NASA Acceptance Criteria MPI
NASA Acceptance Criteria MPI
Engineering Directorate
April 2020
Revised and
Reviewed by: Signature on File 04/07/2020
David Stanley Date
Materials and Processes Branch/ES4
Revised and
Reviewed by: Signature on File 04/07/2020
Norman Ruffino Date
Materials and Processes Branch/ES4
Revised and
Reviewed by: Signature on File 04/07/2020
Miles Skow Date
Materials and Processes Branch/ES4
REVISIONS
VERSION CHANGES DATE
Baseline Original version 7/22/99
A Reviewed document per QMS requirements. Updated 12/19/02
division name, organization codes, and document
numbers.
B Deleted SNT-TC-1A and MSFC-STD-1249. Added 02/14/07
NASA-STD-5009 and NASA-STD-5019.
C Revised 4.0 References (added SNT-TC-1A and SOP 02/23/10
009.86), 9.0 Training and Certification of Personnel
(added SNT-TC-1A and SOP 009.86)
D Deleted SOP-009.86 from paragraph 4.0. Revised 6/29/2011
paragraph 9.0 for uniformity across all NDE PRCs.
E Reviewed document per QMS requirement. Updated 04/1/2020
document signatures. Added requirements for Standard
Magnetic particle inspection per NASA-STD- 5009. 1.0
Scope – Added “detection of surface or slightly
subsurface discontinuities”. 2.0 Applicability – Added
“detect cracks, laps, seams, inclusions”. 3.0 Usage –
Added “Continuous Method” in inspection note for flight
hardware. 3.1 Inspection Sequence – Replace “should”
with “shall”. Added “Fasteners with ultimate tensile
strength of 160 ksi (36 HRC) or higher that are
electroplated shall be inspected after the electroplating
operation”. 3.2 Special NDE of Fracture Critical
Components added “Continuous Method” in Special
NDE inspection note. 6.1 General – Added “A
Quantitative Quality Indicator (QQI) shall be used to
validate local field intensities. Hall Effect probes are
acceptable provided they are verified with a QQI”. 6.3
Fracture Critical Components – deleted “c”; added
“When a Hall Effect probe is used to validate field
intensities, readings shall be correlated with a QQI in an
equivalent part location”. 7.0 Special NDE Qualification
deleted “NASA-STD-5003 or SSP 30558”.
10.0 Definitions – 90/95 deleted “lower” and “bound”.
1.0 SCOPE
2.0 APPLICABILITY
3.0 USAGE
The magnetic particle inspection note for flight hardware and critical ground
equipment is given below.
A magnetic particle inspection note for non-critical ground equipment using the
acceptance criteria in MIL-STD-1907 is given below.
The engineering drawing or referencing document shall indicate the criteria by which
components are judged acceptable. Where acceptance criteria are not otherwise
specified the following criteria shall apply:
b. Single rounded indications – a single rounded indication greater than 0.030 inches in
diameter shall be cause for rejection of the component.
c. Multiple rounded indications - two or more rounded indications each less than
0.030 inches in diameter but separated by less than 0.030 inches shall be
cause for rejection of the component.
4.0 REFERENCES
The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. All documents listed are assumed to be the current
revision unless a specific revision is listed. In the case of conflict between this
specification and the technical requirements cited in other referenced documents,
the requirements of this document take precedence.
6.1 GENERAL
A detailed written procedure shall be prepared for each part to be inspected. The
procedure shall meet the requirements of this specification and shall ensure the
consistency and reproducibility of the inspection at the required sensitivity level.
General procedures covering a variety different parts may be used provided they
meet the requirements of this specification and clearly apply to the parts to be
inspected. When general procedures are used, a written part specific technique shall
be prepared. At a minimum, the part specific procedure or the general procedure and
part specific technique shall cover all the information required by ASTM E 1444.
For work performed at JSC facilities, written procedures should consist of Detailed
Process Instructions (DPIs) selected for use from the DPI-6505-XX series of work
instructions.
c. When a Hall Effect probe is used to validate field intensities, readings shall
be correlated with a QQI in an equivalent part location. Pie gages are not
acceptable for verifying field strength.
Personnel performing acceptance inspections of Class I, II, IIIW and GSE hardware
shall be qualified and certified, at a minimum, to Level 2 in accordance with NAS 410.
Personnel performing acceptance inspections requiring Special NDE shall also be
qualified and certified for Special NDE in accordance with NASA-STD-5009.
10.0 DEFINITIONS
90/95 The point where the 95% lower confidence bound on the
Probability of Detection (POD) vs. flaw size curve crosses
90% POD or 90% POD with 95% confidence.
Final Inspection The final inspection performed for the acceptance of the
component.
Rounded Indication Penetrant indication with a length to width ratio of less than
3:1.