substitution
via cut-off approach.
4.4.1 Use of secondary materials
In the manufacturing of the products secondary aluminium is partly used for the manufacturing of the
cover but not considered due to lack of background data in the LCA model.
Secondary products and material could be part of the intermediary products from the upstream supply
chain and background datasets used in the LCA model.
4.4.2 Allocation for reuse, recycling and recovery
According to the cut-off, waste content approach, all burdens attributed to the product system,
without giving credits for the energy and material recovery.
Packaging waste from up- and downstream processes will be incinerated without credits for the energy
and thermal recovery.
In the modelling of the end-of-life of the notebook and external power supply (EPS), a collection rate
of 100% after the use phase was assumed. All burdens for the treatment of waste are assigned to the
product system, without credits for energy and material recovery.

9
See: Kupfer, T., Baitz, M., Colodel, C. M., Kokborg, M., Schöll, S., Rudolf, M., Bos, U., Bosch, F., Gonzalez, M., Schuller, O.,
Hengstler, J., Stoffregen, A., Thylmann, D., & Koffler, C. (2021). GaBi Databases & Modelling Principles. sphera.
https://sphera.com/wp-content/uploads/2020/04/Modeling-Principles-GaBi-Databases-2021.pdf

10
Weidema, B., Bauer, C., Hischier, C., Mutel, C., Nemecek, T., Reinhard, J., Vadenbo, C., & Wernet, G. (2013). Overview and
Methodology. Data quality guideline for the ecoinvent database version 3 (Ecoinvent Report 1(v3)). The ecoinvent Centre.

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4.5 Unit processes
The presentation of the unit processes is mainly based on screen shots of the LCA software Sphera
LCA for Experts (LCA FE) and additional descriptions. In the screenshots it can be seen how data from
the BOM and process activities (foreground system) is mapped to LCI data from the background data
(background system) used. As direct impact measurements of environmental impacts of processes from
the foreground system are rarely possible in practice, LCIA databases such as LCA FE and ecoinvent
provide inventory data of real-world processes that can be used as a proxy to classify and characterize
the environmental profile of the specific process.
Life cycle data sets were allocated to all parts based on weight (mechanical parts), number of pieces
(electronic components) or size/area (e.g. printed circuit boards). For reasons of confidentiality, the
data presented here does not allow any precise conclusion to be drawn about specific component
information which is not already public or critical for business interest (e.g., part number,
manufacturer). In addition, similar components from the BOM can be clustered together (e.g., screws
of different size) or aggregated (resistors with same size and resistance etc.). Where possible and
appropriate, the screenshots contain references to the respective BOM components with the help of a
unique identification number, which follows the scheme "BID-XXX". The BOM is not publicly disclosed
but may be disclosed to a third party under certain conditions as part of an independent critical review
(see Appendix 8.1.1).
The modelling is based on the assumptions declared in Chapter 3.4.1 and availability and quality of
background data sets. The individual approach for each module and component group is described in
the following sections.
4.5.1 Laptop Lifecycle (A-C)
Lifecycle stages where modelled across hierarchical plan levels, that allow the aggregation and nesting
of detailed plans.

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 4.5.1.1 Complete Lifecycle (A-C)
Figure 4-6 shows the top-level plan for all life cycle stages considered in this study.

Figure 4-6: Overview of the top-level plan for the lifecycle the product from gate to grave

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 4.5.1.1 Cradle to gate (A1-A3)
Figure 4-7 shows the detailed plan of the cradle-to-gate system boundary of the product system and
its nested sub-plans.

Figure 4-7: Overview of the cradle to gate model

4.5.2 Components and modules (A1)

The components and modules are described in the following sections. Approaches across modules,
especially for printed circuit boards and electronics components are described in section 4.5.2.17 to
4.5.2.20.

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 4.5.2.1 Cover and housing

Cover assembly and sub-modules

The cover is modelled based on four sub-modules (see screenshot below), which are described
separately in the following sections.

Figure 4-8: Overview of the Cover assembly model on LCA FE

The data for the modelling was provided by Framework, and the LCA practitioner used a teardown to
further specify and weight the different material fractions. The energy used in the final assembly of
the cover and chassis is not part of this modelling stage and is considered as an aggregated factor in
the final assembly stage of the Framework Laptop (see Chapter 4.5.5).

Bezel
The bezel is a plastic component that acts as an intermediary, anchoring the display module to the top
cover. This component is not only plastic but is also integrated with stainless steel components for the
connection of the LCD cover.

Figure 4-9: Overview of the Bezel production model in LCA FE

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The plastic is sourced from Covestro's Bayblend range.11 For LCA modelling, the plastic is composed of
100% virgin ABS and polycarbonate in a 35:65 ratio of recycled to virgin content. Optimal blend
considerations for ABS-PC, based on mechanical properties and cost analysis, favoured a 40:60
ratio12,13, which was subsequently incorporated into the model. Recent research highlights the
effectiveness of incorporating recycled content into polycarbonate (PC).14 Empirical evidence suggests
that the addition of virgin ABS polymer and a suitable compatibilizer can significantly improve the
properties of recycled PC/ABS blends (60/40%), potentially allowing over 57% recycled PC content,
with selected blends achieving up to 75% recycled content.

Figure 4-10: Overview of the PC-ABS model in LCA FE

Top Cover (LCD-Cover)

The top cover, also referred to as the LCD cover, is the protective outer casing that houses and secures
the display screen. For the modelling, the top cover was disassembled and all major component where
specified and weighted. The primary material of the cover is metal, supplemented by a minor presence
of foam. In the analysis, the foam was disregarded and the entire weight was accredited to the metal
component. Incorporated within the cover are several magnets. To account for their weight, a single
magnet was weighed and its weight was then subtracted from the overall weight of the cover.

11
https://solutions.covestro.com/de/products/bayblend/bayblend-fr3040-r35_00021925-05125431?SelectedCountry=US

12
https://doi.org/10.1016/j.polymertesting.2023.107969

13
https://www.researchgate.net/publication/237602272_MECHANICAL_PROPERTIES_OF_HIGH_IMPACT_ABSPC_BLENDS_-
_EFFECT_OF_BLEND_RATIO

14
Ebd.

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The metal used for the top cover is an aluminium alloy of type AL6063. For further details on this alloy,
please refer to the ALUMERO technical data sheet.15

Figure 4-11: Overview of the Top Cover model in LCA FE

Base cover
The base cover, also termed the bottom casing or chassis, is the protective underside panel that shields
the internal components, also providing access points for upgrades and maintenance.

15
https://www.alumerogroup.eu/fileadmin/user_upload/downloads/technologien/legierungen/ALUMERO_Legierungen-EN-
AW-6063-AlMg0_web.pdf

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Figure 4-12: Overview of the Base Cover model in LCA FE

The back of the laptop consists of a metal plate, magnets, and several plastic parts. The magnets were
removed and weighed. It was not possible to separate all factions during the disassembly; therefore,
the composition of the back cover was estimated to be 25% plastic and 75% metal. The plastic is
glued to the back cover and is used primarily as a mounting base for other modules, such as the
mainboard. The plastics was specified as to be the same blend as described before in the Bezel section.
At the outer side the back cover contains some plastic bottom feet. Expansion card covers, protection
slots for expansion cards and their screws are considered in the model. In addition, all screws to for
the general case were included.

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The metal used for the back cover is an aluminium alloy of type AL5052RC H32. For further details on
this alloy, please refer to the technical data sheet16.

Palmrest cover
The palmrest cover consists as the other cover parts of mainly stamped aluminium and injection-
molded plastic parts. Additionally, it includes two small copper sheets.

Figure 4-13: Overview of the Palmrest Cover model

Display hinge
The display hinge is a pivotal mechanism that allows the top cover to open and close smoothly while
providing structural support and maintaining the screen's desired position. Amount in the screenshots
below is only for one hinge each, as they were set to 2 in the cover assembly model

16
https://www.matweb.com/search/DataSheet.aspx?MatGUID=96d768abc51e4157a1b8f95856c49028&ckck=1

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Figure 4-14: Overview of the Display hinge model in LCA FE

4.5.2.2 Mainboard
The mainboard module was divided in two parts: the heatsink and fan on the one hand, and the PCB
on the other. Additionally, five screws are present on the mainboard module.

Figure 4-15: Overview of the mainboard model in LCA FE

Mainboard PCB
The mainboard PCB was modelled based on the BOM provided by Framework Computer Inc. RAM
and storage module are included as separate modules, see sections 4.5.2.7 and 4.5.2.8.
The board itself is a 12 layer board with an outer area of 229.5 cm2. Cut-outs were included in the
production as the area of the PCB was produced (see section 4.5.2.17). The sub-board for the
processor has a rectangular shape of 12.2 cm2 and assumed to have two layers. Electronic components
were modelled with generic datasets for electronic components from the Sphera data base according
to the BOM, supported by microscope and x-ray analysis of main components. An assembly process
was added based on the size of the mainboard, excluding cut-outs.
The lithium manganese button cell on the mainboard was modelled with an existing data set scaled
by weight.

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Aluminium parts and connectors were modelled based on material composition and weight.

Figure 4-16: Overview of the mainboard PCB model in LCA FE

Fan and Heatsink

The fan and heatsink in detail consist of fan, heatsink, PCB with some electronic components, cables
and housing. Screws were modelled as fixing materials based on weight. The PCB was modelled as a
single-layer PCB scaled by area according to the outer rectangular. Passive electronic components were
scaled according to weight and one IC was scaled according to the packaged area.
The connector was scaled based on the number of pins (see section 4.5.2.18).
The heatsink consists of copper, aluminium and plastic. The fan consists of copper coils, a magnet and
plastic. Exact material composition was not available and based on teardown.

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Figure 4-17: Overview of the heatsink and fan model in LCA FE

4.5.2.3 Keyboard
The keyboard consists of a flex board covering almost the full area of the keyboard, 78 LEDs, a steel
base plate, screws, a connector and several plastic parts.
Weights and materials were determined through the teardown of the keyboard. The flex board was
modelled as a single layer PCB with an area of 305.2 cm2. The connectors were scaled according to
the number of pins. LEDs were modelled with a Sphera dataset scaled by weight. The base plate was
modelled as a steel plate with a stamping process. Manufacturing of the full plate was assumed and
cut-offs assumed to be closed-loop recycled. Keys are assumed to be PET.

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Figure 4-18: Overview of the keyboard model in LCA FE

4.5.2.4 Fingerprint module

The finger print module was modelled based on the BOM and the teardown. It consists mainly of the
sensor, the glass cover and housing as displayed in Figure 4-19.

Figure 4-19: Overview of the fingerprint model in LCA FE

The fingerprint sensor consist of a 4-layer PCB, a connector a some electronic components as displayed
in Figure 4-20.

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Figure 4-20: Overview of the fingerprint PCB model in LCA FE

4.5.2.5 Touchpad Kit

The touchpad was modelled based on the BOM and the teardown and consists of flex PCBs with
electronic components and connector, housing and cover glass as displayed in Figure 4-21.

Figure 4-21: Overview of the touchpad model in LCA FE

4.5.2.6 Display
The Display Kit is made up of several submodules, which are stacked on top of each other to form
several layers. Each submodule has been modelled separately.
 Display holder
 Display cable and connectors
 Display PCB and components
 Display backlight

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  Display panel
The following section describes the display modelling process. Figure 4-22 shows an overview of the
display model and top-level plan created in LCA FE, including the nested sub-modules from the list
above.

Figure 4-22: Overview LCA FE model Display

The weight of the complete display including PCB and cable is 182g.

Display holders
The Display is attached to the case with two display holders. These were modelled using an aluminum
sheet process. Figure 4-23 shows the LCA FE model of these holders.

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Figure 4-23: LCA FE model of Display holders 17

Display cable and connectors

The Display cable consists of two connectors and one connecting cable and is used to attach the Display
PCB to the mainboard. The connecting cable contains 25 individual wires with a diameter of 0.29 mm
each. It was modelled using a generic data set from the LCA FE database.
The modelling of the connectors is described in Section 4.5.2.18. Figure 4-24 shows an overview of
the LCA FE model for the Display cable, which is further detailed in Figure 4-25.

Figure 4-24: LCA FE model of the Display cable

17
The following figures display excerpts from our LCA and calculation software which is set to the German standard data format.
This means a comma is used instead of a point as a decimal separator.

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Figure 4-25: Details of the Display cable modelling

Display PCB
The display module contains a rectangular PCB. PCBs are conventionally modelled according to the
number of layers and outer dimension (smallest rectangular). The PCB has an area of 22.8 cm2
(22,8x1cm).
In addition, a small flex cable is used to connect the PCB to the display panel, which is modelled using
a single layer PCB. The modelling of the passive components is described in section 4.5.2.19, the
connectors on the PCB in section 4.5.2.18, the ICs in 4.5.2.20.
An overview of the display PCB modelling is shown in Figure 4-26.

Figure 4-26: Overview of the Display PCB model in LCA FE

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Display Backlight
The display backlight consists of a flex PCB with 54 small SMD-LEDs and 12 capacitors. The flex PCB
was modelled using a single layer PCB and has an area of 11.56 cm2. The modelling of the capacitors
is described in section 4.5.2.19. The LEDs were modelled using an appropriate dataset from the LCA
FE.
The overview over the modelling process of the Display Backlight is given in Figure 4-27. Details are
listed in Figure 4-28.

Figure 4-27: Overview of Display backlight modelling in LCA FE

Figure 4-28: Details on the modelling of the Display backlight in LCA FE

Display Panel
LCA FE does not contain a suitable LCD data set for a display panel. The ei3.8 dataset for a display is
from 2001 and therefore outdated and of limited applicability for a laptop display. Instead, the display
is modelled according to a CSR report of the Taiwanese display manufacturer AUO (AUO 2021) in
combination with matching datasets from ei3.9.
The data is scaled to the size of the panel, which in the case of the Framework Laptop is 609 cm2
(29x21cm). An overview of the full display panel model can be found in Figure 4-29.

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Figure 4-29: Overview of the Display panel model in LCA FE

The core of the display panel was modelled using AUO data. AUO data covers Scope 1 (direct
emissions) and Scope 2 (purchased energy). Scope 3 includes product use, business travel and
commuting, but does not include the impact of upstream suppliers and is therefore not considered.
Data includes panel manufacturing without backlight and electronics (display board), which were
modelled separately.
The data adopted for the LCA model from the AUO CSR report is shown in Table 8-1 in the Appendix
of this report. Data points marked blue were transferred, the others were excluded from the model.
An overview over the modelling of the Display panel core is given in Figure 4-30. Details can be found
in Figure 4-31.

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Figure 4-30: Overview of the model of the Display panel core

Figure 4-31: Details on the inputs and outputs of the Display panel core model

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The Scope 2 greenhouse gas (GHG) emissions (from purchased energy) reported by AUO are not
directly used, but the energy consumption via the corresponding processes (electricity generation, LPG,
gas, diesel) is included to cover other impact categories. Purchased electricity for the manufacturing
process is included as electricity from Taiwan.
Scope 1 emissions fed into the model as elementary flows only cover impacts for the GWP category.
This data set forms the core of the display panel. In addition, polarisation filters and the front glass of
the display were added using appropriate data from ei3.9 (see Figure 4-29 for an overview).
4.5.2.7 Storage
For the storage module no BOM or material information was available. It was assessed through
teardown, microscope images, x-ray and grinding of the main ICs.
The PCB is as double layer PCB with an area of 17.6 cm2. Passive components were identified via
microscope and modelled according to section 4.5.2.19. Contact areas on the board were measured
via microscope and modelled as nickel-gold plating. The thickness of contacts was based on the results
of a literature and market research18.
The die size of the main ICs was identified through x-ray and grinding:
 2 storage ICs: 4.23852 cm2 die area each
 Controller IC: 0.4671 cm2
 DRAM Cache: 0.2046 cm2
Additional smaller ICs were scaled by package area.

Figure 4-32: Overview of the storage model

18
For example: https://docs.rs-online.com/ba92/A700000008668318.pdf & https://www.rutronik.com/pl.html?id=1132&L=11

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 4.5.2.8 RAM
For the RAM module no BOM or material information was available. It was assessed through teardown,
microscope images, x-ray and grinding of the main ICs. Two memory modules exist per laptop, so the
production plan (Figure 4-33) is set to 2 in the laptop production plan.
The PCB is an 8-layer PCB as determined via grinding with an area of 20.7 cm2. Passive components
were identified via microscope and modelled according to section 4.5.2.19. Contact areas on the board
were measured via microscope and modelled as nickel-gold plating. The thickness of contacts was
based on the results of a literature and market research19.
The die size of the main ICs was identified through x-ray and grinding:
 8 Memory ICs: 0.485 cm2 die area each
 Controller IC: 0.0165 cm2 die area

Figure 4-33: Overview of the RAM model

4.5.2.9 Webcam
The webcam was modelled based on the BOM and the teardown. It consists of a flex cable (modelled
as single layer PCB), connector and PCB with image sensor.

19
For example: https://www.futurlec.com/Memory/62256.shtml ; https://www.westercom.eu/en/ddr4-
memory/6338/advantech-aqd-d4u4gn32-sp.html & https://www.simms.co.uk/PDFS/Products/dram/Innodisk_DRAM_At-a-
Glance.pdf

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The 6-layer PCB was modelled as 8 layer PCB (as no 6-layer PCB data set was available). The connector
was scaled by the number of pins, ICs were scaled according to the package area. The image sensor
was modelled according to the die area assuming two stacked dies (sensor and logic). The two
microphones in the camera were modelled with existing Sphera data sets for SMD microphones. LEDs
were scaled by area. The lens is modelled as borosilic glass. The ambient light sensor is based on a 2-
layer sub-board.

Figure 4-34: Overview of the webcam model

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Figure 4-35: Overview of the webcam PCB model

4.5.2.10 Speaker kit

The speaker kit consists of two identical speakers connected with a cable. The individual speaker
consists of a polycarbonate case, a coil, metal casing and vibration damper.

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Figure 4-36: Overview of the single speaker

Figure 4-37: Overview of the speaker module

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 4.5.2.11 WiFi module
The model was based on the tear down and x-ray of the WiFi module. No BOM or further material and
manufacturing data were available. The holder is modelled as stainless steel sheet. Screws are modelled
with generic Sphera datasets for fixing material. Both are scaled per weight
The WiFi PCB is modelled as 8-layer PCB. Contact areas were measured via microscope and modelled
as nickel-gold contacts. The ICs were modelled based on package area as no information on the die
size was available.

Figure 4-38: Overview of the WiFi module

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Figure 4-39: Overview of the WiFi PCB model

4.5.2.12 Audio jack

The audio jack was modelled based on a tear down, microscopic images and x-rays. It consists of a
rigid and a flex PCB, screws, connectors and the actual audio jack (plug). Screws were modelled with
Sphera datasets for fixing material. The rigid PCB is modelled as 8-layer PCB based on x-rays. The flex
PCB is modelled as single layer PCB. The audio jack itself is based on material composition from
literature (Sanchez, Proske & Baur, 2022).

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Figure 4-40: Overview of the audio jack model

Figure 4-41: Overview of the audio jack PCB model

4.5.2.13 Battery
The battery was modelled based on literature data on chemical composition plus energy consumption
for manufacturing scaled by weight of the battery (Sanchez, Proske & Baur, 2022). Additionally, a
connector and battery management system was added as two pieces based on Sanchez, Proske &
Baur, 2022. Production takes place in China.

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Figure 4-42: Overview of the battery model

4.5.2.14 Expansion Cards (EC)

Two different expansion cards with an USB-A and USB-C connector were included in the modelling
for the laptop.
The ECs are modelled based on tear down, microscopic images and x-rays. No BOM or further material
and manufacturing information was available.
The casing of the expansion cards is assumed to be the same material as of the whole laptop. The
PCBs are modelled as 4-layer boards based on the x-ray images. The card-to-board connectors are
modelled as USB-C plugs based on literature material composition (Sanchez, Proske & Baur, 2022).
The USB-A connector is modelled based on material composition by TE connectivity20.

Figure 4-43: Overview of the expansion card model – USB-C

20
Full material composition:
https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Product+Compliance%7FMD_29
2303-2%7FD%7Fpdf%7FEnglish%7FENG_PC_MD_292303-2_D.pdf%7F292303-2

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Figure 4-44: Overview of the expansion card PCB model – USB-C

Figure 4-45: Overview of the expansion card model – USB-A

Figure 4-46: Overview of the expansion card PCB model – USB-A

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Figure 4-47: Overview of the expansion card model – USB-A connector

4.5.2.15 Antenna module

The antenna module consists of copper adhesive foil and two cables as displayed in Figure 4-48.

Figure 4-48: Overview of the antenna model

4.5.2.16 External Power Supply

The modelling of the external power supply (EPS) is based on a tear down. No further material or
manufacturing information were available.
The EPS consists of a plastic housing with additional steel plates inside, one major PCB with several
electronic components, a small PCB with the USB-C connector, some cables and a power plug. The
PCB was potted with a flexible plastic compound, which is modelled as TPU.

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Figure 4-49: Overview of the EPS model

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Figure 4-50: Overview of the EPS PCB model

4.5.2.17 Printed circuits boards

Some general approaches are applied across the modules. Printed circuit boards are modelled
according to the number of layers and produced board area based on Sphera datasets. As no specific
production layout were available for the Framework laptop boards, the smallest rectangular of irregular
shapes was considered for the impact of the board production.
Additionally, assembly processes were modelled with a generic Sphera dataset. That process is also
modelled per board area. Here, only the specific final board area (without cut-offs) is modelled. Solder
(SnAgCu) is added to all printed circuit boards. As no specific information is available on the amount
of solder paste used, 10% weight based on the populated printed circuit board assembly is added.
4.5.2.18 Connectors
Due to a lack of manufacturer’s data, connectors are modelled according to a standard board-to-board
connector defined based on literature data (Sanchez, Proske & Baur, 2022). These connectors were
assumed to be 40-pin press-fit connectors, mainly consisting of copper for the contacts and nickel or
tin for the plating. The different connectors were then scaled by pin number.
Most modules are connected to the mainboard by flex cables, which have been modelled separately
as one-layered PCBs.
USB plugs were also modelled according to material compositions from literature (Sanchez, Proske &
Baur, 2022).

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 4.5.2.19 Passive components
Passive components were modelled using suitable generic datasets from the LCA FE electronics
extension and scaled by the number of pieces. If necessary, components were rescaled based on weight
and size:
 Diodes, oscillators: scaled by volume
 Inductors, filters and switches: scaled by area
 Resistors, capacitors: scaled per weight
Chip resistors were modelled according to FMD of a chip resistor. In lack of suitable dataset, it was
modelled as a normal resistor (size 0402, scaled by weight) and the amounts of silver and palladium
used were added manually to account for the increase in ADP by these precious metals.
4.5.2.20 Integrated Circuits (ICs)
The environmental impact of integrated circuits is mainly driven by the processed die area within the
package. However, identifying the die size is time-consuming. Therefore different approaches are
applied, depending on the available information:
 “Average” ICs: PCBs were x-rayed. If die size could be measured via x-ray, suitable datasets
from the LCA FE electronics extension were selected and rescaled by die area. If die size could
not be identified via x-ray, ICs were modelled based on type and package area.
 Main ICs (mainly on RAM and storage, plus selected ICs from the mainboard) were x-rayed
and grinded if necessary to determine the die size. The die size of the processor were based
on public technical information.21 Suitable datasets from the LCA FE electronics extension were
selected and rescaled by die area.
Not all package types were available in the Sphera LCA FE data base, so similar types were used as
proxys.
4.5.3 Product Packaging and accessories (A1)
All associated packaging materials from up- and downstream processes have been included.
For the upstream components no primary data was available. The estimated weight of the packaging
material was calculated as approximately 12% of the aggregate weight of the laptop, its accessories,
and related extension cards. The composition of this estimated packaging was determined to be 80%
cardboard and 20% PE foil (see Figure 4-51).

21
https://www.techpowerup.com/cpu-specs/core-i5-1240p.c2583

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Figure 4-51: Model for packaging materials for the upstream components

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The material specifications for the final device, including its accessories (downstream packaging) and
related extension card, were derived from measurements taken during the teardown and aggregated
in a single process (see Figure 4-52).

Figure 4-52: Model for downstream packaging materials for the final Laptop

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The Framework Laptop comes with a screwdriver kit to open and replace individual modules. Due to
the lack of primary data, the modelling was done with generic data sets from the background
databases based on the material fractions.

Figure 4-53: Overview of the model for the production of the screw driver kit

4.5.4 Transports of intermediary product (A2)

The modelling scenarios of upstream transports are described in detail in Chapter 3.4.1.2 and are as
follows:
 Components (A1): Generic transport scenario and mix is assumed (see Figure 4-54)
 Screwdriver Kit (A1): Generic intracontinental transport (see Figure 4-55
 Downstream packaging (A1): Generic local transport (see Figure 4-56)
No specific distances are known for the transport of intermediate products (components from A1), so
an aggregated transport mix based on the components from the USA and other countries (Global
Transports) [CPU and main ICs, memory, RAM] and Asia (Intercontinental Transports) is assumed, based
on the approximate weight percentage of the components as part of the final device (see Figure 4-54).

All modes of transportation are modelled according to the assumptions in Chapter 3.4.1.2, and
background data sets are adjusted accordingly (e.g. payload, distance).

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Figure 4-54: Overview of the transport model for upstream components

Figure 4-55: Overview of the model for intracontinental transports

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Figure 4-56: Overview of the model for local transports

4.5.5 Assembly and shipping preparation (A3)

The assembly stage and shipping preparation (A) are modelled according to the assumptions in Chapter
3.4.1.3).
No primary data for the assembly process was available. A literature research was therefore conducted
to estimate the energy used during the assembly process. Energy consumption during assembly seems
to be fairly constant throughout several different ICT-product categories and was therefore estimated
at 3.89 kWh (14 MJ) for the Framework laptop, which was the literature average [e.g. Proske et al.
(2016; 2020), O’Connell & Stutz (2010), Huawei (2016; 2018-a; 2018-b; 2018-c; 2019-a; 2019-b;
2020-a; 2020-b)].

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Figure 4-57: Overview of the model for assembly of Laptop (red frame)

For the disposal of upstream packaging waste in the manufacturing stage (see Figure below), a generic
municipal waste incineration process was assumed, which is the common treatment practice in Taiwan
for packaging waste. According to the reverse cut-off approach (waste content), no credits are given
for energy recovery. Transports of upstream packaging waste from the assembly stage to waste facility
were estimated by the LCA practitioner as 80 wt-% coardboard/ 20 wt-% plastics. According to
EN50693 Chapter 4.3.2 waste Transports include a full outward journey and empty return journey by
truck and thus modelled with a utilization of payload of 50% over a single distance. The transport
distance of 100 km is estimated by the LCA practitioner based on the area coverage and number of
MWIs in Taiwan.

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Figure 4-58: EoL model for the upstream packaging as part of the assembly stage (A3)

4.5.6 Distribution and use phase (A4-B7)

The modelling scenarios for the distribution and utilization phase includes:
 The transports (A4) of the final Laptop device, the external power supply (EPS), screwdriver kit
and all packaging material from Taiwan to the point of sale (PoS) in the USA where modelled
as global transport chain according the assumptions in Chapter 3.4.1.4.
 The packaging was modelled to become waste at the point of usage (PoU) (A5) and for the
recycling a generic municipal waste incineration process was assumed.
 The operational energy usage (B6) was modelled on base of the typical energy consumption
(TEC) for the device over a period of 5 years (see further details on Chapter 3.4.1.5)

Figure 4-59: Overview of the distribution model and use phase

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4.5.7 End of Life (C2-C4)
For the EoL of the device a generic treatment for electronic equipment and products was assumed and
adjusted to the approximated material fraction determined in Chapter 3.4.1.7. The energy intensity
for shredding and sorting the device was adopted from a generic ecoinvent dataset. A 100% collection
and recycling rate is assumed.
All burdens for the incineration of plastic fractions are assigned to the product system and no credits
for energy recovery are given (cut-off, “polluter pays” principle). Shredded and sorted metal waste is
valuable good that will lose its waste status after the sorting process and no additional waste
processing is needed (e.g. melting) and no credits for material recovery are given.

Figure 4-60: Overview of the EoL of the Laptop

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Figure 4-61: Overview of the EoL of the Screwdriver

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5 Lifecycle impact assessment

The following impact assessment is based on the characterization factors of the Environmental
Footprint Reference Package 3.1 (abbreviated as EF 3.1) as implemented in the LCA Software LCA FE
by Sphera. The results of the impact assessment are relative expressions, and the impact estimate
results do not predict impacts on category endpoints or the transgression of thresholds, safety margins
or risks.
For the following impact categories, the results will be displayed and discussed in detail:
 Climate change:
o Global Warming Potential, 100 years (GWP100) in kg CO2-equivalents
 Resource depletion:
o Abiotic resource depletion (ADP) elements in kg Sb equivalents
Normalization, grouping, and weighting of the results (optional steps in the impact assessment of an
LCA) will not be applied.
The results will be presented as follows:
 Chapter 5.1 gives an overview of the aggregated LCA results per lifecycle stage
 Chapter 5.2 gives a detailed view of disaggregated LCA results for single modules and
components.

5.1 Indicators for Impact Assessment per Lifecyle Stage

This section provides the aggregated results for each lifecycle stage as described in Section 3.4.1 and
the following table.

Table 5-1: Lifecycle stages and corresponding modules codes considered in the LCA

USE
PRODUCT STAGE DISTRIBUTION END OF LIFE STAGE
PHASE
Manufacturing/

De-installation
Cradle to gate
Raw materials

Installation at
intermediary

Transport to

Operational
energy use

processing
Fulfilment
Transport

Transport
products

Disposal
center

Waste
total.

PoU

PoU
and

PoS

at

A1 A2 A3 A1-3 A4 A5 B6 C1 C2 C3 C4

The following Table 5-1 provides the aggregated results for each life cycle phase and sub-
phases/modules for the target impact categories of GWP and ADPe.
The total impact for the Framework Laptop is estimated to be a GWP of 200 kg CO2e and an ADPe of.
1.7E-02 kg Sb-e.

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Table 5-2: Impact contribution per lifecycle stage and process

GWP ADPe
Lifecycle Stage
[kg CO2 eq.] [kg Sb eq.]
A1 - Preproducts 128.74 1.73E-02
A1, Laptop 123.60 1.66E-02
A1, EPS 2.06 7.02E-04
A1, Packaging Downstream 2.65 1.46E-05
A1, Packaging Upstream 0.39 1.35E-06
A1, Screwdriver 0.04 1.73E-07
A2, Transports 0.44 2.61E-08
A3 - Assembly 3.19 1.35E-07
A3, Electricity 3.11 1.34E-07
A3, EoL Upstream Packaging 0.08 4.18E-10

A1-3 -Cradle to gate 132.37 1.73E-02

A4 - Transport to PoS* 18.93 1.16E-06
A5 - Installation at PoU* 0.05 2,42E-09
B6 - Usage 47.42 3,05E-0,6
C2 - Transport to EoL 0.01 7,24E-10
C3 - EoL 0.97 5,01E-08

A-C - Cradle to grave 199.75 1,73E-02

* PoS = Point of Sale; PoU = Point of Use

The cradle-to-gate, meaning the manufacturing and raw material acquisition phase has the highest
impact in both impact categories. Separating in the phases production, use, transport (over the whole
life cycle) and end-of-life, the results are displayed in Figure 5-1 showing that especially the resource
use is almost exclusively caused by the production phase. Use phase follows in its relative contribution,
although this is only a relevant order of magnitude for GWP. For EoL, only impacts were considered
and no credits for recycling were given, so this phase also has a small contribution. Transport has a
smaller impact, mainly caused by the distribution (A4) and less by transports during the manufacturing
phase (A2) or to EoL treatment (C2).

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Figure 5-1: Relative impact of life cycle phase to the total impact per impact category

100%
90%
80%
70%
EoL
60%
Transport
50%
Use
40%
Production
30%
20%
10%
0%
GWP ADPe

5.2 Indicators for Impact Assessment per components and modules

The relative impact of the production (A1, A3) is displayed in the following Figure 5-2 (rest includes all
modules with an individual contribution <1.5% in both impact categories). The highest contribution
to the GWP has the display module, whereas the ADPe is mainly influenced by the RAM (and thereby
by the assumed amount of gold on the connector of the RAM bar). Mainboard and storage have also
a significant impact in both impact categories.

Figure 5-2: Relative impact per module to the production phase

100%
Rest
90% Packaging
80% Assembly
EPS
70%
Touchpad
60% Storage
50% Ram
40% Mainboard
Keyboard
30%
Display
20% Cover assembly
10% Battery
Antenna
0%
GWP ADPe

The absolute impact per module is displayed in Table 5-3.

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Table 5-3: Absolute impact per module

Module GWP ADPe

[kg CO2e] [kg Sb-e]

Antenna 0.69 5.96E-04

Audio jack 0.22 7.24E-05

Battery 8.46 1.06E-04

Cover assembly 8.93 3.74E-05

Display 36.20 5.30E-04

EC USB-A 0.19 1.09E-04

EC USB-C 0.21 1.91E-04

Fingerprint module 0.17 2.87E-05

Keyboard 4.14 2,36E-04

Mainboard 26.57 2.60E-03

Ram 18.44 9,69E-03

Speaker 0,15 7.54E-06

Storage 16.28 1.98E-03

Touchpad 2.01 2.44E-04

WiFi module 0.93 1.93E-04

EPS 2.06 7.02E-04

Assembly 3.11 1.34E-07

Packaging 3.04 1.59E-05

Screwdriver 0.04 1.73E-07

5.2.1 Display
The LCIA shows that the final global warming emissions of the raw material acquisition and production
of the display amount to 35.91 kg CO2-eq. Of these, a total of 32.65 kg CO2-eq. can be attributed to
the display panel. Detailed results for the different impact categories and components of the display
are shown in Table 5-4.

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Table 5-4: LCA Results of the Display

Impact Production Display Display Display Display Display

category total
backlight cable holder panel PCB

GWP 100 35.91 1.46 0.02 0.15 32.65 1.64

years [kg
CO2 eq.]

ADP 5.29E-04 6.20E-05 1.61E-05 1.52E-08 1.51E-04 3.00E-04

elements
[kg Sb eq.]

Figure 5-3 shows the distribution of impact on the GWP-category across the Display module. As can
be seen, the Display panel contributes by far the most to the GWP-category with a share of over 90%.
The PCB and the backlight of the display make up around 4% each, the other components are
negligible.

Figure 5-3: Contributions to GWP impact during the production phase of the display

4,57% 0,05%
4,06%
0,41%

Display_backlight
Display_cable
Display_holder
Display_panel
Display_PCB

90,90%

Figure 5-4 shows the distribution of impact on the GWP-category across the Display module. The PCB
is the main contributor for the ADPe category with a share of 56%. The panel is the second-largest
contributor with a share of 28.5%, followed by the backlight (11.7%).

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Figure 5-4: Contributions to ADPe impact during the production phase of the display

11,73%

3,04%
0,003%
Display_backlight
Display_cable
56,63% Display_holder
Display_panel
Display_PCB
28,60%

5.2.2 RAM
The RAM bar has the highest contribution to the ADPe with more than 58% of the overall production
impact and about 14% contribution to the GWP production impact. The ADPe impact is thereby mostly
caused by the connector material, mainly the gold on the edge of the RAM bar. The GWP impact is
determined by the memory ICs themselves (see Figure 5-5).

Figure 5-5: Relative impact to the RAM module

100%
90%
80%
70%
60% Rest
50% Connector contacts
40% PCB
30% ICs
20%
10%
0%
GWP ADPe

5.2.3 Cross module impacts

The impact of individual component and material types across modules are displayed in Figure 5-6
(electronic components refers to passive and active components on the printed circuit boards excl. ICs),
ICs cause the highest contribution to GWP, followed by the PCBs. The ADPe is mainly caused by the
connectors, followed by the ICs. Other electronic components have a small impact below 3% in both
impact categories.

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Figure 5-6: Relative impact of component types across modules

100%
90%
80%
70% Rest

60% Connectors
50% Aluminium
40% Electronic components
30% PCBs
20% ICs
10%
0%
GWP ADPe

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6 Life cycle interpretation and sensitivity analysis

Due to variations in the methodological approaches and data (assumptions, dataset choice, etc.), direct
comparison between LCA results should be done with care. Nevertheless, comparison is still a valuable
tool to review the methodology and modelling assumptions used. At 199 kg CO2e, the absolute impact
of the Framework Laptop, as well as the distribution across lifecycle stages, is comparable to other
laptop LCAs with similar memory and display sizes (Apple 2022; ASUS 2021 & 2022). Some LCAs do,
however, yield significantly higher impact values (Dell 2023; HP 2021; Lenovo 2022). It has to be noted,
though, that all of these assessments use a streamlined LCA-approach called “Product Attribute to
Impact Algorithm” (PAIA). Larger differences in the overall impact results are therefore most likely due
to differences in methodology and data sources rather than differences in the products themselves.
PAIA-estimations include an uncertainty range for their results and the absolute impact of the
Framework laptop is within, or very close to, the lower bound of this range for all LCAs considered.
PAIA appears to attribute a larger overall impact to the production of electronic components than
other methodologies, but no further conclusions can be drawn without deeper insight into the
algorithm.
Impact categories other than GWP are more difficult to compare as they are not addressed in many
other studies.
The results and contribution analysis show that the display module, mainboard, RAM and storage
cause the main environmental impact. This is in line with the other laptop LCAs, though the
proportions differ slightly from case to case.

6.1 Differences between LCA indicators

Impact hotspots for different LCA indicators may vary due to the different impact areas they illustrate.
In this LCA, ICs are a large contributor for both, GWP and ADPe indicator. The gold connectors for
RAM and storage module, on the other hand, contribute largely to the ADPe due to their high precious
metal content, but contribute very little to the GWP value.
Regarding data quality, both analysed impact categories are fully covered by the used Sphera LCA FE
and ecoinvent datasets. An exemption here is the display panel. As no suitable display data was
available, the display was modelled based on environmental reporting by AUO as described in section
4.5.2.6. The corporate environmental reporting is very much focused on greenhouse gas (GHG)
reporting and therefore does not specifically address the use and consumption of metals and other
resources relevant to the ADPe impact category. The modeling has attempted to address and cover
ADPe as best as possible, e.g. by including Scope 2 emissions not only as GHG emissions, but via
Sphera LCA FE data sets for the corresponding energy and electricity generation, which covers ADPe
as well. However, ADPe for the display panel (but not the other parts of the display) may be under-
represented by this approach.

6.2 Integrated Circuits

ICs are the largest contributor to the overall GWP impact of the laptop and the second largest
contributor to its ADPe. Modelling of the ICs therefore needs to be carefully evaluated. ICs are,
however, also an area where up-to-date LCA data is scarce and technology advances fast.
The die size is an important determinant of the life cycle impact of an IC, so modelling the IC based
on the die size is the method of choice. X-ray and grinding methods have been used to determine die
size. Modelling results are most accurate when an appropriate data set is selected and the die size is
adjusted. However, in many cases this was not possible, which affects the reliability of the results.

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6.2.1 Storage ICs
As mentioned above, in this study, the die size of the main ICs such as the memory ICs of the RAM
bar and the memory module were identified to model them accordingly. However, the die size is not
documented for all LCA FE IC datasets. Thus, these datasets could only be applied based on package
size (or weight, which is not applicable for ICs).
Therefore, there were two options for the memory module: model the flash IC with a NAND flash IC
dataset, which scales less accurately with package size, or use a more generic chip type (MPU22) which
scales specifically with the measured die size. The latter approach was chosen for the overall LCA result.
In Figure 6-1 a comparison is given for two methods of modelling the main storage flash ICs. Dataset
IC B was used in this model for the storage ICs. It is less suitable in type, but the die size was scaled
according to the grinding measurements and it is suitable in package type. IC A is more suitable in type
for the storage module, but since no die size was given for the data set, scaling was only possible
according to package size. As can be seen, the differences in result are significant. As there is often,
especially in highly complex BGAs, little correlation between package and die size, it seems best to
scale datasets according to die size (Billaud et al. 2023). Other sources also state die-to-package-ratios
of 30% to 80% to be on the market and found in lab testing for NAND flash chips in 2019, significantly
impacting the final results (Thinkstep, 2019).
Some packages may, however, have specific characteristics that make them less suitable for
substitutions (see section 6.2.2).

Figure 6-1: GWP and ADPe comparison of two different IC datasets from the LCA FE database for the storage
module

100%
90%
80% IC A (BGA 300,
18x13mm 1GB NAND
70%
flash)
60%
IC B (BGA 144,
50% 10x10mm MPU generic )
40%
30%
20%
10%
0%
GWP ADPe

6.2.2 RAM ICs

Another problem with the limited availability of IC datasets is that the most appropriate dataset for
the function may be in a different package type. This was the case for the RAM bar. There were also

22
Sphera data set documentation: „The MPU process technology reflects a device at the 130 nm CMOS generation with both
logic and on-chip memory, which is representative of a generic microprocessor unit.“, online: https://sphera.com/2023/xml-
data/processes/e83c9bb2-85b9-4d3a-a19f-3d47f400b1e4.xml

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two options: model the RAM with a DRAM IC dataset of a different package type (TSSOP23), scaled by
die size, or applying a more generic chip type (MPU) scaling specifically by measured die size. For the
overall result of the LCA, the latter approach was chosen.
In Figure 6-2 a comparison is given for two methods of modelling the RAM ICs. The values given are
for the total die/package size of this IC on the RAM module. Dataset IC B was used in this model. It is
of the correct package type, but less suitable in type. But die size could be scaled according to the
grinding measurements. IC C was scaled according to die size. It is most suitable in function for the
RAM bar, but of a different package type.
As can be seen in Figure 6-2 the ADPe-values are much higher for the TSSOP package, possibly due to
a larger gold-content in the package. The generic BGA-dataset was therefore chosen instead of the
DRAM TSSOP dataset for the RAM ICs.

Figure 6-2: GWP and ADPe comparison of two different IC datasets from the LCA FE database for the RAM bar

120%

100% IC B (BGA 144,

10x10mm MPU generic )
80%
IC C (TSSOP 48, 6.1x12.5
mm DRAM)
60%

40%

20%

0%
GWP ADPe

6.2.3 Processor modelling

The GWP of the processor is estimated to be 5.19 kg CO2e based on modelling with Sphera LCA FE.
However, due to innovation pace and complex processes up-to-date IC data is crucial but scarce. Imec
publishes carbon footprint data for newer technology nodes compared to Sphera LCA FE. However,
this data is not directly applicable in LCAs as it covers on only the impact category GWP and (more
importantly) does not address the whole packaged IC, but only front-end processes of the IC
manufacturing. Nevertheless, the data is used for qualitative comparison.
Data from this IC modelling tool (imec.netzero) is shown in Figure 6-3 for a die of the size of 225 mm2
manufactured in different technology nodes. The energy mix assumed is for Taiwan24. The data is
modeling data that is not based on a specific product, but the tool is used by manufacturers to assess
their environmental impact. The yield for the data points in Figure 6-3 was set to 70% to portray a
worst-case-scenario.

23
Sphera data set documentation: „IC TSSOP 48 (187mg) 6.1x12.5 mm DRAM (57 nm node).“, online: Process data set: IC
TSSOP 48 (187mg) 6.1x12.5 mm DRAM (57 nm node); front-end and back-end processing of the wafer, including Czochralski
method of silicon growing; production mix, at plant; (187mg) 6.1x12.5 mm DRAM (57 nm node) (en) (sphera.com)

24
https://netzero.imec-int.com/

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The processor of the Framework Laptop was manufactured with a 10 nm node, which IMEC lists as
having a GWP of 2.85 kg CO2e. Assuming an overhead of 30 to 50% for packaging, the IMEC data is
still lower than the LCA FE data for the IC in question25.

Figure 6-3: GWP of a die (225mm2) for different technology nodes26

4,8
4,3
3,8
kg CO2e/Die

3,3
2,8
2,3
1,8
1,3
0,8
N28 N20 N14 N10 N7 N5
Technology node

Additionally it is interesting to see the differences in GWP of different technology nodes for the
manufacturing of a die of the same size. Newer technologies need additional process steps causing
higher GWP per produced area (with more transistors on the same area). Pirson et al. conducted a
comprehensive literature research of 27 different studies on this topic. The results of their analysis
“highlight a clear increasing trend of the environmental footprint with CMOS technology downscaling
below 0.13 μm, despite a significant variation between the sources mainly due to scope mismatch.”
Additionally, they “show that environmental impacts per cm2 did not significantly decrease compared
to historical values from 1980–2010 […]” (Pirson, 2022; p.1). This highlights the need for up-to-date
lifecycle data on ICs is to produce accurate LCA results.

6.3 Display
The display module has a large effect on the overall GWP value of the laptop with a total of 36.2 kg
CO2e. Due to a lack of primary data and datasets in the database, the display panel was modelled
based on AUO environmental data.
When comparing the results of the display modelling for the Framework Laptop to other laptop LCAs
the same effect as for the absolute environmental impact can be observed. The results are in line with
some other LCAs, but are much lower than the results for display modules assessed via the PAIA
method: LCAs of the ASUS laptops under consideration state a GWP value of 25.8 and 30.6 kg CO2e
for the respective displays (ASUS 2021 & 2022). The LCA of the Lenovo and Dell laptop under
consideration, which were conducted using PAIA, state a value of 67 and 118.8 kg CO2e respectively
for the displays (Lenovo 2022; Dell 2023). Larger differences in the results are therefore again most
likely due to differences in methodology rather than differences in the products themselves.
All laptops mentioned contain a 13.5- or 14-inch display.

25
30% overhead would lead to a total GWP of 3,705 kgCO2e/die, 50% to 4,275 kgCO2e/die.

26
Data retrieved from https://netzero.imec-int.com/ on 13.09.2023

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6.4 Connectors
The RAM and storage connectors largely influence the overall ADPe results due to the rather large
amount of gold used in the contacts. Due to a lack of primary data, the area of the gold contacts was
measured using a microscope and assumptions on the coating thickness was taken from literature.
These gold contacts are, however, rather standard in these modules and coating thickness is well
documented. The assumptions the model was based on therefore seem plausible. However, the overall
ADPe result is sensitive to the assumed coating thickness. Varying the assumed coating thickness (and
thereby assumed amount of gold and nickel) by 20%, changes the overall ADP of the production phase
by about 8%, but the GWP only by about 0.5% (see Figure 6-4 and Figure 6-5).

Figure 6-4: Impact of the assumed contact thickness of the RAM bar on the overall production phase - GWP

140 Rest

120 EPS
Touchpad
100
GWP [kg CO2e]

Storage
80 Ram
60 Mainboard
Keyboard
40
Display
20 Cover assembly
0 Battery
Coating thickness Original Coating thickness - Antenna
+20% 20%

Figure 6-5: Impact of the assumed contact thickness of the RAM bar on the overall production phase - ADPe

2,0E-02 Rest
1,8E-02 EPS
1,6E-02 Touchpad
1,4E-02 Storage
ADPe [kg Sb-e]

1,2E-02 Ram
1,0E-02 Mainboard
8,0E-03 Keyboard
6,0E-03 Display
4,0E-03 Cover assembly
2,0E-03 Battery
0,0E+00 Antenna
Coating thickness Original Coating thickness
+20% -20%

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7 Conclusions

The results of the LCA show that electronics and thereby the ICs as such cause the main global warming
potential. Therefore, the functionality and performance parameter determine the overall impact much
more strongly than the overall design. Although, of course (display) size and housing material also
influence the impact, but to a smaller degree.
For ADPe, it was shown that the connector material is very important as it is a critical factor in the
modular design. A direct comparison between directly soldered memory and storage compared to
exchangeable modules was not carried out in this study, but might be interesting regarding ADPe.
However, good need-fitting customization and possible repair and especially upgradability of
functionality through the modular design is likely to be beneficial in term of service life extension.
It was shown, that up-to-date lifecycle data for electronics are crucial but scarce. Further (industry
wide) data collection on semiconductors would help to improve the quality of LCA for electronics. On
the specific level of the Framework Laptop, more primary data e.g. regarding electricity consumption
of assembly, production layouts of PCBs or specific data from battery or display suppliers could help to
improve data quality of the LCA and identify product specific eco-design options.

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8 Appendix

8.1 Life cycle inventory

8.1.1 Bill of material

Due to its scope and confidentiality, the bill of materials (BOM) is not publicly available as part of
this report. The bill of materials contains important data for the LCI of the laptop and is provided
as Appendix II. The BOM is for internal use only. Interested third parties can request further
information directly from the contractor of this study.

Annex II Version number: A2-FW-NB2022/IZM2023-1.0

8.1.2 Materials for component modelling

Table 8-1: Display panel manufacturing data by AuO [2021]

Input Total per m2
Material
Glass substrate 91,769.86 tonnes 1.35E+00 kg/m2
liquid crystal 88.60 tonnes 1.30E-03 kg/m2
Photoresist 30,120.00 kiloliters 4.43E-02 l/m2
Array stripper Usage 57,758.00 tonnes 8.49E-01 kg/m2
CF Thinner 1,957.00 tonnes 2.88E-02 kg/m2
Developer 11,385.00 tonnes 1.67E-01 kg/m2
Aluminium Etchant 8,251.00 kiloliters 1.21E-01 l/m2
PFC Usage 1,185.91 tonnes 1.74E-02 kg/m2
Energy
total consumed 19,056,414.56 GJ 2.80E+05 kJ/m2
Purchased Electricity 18,264,773.14 GJ 2.69E+05 kJ/m2
Natural Gas 668,187.88 GJ 9.83E+03 kJ/m2
LPG 26,717.99 GJ 3.93E+02 kJ/m2
Diesel 76,490.01 GJ 1.12E+03 kJ/m2
Gasoline 774,01 GJ 1.14E+01 kJ/m2
self-generated solar power 19,471.54 GJ 2.86E+02 kJ/m2
Wind power 0.00 GJ 0.00E+00 kJ/m2
Water
total 24,991.78 megaliters 3.68E+02 l/m2

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 Input Total per m2
Emissions
scope 1 79,200.00 tonnes CO2 1.16E+00 kg CO2/m2
scope 2 2,841,200.00 tonnes CO2 4.18E+01 kg CO2/m2
scope 3 1,286,100.00 tonnes CO2 1.89E+01 kg CO2/m2
ODS emissions 0.07 tonnes 1.00E-06 kg/m2
SOx 49.96 tonnes 7.35E-04 kg/m2
NOx 72.52 tonnes 1.07E-03 kg/m2
Fluorides 0 tonnes 0 kg/m2
HCl4 0 tonnes 0 kg/m2
Volatile organic compounds
(VOC) 168.46 tonnes 2.48E-03 kg/m2
Wastewater 17,280.86 megaliters 2.54E+02 l/m2
COD 574.25 tonnes 8.05E-03 kg/m2
Biochemical oxygen demand
(BOD) 56.04 tonnes 8.24E-04 kg/m2
total suspended solids 111.66 tonnes 1.64E-03 kg/m2
hazardous waste 18,099.85 tonnes 2.66E-01 kg/m2
non-hazardous waste 64,554.67 tonnes 9.49E-01 kg/m2

8.1.3 Foreground processes and mapped background datasets

Due to its scope the mapped foreground processes and used background datasets can be found in
a separate Annex I: Background data on LCA-processes and background data, which displays the
nested LCA models per column and used datasets.

Annex I Version number: A1-FW-NB2022/IZM2023-1.0

8.2 Life cycle impact assessment

8.2.1 Indicators according to PEF
Table 8-2 gives an overview of the LCA results aggregated for each lifecycle module and for all core
LCA impact categories required for reporting according to the latest recommendation on the use of
the Environmental Footprint methods by the European Commission in December 2021.27 The LCA
model uses background data from different LCIA databases, which may lead to inconsistencies and
influence the impact indicators (Pauer et al., 2020).

27
https://environment.ec.europa.eu/system/files/2021-12/Annexes%201%20to%202.pdf

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Table 8-2: Results of the LCA - Indicators according to PEF

LCA Impact Assessment Framework Laptop 2022 | EF 3.1

Indicator Unit A1 A2 A3 A1-A3 A4 A5 B6 C1 C2 C3 C4

GWP Total [kg CO2-Äq.] 1.29E+02 4.39E-01 3.19E+00 1.32E+02 1.89E+01 5.02E-02 4.74E+01 0.00E+00 1.11E-02 9.74E-01 0.00E+00

GWP-fossil [kg CO2-Äq.] 1.28E+02 4.35E-01 3.19E+00 1.32E+02 1.89E+01 4.99E-02 4.74E+01 0.00E+00 1.10E-02 9.74E-01 0.00E+00

GWP-biogenic [kg CO2-Äq.] 3.26E-01 1.08E-03 2.90E-04 3.27E-01 4.14E-03 1.53E-04 2.75E-02 0.00E+00 2.93E-05 4.74E-05 0.00E+00

GWP-luluc [kg CO2-Äq.] 1.14E-01 3.60E-03 1.96E-03 1.20E-01 2.43E-03 9.79E-05 3.00E-03 0.00E+00 1.01E-04 8.27E-06 0.00E+00

ODP [kg CFC11-Äq.] 3.46E-06 5.36E-14 1.42E-11 3.46E-06 1.62E-12 1.97E-13 2.34E-10 0.00E+00 1.42E-15 1.49E-09 0.00E+00

AP [kg SO2-Äq.] 8.63E-01 3.18E-03 1.51E-02 8.81E-01 7.39E-02 5.43E-04 9.10E-02 0.00E+00 6.39E-05 3.09E-04 0.00E+00

EP-freshwater [kg PO4-Eq.] 1.46E-02 1.43E-06 1.37E-06 1.47E-02 3.41E-06 9.64E-08 2.85E-05 0.00E+00 3.99E-08 7.53E-06 0.00E+00

EP-marine [kg N-Eq.] 1.23E-01 1.39E-03 2.40E-03 1.26E-01 3.24E-02 1.86E-04 1.50E-02 0.00E+00 2.98E-05 1.73E-04 0.00E+00

EP-terrestrial [mol N-Eq.] 1.33E+00 1.54E-02 2.61E-02 1.38E+00 3.54E-01 2.29E-03 1.62E-01 0.00E+00 3.31E-04 1.39E-03 0.00E+00

EcoTox [CTUe] 1.00E+03 4.18E+00 4.64E+00 1.01E+03 2.12E+02 3.04E-01 2.21E+02 1.00E+00 1.07E-01 9.43E+00 1.00E+00

HT-c [CTUh] 1.98E-07 8.40E-11 6.33E-10 1.98E-07 3.24E-09 1.51E-11 6.32E-09 2.00E+00 2.16E-12 1.23E-10 2.00E+00

HT-nc [CTUh] 1.57E-06 3.65E-09 1.07E-08 1.58E-06 6.22E-08 4.12E-10 1.12E-07 3.00E+00 9.62E-11 2.13E-08 3.00E+00

IR [kBq U235 eq.] 9.65E+00 1.57E-03 4.98E-02 9.71E+00 4.53E-02 4.27E-03 6.58E+00 4.00E+00 4.17E-05 6.52E-03 4.00E+00

[Disease
PM 9.18E-06 3.17E-08 1.52E-07 9.36E-06 2.23E-07 2.62E-09 6.25E-07 5.00E+00 2.46E-10 1.51E-09 5.00E+00
incidences]

POCP [kg Ethen Äq.] 3.54E-01 3.01E-03 7.10E-03 3.64E-01 8.78E-02 4.75E-04 4.28E-02 0.00E+00 5.83E-05 3.38E-04 0.00E+00

ADPF [MJ] 1.56E+03 5.81E+00 3.10E+01 1.60E+03 2.49E+02 5.59E-01 5.86E+02 0.00E+00 1.48E-01 7.31E-01 0.00E+00

ADPE [kg Sb Äq.] 1.73E-02 2.61E-08 1.35E-07 1.73E-02 1.16E-06 2.42E-09 3.05E-06 0.00E+00 7.24E-10 5.01E-08 0.00E+00

Land use [Pt] 4.31E+02 2.21E+00 4.16E+00 4.37E+02 2.16E+00 2.01E-01 7.90E+01 1.00E+00 6.21E-02 1.24E-01 1.00E+00

WDP [m³ world-Eq 3.93E+01 4.76E-03 1.01E+00 4.03E+01 7.24E-02 1.98E-01 1.08E+01 0.00E+00 1.32E-04 3.27E-02 0.00E+00

GWP = Global warming potential; ODP = Depletion potential of the stratospheric ozone layer; AP = Acidification potential of land and water; EP = Eutrophication potential; EcoTox =
Caption Ecotoxicity; HT-c = Human toxicity, cancer; HT-nc = Human toxicity, non-cancer; IR = Ionising radiation; PM = Particulate matter; POCP = Formation potential of tropospheric ozone
photochemical oxidants; ADPE = Abiotic depletion potential for non-fossil resources; ADPF = Abiotic depletion potential for fossil resources; WDP = Water (user) deprivation potential

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9 References

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products and systems

Dell 2023 Dell Technologies (2023):

HP 2021 HP Inc. (2021): Product carbon footprint HP Elite Dragonfly G2 Notebook PC

Lenovo 2022 Lenovo Group Limited (2022): Lenovo Product Carbon Footprint (PCF)
Information Sheet for the Yoga Slim 7 Carbon 13IAP7

Huawei 2016 Huawei Technologies Co., Ltd. (2016): Product Environmental Information
HUAWEI MateBook (model: HZ-W09/ HZ-W19/ HZ-W29)

Huawei 2018-a Huawei Technologies Co., Ltd. (2018): Product Environmental Information
HUAWEI MediaPad M5

Huawei 2018-b Huawei Technologies Co., Ltd. (2018): Product Environmental Information
HUAWEI MediaPad T5

O’Connell 2010 O’Connell, S., Stutz, D. (2010): Product Carbon Footprint (PCF) Assessment
of Dell Laptop – Results and Recommendations

Proske 2016 Proske, M., Clemm, C., & Richter, N. (2016). Life Cycle Assessment of the
Fairphone 2.

Proske 2020 Proske, M., Sánchez, D., Clemm, C., & Baur, S.-J. (2020). Life cycle
assessment of the Fairphone 3.

Huawei 2020-a Huawei Technologies Co., Ltd. (2020): Product Environmental Information
HUAWEI P40/P40 Pro/P40 Pro+

Huawei 2020-b Huawei Technologies Co., Ltd. (2020): Product Environmental Information
HUAWEI Mate 40/40 Pro/ 40 Pro+

Huawei 2019-a Huawei Technologies Co., Ltd. (2019): Product Environmental Information
HUAWEI P30/P30 Pro/P30 Pro+

Huawei 2019-b Huawei Technologies Co., Ltd. (2019): Product Environmental Information
HUAWEI P smart 2019

Huawei 2018-c Huawei Technologies Co., Ltd. (2019): Product Environmental Information
HUAWEI Y6 2018/Y6 Prime 2018

Fraunhofer IZM LCA Report Framework Laptop 2022 88 | 89

 Billaud 2023 Billaud, M., Clemm, C., Sanchez, D., Proske, M., Jügel, M., Stobbe, L.,
Nissen, N., Schneider-Ramelow, M. (2023). ICS AS DRIVERS OF ICT CARBON
FOOTPRINT: AN APPROACH TO MORE ACCURATE DIE SIZE ASSESSMENT

Pirson, 2022 Pirson, T., Delhaye, T.; Pip, A., Le Brun, G., Raskin, J.-P., Bol, D. (2022). The
Environmental Footprint of IC Production: Review, Analysis, and Lessons
From Historical Trends. DOI: 10.1109/TSM.2022.3228311

Thinkstep, 2019 Thinkstep (2019): Life Cycle Assessment of Dell R740

Fraunhofer IZM LCA Report Framework Laptop 2022 89 | 89