GaAs MMIC I/Q Mixer Specs
GaAs MMIC I/Q Mixer Specs
v00.1012
Conversion Gain, LSB vs. Temperature Conversion Gain, LSB vs. LO Drive
0 0
-10 -10
8 dBm
10 dBm
-15 -15 12 dBm
-20 -20
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Image Rejection, LSB vs. Temperature Image Rejection, LSB vs. LO Drive
50 50
+25 C 8 dBm
+85 C 10 dBm
IMAGE REJECTION (dBc)
40 -40 C 40
12 dBm
30 30
20 20
10 10
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
RF +25 C
-5
12 +85 C
LO
-40 C
RETURN LOSS (dB)
-10
P1dB (dBm)
-15
6
-20
3
-25
-30 0
7 8 9 10 11 12 13 8 9 10 11 12
Input IP3, LSB vs. Temperature Input IP3, LSB vs. LO Drive
35 35
mixers - i/q mixers, IRMs & Receivers - SMT
30 +25 C 30 8 dBm
+85 C 10 dBm
-40 C 12 dBm
25 25
IP3 (dBm)
IP3 (dBm)
20 20
15 15
10 10
5 5
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Isolations IF Bandwidth*
0 0
RETURN LOSS
-10 -4 CONVERSION GAIN
RF/IF2
RESPONSE (dB)
-20
ISOLATION (dB)
RF/IF1 -8
-30 LO/IF1
LO/IF2 -12
LO/RF
-40
-16
-50
-60 -20
7 8 9 10 11 12 13 0.5 1 1.5 2 2.5 3 3.5 4
RF FREQUENCY (GHz) IF FREQUENCY (GHz)
Amplitude Balance, LSB vs. LO Drive Phase Balance, LSB vs. LO Drive
3 10
8 dBm
10 dBm
AMPLITUDE BALANCE (dB)
2 12 dBm 8 dBm
PHASE BALANCE (deg)
5 10 dBm
12 dBm
1
0
0
-5
-1
-2 -10
7 8 9 10 11 12 13 7 8 9 10 11 12 13
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
-5 12 dBm 12 dBc
30
-10
20
-15
10
-20 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Conversion Gain, USB vs. Temperature Conversion Gain, USB vs. LO Drive
0 0
+25 C
+85 C
CONVERSION GAIN (dB)
-5 -40 C -5
-10 -10
8 dBm
10 dBm
-15 -15 12 dBm
-20 -20
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Image Rejection, USB vs. Temperature Image Rejection, USB vs. LO Drive
50 50
+25 C
+85 C 8 dBm
10 dBm
IMAGE REJECTION (dBc)
40 -40 C 40
12 dBm
30 30
20 20
10 10
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Input P1dB, USB vs. Temperature Input IP3, USB vs. Temperature
15 35
mixers - i/q mixers, IRMs & Receivers - SMT
+25 C 30 +25 C
+85 C
12 +85 C -40 C
-40 C
25
P1dB (dBm)
IP3 (dBm)
9
20
15
6
10
3
5
0 0
8 9 10 11 12 7 8 9 10 11 12 13
Input IP3, USB vs. LO Drive Amplitude Balance, USB vs. LO Drive
35 3
8 dBm
30 8 dBm 10 dBm
10 dBm
AMPLITUDE BALANCE (dB)
2 12 dBm
12 dBm
25
1
IP3 (dBm)
20
15 0
10
-1
5
0 -2
7 8 9 10 11 12 13 7 8 9 10 11 12 13
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
8 dBm
8 dBm 10 dBm
CONVERSION GAIN (dB)
10 dBm -5 12 dBm
PHASE BALANCE (deg)
5 12 dBm
-10
0
-15
-5
-20
-10
7 8 9 10 11 12 13
7 8 9 10 11 12 13
RF FREQUENCY (GHz) RF FREQUENCY (GHz)
30
20
10
0
7 8 9 10 11 12 13
RF FREQUENCY (GHz)
Conversion Gain, LSB vs. Temperature Conversion Gain, LSB vs. LO Drive
0 0
mixers - i/q mixers, IRMs & Receivers - SMT
+25 C
+85 C
CONVERSION GAIN (dB)
-10 -10
8 dBm
10 dBm
-15 -15 12 dBm
-20 -20
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Image Rejection, LSB vs. Temperature Image Rejection, LSB vs. LO Drive
50 50
+25 C 8 dBm
+85 C 10 dBm
IMAGE REJECTION (dBc)
40 -40 C 40
12 dBm
30 30
20 20
10 10
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Input IP3, LSB vs. Temperature Input IP3, LSB vs. LO Drive
35 35
30 +25 C 30 8 dBm
+85 C 10 dBm
-40 C 12 dBm
25 25
IP3 (dBm)
IP3 (dBm)
20 20
15 15
10 10
5 5
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
-5 12 dBm 12 dBc
30
-10
20
-15
10
-20 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Conversion Gain, USB vs. Temperature Conversion Gain, USB vs. LO Drive
0 0
+25 C
+85 C
CONVERSION GAIN (dB)
-5 -40 C -5
-10 -10
8 dBm
10 dBm
-15 -15 12 dBm
-20 -20
8 9 10 11 12 13 14 8 9 10 11 12 13 14
Image Rejection, USB vs. Temperature Image Rejection, USB vs. LO Drive
50 50
+25 C 8 dBm
+85 C 10 dBm
IMAGE REJECTION (dBc)
40
IMAGE REJECTION (dBc)
40 -40 C 12 dBm
30 30
20 20
10 10
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Input IP3, USB vs. Temperature Input IP3, USB vs. LO Drive
35 35
mixers - i/q mixers, IRMs & Receivers - SMT
30 +25 C 30 8 dBm
+85 C 10 dBm
-40 C 12 dBm
25 25
IP3 (dBm)
IP3 (dBm)
20 20
15 15
10 10
5 5
0 0
8 9 10 11 12 13 14 8 9 10 11 12 13 14
8 dBc
SIDEBAND REJECTION (dBc)
8 dBm 10 dBc
10 dBm 40
CONVERSION GAIN (dB)
12 dBc
-5 12 dBm
30
-10
20
-15
10
-20 0
8 9 10 11 12 13 14 7 8 9 10 11 12 13
Conversion Gain, LSB vs. Temperature Conversion Gain, LSB vs. LO Drive
0 0
-10 -10
8 dBm
10 dBm
-15 -15 12 dBm
-20 -20
7 8 9 10 11 12 13 7 8 9 10 11 12 13
Image Rejection, LSB vs. Temperature Image Rejection, LSB vs. LO Drive
50 50
+25 C 8 dBm
+85 C 10 dBm
IMAGE REJECTION (dBc)
40 -40 C 40
12 dBm
30 30
20 20
10 10
0 0
8 9 10 11 12 13 14 8 9 10 11 12 13 14
Input IP3, LSB vs. Temperature Input IP3, LSB vs. LO Drive
35 35
30 +25 C 30 8 dBm
+85 C 10 dBm
-40 C 12 dBm
25 25
IP3 (dBm)
IP3 (dBm)
20 20
15 15
10 10
5 5
0 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13
-5 12 dBm 12 dBc
30
-10
20
-15
10
-20 0
7 8 9 10 11 12 13 7 8 9 10 11 12 13 14
Conversion Gain, USB vs. Temperature Conversion Gain, USB vs. LO Drive
0 0
+25 C 8 dBm
+85 C 10 dBm
CONVERSION GAIN (dB)
-5 -40 C -5 12 dBm
-10 -10
-15 -15
-20 -20
8 9 10 11 12 13 14 8 9 10 11 12 13 14
Image Rejection, USB vs. Temperature Image Rejection, USB vs. LO Drive
50 50
+25 C
+85 C 8 dBm
10 dBm
IMAGE REJECTION (dBc)
40 -40 C 40
12 dBm
30 30
20 20
10 10
0 0
8 9 10 11 12 13 14 8 9 10 11 12 13 14
Input IP3, USB vs. Temperature Input IP3, USB vs. LO Drive
35 35
IP3 (dBm)
20 20
15 15
10 10
5 5
0 0
8 9 10 11 12 13 14 8 9 10 11 12 13 14
8 dBm 8 dBc
10 dBm 40 10 dBc
CONVERSION GAIN (dB)
-5 12 dBm 12 dBc
30
-10
20
-15
10
-20 0
8 9 10 11 12 13 14 8 9 10 11 12 13 14
Outline Drawing
NOTES:
1.. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED
PLASTIC SILICA AND SILCON IMPREGNATED.
2.. LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.
3.. LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.
4.. DIMENSIONS ARE IN INCHES [MILLIMETERS].
5.. LEAD SPACING TOLERANCE IS NON-CUMULATIVE.
6.. PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL
BE 0.05mm MAX.
7.. PACKAGE WARP SHALL NOT EXCEED 0.05mm.
8.. ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED
TO PCB RF GROUND.
Package Information
Part Number Package Body Material Lead Finish MSL Rating [2] Package Marking [1]
H1056
HMC1056LP4BE RoHS-compliant Low Stress Injection Molded Plastic 100% matte Sn MSL1
XXXX
[1] 4-Digit lot number XXXX
[2] Max peak reflow temperature of 260 °C
Pin Descriptions
Pin Number Function Description Interface Schematic
These pins are not connected internally; however, all data
Evaluation PCB
mixers - i/q mixers, IRMs & Receivers - SMT
Notes: