FDC6325L Features

Integrated Load Switch VDROP=0.2V @ VIN=5V, IL=1.5A. R(ON) = 0.13Ω

VDROP=0.2V @ VIN=3.3V, IL=1.2A. R(ON) = 0.16Ω
General Description VDROP=0.2V @ VIN=2.5V, IL=1A. R(ON) = 0.18Ω.
This device is particularly suited for compact power SuperSOTTM-6 package design using copper lead
management in portable electronic equipment where frame for superior thermal and electrical capabilities.
2.5V to 8V input and 1.8A output current capability are
needed. This load switch integrates a small N-Channel
power MOSFET (Q1) which drives a large P-Channel
power MOSFET (Q2) in one tiny SuperSOTTM-6
package.

SOT-23 SuperSOTTM-6 SuperSOTTM -8 SO-8 SOT-223 SOIC-16

EQUIVALENT CIRCUIT
V in,R1 4 3 Vout,C1

5 Q2 V DROP

.32
+ -
IN OUT
O N / O FF 5 2 Vout,C1

Q1
O N / O FF

R1,C1 6 1 R2

pin 1
TM See Application Circuit
SuperSOT -6

Absolute Maximum Ratings TA = 25°C unless otherwise noted

Symbol Parameter FDC6325L Units
VIN Input Voltage Range 2.5 - 8 V
VON/OFF On/Off Voltage Range 1.5 - 8 V
IL Load Current - Continuous (Note 1) 1.8 A
- Pulsed (Note 1 & 3) 5
PD Maximum Power Dissipation (Note 2) 0.7 W
TJ,TSTG Operating and Storage Temperature Range -55 to 150 °C
ESD Electrostatic Discharge Rating MIL-STD-883D Human Body 6 kV
Model (100pf/1500Ohm)
THERMAL CHARACTERISTICS
RθJA Thermal Resistance, Junction-to-Ambient (Note 2) 180 °C/W
RθJC Thermal Resistance, Junction-to-Case (Note 2) 60 °C/W

© 1998 Semiconductor Components Industries, LLC. Publication Order Number:

October-2017, Rev. 2 FDC6325L/D
Electrical Characteristics (T A = 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
IFL Forward Leakage Current VIN = 8 V, VON/OFF = 0 V 1 µA
ON CHARACTERISTICS (Note 3)
VDROP Conduction Voltage Drop VIN = 5 V, VON/OFF = 3.3 V, IL = 1.5 A 0.15 0.2 V
VIN = 3.3 V, VON/OFF = 3.3 V, IL = 1.2 A 0.145 0.2
VIN = 2.5 V, VON/OFF = 3.3 V, IL = 1 A 0.13 0.2
R(ON) Q2 - Static On-Resistance VGS = -5 V, ID = -1.8 A 0.115 0.13 Ω
VGS = -3.3 V, ID = -1.6 A 0.13 0.16
VGS = -2.5 V, ID = -1.5 A 0.155 0.18
IL Load Current VDROP = 0.13 V, VIN = 5 V, VON/OFF = 3.3 V 1 A
VDROP = 0.16 V, VIN = 3.3 V, VON/OFF = 3.3 V 1
VDROP = 0.2 V, VIN = 2.5V, VON/OFF = 3.3 V 1
Notes:

1. VIN=8V, VON/OFF=8V, TA=25oC

2. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface

of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design.
3. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.

FDC6325L Load Switch Application

APPLICATION CIRCUIT

Q2

IN OUT
R1 C1

ON/OFF
Ci Q1 Co LOAD

R2

External Component Recommendation

For Co £ 1uF applications:
First select R2, 100 - 1kW, for Slew Rate control. C1 £ 1000pF can be added in addition to R2 for
further In-rush current control.
Then select R1 such that R1/R2 ratio maintains between 10 - 100. R1 is required to turn Q2 off. For
SPICE simulation, users can download a "FDC6325L.MOD" Spice model from ON Semiconductor Web
Site at www.onsemi.com

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 Typical Electrical Characteristics (TA = 25 OC unless otherwise noted )

0.5 0.5

0.4 0.4
TA = 125°C
TA = 125°C

V DROP , (V)
V DROP , (V)

0.3 0.3

TA =25°C TA =25°C
0.2 0.2

V IN =3.3V
0.1 V IN = 5V 0.1
V ON/OFF = 1.5 - 8V
V ON/OFF = 1.5 - 8V PW =300us, D≤ 2%
PW =300us, D≤ 2%
0 0
0 1 2 3 4 0 1 2 3 4
I L ,(A) I L ,(A)

Figure 1. Conduction Voltage Drop Figure 2. Conduction Voltage Drop

Variation with Load Current. Variation with Load Current.

0.5 0.6
I L = 1A
TA = 125°C V ON/OFF = 1.5 - 8V
0.5 PW =300us, D≤ 2%
0.4 V DROP ,(V) / R ON ,(Ohm)

TA =25°C 0.4
V DROP , (V)

0.3
0.3

0.2 TA =125°C
0.2

V IN =2.5V
0.1 0.1 TA = 25°C
V ON/OFF = 1.5 - 8V
PW =300us, D≤ 2%

0 0
1 2 3 4 5
0 1 2 3 4
V IN ,(V)
I L ,(A)

Figure 3. Conduction Voltage Drop Figure 4. On-Resistance Variation

Variation with Load Current. with Input Voltage.

1
TRANSIENT THERMAL RESISTANCE

0.5 D = 0.5
r(t), NORMALIZED EFFECTIVE

RθJA (t) = r(t) * R θJA

0.2 0.2
RθJA = See Note 2
0.1 0.1

0.05 P(pk)
0.05

0.02 t1
0.02 t2
0.01
TJ - TA = P * R θJA(t)
0.01
Single Pulse Duty Cycle, D = t 1/ t 2
0.005
0.00001 0.0001 0.001 0.01 0.1 1 10 100 300
t 1, TIME (sec)

Figure 5. Transient Thermal Response Curve.

Thermal characterization performed on the conditions described in Note 2.
Transient thermal response will change depends on the circuit board design.

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