FSC-BT691 Datasheet

BLE 5.1 Single Mode Bluetooth Module

Datasheet Version 1.5

Shenzhen Feasycom Technology Co.,Ltd -1- www.feasycom.com

 FSC-BT691 Datasheet

Copyright © 2013-2023 Feasycom Technology. All Rights Reserved.

Feasycom Technology reserves the right to make corrections, modifications, and other changes to its
products, documentation and services at anytime. Customers should obtain the newest relevant
information before placing orders. To minimize customer product risks, customers should provide
adequate design and operating safeguards. Without written permission from Feasycom Technology,
reproduction, transfer, distribution or storage of part or all of the contents in this document in any form is
prohibited.

Revision History
Version Data Notes
1.0 2020/07/25 Initial Version Marsh
1.1 2020/09/24 EEPROM changes Flash Marsh
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1.2 2021/01/05 Add FCC,CE,IC,SRRC Certificate Marsh

1.3 2021/04/29 Update Marsh
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1.4 2022/05/04 Update Mechanical Details Marsh

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1.5 2023/02/10 Update Reset Description Marsh

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Contact Us
Shenzhen Feasycom Co.,LTD

Email: [email protected]

Address: Rm 508, Building A, Fenghuang Zhigu, No.50, Tiezai Road,

Xixiang ,Baoan District,Shenzhen,518100,China.
Tel: 86-755-27924639,86-755-23062695

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 FSC-BT691 Datasheet

Contents
1. INTRODUCTION ........................................................................................................................................................... 4

2. GENERAL SPECIFICATION ............................................................................................................................................. 5

3. HARDWARE SPECIFICATION ...................................................................................................................................... 6

3.1 BLOCK DIAGRAM AND PIN DIAGRAM ......................................................................................................................................... 6

3.2 PIN DEFINITION DESCRIPTIONS ................................................................................................................................................. 7

4. PHYSICAL INTERFACE ................................................................................................................................................... 8

4.1 POWER SUPPLY....................................................................................................................................................................... 8

4.2 RESET ................................................................................................................................................................................... 8
4.3 GENERAL PURPOSE ANALOG IO ................................................................................................................................................. 8
4.4 GENERAL PURPOSE DIGITAL IO .................................................................................................................................................. 8
4.5 RF INTERFACE ........................................................................................................................................................................ 9
4.6 SERIAL INTERFACES .................................................................................................................................................................. 9
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4.6.1 UART........................................................................................................................................................................... 9
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4.6.2 I2C Interface .............................................................................................................................................................. 10

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5. ELECTRICAL CHARACTERISTICS ................................................................................................................................... 10

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5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................................................................... 10

5.2 DC ELECTRICAL CHARACTERISTICS ............................................................................................................................................ 11
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5.3 AC ELECTRICAL CHARACTERISTICS ............................................................................................................................................ 11

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6. MSL & ESD ................................................................................................................................................................ 11

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7. RECOMMENDED TEMPERATURE REFLOW PROFILE ..................................................................................................... 12

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8. MECHANICAL DETAILS ............................................................................................................................................... 13

8.1 MECHANICAL DETAILS ............................................................................................................................................................ 13

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9. HARDWARE INTEGRATION SUGGESTIONS .................................................................................................................. 14

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9.1 SOLDERING RECOMMENDATIONS ............................................................................................................................................. 14

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9.2 LAYOUT GUIDELINES (INTERNAL ANTENNA) ................................................................................................................................ 14

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9.3 LAYOUT GUIDELINES(EXTERNAL ANTENNA) ................................................................................................................................ 15

9.3.1 Antenna Connection and Grounding Plane Design .................................................................................................. 15

10. CERTIFICATE ............................................................................................................................................................ 17

10.1 FCC CERTIFICATE .............................................................................................................................................................. 17

10.2 IC CERTIFICATE................................................................................................................................................................. 18
10.3 CE CERTIFICATE ................................................................................................................................................................ 21
10.4 SRRC CERTIFICATE............................................................................................................................................................ 22

11. PRODUCT PACKAGING INFORMATION...................................................................................................................... 24

11.1 DEFAULT PACKING ............................................................................................................................................................... 24

11.2 PACKING BOX(FOR REFERENCE ONLY) .................................................................................................................................... 25

12. APPLICATION SCHEMATIC ........................................................................................................................................ 26

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 FSC-BT691 Datasheet

1. INTRODUCTION

Overview 144 kB ROM

Clock-less hibernation mode: 270 nA
FSC-BT691 is Bluetooth Low Energy (BLE) 5.1 Module.
10-bit ADC for battery voltage monitoring
integrating a 2.4 GHz transceiver and an ARM® Cortex-
Built-in temperature sensor for die temperature
M0+TM microcontroller with a RAM of 48 kB and a One-
monitoring
Time Programmable (OTP) memory of 32 kB.
TX: 3.5 mA, RX: 2.2 mA (system currents
It can be used as a standalone application processor or as with DC-DC, VBAT_HIGH =3 V and 0 dBm)
a data pump in hosted systems. Programmable transmit output power from
-19.5 dBm to +2.5 dBm
Very low active RF, MCU current and low-power mode -94 dBm receiver sensitivity
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current consumption provide excellent battery lifetime Support SPI, UART, I2C interface
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and allow for operation on small coin cell batteries and in Support the OTA upgrade
energy-harvesting applications. Wide Operating Voltage Range:1.65V to 3.6V
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Operating Temperature: -40°C to +85°C

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The BLE firmware includes the L2CAP service layer

protocols, Security Manager (SM), Attribute Protocol
Application
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(ATT), the Generic Attribute Profile (GATT), and the Medical applications
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Generic Access Profile (GAP). All profiles published by the

Disposables
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Bluetooth® SIG as well as custom profiles are supported.

Beacons
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The device is suitable for disposables, wireless sensor Proximity tags and trackers
nodes, beacons, proximity tags and trackers, smart HID
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Smartwatches
devices (stylus, keyboards, mice, and trackpads), toys,
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and medical and industrial applications. Human interface devices (HID)

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Industrial appliances
Features
Module picture as below showing
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2.4-GHz RF Transceiver Compatible With Bluetooth

Low Energy (BLE) 5.1
Supports up to three BLE connections
Typical cold boot to radio active 35 ms
16 MHz 32-bit ARM® Cortex-M0+ with
SWD interface
Dedicated Link Layer Processor
AES-128 Encryption Processor
32 kB One-Time-Programmable (OTP)
Figure 1: FSC-BT691 Picture
48 kB Retainable System RAM
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 FSC-BT691 Datasheet

2. General Specification
Table 1: General Specifications
Categories Features Implementation
Bluetooth Version Bluetooth Low Energy 5.1
Frequency 2.400 - 2.483.5 GHz
Wireless
Transmit Power -19.5 dBm to +2.5 dBm
Specification
Receive Sensitivity -94 dBm (Typical)
Modulation GFSK
TX, RX, CTS, RTS
General Purpose I/O
UART Interface Default 115200,N,8,1
Baudrate support from 1200 to 921600
5, 6, 7, 8 data bit character
7 (maximum – configurable) lines
GPIO Pull-up resistor (25 KΩ) control
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Host Interface and Read pin-level

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Peripherals I2C Interface 2 (configurable from GPIO total). Up to 400 kbps

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Analog input voltage range: 0.4V ~ 1.4V(or 2.4V) based on configure

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Supports single 10-bit SAR ADC conversion

ADC Interface
3 channels (configured from GPIO total)
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Up to 200MSPS conversion
2 PWM outputs
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PWM Supports edge-alignment or center-alignment

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Supports fault detection

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Class Bluetooth No Support

Profiles
Bluetooth Low Energy GATT Client & Peripheral - Any Custom Services
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FW upgrade J-Link
Wide Supply Voltage Supply 1.65V ~ 3.6V
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Power Consumption 1.6uA (Sleep)

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Physical Dimensions 10mm X 11.9mm X 2mm; Pad Pitch 0.8mm

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Operating -40°C to +85°C

Environmental
Storage -40°C to +85°C
Lead Free Lead-free and RoHS compliant
Miscellaneous
Warranty One Year
Humidity 10% ~ 90% non-condensing
MSL grade: MSL 3
Human Body Model ±2000V
ESD grade:
Charged Device Model ±2500V

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 FSC-BT691 Datasheet

3. HARDWARE SPECIFICATION
3.1 Block Diagram and PIN Diagram

External antenna
UART
RC network
(optional)

I2C
32MHZ
Crystal
Bluetooth chip:
oscillator
DA145xx
AIO
GPIO/ADC MCU：M0+

VDD
Reset
1.8V ~ 3.3V Flash
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Figure 2: Block Diagram

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RF 20
GND 19
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1 PIO8/UART_TX PIO11 18
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2 PIO9/UART_RX PIO5 17
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3 NC NC 16
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4 NC PIO7 15
5 PIO6 PIO2 14
6 RESET NC 13
7 VDD NC 12
8 GND NC 11
PIO2
NC

9 10

Figure 3: FSC-BT691 PIN Diagram(Top View)

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 FSC-BT691 Datasheet

3.2 PIN Definition Descriptions

Table 2: Pin definition
Pin Pin Name Type Pin Descriptions Notes
1 PIO8 I/O Programmable input/output line
UART_TX O Serial Transmitter Data
2 PIO9 I/O Programmable input/output line
UART_RX I Serial Receiver Data
3 NC NC (Do not connect to any pin)
4 NC NC (Do not connect to any pin)
5 PIO6 I/O Programmable input/output line
ADC2 I Analog to Digital Converter input 2.
6 RESET I RST active Low hardware reset (default).
7 VDD VDD Power supply voltage 1.8V-3.3V 
8 GND Vss Power Ground
9, 13 NC NC (Do not connect to any pin)
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10,14 PIO2 I/O Programmable input/output line

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ADC1 I Alternative Function: Analog to Digital Converter input 1.

11,12 NC NC (Do not connect to any pin)
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15 PIO7 I/O Programmable input/output line

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ADC3 I Alternative Function: Analog to Digital Converter input 3.

16 NC NC (Do not connect to any pin)
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17 PIO5 I/O Programmable input/output line

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18 PIO11 I/O Programmable input/output line

19 GND Vss Power Ground
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20 RF O RF signal output .
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 FSC-BT691 Datasheet

4. PHYSICAL INTERFACE
4.1 Power Supply

The transient response of the regulator is important. If the power rails of the module are supplied from an external
voltage source, the transient response of any regulator used should be 20μs or less. It is essential that the power rail
recovers quickly.

4.2 Reset

Comprises a reset (RST) pad which is active low. It contains an RC filter with a resistor of 65 kΩ and a capacitor of 3.5
pF to suppress spikes. It also contains a 25 kΩ pull-down resistor. This pad should be driven externally by a field-effect
transistor (FET) or a single button connected to VBAT. The typical latency of the RST pad is in the range of 2 μs.

4.3 General Purpose Analog IO

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The FSC-BT691 is equipped with a high-speed ultra-low-power 10-bit general purpose Analog-to-Digital
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Converter (GPADC). It can operate in unipolar (single ended) mode as well as in bipolar (differential) mode. The
ADC has its own voltage regulator (LDO) of 0.9 V, which represents the full-scale reference voltage.
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10-bit dynamic ADC with 125 ns typical conversion time

Maximum sampling rate 1 Msample/s
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128x averaging; conversion time 1 ms, up to 11b ENOB

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Ultra-low power (20 uA typical supply current at 100 ksample/s)

Two single-ended or two differential external input channels (GPIOs)
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Battery, DCDC outputs, and the internal VDD monitoring channels

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Chopper function
Offset adjust
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Common-mode input level adjust

Configurable attenuator: 1x, 2x, 3x and 4x
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Input shifter
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4.4 General Purpose Digital IO

There are 6 general purpose digital IOs defined in the module. All these GPIOs can be configured by software to realize
various functions, such as button controls, LED drives or interrupt signals to host controller, etc. Do not connect them if
not use.

The I/O type of each I/O pins can be configured by software individually as Input or Push-pull output mode. After the
chip is reset, the I/O mode of all pins is input mode with no pull-up and pull-down enable. Each I/O pin has an individual
pull-up and pull-down resistor which is about 30 kΩ ~ 50 kΩ for VDD and Vss.

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 FSC-BT691 Datasheet

4.5 RF Interface
The Radio Transceiver implements the RF part of the BLE protocol. Together with the Bluetooth 5.1 PHY layer, it
provides up to 93 dB RF link budget for a reliable wireless communication. All RF blocks are supplied by on-chip low-
drop out-regulators (LDOs). The bias scheme is programmable per block and optimized for minimum power
consumption.

Single ended RFIO interface, 50Ω matched

Alignment free operation
-94 dBm receiver sensitivity
Configurable transmit output power from -19.5 dBm up to 2.5 dBm
Ultra-low power consumption
Fast frequency tuning minimizes overhead

4.6 Serial Interfaces

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4.6.1 UART
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FSC-BT691 provides one channels of Universal Asynchronous Receiver/Transmitters (UART)(Full-duplex asynchronous

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communications). The UART Controller performs a serial-to-parallel conversion on data received from the peripheral and
a parallel-to-serial conversion on data transmitted from the CPU.
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This is a standard UART interface for communicating with other serial devices. The UART interface provides a simple
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mechanism for communicating with other serial devices using the RS232 protocol.
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When the module is connected to another digital device, UART_RX and UART_TX transfer data between the two devices.
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The remaining two signals, UART_CTS and UART_RTS, can be used to implement RS232 hardware flow control where
both are active low indicators.
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This module output is at 3.3V CMOS logic levels (tracks VCC). Level conversion must be added to interface with an RS-
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232 level compliant interface.

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Some serial implementations link CTS and RTS to remove the need for handshaking. We do not recommend linking CTS
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and RTS except for testing and prototyping. If these pins are linked and the host sends data when the FSC-BT691 deasserts
its RTS signal, there is significant risk that internal receive buffers will overflow, which could lead to an internal processor
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crash. This drops the connection and may require a power cycle to reset the module. We recommend that you adhere
to the correct CTS/RTS handshaking protocol for proper operation.

Table 3: Possible UART Settings

Parameter Possible Values
Minimum 1200 baud (≤2%Error)
Baudrate Standard 115200bps(≤1%Error)
Maximum 921600bps(≤1%Error)
Flow control RTS/CTS, or None
Parity None, Odd or Even
Number of stop bits 1 /1.5/2
Bits per channel 5/6/7/8

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 FSC-BT691 Datasheet

When connecting the module to a host, please make sure to follow .

TX RX
RX TX

RTS CTS
Module CTS RTS Host

GND GND

Figure 4: UART Connection

4.6.2 I2C Interface

The I2C Interface is a programmable control bus that provides support for the communications link between Integrated
Circuits in a system. It is a simple two-wire bus with a software-defined protocol for system control, which is used in
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temperature sensors and voltage level translators to EEPROMs, general-purpose I/O, and A/D and D/A converters.
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Two-wire I2C serial interface consisting of a serial data line (SDA) and a serial clock (SCL)
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Clock synchronization
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32 locations deep transmit/receive FIFOs (32× 8-bit Rx and 32× 10-bit Tx)
Master transmit and Master receive operation
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Slave transmit and Slave receive operation

7-bit or 10-bit addressing
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7-bit or 10-bit combined format transfers

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Bulk transmit mode

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Default slave address of 0x055

Interrupt or polled-mode operation
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Handles bit and byte waiting at both bus speeds

Programmable SDA hold time
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DMA support
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5. ELECTRICAL CHARACTERISTICS
5.1 Absolute Maximum Ratings
Absolute maximum ratings for supply voltage and voltages on digital and analogue pins of the module are listed below.
Exceeding these values causes permanent damage.

The average PIO pin output current is defined as the average current value flowing through any one of the corresponding
pins for a 100mS period. The total average PIO pin output current is defined as the average current value flowing through
all of the corresponding pins for a 100mS period. The maximum output current is defined as the value of the peak current
flowing through any one of the corresponding pins.

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 FSC-BT691 Datasheet

Table 4: Absolute Maximum Rating

Symbol Description Min Trp Max Unit
VDD BT Input voltage -0.2 - 3.6 V
VI Input voltage -0.2 - 3.6 V
VO Output voltage VSS - VDD_H V
TOP Operating Temperature -40 - 85 °C
TSTG Storage Temperature -50 - 150 °C

Note: Exceeding one or more of the limiting values may cause permanent damage to FSC-BT691.
Caution: Electrostatic sensitive device, comply with protection rules when operating.

5.2 DC Electrical Characteristics

Table 5: Voltage and current
Symbol Parameter Min Type Max Unit Test Conditions
VDD-VSS - DC Power Supply 1.8 3.3 V TA=25°C
TA - Operating Temperature -40 25 +85 °C -
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I1 Standby Current in Sleep mode - 1.6 - uA 48K+RCX

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VOH Output high level voltage VDD-0.3 - VDD V -

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VOL Output low level voltage VSS - VSS+0.3 V -

VIH Input high level voltage 1.8 - 3.3 V -
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VIL Input low level voltage VSS - VSS+0.3 V -

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5.3 AC Electrical Characteristics

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Table 6: RF
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Symbol Parameter Min Type Max Unit

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General frequency
Fop Operating frequency 2400 - 2483.5 MHz
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NCH number of channels - 40 - 1

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Transmitter
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PRF Output power -19.5 - 2.5 dBm

PBW 20dB Bandwidth for Modulated Carrier at 1Mbps - 1.5 - MHz
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Receiver
RXSENS Sensitivity (0.1%BER) @1Mbps - -94 - dBm

6. MSL & ESD

Table 7: MSL and ESD
Parameter Value
MSL grade: MSL 3
Human Body Model ±2000V
ESD grade:
Charged Device Model ±2500V

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 FSC-BT691 Datasheet

7. RECOMMENDED TEMPERATURE REFLOW PROFILE

Prior to any reflow, it is important to ensure the modules were packaged to prevent moisture absorption. New packages
contain desiccate (to absorb moisture) and a humidity indicator card to display the level maintained during storage and
shipment. If directed to bake units on the card, please check the Picture below and follow instructions specified by
IPC/JEDEC J-STD-033.
Note: The shipping tray cannot be heated above 65°C. If baking is required at the higher temperatures displayed in the
Picture below, the modules must be removed from the shipping tray.
Any modules not manufactured before exceeding their floor life should be re-packaged with fresh desiccate and a new
humidity indicator card. Floor life for MSL (Moisture Sensitivity Level) 3 devices is 168 hours in ambient environment
30°C/60%RH.

Table 8: Recommended baking times and temperatures

125°C Baking Temp. 90°C/≤ 5%RH Baking Temp. 40°C/ ≤ 5%RH Baking Temp.
Saturated @ Floor Life Limit Saturated @ Floor Life Limit Saturated @ Floor Life Limit
MSL
30°C/85% + 72 hours @ 30°C/85% + 72 hours @ 30°C/85% + 72 hours @
30°C/60% 30°C/60% 30°C/60%
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3 9 hours 7 hours 33 hours 23 hours 13 days 9 days

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Feasycom surface mount modules are designed to be easily manufactured, including reflow soldering to a PCB. Ultimately
it is the responsibility of the customer to choose the appropriate solder paste and to ensure oven temperatures during
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reflow meet the requirements of the solder paste. Feasycom surface mount modules conform to J-STD-020D1 standards
for reflow temperatures.
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The soldering profile depends on various parameters necessitating a set up for each application. The data here is given
only for guidance on solder reflow.
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250
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217
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210
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25 A B C D E

0 1 2 3 4 5 6 min

Figure 5: Typical Lead-free Re-flow

Pre-heat zone (A) — This zone raises the temperature at a controlled rate, typically 0.5 – 2 °C/s. The purpose of this
zone is to preheat the PCB board and components to 120 ~ 150 °C. This stage is required to distribute the heat uniformly
to the PCB board and completely remove solvent to reduce the heat shock to components.
Equilibrium Zone 1 (B) — In this stage the flux becomes soft and uniformly encapsulates solder particles and spread over
PCB board, preventing them from being re-oxidized. Also with elevation of temperature and liquefaction of flux, each
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 FSC-BT691 Datasheet

activator and rosin get activated and start eliminating oxide film formed on the surface of each solder particle and PCB
board. The temperature is recommended to be 150° to 210° for 60 to 120 second for this zone.
Equilibrium Zone 2 (C) (optional) — In order to resolve the upright component issue, it is recommended to keep the
temperature in 210 – 217 ° for about 20 to 30 second.
Reflow Zone (D) — The profile in the figure is designed for Sn/Ag3.0/Cu0.5. It can be a reference for other lead-free
solder. The peak temperature should be high enough to achieve good wetting but not so high as to cause component
discoloration or damage. Excessive soldering time can lead to intermetallic growth which can result in a brittle joint. The
recommended peak temperature (Tp) is 230 ~ 250 °C. The soldering time should be 30 to 90 second when the
temperature is above 217 °C.
Cooling Zone (E) — The cooling ate should be fast, to keep the solder grains small which will give a longer-lasting joint.
Typical cooling rate should be 4 °C.

8. MECHANICAL DETAILS
8.1 Mechanical Details
 Dimension: 10mm(W) x 11.9mm(L) x 2 mm(H) Tolerance: ±0.2mm
Module size: 10mm X 11.9mm Tolerance: ±0.2mm
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
 Pad size: 0.9mmX0.6mm Tolerance: ±0.1mm
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 Pad pitch: 1.1mm Tolerance: ±0.1mm

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Figure 6: FSC-BT691 footprint

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 FSC-BT691 Datasheet

9. HARDWARE INTEGRATION SUGGESTIONS

9.1 Soldering Recommendations
FSC-BT691 is compatible with industrial standard reflow profile for Pb-free solders. The reflow profile used is dependent
on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven and particular type of solder paste
used. Consult the datasheet of particular solder paste for profile configurations.
Feasycom will give following recommendations for soldering the module to ensure reliable solder joint and operation of
the module after soldering. Since the profile used is process and layout dependent, the optimum profile should be studied
case by case. Thus following recommendation should be taken as a starting point guide.

9.2 Layout Guidelines (Internal Antenna)

It is strongly recommended to use good layout practices to ensure proper operation of the module. Placing copper or any
metal near antenna deteriorates its operation by having effect on the matching properties. Metal shield around the
antenna will prevent the radiation and thus metal case should not be used with the module. Use grounding vias separated
max 3 mm apart at the edge of grounding areas to prevent RF penetrating inside the PCB and causing an unintentional
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resonator. Use GND vias all around the PCB edges.

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The mother board should have no bare conductors or vias in this restricted area, because it is not covered by stop mask
print. Also no copper (planes, traces or vias) are allowed in this area, because of mismatching the on-board antenna.
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11.9
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2.8
15
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Max.0.5
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35.5

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Max.1.0

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8.2

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no bare copper(exept solder pads for module)

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no copper and components on any layer

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no components on any layer

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do not place any conductive parts in this area

Applic. PCB
20 8

Provide solid ground plane(s) as large as possible around area

Figure 7: Restricted Area (Design schematic, for reference only. Unit: mm)

Following recommendations helps to avoid EMC problems arising in the design. Note that each design is unique and the
following list do not consider all basic design rules such as avoiding capacitive coupling between signal lines. Following
list is aimed to avoid EMC problems caused by RF part of the module. Use good consideration to avoid problems arising
from digital signals in the design.
Ensure that signal lines have return paths as short as possible. For example if a signal goes to an inner layer through a via,
always use ground vias around it. Locate them tightly and symmetrically around the signal vias. Routing of any sensitive

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 FSC-BT691 Datasheet

signals should be done in the inner layers of the PCB. Sensitive traces should have a ground area above and under the
line. If this is not possible, make sure that the return path is short by other means (for example using a ground line next
to the signal line).

9.3 Layout Guidelines(External Antenna)

Placement and PCB layout are critical to optimize the performances of a module without on-board antenna designs. The
trace from the antenna port of the module to an external antenna should be 50Ω and must be as short as possible to
avoid any interference into the transceiver of the module. The location of the external antenna and RF-IN port of the
module should be kept away from any noise sources and digital traces. A matching network might be needed in between
the external antenna and RF-IN port to better match the impedance to minimize the return loss.
As indicated in picture below, RF critical circuits of the module should be clearly separated from any digital circuits on the
system board. All RF circuits in the module are close to the antenna port. The module, then, should be placed in this
way that module digital part towards your digital section of the system PCB.

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et n
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t
n n
A A
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RF & heat
Non enmitting enmitting
Non enmitting circuits
circuits
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circuits
Digital Part

RF & heat
enmitting
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RF_IN circuits
RF_IN

Digital Part
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Digital & Analog Circuits

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Digital & Analog Circuits

PCB
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PCB
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Figure 8: Placement the Module on a System Board

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9.3.1 Antenna Connection and Grounding Plane Design

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Matching
Antenna
Network RF_IN
5mm

Figure 9: Leave 5mm Clearance Space from the Antenna

General design recommendations are:

The length of the trace or connection line should be kept as short as possible.

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 FSC-BT691 Datasheet

Distance between connection and ground area on the top layer should at least be as large as the dielectric thickness.
Routing the RF close to digital sections of the system board should be avoided.
To reduce signal reflections, sharp angles in the routing of the micro strip line should be avoided. Chamfers or fillets
are preferred for rectangular routing; 45-degree routing is preferred over Manhattan style 90-degree routing.

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n n n
A A A

PCB PCB PCB

Wrong Better Best
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Figure 10: Recommended Trace Connects Antenna and the Module

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Routing of the RF-connection underneath the module should be avoided. The distance of the micro strip line to the
ground plane on the bottom side of the receiver is very small and has huge tolerances. Therefore, the impedance of
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this part of the trace cannot be controlled.

Use as many vias as possible to connect the ground planes.
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 FSC-BT691 Datasheet

10. Certificate

10.1 FCC Certificate

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 FSC-BT691 Datasheet

10.2 IC Certificate
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TECHNICAL ACCEPTANCE CERTIFICATE

23872-FSCBT691 / 31 Dec 2020 / Rev A
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for Innovation, Science and Economic Development (ISED) Canada

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MiCOM Labs Inc. declares, on the basis of the assessment of the tests and the technical
documentation provided by the applicant that the following product complies with the
requirements of the above noted regulator.
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Product Marketing Name:

.,

FSC-BT691
Applicant Name:
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Shenzhen Feasycom Technology Co., LTD

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I hereby attest that the subject equipment was tested and found in compliance with the below noted specification.
J'atteste, par la présente, que le matériel a fait l'objet d'essai et a été jugé conforme à la spécification ci-dessous.

Gordon Hurst, Product Certifier

This Certificate is Issued under the Authority of:
Doc - Cert v2.1

MiCOM Labs Inc., 575 Boulder Court, Pleasanton, California 94566, USA
FCB Number: US0159

AGCC463 Page 1 of 3 23872-FSCBT691

Shenzhen Feasycom Co.,Ltd -18- www.feasycom.com

 FSC-BT691 Datasheet

TECHNICAL ACCEPTANCE CERTIFICATE

23872-FSCBT691 / 31 Dec 2020 / Rev A
for Innovation, Science and Economic Development (ISED)

Product Marketing Name:

FSC-BT691
Unique Product Number: FSCBT691

Applicant: Shenzhen Feasycom Technology Co., LTD, Room 2004A, 20th Floor, Huichao Technology Building, Jinhai
Road, Xixiang, Baoan District, Shenzhen , China; CN Number: 23872

ISED Representative: TianHeng Consulting Inc., 130 Terence Matthews Cres, Suite C2, Kanata, ON, K2M 0J1, Canada; CN
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Number: 11802A
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Test Lab: Attestation of Global Compliance (Shenzhen) Co., Ltd, 1-2/F, Building 19, Junfeng Industrial Park,
Chongqing Road, Heping Community, Fuhai Street, Bao'an District, Shenzhen, Guangdong, China; CN
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Number: 24842
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Wireless Test Site Open Area Test Site SAR Test Site Terminal Test Site

24842 -- -- --
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Technical Details
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Frequency Range Power

Emission
Specification Issue Technology
Designator
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From To Min. Max. Type

RSS-247 2 Bluetooth LE 2402MHz 2480MHz 1M05F1D-- 0.0007W 0.0008W Conducted
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Cahiers des Numéro de la Désignatif

charges version Technologie Gamme de fréquence d’émission Puissance
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Technical Acceptance Certificate Certificat Dacceptabilite Technique

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Company Name Nom de l'entreprise

Shenzhen Feasycom Technology Co., LTD
Certification No. No. De certification
LT

23872-FSCBT691
Issue Date / Rev Date D’émission / Rev
D.

31 Dec 2020 / Rev A

Equipment Description Description de l'équipement
Bluetooth module
Type of Equipment Type de materiel
Bluetooth Device
Spread Spectrum/Digital Device (2400-2483.5MHz)
Modular Approval
Product Marketing Name Nom du produit Marketing(PMN)
FSC-BT691

Certification of equipment means only that the equipment has met the requirements of the above- La certification du matériel signifie seulement que le matériel a satisfait aux exigences de la norme
noted specification. Licence applications, where applicable to use certified equipment, are acted on indiquée ci-dessus. Les demandes de licences nécessaires pour l'utilisation du matériel certifié sont
accordingly by the ISED issuing office and will depend on the existing radio environment, service traitées en conséquence par le bureau de délivrance d'ISDE et dépendent des conditions radio
and location of operation. This certificate is issued on condition that the holder complies and will ambiantes, du service et de l'emplacement d'exploitation. Le présent certificat est délivré à la
Doc - Cert v2.1

continue to comply with the requirements and procedures issued by ISED. The equipment for which condition que le titulaire satisfasse et continue de satisfaire aux exigences et aux procédures
this certificate is issued shall not be manufactured, imported, distributed, leased, offered for sale or d'ISDE. Le matériel à l'égard duquel le présent certificat est délivré ne doit pas être fabriqué,
sold unless the equipment complies with the applicable technical specifications and procedures importé, distribué, loué, mis en vente ou vendu à moins d'être conforme aux procédures et aux
issued by ISED. spécifications techniques applicables publiées par ISDE.

MiCOM Labs, 575 Boulder Court, Pleasanton, California 94566, USA

Tel: +1 (925) 462-0304, Fax: +1 (925) 462-0306, Web: www.micomlabs.com
AGCC463 Page 2 of 3 23872-FSCBT691

Shenzhen Feasycom Co.,Ltd -19- www.feasycom.com

 FSC-BT691 Datasheet

TECHNICAL ACCEPTANCE CERTIFICATE

23872-FSCBT691 / 31 Dec 2020 / Rev A
for Innovation, Science and Economic Development (ISED)

Technical Acceptance Certificate - Continued Certificat Dacceptabilite Technique

Host Marketing Name Nom de l'hôte marketing (HMN)
--
Hardware Version Identification Number Version Hardware numéro d 'identification (HVIN)
FSC-BT691
Firmware Version Identification Number Firmware Version numéro d 'identification (FVIN)
V1.1

Antennas

Antenna Type Manufacturer Model/Part No. Gain (dBi) Frequency Range (MHz)
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PCB Antenna Shenzhen Feasycom Technology 2.4GHZ PCB antenna 2dBi 2400-2500MHz
Co., LTD
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Doc - Cert v2.1

MiCOM Labs, 575 Boulder Court, Pleasanton, California 94566, USA

Tel: +1 (925) 462-0304, Fax: +1 (925) 462-0306, Web: www.micomlabs.com
AGCC463 Page 3 of 3 23872-FSCBT691

Shenzhen Feasycom Co.,Ltd -20- www.feasycom.com

 FSC-BT691 Datasheet

10.3 CE Certificate

T: 0086-755-2523 4088
E-mail: [email protected]
Web: Http://www.agc-cert.com

1-2/F, Building 19, Junfeng Industrial Park

Recognized by China National Accreditation Service for Chongqing Road, Heping Community, Fuhai Street
Conformity Assessment &Taiwan Accreditation Foundation Bao'an District, Shenzhen, Guangdong, China

Attestation of Conformity
Registration No. AGC03285201201E0

Applicant Shenzhen Feasycom Technology Co., LTD

Room 2004A,20th Floor, Huichao Technology Building,

Jinhai Road, Xixiang, Baoan District, Shenzhen, China

Product Designation Bluetooth module

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Brand Name Feasycom

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Model / Series Models FSC-BT691

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Manufacturer Shenzhen Feasycom Technology Co., LTD

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Room 2004A,20th Floor, Huichao Technology Building,

Jinhai Road, Xixiang, Baoan District, Shenzhen, China
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Requirement Applied Standards Document Evidence Result

Art.3.1(a) EN 62479:2010 Test Report:
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Conform
Health EN 50663:2017 AGC03285201201EH02
Art.3.1(a) Test Report:
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EN 62368-1:2014+A11:2017 Conform
Safety AGC03285201201ES01
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Art.3.1(b) ETSI EN 301 489-1 V2.2.3 (2019-11) Test Report:

Conform
EMC ETSI EN 301 489-17 V3.2.4 (2020-09) AGC03285201201EE01
Art.3.2 Test Report:
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ETSI EN 300 328 V2.2.2 (2019-07) Conform

Radio AGC03285201201EE11
.,
LT
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Signed by General Manager (King Zhang)

Issue Date: December 24, 2020

This Attestation of Conformity is recognized by Attestation of Global Compliance (Shenzhen) Co., Ltd. and made in accordance with
the RED Directive 2014/53/EU. The attestation doesn’t imply assessment of the production. The Applicant of the attestation is
authorized to use this attestation in connection with EC declaration of conformity to the Directive. The attestation is only applicable to
the equipments described above. This attestation shall not be re-produced except in full without the written approval of Attestation of
Global Compliance (Shenzhen) Co., Ltd.
Note: This attestation is part of the full test report(s) and should be used in conjunction with it. Version: 2.2

Shenzhen Feasycom Co.,Ltd -21- www.feasycom.com

 FSC-BT691 Datasheet

10.4 SRRC Certificate

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Shenzhen Feasycom Co.,Ltd -22- www.feasycom.com

 FSC-BT691 Datasheet

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 FSC-BT691 Datasheet

11. PRODUCT PACKAGING INFORMATION

11.1 Default Packing
a, Tray vacuum
b, Tray Dimension: 180mm * 195mm
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Figure 11: Tray vacuum

Shenzhen Feasycom Co.,Ltd -24- www.feasycom.com

 FSC-BT691 Datasheet

11.2 Packing box(For reference only)

* If require any other packing, must be confirmed with customer

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* Package: 2000PCS Per Carton (Min Carton Package)

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Figure 12: Packing Box

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 FSC-BT691 Datasheet

12. APPLICATION SCHEMATIC

20
RF
19
GND
UART_TX 1 18
PIO8 PIO11 PIO11
2
UART_RX
3
PIO9
NC
FSC-BT691 PIO5
17
16
PIO5/LED
NC
4 15 PIO7
VCC33 NC PIO7
5 14 PIO2
PIO6/BAT_DET PIO6 PIO2
6 13
RESET RESET NC
VBAT 1 5 7 12
VIN VOUT VDD NC
8 11
2 GND NC
GND

PIO2
C3
C1

NC
1 3 4
EN NC
4.7uF

10
4.7uF
2
U4
U3
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BAT SGM2028-3V3
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BAT_DET
Download LED KEY
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VCC33
VBAT

R11 10K
S1
TP21 VCC33 1 3

TP22
2 4 PIO7
PIO5/LED TP23 D4 GREEN/NC
R14 100R/NC
PIO5/LED IT-1100DS-250GF
R5
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330K

PIO6/BAT_DET
.,

C7
R4
100K

100nF
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RC Reset Circuit
RESET (Optional)
Motor RC Reset Circuit already included in this module.
VDD_BT

Reset Circuit Based On Voltage Dual Comparators

R4 100K R1
VBAT C22
D2 VDD_BT 10K
100nF/NC
IN4148/NC
U5
R3 10R/NC
1
2
+ RESET
3

-
3
NC
VCC

3 LZ3612 C14
PIO11 1 2
R6 1K/NC
2 Q1
GND RESET RESET 100nF
BLM2302/NC
1 U3
CN809R-2.63V

Shenzhen Feasycom Co.,Ltd -26- www.feasycom.com