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Assignment - 3

The document discusses bending of rectangular and square plates, mechanical vibration theory for microaccelerometer design, thermal stresses induced in micro devices, finite element analysis for stress analysis, damping coefficients in squeeze film and shear resistance, determining minimum thickness of a circular diaphragm pressure sensor, thin film mechanics, bending of square plates with equations, and determining equivalent spring constant and natural frequency of a cantilever beam element.

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10 views2 pages

Assignment - 3

The document discusses bending of rectangular and square plates, mechanical vibration theory for microaccelerometer design, thermal stresses induced in micro devices, finite element analysis for stress analysis, damping coefficients in squeeze film and shear resistance, determining minimum thickness of a circular diaphragm pressure sensor, thin film mechanics, bending of square plates with equations, and determining equivalent spring constant and natural frequency of a cantilever beam element.

Uploaded by

bk097027
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Module-3

1. With relevant diagram, explain the concept of bending of rectangular plate.


Write mathematical expressions for bending moments and bending stresses.
2. Explain the concept of bending of square plates with all edges fixed. Give
equations for maximum stress, maxinpum deflections, stress at the center of plate
and strain at the centre of plate.
3. Explain the theory of mechanical vibration for microaccelerometer design
considering mass- spring system. Also mention expressions for X(t), the
instantaneous position of the mass for different situations.
4. Write a note on thermal stresses induced in micro devices for a bar with fixed
ends and bimaterial strip subject to temperature change.
5.Explain the input information to FEA and output in stress analysis from FEA
along with equations.
6. With a neat schematic explain damping coefficients in i) Squeeze film ii) Shear
resistance. Also mention the resistance force Fd expression.
7. Determine the minimum thickness of the circular diaphragm of a mictopressure
sensor made of silicon shown in Fig. Q5b). The diaphragm has a diameter of
600µm and its edge is rigidly tixed to the silicon die. The diaphragm is designed
to withstand a pressure of 20MPa without exceeding the plastic yielding strength
of 7000MPa Assume Young's modulus E-190.000MPa and Poisson's ratio V =
0.25

8. Write a short note on Thin film mechanics

9. Explain the concept of bending of square plates with all edges fixed. Give
equation for maximum stress, maximum deflection stress at the centre of the plate
and strain at the centre of plate.
10. Determine the equivalent spring constant K and the natural frequency W, of a
cantilever beam element in a micro accelerometer shown in Fig. 06(b) The beam
is made of silicon with a Young's modulus of 190.000MPa.

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