Applicable Country & Regions:

All Regions

Product Service Manual – Level 1

Service Manual for BenQ:

Projector/W500
< 9J.J2K77.000 >

Version: 00a
Date:2007/04/09
Notice:
For RO to input specific “Legal Requirement” in specific NS regarding to responsibility and liability
statements.
Please check BenQ’s eSupport web site, http://esupport.benq.com, to ensure that you have the most
recent version of this manual.

First Edition (April 2007)

© Copyright BenQ Corporation 2007. All Right Reserved.
1
Content Index
Abbreviations & Acronyms………………………………………………………..……..3
About This Manual……………………………………………………..………………..4
Trademark…………………………………………………………...……………...4
Introduction……………………………………………………………………..……....4
Important Service Information………………………………………….……….....4
RoHS (2002/95/EC) Requirements – Applied to all countries require RoHS.……...4
Safety Notice…………………………....………………………....…………..…….5
Compliance Statement……………………………………………………….……..5
General Descriptions…………………………………………………………………….5
Related Service Information……………………………………………………………..5
Service Web Site…………………………………………………………………….5
Product Overview………………………………………………………………………..6
Specifications……………………………………………………………………….6
Packing……………………………………………………………………………40
Customer Acceptance……………………………………………………………..41
Disassembly/Assembly…………………………………………………………………45
Exploded View………………………………………………………………….....45
Module 1 – Total Exploded view……………………………………………….....45
Module 2 – ASSY Blower…………………… …………….. …………………….47
Module 3 – ASSY Ballast Module…………………….………………...………....48
Module 4 – ASSY Front Case…….…….……………………………...………….48
Module 5 – ASSY Lower Case………………………………………...…………..49
Disassembly / Assembly…………………………………………………………..50
Level 1 Cosmetic / Appearance / Alignment Service…………………………..………63
Visual Inspection & Cleaning…………………………………………………….63
Adjustment / Alignment Procedure………………………………………………76
Software/Firmware Upgrade Process………………………………………….....120
Level 2 Circuit Board and Standard Parts Replacement……………………………..123
System operation theory……………………………………………….……….125
LCD circuit operation theory…………………………………………………..127
Input Signal Processing Theory…………………..………..…………………...128
Cooling Circuit Operation Theory…… ……………………………………….130
Power Supply Circuit Operation Theory…….…………………………………132
Troubleshooting……………………………………….…..………………………...141
Appendix 1 – Screw List /Torque……………………………………………………148
Appendix 2 – Optical Engine RMA………………………………………………….150
Appendix 3 – DDC Data…………………………………………………………….160

2
Abbreviations & Acronyms

A
A/D Analog to Digital
B
BenQ BenQ Corporation
D
DLP Digital Light Processing / Texas Instruments®
DMD Digital Micro mirror Device
DVI Digital Video Interface
DVI-I Digital Video Interface-Integrated
P
POM Pond of Mirrors
R
RS232 Interface Between Data terminal Equipment and
Data Communications Equipment Employing
Serial Binary Data Interchange
S
SVGA Super Video Graphics Array, A screen resolution
of 800 x 600 pixels.
SXGA Super XGA. A screen resolution of 1280x1024
pixels.
V
VGA Video Graphics Array. A screen resolution of
640x480 pixels.
X
XGA A screen resolution of 1024x768 pixels.

3
About This Manual
This manual contains information about maintenance and service of BenQ products. Use this
manual to perform diagnostics tests, troubleshoot problems, and align the BenQ product.
Important
Only trained service personnel who are familiar with this BenQ Product shall perform
service or maintenance to it. Before performing any maintenance or service, the
engineer MUST read the “Important Safety Information”

Trademark

The following terms are trademarks of BenQ Corporation:

BenQ

Other companies, products, or service names may be the trademarks of their respective companies.

Introduction
This section contains general service information, please read through carefully. It should be stored
for easy access place.

Important Service Information

RoHS (2002/95/EC) Requirements – Applied to all countries require RoHS.

The RoHS (Restriction of Hazardous Substance in Electrical and Electronic Equipment Directive) is a
legal requirement by EU (European Union) for the global electronics industry which sold in EU and
some counties also require this requirement. Any electrical and electronics products launched in
the market after June 2006 should meet this RoHS requirements. Products launched in the market
before June 2006 are not required to compliant with RoHS parts. If the original parts are not RoHS
complaints, the replacement parts can be non ROHS complaints, but if the original parts are RoHS
compliant, the replacement parts MUST be RoHS complaints.
If the product service or maintenance require replacing any parts, please confirming the RoHS
requirement before replace them.

4
Safety Notice

1 Make sure your working environment is dry and clean, and meets all government safety
requirements.
2 Ensure that other persons are safe while you are servicing the product.
3 DO NOT perform any action that may cause a hazard to the customer or make the product
unsafe.
4 Use proper safety devices to ensure your personal safety.
5 Always use approved tools and test equipment for servicing.
6 Never assume the product’s power is disconnected from the mains power supply. Check that it is
disconnected before opening the product’s cabinet.
7 Modules containing electrical components are sensitive to electrostatic discharge (ESD). Follow
ESD safety procedures while handling these parts.
8 Some products contain more than one battery. Do not disassemble any battery, or expose it to
high temperatures such as throwing into fire or it may explode.
9 Refer to government requirements for battery recycling or disposal.

Compliance Statement

1. Caution: This Optical Storage Product contains a Laser device. Refer to the product
specifications and your local Laser Safety Compliance Requirements.

General Descriptions
This Service Manual contains general information. There are 2 levels of service:
Level 1: Cosmetic / Appearance / Alignment Service
Level 2: Circuit Board or Standard Parts Replacement

Related Service Information

Service Web Site

BenQ Global Service Website: http://support.benq.com/front/benqmain.asp

eSupport Website: http://esupport.benq.com/v2

5
Product Overview

Specifications

1.0 Optical Performance

2.0 Image Quality
3.0 Mechanical Specification
4.0 Packaging
5.0 Thermal Specification
6.0 Environmental
7.0 Regulatory
8.0 Reliability
9.0 Power Requirements
10.0 Panel Specification
11.0 Compatibility
12.0 Image Interface
13.0 Control Interface
14.0 User Interface
15.0 Audio
16.0 Accessories

6
 Tested under 60” (diagonal) image size +120% offset with Wide
projection lens position unless other specified. Lamp is normal
mode. Measurement Details refer to Appendix A. Reference
1.0 Optical Performance meter : BENQ RD CL200 meter (S/N 72321017) for brightness,
BENQ RD T10 (S/N 52231049)for Iris Contrast
Equipment : Benq production line (Correlation based on BenQ
RD meter)
1.1 ANSI Brightness Minimum 800 Lumens
1.2 Brightness Uniformity
1.2.1 Uniformity Minimum 60%
1.3 Contrast Ratio
1.3.1 ANSI Contrast Minimum 150:1
1.3.2 FOFO Contrast
(Iris function on) Minimum 4000:1
1.4 Light Leakage
1.4.1 Light Leakage in Active
Not Visible
Area

Not Visible, < 0.5 Lux

1.4.2 Light Leakage out of (Check light leakage of check 90” area when projecting 60”.) in
Active Area Full black pattern.

Reference meter: BENQ RD CL200 meter (S/N 72321017)

1.5 Color
(correlation data check appendix A.21)
X Y
1.5.1 White 0.307±0.04 0.362±0.04
1.5.2 Red 0.635±0.04 0.354±0.04
1.5.3 Green 0.360±0.04 0.608±0.04
1.5.4 Blue 0.134±0.04 0.051±0.04
1.6 Color Uniformity X Y
1.6.1 White 0.040 0.040
1.6.2 Red 0.040 0.040
1.6.3 Green 0.040 0.040
1.6.4 Blue 0.040 0.040
2.0 Image Quality
2.1 Throw Ratio 100”±5% Diagonal at 3.3m (Wide)
2.2 Zoom Ratio (tolerance
>1.2X
applied)
2.3 Distortion
2.3.1 Keystone Distortion <1.0%
2.3.2 Vertical TV Distortion <1.0%
2.3.3 Screen distortions within 7.5mm
Vertical: +/-120%+16%/-4%,
2.4 Projection Offset
Horizontal: +/-48.8%+16%/-4%
2.5 Focus Range
2.5.1 Visible Range 1.2~8.7 m
2.5.2 Clearly Focus Range 1.5~6 m(Spec. defined as item 2.6)
2.6 Focus
(1)If pattern can be uniformly focused, pass!
(2)If not, NG
2.6.1 区 Pattern
(3) If confusing, check 2.6.2
Viewer stands on 2m to screen.
Defocus: ≦2 pixels
2.6.2 Defocus and Flare
Flare: ≦ 4 pixels
2.6.3 Focus unbalance 30 cm
2.7 Convergence 0% and 120% offset
All other area
of 60”diagonal area

7
 R-G ≦1 ≦1.2
G-B ≦1 ≦1.2
R-B ≦1 ≦1.2
2.8 Image Quality
2.8.1 LCD Image Quality See Appendix D
2.8.2 Image Imperfection See Appendix D
3.0 Mechanical Specification
295.8 x 349 x 126.8mm (L x W x H)
3.1 Dimensions
295.8 x 349 x 109.5mm (L x W x H) without feet
3.2 Weight 4.0kg+/-0.2
3.3 Security Slot Kensington compatible slot 150N break away force
3.5 Lens Cover Attached Lens Cover
Two fast adjustable feet in front, A Fixed foot in rear. foot
3.6 Feet
Tilt:0-6∘,right/left: +2.2∘/-0.5∘
4.0 Packaging Detail refer to C309 (Packing Description)
4.1 Outside Dimensions 410 x 375 x 207(L x W x H)
4.2 Weight 5.9 Kg (Including Accessories, Projector).
4.3 Palletization 36 by Air; 1680 / 40’ container, or 840/20’ container by sea
5.0 Thermal Specification Mechanical component temperature at ambience 0~40℃
Normal surface:
5.1 Surface held or touched for Metal < 70°C; Plastic<95°C
short periods Bottom surface: @ 25° C
Metal < 55°C; Plastic<70°C
5.2 Surface which may be Metal Plastic
touched <60°C <85°C
5.3 Exhaust Air <95°C
6.0 Environmental Adhere to Appendix B
Operating 0~35°C, without condensation
6.1 Temperature
Storage -20~60°C, without condensation
Operating 10~90%RH, without condensation
6.2 Humidity
Storage 10~90%RH, without condensation
Normal mode: 31dBA @ 25°C
Typical
Eco mode: 27dBA @ 25°C
6.3 Audible Noise Level
Normal mode: 32dBA @ 25°C
Maximum
Eco mode: 28dBA @ 25°C
Operating:
6.4 Altitude 1) W/O high altitude mode:0~1499m, 0~35degC
2) With high altitude mode: 1500~3000m 0~30degC
Non-operating: 30°C @ 0~12200 feet above sea level
6.5 Shock See Appendix B2.1
6.6 Drop See Appendix B2.1
6.7 Vibration See Appendix B2.1

Safety cCSAus, TUV-GS, CCC, CB Report, PSE, GOST-R, PSB,

SASO
EMC FCC Class B requirements, C-Tick, VCCI, MIC
7.0 Regulatory CE Directive 73/23/EEC;
Marks Directive 89/336/EEC

ESD BENQ ESD Specification

8
8.0 Reliability

8.1 MTBF TBD

Normal : 2000 hours (50% brightness maintenance)
8.2 Lamp Lifetime
Eco: 3000 hours
9.0 Power Requirements Adhere to Appendix F
9.1 Power Supply (Normal) VAC 100 – 240 Universal (50/60Hz), 3 Wire Grounded
Typical 215W Max.
9.2 Power consumption
Standby 1.5W Max.
9.3 Power Connector IEC-06
10.0 Panel Specification
10.1 Type Three Chip 0.55” WXGA LCD
10.2 Pixels H: 1280 X V: 720
10.3 Color Depth 24 Bits (16770000 colors)
11.0 Compatibility Appendix E1
11.1 PC PC Compatible 640X480 Æ 1024X768, compressed 1280X1024;
Composite-Sync; Interlace Mode (8514A);
NTSC/ NTSC4.43/ PAL (Including PAL-M, PAL-N)/ SECAM/
11.2 Video
PAL60/
NTSC (480i)/ 480p/ PAL (576i)/ 576p, HDTV (720p/ 1080i/
11.3 YPbPr
1080p)
11.4 HDMI 480p/720p/1080i/1080p
11.5 DDC DDC 2B
12.0 Image Interface Adhere to Appendix E.2
15 pin D-Sub (Female) x 1
G(Y): Video amplitude 0.7/1.0 Vp-p : Impedance 75
12.1 Analog RGB Input
RB(CbCr): Video amplitude 0.7 Vp-p : Impedance 75
HD/VD/CS: TTL Level
RCA jack (Yellow)
12.2 Video Input
Video amplitude 1.0 Vp-p : Impedance 75Ω
4 pin Mini-Din (Female)
12.3 S-Video Input Y: Luminance amplitude 1.0 Vp-p : Impedance 75Ω
C: Chroma amplitude 0.268 Vp-p : Impedance 75Ω
12.4 YPbPr Input RCA jack (Green, Blue , Red) x 2
Y: Luminance amplitude 1.0 Vp-p: Impedance 75Ω
PbPr/CbCr: Chroma amplitude 0.7 Vp-p : Impedance 75Ω
19 pin HDMI type A x 1
12.5 HDMI Input
TMDS: LVDS 2.6Vp-p: Impedance 100
13.0 Control Interface
IR Receiver x2 (Front, Rear) Angle:Left Right ±15°, Up 30° Down
13.1 IR Receiver
15° ,Distance 0~8m
13.2 Serial Connector RS232 8pin Mini DIN
13.3 USB Connector For download Firmware only
14.0 User Interface Adhere to Appendix E.3
10 Keys:
14.1 Operator Keypad Power ; Source ; Exit ; Mode ; Left; Right ; Up ; Down ; Menu ;
Enter
3 LEDs:
14.2 Indicators
Power On/Off Status; Lamp Status; Temperature Status
14.3 Electric Keystone vertical keystone and adjustable range ±7°

9
 Optical Measurement
1. Scope:
This document describes critical optical related test definitions and Instructions for data or video
projectors. The other general terminologies are specified in ANSI IT7.228-1997.

2. General Requirements
1. The unit under test should be allowed to stabilize without further adjustment for a minimum of 5
minutes, at nominal ambient room temperature of 25°C, before making measurements.
2. Measurements shall take place in a light proof room, where the only source of illumination is the
projector. Less than 1 lux of the light on the screen shall be from any source other than the
projector.
3. All measurements shall be made on flat screens that do not provide any advantage to the performance
of the unit
4. All measurements shall be made at standard color temperature setting, 100% white image (per ANSI
IT7.228-1997), except where noted

3. Practical Requirements
1. When measuring contrast manually, operators should not wear white clothing since light reflected
from white clothing can influence the measurement.
2. Unless otherwise specified, the projection lens is set in the widest zoom position since zoom function
can influence the measurement.
3. Measurement should be performed with Minolta Chromameter, Model CL-100, or equivalent.

A1. ANSI BRIGHTNESS

ANSI Lumens = (L1+L2+L3+L4+L5+L6+L7+L8+L9)/9 (lux) x A (m^2)
A (Area) = W * H (m^2)
W: width of projected image (m)
H: height of projected image (m)

L10 L11

L1 L2 L3

L4 L5 L6

L7 L8 L9

L13 L12

Note: L10, L11, L12, L13 are located at 10% of the distance from corner itself to L5

A2. UNIFORMITY
Unit: %
Brightness: Default
Contrast: Default
MIN ( E10, E11, E12, E13)
L1 + L2 + L3 + L4 + L5 + L6 + L7 + L8 + L9
Uniformity = 9

10
A3. JBMA UNIFORMITY
JBMA Uniformity = Average (L1, L3, L7, L9)/ L5

A4. ANSI CONTRAST

ANSI Contrast = Average lux value of the white rectangles/Average lux value of the black rectangles

Contrast Ratio shall be determined from illuminance values obtained from a black-and-white ”chessboard”
pattern consisting of 16 equal rectangles. The white rectangles shall be at 100% gray and the black
rectangles at 0% gray. Illuminance measurements shall be made at the center of each of the rectangles.

A5. FOFO CONTRAST

FOFO Contrast = Lux value at the center of a solid white screen/the lux value at the center of a solid black
screen

A6. JBMA CONTRAST

JBMA Contrast = Average (L1,L2,L3,L4,L5,L6,L7,L8,L9) under solid white / Average
(L1,L2,L3,L4,L5,L6,L7,L8,L9) under solid black

A7. LIGHT LEAKAGE

Leakage = The maximum light leakage under a solid black pattern in or outside of the projected image

A8. IMAGE DISTORTION

Keystone = (W2-W1)/ (W1+W2) x 100%
Vertical TV dist = (H1+H2-2xH3)/2H2 x100%
Horizontal TV dist = (W1+W2-2xW3)/2W1 x100%
W1: image width at image bottom
W2: image width at image top
W3: image width at the half image height.
H1: image height at image left
H2: image height at image right
H3: image height at half image
Note:
1. Keystone and Vertical TV Distortion are recommended for Front Projection Display
2. Vertical and Horizontal TV Distortion are recommended for Rear Projection Display
W2

W3
H1 H3 H2

W1

11
A9. THROW RATIO
Throw ratio = projection distance / the width of the projected image

A10. ZOOM RATIO

Zoom ratio = maximum / minimum image diagonal size at a fixed projection distance

A11. FOCUS RANGE

The minimum/maximum focus distance is the minimum/maximum projection distance (The distance
between the outermost element of projection lens and screen), expressed in meter, at which the image is
still at its acceptable focus level.(acceptable focus level is specified by FOCUS LIMIT SAMPLE approved by
customer)

A12. COLOR
Color is expressed as (x, y) in 1931CIE chromaticity values
Note: Color is measured at the center of the screen that is entirely the measured color under default
brightness and contrast settings

A13. ANSI COLOR

ANSI Color is expressed as (u, v) in 1976 CIE chromaticity values
Note: Color is measured at the center of the screen that is entirely the measured color under default
brightness and contrast settings.

A14. COLOR UNIFORMITY

Color Uniformity is the maximum color difference (△x, △y) between any two points out of L1~L13

A15. ANSI COLOR UNIFORMITY

ANSI Color Uniformity: △u’v’= [(u’1-u’0)^2+(v’1-v’0)^2]^1/2
(u’0,v’0): the average color of L1~L13
(u’1,v’1): the spot with maximum deviation from (u’0,v’0)

A16. PROJECTION OFFSET

Projection Offset= Center of image above projection lens optical axis / Half image height x 100%
Note: Optical engine should be kept horizontal attitude

A17. Defocus and Flare Test Procedure

Procedure:
Step 1: Get best focus at Screen Center with Pattern1
Step 2: Check specified screen sizes and zoom positions
Step 3: Use Chart1 to measure Defocus and Flare for whole screen of R,G,B color at Pattern 2 and record
the maximum number
Example of 1.5 pixel flare:

Grid of 1.5
1 Pixel pixels

Flare

Defocus
1.5 pixels
i.

A18. Convergence Test Procedure

Procedure:
Step 1: Get best focus at Screen Center with Pattern 1
Step 2: Check specified screen sizes and zoom positions
Step 3: Check Convergence for whole screen by pattern.3

A19. Lamp Lifetime Test Procedure

12
50% lamp brightness maintenance under 2hr ON, 15 min OFF cycling test

A20. Screen Distortion

Pattern 1 (Please contact BenQ RD for file with correct resolution)

Pattern 2 (Please contact BenQ RD for file with correct resolution)

13
Pattern 3 (Please contact BenQ RD for file with correct resolution)

14
Chart 1 Example of Pixel Testing Pattern (60” screen size)
(Please contact BenQ RD for file with correct size)

15
A20. Definition of “Slight flare”
Slight flare is observed with following steps:
1. Slight flare is measured with the “Line” in pattern “Cross hatch with dots”
2. A slight flare is defined as flare with very faint brightness compares to
“Normal Flare” in “Line”. Please refer to the drawing below:

“Normal”
Flare

Slight flare

A21. meter correlation

Brightness PE = 0.981 RD
Color
Wx PE = RD -8
Wy PE = RD +1
Rx PE = RD +3
Ry PE = RD -3
Gx PE = RD -18
Gy PE = RD +15
Bx PE = RD -1
By PE = RD -3
BKx PE = RD -6
Bky PE = RD -2

16
Design Verification Test Procedure
Drop test with packing gross weight and falling height relationship
Gross Weight Falling Height (cm) Spec.
( Kg ) C3 C4/C5/MP
0.0<W<4.5 91 (106) 91
4.5≦W<11.0 91 (106) 91
11.0≦W<20.5 76 (91) 76
20.5≦W<34.0 61 (76) 61
34.0≦W<45.5 46 (61) 46
45.5≦W<79.4 31 (46) 31
Package Drop
Criteria *A *B
Test Orientation: 1 corner, 3 edges, 6 faces
Criteria:
1. Criterion *A: After testing, no abnormality on function
and appearance, brightness and uniformity deviation
must be within +/- 5%.
2. Criterion *B: After testing, no abnormality on function
and appearance. (This is tightened spec to double
check design margin on R&D stage only.)
3. No broken issue on carton.
4. No broken issue on cushion, but cracks acceptable.
Package Vibration Test condition :
1. Sine wave:
5~200Hz 1.5G, 1 octave/min, 15 min dwell on each resonant
frequency, all primary axis, one sweep 30 minutes/Min. per
orientation, total of 90+ min.
2. Random wave:
5-100Hz, 0dB/Oct. 0.015(g2/Hz);
100-200Hz, -6dB/Oct. N/A
200Hz, N/A 0.0038(g2/Hz)
Equivalent to 1.47 Grms, all primary axes, 20 min
per-orientation, total of 60 min.
Note: Perform random vibration test before, the Sine-wave
vibration should be done first.

Un-package Vibration Sine-wave, 5~200Hz, 1.5G, all primary axis, one sweep (5 minutes)
(Non-operating) per orientation, total of 15 min.

17
Un-package Shock Waveform: Half sine
(Non-operating) Faces: 6 sides/per orientation, 3 shocks
Duration: < 20 ms
Velocity accelerate: 50 G

Bench Drop 1. Pivot, 90 degree, sitting on right and left side, 1 drop per
orientation, total of 2 drops.
2. Bottom and opposite, 1 drop per orientation, drop height 5 cm,
totally 2 drops.

Security Lock 150N break away force

B2.2 Atmospherics Test

Temperature/Humidity, Test condition: 0℃~ 40℃, 10%~90%, no condensation

(Operating) Test procedure:
25℃/90%, 2hrs → 40℃/90%, 6hrs → 0℃, 6hrs →
40℃/10%, 6hrs → 25℃/90%, 2hrs; (2 Cycles)

Storage High Temperature / Test condition: (-20°C ~ 60°C, 10% ~ 90% R.H.)
Humidity
1. Storage high temperature / humidity exposure test:
(Non-operating, with package)
25℃/60%, 1hrs → 60℃/90%, 24hrs → 25℃/60%, 1hrs

2. Storage transportation test:

25℃/60%, 1hrs → -20℃, 24hrs → 25℃/60%, 1hrs →
60℃/90%, 24hrs → 25℃/60%, 1 hrs

Criteria Inspection:
1. The products should be operated normally at specified lower and
higher temperature environment.
2. The carton no crash and broken issue.

Altitude Operating:
0°C ~ 40°C @ 0 ~ 3000 feet above sea level
0°C ~ 30°C @ 3000 ~ 6000 feet above sea level
1°C drop per 500 feet @ 6000 ~ 10000 feet above sea level
Non-operating: 30°C @ 0 ~ 40000 feet above sea level

Start Turn On @ 0℃ and 40℃, AC90~264V, 47~63Hz

B2.3 Regulatory

18
EMC Test condition:
FCC part 15J class B, EN55022 class B, under 3 dBuv

ESD 1. Air discharge to set surface: 15KV

2. Contact discharge to set surface and metal: 8KV
3. Contact discharge to Vert./Horiztl coupling plane: 8KV
4. Contact discharge to D-sub/S-video input pins: 4KV

Surge 1KV line to line, 2KV line to ground on input power lines.

Safety Please refer to UL1950 for details

B3. Failure Criteria

The product is expected to perform to its full potential without loss of function, performance,

critical parametric changes, and other undesirable anomalies, over the applied boundaries of this

specification. The following product failure is not allowed within the boundaries defined in this

specification:

1. Failure including permanent damage, critical paramedics changes (optical performance defined in

Appendix A), and latent defects.

2. Failure requiring operator intervention.

3. Failure violating external laws, regulatory agency standards, and government directives.

4. Failure resulting in a safety, potential safety, issue.

19
B4. Test Sequence

Atmospherics, Dynamic, and Regulatory test sets require separate units and can be processed in

parallel. EUT testing shall be performed serially within each set.

Set 1 (2 units) Set 2 (2 units) Set 3
Dynamics: Atmospherics: Safety/EMC:
1 Temperature / Humidity,
Package Vibration EMC
Operating
2 Storage High Temperature /
Package Drop ESD
Humidity, Non-operating
3 Un-Package Vibration Altitude, Operating Surge
4 Un-Package Shock Start Safety
5 Bench Drop

20
 Thermal and Noise Test Procedure

Ⅰ、Noise Testing Standard Based on *B Shown as follows,

(1) Desk high: 75 cm
(2) Projector Position: On the edge of desk
(3) Microphone Position: Distance from projector 100cm; Height 150 cm; Title 30 degree
(4) Measured four surfaces and calculated the noise value by log average.
(5) Background noise: <19dBA

ⅡExhausted Air Test Procedure

Exhausted Air<95 oC, measurement position shown as follows
T
h
e
e
d
g
e
o
f
o
u
t
l
e
t
S
h
a
p
e
o
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a
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o
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e
t

A
i
r
F
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o
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F
i
n
d
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e
m
a
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i
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a
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n

Position of measurement

21
Ⅲ、Temperature of System Level：
Before measurement temperature, we can use IR camera to make sure the position of hot spot.
We defined maximum temperature and measurement position as following：

Spec. Maximum
Area Define
metal℃ plastic℃

Maybe touch All surface 70 95

Touch for short
Key pad, Adjustment foot/lens, side surface 60 85
period only
Bottom Lamp cover 55 70

Outlet Mesh surface 70 95

22
LCD Image Quality

Bright defect
(white dot)
(Image In Focus)
(Test pattern: Any grey level with 100% dot)

Count Size
G R B R/B G/R/B
White dot (5% OVER) White dot(0.8%-5%)
Under 0.8% No count No count No count
1.3~0.8% ≦8 No count No count
2.0~1.3% ≦1 No count No count
2.5~1.3% 0 ≦4 No count
5~1.3% 0 No count < 2 pixel < 3 pixel

10~2.0% 0
10~2.5% 0 ≦1
20~5% 0 0 ≦3
100~20% 0 0 0
Total ﹣ ﹣ ﹣

23
 Black dot defect Blemish and
Bright dust(0% FB )
(Black level depends on Shark Unevenness(Same
Dark dust(100%FW) Pixel short cut
limit sample) skin sample),
(Dust In Focus)
(Image In focus) Rubbing strain

Size =Total dust area Count Size Pair Size 30% Grey
G R B G R B G/R/B R/G/B R/G/B G R G B

Limit
sample
1 3 5 S＜3dot 5 < 3 dot Area Limit sample
depands
≦4 dot ≦ 6 dot on picture
≦ 10 dot

﹣ ﹣ ﹣ 1 3 5 5

24
 Bright dust
Half-bright dust black Dust
(Possible to
(Possible to Just Focus (out of Focus) Scratch
Just Focus
\Out of Focus) (Lens Array )
\Out of Focus)
Set Set TBD
G/R B G/R W B
﹣
﹣ ﹣ ﹣ ﹣
T≦10% ﹣
﹣ ﹣ ﹣
T≦30% T≦30% ﹣
﹣ ﹣ ﹣ ﹣
﹣ T≦50%
﹣ ﹣ ﹣ ﹣
﹣ ﹣ ﹣ T≧80% ﹣
﹣
﹣ ﹣ ﹣ ﹣ ﹣

25
 Supporting Timings

1. Timing Table

The Default timing is as following:

( D – sub 15 ) PC
Refresh rate H-frequency Clock
Resolution Mode
(Hz) (kHz) (MHz)

720 x 400 70.000 29.190 26.154

VGA_60 59.940 31.469 25.175

VGA_72 72.809 37.861 31.500

640 x 480
VGA_75 75.000 37.500 31.500

VGA_85 85.008 43.269 36.000

SVGA_60 60.317 37.879 40.000

SVGA_72 72.188 48.077 50.000

800 x 600
SVGA_75 75.000 46.875 49.500

SVGA_85 85.061 53.674 56.250

XGA_60 60.004 48.363 65.000

XGA_70 70.069 56.476 75.000

1024 x 768
XGA_75 75.029 60.023 78.750

XGA_85 84.997 68.667 94.500

1280 x 1024 SXGA3_60 60.020 63.981 108.000

1280 x 768 SXGA_60 60.09 47.77 80.768

26
HDMI support timing is as following:

Signal format fh(kHz) fv(Hz)

480p@59Hz 31.47 59.94

576p@50Hz 31.25 50.00

720p@60Hz 45.00 60.00

720p@50Hz 37.50 50.00

1080i@30Hz 33.75 60.00

1080i@25Hz 28.13 50.00

1080p@24Hz

1080p@60Hz 67.50 60.00

Refresh rate H-frequency Clock
Resolution Mode
(Hz) (kHz) (MHz)

720 x 400 70.000 29.190 26.154

VGA_60 59.940 31.469 25.175

VGA_72 72.809 37.861 31.500

640 x 480
VGA_75 75.000 37.500 31.500

VGA_85 85.008 43.269 36.000

SVGA_60 60.317 37.879 40.000

SVGA_72 72.188 48.077 50.000

800 x 600
SVGA_75 75.000 46.875 49.500

SVGA_85 85.061 53.674 56.250

XGA_60 60.004 48.363 65.000

XGA_70 70.069 56.476 75.000

1024 x 768
XGA_75 75.029 60.023 78.750

XGA_85 84.997 68.667 94.500

1280 x 1024 SXGA3_60 60.020 63.981 108.000

1280 x 768 SXGA_60 60.09 47.77 80.768

27
YPbPr support timing is as following:

Signal format fh(kHz) fv(Hz)

480i(525i)@60Hz 15.73 59.94

480p(525p)@60Hz 31.47 59.94

576i(625i)@50Hz 15.63 50.00

576p(625p)@50Hz 31.25 50.00

720p(750p)@60Hz 45.00 60.00

720p(750p)@50Hz 37.50 50.00

1080i(1125i)@60Hz 33.75 60.00

1080i(1125i)@50Hz 28.13 50.00

1080p@24Hz

1080p@60Hz 67.50 60.00

Video, S-Video support timing is as following:

Video mode fh(kHz) fv(Hz) fsc(MHz)

NTSC 15.73 60 3.58

PAL 15.63 50 4.43

SECAM 15.63 50 4.25 or 4.41

PAL-M 15.73 60 3.58

PAL-N 15.63 50 3.58

PAL-60 15.73 60 4.43

NTSC4.43 15.73 60 4.43

28
2. Characteristics of inputs/outputs

Signal Parameter Min Type Max

RDATA Impedance 75 Ohm
GDATA Amplitude 0.7 Volts peak-to-peak
BDATA Black pedestal 0 Volts
Pixel Clock 110 M Hz
GDATA_SOG Impedance 75 Ohm
Amplitude 1 Volts peak-to-peak
Video amplitude 0.7 Volts peak-to-peak
Sync amplitude 0.3 Volts peak-to-peak
Black pedestal 0 Volts
Pixel Clock 110 M Hz
HDATA Impedance 1 K ohm
Amplitude, low level 0 0.8 volt
Amplitude, high level 2.5 5 Volt
Frequency 31 82 K Hz
VDATA Impedance 1 K ohm
Amplitude, low level 0 0.8 volt
Amplitude, high level 2.5 5 Volt
Frequency 48 85 Hz
SDADATA Amplitude, low level 0 0.8 volt
Amplitude, high level 2.5 5 Volt
SCLDATA Amplitude, low level 0 0.8 volt
Amplitude, high level 2.5 5 Volt
RXD Amplitude -25 25 Volt
TXD Amplitude -25 25 Volt
CVBS Amplitude, total (video+ sync) 1 Volts peak to peak
Luminance Amplitude, video 0.7 Volts peak to peak
Amplitude, sync 0.3 Volts peak to peak
Impedance 75 ohm
CVBS Chroma Amplitude 300 m Volts peak to peak
Impedance 75 ohm

29
3. Electrical Interface Character

Interface Definition

15 pin definition of the mini D-sub male for DDC2B protocol

1 5
6 10

11 15

Pi Definition Pin Definition Pin Definition Pin Definition

n
1 Red video 2 Green Video 3 Blue Video 4 NC
5 NC 6 Red Video 7 Green Video 8 Blue Video
Return Return Return
9 PC-5V 10 Sync. Return 11 Monitor ID bit 12 Bi-directional
0 data (SDA)
13 Horizontal 14 Vertical Sync 15 Data clock
Sync (SCL)

• Video & Component Input

Composite input

Pin Definition

1 Composite video
input

30
• S-Video input
Pin Description
4 3 1 GND
2 1 2 GND
3 Luminance
4 Chroma
• Control Port
Pin Description Pin Description

8 7 6 1 RX 2 NC

5 4 3 3 NC 4 GND
2 1 5 NC 6 NC
7 TX 8 GND

• HDMI Port

31
• Component Port
1 2 3

PIN Definition PIN Definition

1 Y1 4 Y2
4 5 6 2 Pb1 5 Pb2
3 Pr1 6 Pr2

32
Local Keyboard Description (Detailed description refer to SW Specification)
Key Name Detailed Description
Power Use this button to turn your Data Projector on and off (standby mode).
Source To select input sources as Computer, Video, S-Video, YPbPr, HDMI
Exit Exit menu function
Mode Change Different presentation mode
Menu (1) OSD –up (2)OSD close
Enter Enter menu function
Right (1) Move next page (2) OSD increment & move next sub-item (3) Keystone+.
Left (1) Move previous page (2) OSD decrement & move previous sub-item (3)
Keystone-.
Up (1) Move item bar. (2) Move to page level
Down Move item bar

Remote Control Keys Description (Detailed description refer to SW Specification)

Function Description
To turn on and off projector
Comp 1 select component 1
Comp 2 select component 2
Video select composite video
HDMI select HDMI digital signal input
D-sub select PC signal input,
S-Video select S-video channel
ANA select 16:9 linear aspect ratio(1280*720)
4:3 select 4:3 aspect ratio (960*720)
LB select letter box (1280*720)
WIDE select nonlinear scaling (depends on input source)
REAL output without scaling when input resolution is lower 1280*720
PICTURE Load PICTURE MODE: Jump to osd “picture” page
MEMORY 1 Load User 1
MEMORY 2 Load User 2
MEMORY 3 Load user 3
DEFAULT LOAD DEFAULT VALUE
← If Menu item is selected, press this button to decrease the setting scale bar
number.
→ If Menu item is selected, press this button to increase the scale bar number
setting.

33
↑ If Menu item is selected, press this button to increase the scale bar number
setting
↓ When the Menu page is selected, and shift to lower item. If Menu item is
selected, press this button to decrease the scale bar number setting.
Menu press it to pop-up OSD menu, press again to close
Exit press it to exit focused menu layer
Enter press it to enter focused function
BRIGHTNESS Hot Key Brightness
CONTRAST Hot Key Contrast
COLOR Hot Key Color
TINT Hot Key Tint
LIGHT Press to light on and off

External Status indicator

LED Name Detailed Description
Power LED Display the power on/off sequence status
Lamp Status LED Display the Lamp status (Lamp fail, Lamp spoil etc.)
Temperature Status LED Display the Thermal status (Fan Fail, Over Temperature, etc.)

34
4. Functionality

The Following functionality will be supported: (Detailed description refer to SW Specification)

Functionality Data (Computer) Video/S-Video YPbPr/YCbCr
Volume YES YES YES
Mute YES YES YES
Preset Mode YES YES YES
Brightness YES YES YES
Contrast YES YES YES
Color NO YES YES
Tint NO YES YES
Sharpness NO YES NO
Color Temp YES YES YES
H. Position YES NO YES
V. Position YES NO YES
H. Phase YES NO YES
H. Size YES NO YES
Keystone YES YES YES
Language YES YES YES
Auto YES YES YES
Image Ratio YES YES YES
Auto Off YES YES YES
Mirror YES YES YES
Source YES YES YES
Freeze YES YES YES
Blank YES YES YES
Lamp Reset YES YES YES
OSD Timer YES YES YES
Source Scan YES YES YES
Keystone Hold YES YES YES
Mirror Hold YES YES YES
Blank Time YES YES YES
Information YES YES YES
Reset YES YES YES

35
External Message indicator (Detailed description refer to SW Specification)
Message Occasion
PC/Composite Video /S-Video /YPbPr/HDMI The system does not detect the signal
Searching
Acquiring Signal The system is auto- adjusting
Out of range The signal is over the specification
Chang Lamp if Brightness is Low Lamp Hour is over 2000 hours
Change the lamp! The power will turn off after 3000 Lamp Hour is over 2980 hours
hours.
Change the lamp! Lamp Hour is over 3000 hours.
And the message will blink , and it will shut down
after 40 seconds.

36
Power Supply Specification

Input Power Specification

Specification Description
Input Voltage Range The unit shall meet all the operating requirements with the range 90
~ 264 VAC
Frequency Range The unit shall meet all the operating requirements with an input
frequency range 50 Hz ~ 60 Hz
Power Consumption Normal operation: 215 W (Max)
standby mode: <1.5 W
Regulation Efficiency 80 % (typical) measuring at 115Vac and full load

2. Output Power Requirement

The power supply can provide DC output as below：

NO. Voltage Regulation Load Current Range Ripple & Noise
1 +5 V ±5 % 0.06A ~ 2.4A 100 mV
2 +12V ±10 % 0.3 A~1.3 A 120 mV
3 +15.5 V ±10 % 0.04 A ~ 0.65A 200 mV

3. Lamp Power specifications

Specification Description
Applicable Lamp 140W, DC operation
Starting pulse from Ignitor Pulse voltage 10KV max.

37
4. Others

Item Description
Power good signal Active high after 5 Volt reach 95% of its rating and goes to logic low at
least 0.5ms before power falls to 90% of its rating
High voltage and high To avoid user from the dangerous of HV and high temperature, when
temperature protection front door of lamp case is opened whether intentionally or accidentally,
the power should be disconnected immediately. When the door is closed
again, the igniter restart sequence should be compliant to that is
described previously

38
Drawing

39
Packing

40
Customer Acceptance

41
42
43
44
Disassembly/Assembly

Exploded View

Module 1 – Total Exploded view

45
46
Module 2 – ASSY Blower

47
Module 3 – ASSY Ballast Module

Module 4 – ASSY Front Case

48
Module 5 – ASSY Lower Case

49
Disassembly / Assembly
Lens Cap

50
Lamp + Lamp Door

Up_ Rear case + Lens Ring

51
52
Filter

53
Front Case

54
MB

55
MB Fan

56
Ballast

57
58
OPT Engine

59
Power BD

60
Blower

61
62
Level 1 - Cosmetic / Appearance / Alignment Service

Visual Inspection & Cleaning

1. 外觀檢驗規格/Appearance Inspection Spec.

1.1 標準檢驗環境規範 (Environment Condition)
1.1.1 光源強度(Lighting intensity)
所有外觀品質的檢驗環境亮度(白色燈管或自然光源)條件為 500- 800Lux。
All appearance quality shall be inspected with the lighting condition as 500~800Lux
(natural lighting or white fluorescent light).
1.1.2 目標或被觀察物的位置與目視距離
Inspection angle and distance to object or target
所有目標或被觀察物都要放置在投射的光源下檢測，其目視檢測的角度與距離是根
據表面位置等級加以區分。在所有檢測中，光源儘量避免其產品或零件對檢測人員
眼睛造成反射干擾。
All part inspection must be done under direct overhead lighting. Viewing angle and
distance are dependent on surface classification. In all cases, parts must be held in such
that the light reflection does not disturb the inspector's eye.

圖 1

63
 等級區分 A 區 B 區 C 區
Classification Area A Area B Area C
光源位置 被觀察物正上方
Lighting positioning Above of inspected part
目視與被觀察物位置(垂直)
90º 90º 90º
Inspection position relative to part
目視距離(參考距離)
45 cm 45 cm 45 cm
Inspection distance
表 1
1.1.3 檢視時間
Inspection interval (time)
檢視時間與樣品大小及檢視區域有關。
Inspection interval is a function of surface area.
檢視時間以 10 秒為限。
Time for visual inspection: 10sec.

Parts Size “A” surface “B” surface “C” surface

Time 10 sec 10 sec 10 sec

表 2

64
 TABLE 1. 產品一般外觀塑膠件的黑點、雜質、凸點、砂粒缺陷檢驗標準
(General Product of plastic outlook of dot, blemish, and others spec inspection standard)

A 級面 B 級面 C 級面
規格 A surface B surface C surface
Spec (允許數) (允許數) (允許數)
(面積 cm2) (Number of defect) (Number of defect) (Number of defect)
( Area cm2 ) 100*10 100*10
20*20 50*50 70*70 20*20 50*50 70*70 20*20 50*50 70*70 100*100
0 0
P < 0.1 mm2 不計 不計 不計 不計 不計 不計 不計
不計 不計 不計 不計 不計
雜質 點距 Distance Ignor Ignor Ignor Ignor Ignor Ignor Ignor
Ignore Ignore Ignore Ignore Ignore
Particle 2cm e e e e e e e
黑點 0.1 ≦P< 0.2
Blemis mm2
h 2 3 4 5 2 3 4 5 4 4 5 6
點距 Distance
| 4cm
異色點 0.2≦P
Color <0.3mm2 點距 0 0 0 0 2 3 4 5 3 4 5 6
spot Distance 4cm
P<0.1 mm2 不計 不計 不計 不計 不計 不計
不計 不計 不計 不計 不計 不計
點距 Distance Ignor Ignor Ignor Ignor Ignor Ignor
Ignore Ignore Ignore Ignore Ignore Ignore
2cm e e e e e e
凸點
0.1≦P<0.2mm
砂粒 2
點距 Distance 4 4 5 6 5 5 6 7 6 6 7 8
棉絮
4cm
毛屑
0.2 ≦P <
Particle 0.3mm2
| 3 4 4 5 4 5 5 6 6 7 7 8
點距 Distance
同色點
4cm
Spot with
0.3 ≦P <
same color
0.5mm2
2 2 3 4 3 3 4 5 4 4 5 6
點距 Distance
5cm
Total 4 4 5 6 5 5 6 7 6 6 7 8

備註 Note:
1. 檢測面積 A <20*20 以 20*20 之規範檢驗之, 20*20≦A<50*50，以 50*50 等級檢驗之，以此類
推
Use the 20*20 criteria to the area less than 20*20; 50*50 inspection criteria to the area
20*20≦A<50*50; etc.
雜質/黑點/異色點(Particle/Blemish/Color Spot)
1.1 A、B、C 級面定義請參考 6.2 級面定義。
Definition of surface A, B, C refer to 6.2
1.2 LOGO 周邊 2 cm 內不可有 0.05 mm2 以上之點, (0.05 mm2 以內之點不計)。
Blemish around the logo must be equal or smaller than 0.05 mm2
1.3 表面氣泡—不可有。
Bubble on the surface is to be reject.

65
TABLE 2 :產品一般外觀的塑膠件檢驗標準
(General Product of plastic outlook inspection standard)
NO Appearance Spec
A 區:不可有縮水,以帶手套檢驗,手摸過去不可有凹陷的感覺
A region: No Shrink. With gloves, no feeling of sink when touching
縮水
1 the surface
Shrinkage
B/C 區:不能明顯看出
B/C region: not obvious
流痕, 咬花, 光澤 不能有明顯的深淺不均
2
Run, Texture, Gloss No obvious non-uniformity
用指甲劃過不會有停頓感,並附近無明顯之光澤差異
接合線
3 When scratching on it, there’s no feeling of obstruction. Also, there
Welding Line/Knit Line
should not be obvious difference in gloss nearby it.
頂白 不可
4
Ejector Mark Reject
不允許
5 Label/screws shortage
Reject
缺料不可影響機構强 度和表面
缺料
6 Material shortage is not allowed to impact structure strength and
Material shortage
surface
噴漆(Painting): ΔE<=2; L<=1.5 ; Δ A,B <= 0.6 銀粉漆 (Paint,
色差 aluminum)ΔE<=2 L<=1.0; Δ A, B <= 0.6
7
Chromatic aberration 非銀粉漆(Paint, non-aluminum)素材(Raw material) :
ΔL,A,B<=0.6 ,ΔE<=0.75
文字印刷不得有漏印、斷線、重影、組細不均、溢墨、印偏
( 1mm )、印斜 (歪斜＜0.3 mm )。
Printing must not have incomplete printing, break off, overlap,
印刷
8 uneven thickness, excessive ink, printing misalignment (1mm),
Printing
printing slanting & crooked (<0.3mm)
文字印刷顏色須確認是否正確。
Printing color must be comparable to color chip and sample.
文字印刷不得有漏印、斷線、重影、組細不均、溢墨、印偏(1mm)
印斜 (歪斜 ＜ 0.4 mm).
Printing must not have incomplete printing, break off, overlap,
9 Logo of panel sticker uneven thickness, excessive ink, printing misalignment (1mm),
printing slanting & crooked (<0.4mm)

文字印刷顏色須確認是否正確.
Printing color must be comparable to color chip and sample.

66
 Side A:
(W < 0.1mm , L < 3mm): 容許 1 個
Only 1 this kind of scratch is accepted
W < 0.1mm , L < 3-5mm 容許 0 個
No this kind of scratch is accepted
Side B:
W < 0.15mm , L < 3mm 容許 2 個
Only less than 2 this kind of scratch is accepted
W < 0.15mm , L < 3-5mm 容許 1 個
Only 1 this kind of scratch is accepted
刮傷 Side C:
10
Scratch/Nicks W < 0.2mm , L < 1mm 容許 4 個
Only 4 this kind of scratch is accepted
W < 0.2mm , L < 3mm 容許 3 個
Only 3 this kind of scratch is accepted
W < 0.2mm , L < 3-5mm 容許 2 個
Only 2 this kind of scratch is accepted
Note:
刮傷見底材者不允許
Severe scratch which disclose the Natural
刮擦傷兩兩需相距 5cm 以上
Each scratch should be 5cm more far away from each other

67
68
69
Gap Spec (Refer to C321 document)

70
71
72
73
74
75
Adjustment Procedure

1. YPBPR Color Alignment:

Default valve(User menu)

Contrast Brightness color Tint Sharpness Temp
YPbPr 50 50 50 0 50 Normal
RGBHD 50 50 50 0 50 Normal
YCbCr 50 50 50 0 50 Normal
S-Video 50 50 50 0 50 Normal
Video 50 50 50 0 50 Normal
HDMI-0 IRE 50 50 50 0 50 Normal

*The Gamma selection is Gamma 1(Linear Gamma) for all temperature.

* Dynamic Iris is off mode
* The LCD driver setting Red, Green, Blue brightness are 0, Red, Green, Blue contrast are 512
(A) YPbPr Component 1:
Equipment:

- Pattern generator (VG-828)

- Lux meter ( CL-200)

Color temperature spec:

Color temperature Lamp Native Warm Normal Cool

27u ' Default 0.313 0.296 0.283

x=
18u ' − 48v ' + 36
12v ' Default 0.329 0.316 0.297
y=
18u ' − 48v ' + 36
x : +/-0.10, x : +/-0.10, x : +/-0.10,
Deviation: Default
y : +/- 0.10 y : +/- 0.10 y : +/- 0.10
The color temp of User1 ~3 is the same as that of Normal color temperature

Color temperture Lamp Native Warm Normal Cool

Gamma-Rgain 512 512 512 500
Gamma-Ggain 512 384 404 414
Gamma-Bgain 512 425 464 512
Gamma Red Offset 512 512 512 512

76
 Gamma Green Offset 512 512 512 512
Gamma Blue Offset 512 512 512 512

1). Color Temperature at 80% gray

1. Load All user default in the factory OSD.
2. Set black level to 0 IRE.
3. Change pattern of pattern generator :
Timing : 480P(H:31.54 KHz,V:60.08 Hz)
Pattern : 80% gray
4. User the lux meter and adjust color temperature R gain, G gain, & B gain to meet Normal color
temperature spec.
5. Press “Restore Color Temperature” to save current setting into color temp “Normal color
temperature” memory.
6. Follow step 1 to 3 to adjust Cool and Warm color temperature.

1. Follow the Pb, Pr offset adjustment flow chart to adjust color temperature to Normal color temperature.

Use Lux meter to

read the coordinate of
black and the value
note (x1,y1).

Case Case Case Case

x1>x0 & y1>y0 x1<x0 & y1<y0 x1>x0 & y1<y0 x1<x0 & y1>y0

Decrease Pb offset Increase Pb offset

Increase Pr offset until Decrease Pr offset
until x<=x0 or until x>=x0 or
x<=x0 or y>=y0 until x>=x0 or y<=y0
y<=y0 y>=y0
A B C D

Case x<=x0: Case y<=y0: Case x>=x0: Case y>=y0:

Case x<=x0: Case y>=y0: Case x>=x0: Case y>=y0:
The value note (x2,y2). The value note (x2,y2). The value note (x2,y2). The value note (x2,y2).
Dy = y2 - y0. Dx = x2 - x0. Dy = y0 - y2. Dx = x0 - x2.

Decrease Pb offset until the y Decrease Pb offset until the x Increase Pb offset until the y Increase Pb offset until the x
C B A D
value <= y2 - 1/2Dy . Now, the value <= x2 - 1/2Dx . Now, the value >= y2 + 1/2Dy . Now, the value >= x2 + 1/2Dx . Now, the
reading of the Lux meter = reading of the Lux meter = reading of the Lux meter = reading of the Lux meter =
(x3,y3) and x3 will < x0, y3 will (x3,y3) and x3 will > x0, y3 will (x3,y3) and x3 will > x0, y3 will (x3,y3) and x3 will < x0, y3 will
> y0. < y0. < y0. > y0.

Decrease Pr offset the x value Increase Pr offset the x value will Increase Pr offset the x value will Decrease Pr offset the x value
will increase and y value will decrease and y value will increase decrease and y value will increase will increase and y value will
decrease to meet the spec. to meet the spec. to meet the spec. decrease to meet the spec.

77
Case x1>x0 & y1 > y0 :
y =.331
dy=.01
1/2dy=0.005
x =.291 x =.281 y =.321 dec. Pb y =.316
dec. Pb dec. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
x =.276

x =.301
dx=.01
1/2dx=0.005
y =.321 x =.291 y =.311 dec. Pb x =.286
dec. Pb inc. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.306

Case x1<x0 & y1 < y0 :

dy=.01
1/2dx=0.005
inc. Pb x =.286
inc. Pb inc. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
x =.281 y =.306
x =.271
y =.301

y =.291

dx=.01
1/2dx=0.005 y =.316
dec. Pb inc. Pb dec. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.311 x =.276
y =.301
x =.271

x =.261

Case x1>x0 & y1 < y0 :

dy=.01
1/2dx=0.005
x =.291 inc. Pb x =.286
inc. Pr x =.281 inc. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.306
y =.301

y =.291

x =.301 dx=.01
1/2dx=0.005
x =.291 y =.311 dec. Pb x =.286
inc. Pr inc. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.306
y =.301

Case x1<x0 & y1>y0

y =.331
dy=.01
1/2dy=0.005
y =.321 dec. Pb y =.316
dec. Pr dec. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
x =.281 x =.276
x =.271

dx=.01
y =.321 1/2dx=0.005 y =.316
dec. Pr inc. Pb dec. Pr
x0 =.281 y0 =.311 x0 =.281 y0 =.311 x0 =.281 y0 =.311 x =.281 y =.311
y =.311 x =.276
x =.271

x =.261

78
2. Video Color Alignment Procedure
Equipment:

- Pattern generator (VG-828)

- Lux meter ( CL-200)
OSD Default value used for S-video color temp alignment:
Item Value Item Value
USER>Picture> Factory>Video signal>Composite & 0 IRE 7.5 IRE

S Video>
USER>Picture>Basic Brightness 101
Contrast 50 Contrast 131
Brightness 50 Saturation 140
Color 50 Hue 0
Tint 0 Sharpness 50
Sharpness 50
Color Temp Normal

Color temperature spec:

Color temperature Lamp Native Warm Normal Cool

27u ' Default 0.313 0.296 0.283

x=
18u ' − 48v ' + 36
12v ' Default 0.329 0.316 0.297
y=
18u ' − 48v ' + 36
x : +/-0.10, x : +/-0.10, x : +/-0.10,
Deviation: Default
y : +/- 0.10 y : +/- 0.10 y : +/- 0.10
The color temp of User 1 ~3 is the same as that of Normal color temperature
Color temperture Lamp Native Warm Normal Cool

Gamma-Rgain 512 512 512 500

Gamma-Ggain 512 400 424 428
Gamma-Bgain 512 431 470 512
Gamma Red Offset 512 512 512 512
Gamma Green Offset 512 512 512 512
Gamma Blue Offset 512 512 512 512

1.)Black Level Adjustment:

1. Load All user default in the factory OSD.
2. Set black level to 0 IRE.
2). Color Temperature at 80% gray
3. Change pattern of pattern generator :
Timing : NTSC(H:15.73 KHz,V:29.96 Hz)
Pattern : 80% gray

79
4. User the lux meter and adjust color temperature R gain, G gain, & B gain to meet Normal color
temperature spec.
5. Press “Restore Color Temperature” to save current setting into color temp “Normal color
temperature” memory.
6. Follow step 1 to 3 to adjust Cool and Warm color temperature.

80
3. Mechanical alignment procedure

Item Picture Remark

IR wire ground

Slot of lamp box

for fan wire

Fan wire position

81
Item Picture Remark

Wire clip for interlock wire

the hooks need to be crossed

blower wire

AC switch wire

AC switch wire can’t

IRIS motor interfere with IRIS bar.
The IRIS bar moving track
should be cleared.

AC switch wire can’t IRIS bar

Interfere with IRIS bar.

82
Item Picture Remark

Mylar for shielding of IR noise

HDMI connect EMI touch

LED sponge

83
Item Picture Remark
The distance (d) which be
Add saddle wire allowed between the edge
of pin and saddle wire is
d=0.00~10.0mm

Pin & Joystick

can not have any

gap

Before Packing, joystick position

84
Item Picture Remark

Slot of lamp box for fixing thermal break wire

85
Item Picture Remark

10

Ground wire addressed

route

Position of ballast wire

11

Bending metallic clip

12

86
Item Picture Remark

gap( reference)

There is no gap between main board shielding and clip.

Power to main BD wire

shouldn’t enter ballast side.

13

Main board shielding and

upper shielding need to be
Rear case
touch together after that
rear case has be assembled.

14

Upper shielding
Touch together Main board shielding

87
Item Picture Remark

Rear case

thermal break wire position

15

blower wire position

EMI core position

16

ballast wire position

88
 4. Optical Engine Alignment & Assembly Concerns

I. Assembly Lamp Module

1. Screw (8F.1G524.8R0) & Washer (8H.00032.001) Assembly.

ÆRefer to the following Figure.

. Screw M3 Washer

HLD_Lamp (3J.J2K01.001)

89
2. Clip_Corner_Lamp (3D.J2K04.001) vs. Lamp HLD (3J.J2K01.001) Assembly: The Clip Must
be Hooked well with HLD Lamp Æ Refer to the following Figure.

Hook
Clip_Corner_Lamp

Clip_Corner_Lamp Opening

90
3-1. Lamp vs. HLD Lamp Assembly: Lamp Must be Placed to Contact Well with 3 Datum(X, Y, Z)
of Lamp HLD. Æ Refer to the following Figures.

Lamp

91
Y Datum

Z Datum
X Datum

92
 Clip_Lamp (3D.J2K03.001) Assembly:
Æ Refer to the following Figures.
Pins

Opening

Opening

Clip_Lamp

93
Mesh_Lamp (3D.J2K13.001) Assembly:
The “Mesh_Lamp” Must be Hooked Well with “Lamp HLD”.Æ Refer to the following
Figure.

Groove vs. Protrusion

Mesh_Lamp

94
6. “Mesh_Fin_Lamp” (3D.J2K14.001) Assembly:
The “Mesh_Fin_Lamp” Must be Hooked Well with “Lamp HLD”.Æ Refer to the following
Figure.

95
7. “Negative Lens” (3E.81J2K.001) Assembly:
To Place the Lens by Setting the “Blue-marked” Side forward Holder_Lamp Æ Refer to the
following Figure.

Blue mark

96
 8. “Clip_Lens” (3D.J2K01.001) Assembly:
Æ Refer to the following Figure.

Hook

Screw M2

Pins

97
9. “Plate_Lamp” (3J.J2K02.001) Assembly:
Æ Refer to the following Figure.

Plate_Lamp

Screw M2.5

98
10-1. “Connector_Lamp” Assembly Criteria:( see the following Fig1.~ Fig4.)
.

Fig1.

Fig2.

99
Fig3.

Fig4.

100
 10-2. Wire-Dressing Criteria:
Æ Refer to the following Figure.

Weak

101
 II. Assy_Cap_Lens_Module
Æ Refer to the following Figure.

Spring_Clip_Cap_Lens Clip_Cap_Lens
(3D.J2K12.001) 4B.J2K18.001

Groove vs. Spring

102
 III. Optical Engine Assembly

1.“Ring_Zoom_Inner” (3J.J2K06.001) Assembly:

Æ Refer to the following Figure.

Ring_Zoom_Inner

103
 2.“Ring_Focus_Inner” (3J.J2K05.001) Assembly:
Æ Refer to the following Figure.
.

Ring_Focus_Inner

104
 3.Lamp Module vs. Engine Assembly:
Æ Refer to the following Figures.

Orientation
Hole

Pins

105
106
IV. Ring_Zoom_Adjustment & Ring_Focus_Module Assembly

4-1. “Ring_Zoom”/”Ring_Focus_Module” Assembly(Dis-assembly)

First turn Projection Lens clockwise to end ,before to assembl the “Rings” in the direction
normal to the Projection Lens,. Æ Refer to the following Figures.

Assembly Direction – Normal to P/L

107
4-2. “Ring_Zoom_Adjustment”/ “Assy_Ring_Focus_Module” Disassembly :
Example: First turn Projection Lens clockwise to end, then thumbs push Projection Lens,
and the other fingers pull Ring_Zoom_Adjustment or Assy_Ring_Focus_Module.
Æ Refer to the following Figures.

Pull Pull

Push

108
5. PC ADC Alignment Procedure:

Equipment:
- Pattern generator( Chroma -2327)
Procedure:

Source：D-SUB
ADC：AD9380
1. Input test pattern with SXGA timing 1280×1024@60Hz
2. Input pattern as follow.
3. Into factory OSD
4. Select “ Graphic signal ” and press Enter key
5. Select “ RGBHV Format “ and press Enter key
6. Select “ Auto Calibration “ and press Enter key

109
6. YPbPr Adjustment Procedure
Equipment:
- Pattern generator (Chroma-2327)
Procedure:

Source：Component
AD ：AD9380
1. Input test pattern with 480P timing(attached file hcolourbar.bmp)
2. Into factory OSD
3. Select “ Graphic signal ” and press Enter key
4. Select “YPbPr Format…“ and press Enter key
5. Select “ Auto Calibration “ and press Enter key

110
7. LCD Panel Correction Procedure

- Pattern generator( Chroma -2327)

Source：D-SUB

z Vertical Stripes Correction

1. Input test pattern with 720P timing

2. Into factory OSD
3. Select “ LCD.. ” and press Enter key
4. Select “Correction..” and press Enter key
5. Select “Vertical Stripes..“ and press Enter key
6. Select “Red“ “Green” and “Blue” to set correction function is in effect for “R” “G” “B” channel
respectively
7. Select one bar of these different brightness levels to correct that vertical strips obviated on screen
8. Adjust the bar value to minimize vertical stripes
9. If the correcting position is mismatch the vertical stripes where happened, please adjust “Base
Position” value to match it.
10. After completing the adjustment for “R” “G” “B” channel, select “Off ” to restore to normal mode

111
8.Thermal alignment concerns

1.The Blower 5020 need to close Lamp nozzle. Such as picture

2. When burning in the factory, the projector must use Eco model and the ambient
temperature is under 40 degree C.

3. When burning in the factory, the distance between each other must be more than
30cm and the outlet area can’t have any thing.

112
9.POWER alignment concerns

Note: Silicon glue is added between D703 and T691 and D703 can’t touch T691.

113
Silicon glue is added on pine of TR601 that is closer to AC skt . As TR601 is push by 10Nt force ,
TR601 can’t touch iron shelf.

114
10. EMI alignment concerns

ITEM PROBLEM SOLUTION

1 741MHz Shielding cover.

2 855MHz Add ground wire with Blower wire on shielding.

115
3 293MHz Add a core on ballast wire.

4 593MHz Add 3 cores on PFC.

2E.72102.051

116
5 890,965MHz Add a gasket on Main board.
4G.J2K17.001

6 293MHz Clip IR wire on shielding of Main/B.

117
7 217,293,741,891MHz Clip thermal sensor wire onto Main/B shielding.

8 855MHz Add gasket on Len shifter.

4G.J1B13.001

118
9 891MHz Add shrapnel between engine and panel to contact panel
and shielding case.

119
Software/Firmware Upgrade Process

z How to enter Factory mode

1. the projector must be power on. If use keypad go to item2. if use remote go to item3
2. use keypad : press right + down key at the same time
3. use remote : under information page and press up, down three times in a row(up, down, up,
down, up, down)

z How to Download
Hardware required
1. Standard USB Download cable (P/N 50.73213.501)
2. Personal computer or laptop computer
Software required
1. SOI TDK tools with “Updater” of “File Manager”
2. New version FW
Download:
1. Hold the right key
2. Ac power on (let the projector into download mode)
3. Open Updater tool

4. Select USB in “Targets on” and press “Search”. If PC find the link between pc and projector,
the below window will show otherwise go back to first step and go through again.

120
5. Press “Browse…” to find the source code (*.brec) location in your computer.

121
 6. Press “Update Firmware” to update firmware
7. As finish the firmware update, the window will show 100%
8. Reboot the projector

z How to change Model name

Equipment:
- PC and RS232 cable and use SOI TDK tools “File Manger” to download the new splash
screen
1. Open File Manger tool
2. Press “Connect” and select one of the connections under the “Devices Connected to the Router”
window
and press”Connect To Board”
3. Open c:\system\config\osd on the right window
4. Delete splashm.jpg and update the new splashm.jpg (right now we have to keep the same file
name)
5. Reboot the projector

122
Level 2 - Circuit Board and Standard Parts Replacement
Catalog:
1. Introduction

2. Chapter 1 System operation theory

3. Chapter 2 LCD circuit operation theory

4. Chapter 3 Input signal circuit operation theory

5. Chapter 4 Cooling circuit operation theory

6. Chapter 5 Power supply circuit operation theory

Introduction

Overview
The Projector consists of the LCD projector controller, Lamp controller, Power supply system, and the system
cooling controller. The LCD controller captures the digital PC data and video data and converts them into the
LCD display device. The lamp controller controls the lamp’s power and synchronizes its frequency with color
display sequence. Power supply unit controls the AC line power factor and converts primary voltage to
secondary low voltage for digital board. The system cooling controller drives the airflow to cool the lamp’s heat
and electrical component’s heat.

Hardware Architecture
The Projector consists of the Source board, Main board, Keypad board, Fan board, PFC board, Ballast
board, Door interlock switch, and the Thermal break sensor board. Please see Figure 1.
Source Board consists of audio phone jack, video RCA jack, S-video mini-DIN head, and USB head. Main
Board consists of RGB A/D conversion, Video decoder, T1+ ASIC, Flash and DDR and IR receiver. Please see
Figure 2. Keypad Board consists of 10 keypads and 3 twice-color LEDs. Please see Figure 3. Fan Board consists
of DC/DC converter, Thermal Break circuit, Blower Fan driver circuit, Rear Fan driver circuit, and the
temperature sensing circuit. Please see Figure 8. Power supply circuit consists of AC line EMI filter, Power
Factor Correction circuit. Ballast Board consists of Lamp synchronization circuit, Lamp lit feedback circuit,
and Lamp power control circuit.
The following chapter will introduce each function block circuit operation theory.

123
 Chapter 1 Chapter 2 Chapter 3 Chapter 4 Chapter 5

System T1+ Input signal Cooling Power

operation operation operation operation operation
theory theory theory theory theory

Hardware Architecture
Thermal break
Keypad Main
sensor Circuit
Circuit Operation
Fan Driver
Circuit
Circuit

Input Ballast
Source Module
Circuit

From AC Door To Lamp

EMI PFC Circuit
socket interlock
Filter
switch

Figure 1

124
System Operation Theory

1.1 Overview
The Projector system consists of display function, cooling function, lighting function, safety protection function, and User
interface control function and power control function. An processor embedded in the T1+ ASIC is used to execute system
firmware. The processor serves as the master controller of the projector and provides the link between the display screen
and end-user controls such as a keypad and IR remote control. These inputs can be processed in the processor by system
firmware so that commands can be issued to configure the T1+ ASIC, the analog interface device, the video decoder, the
cooling device, and other system peripheral devices. Please see figure 2.

Figure 2 Main board & Input board BLOCK DIAGRAM

125
1.2 User Interface Function
(1) Keypad function: There are 10 keypads on top case. Please see Figure 3. MCU does polling on these signals
[KEY9:0] to detect the key pressing action. Each key pressing action will request MCU to execute the specified
program.
(2) Indicator LED function: There are 3 twice color LED on top case. MCU releases the status of program indication
by setting LED signal LED[5:0]. It will show the power status, lamp status, and temperature status.
(3) IR remote function: There are two IR receivers, one is at the front side, and the other one is at back side. The
receiver sensor has 3 legs, pin1 is output, pin2 is ground, and pin3 is VCC (5V). The output pin is pulled high,
and will sink to low when it receives infrared signal coming from remote controller. MCU will decode the signal
and execute related program.
(4) USB function: There is a MINI USB terminal for FW at back side. MCU supports the universal serial bus version
1.1 in a slave mode only.
(5) OSD function: Please refer to C212 Software Specification.

Keypad Board
KEY[9:0] 10
KEYPADS

To main
LED[5:0]
3
board
CONNECTO Twice-color
R LED

VDD, GND
2
Backlight LED

Figure 3 Keypad board BLOCK DIAGRAM

1.3 Turn On/ Turn Off Function

(1) Turn On function: User can touch “Power” key, or use remote controller to turn on the projector. When MCU
receives the command, it will start the power up sequence for T1+ ASIC. Then Lamp enable signal will be sent to
Ballast board. After Lamp was ignited, LAMPLIT signal will be fed back to T1+ ASIC. It will reset itself and start
to send the formatting data to LCD chip. At the mean time MCU reset the cooling circuit and let it working.
Then the whole system is warming up.

126
 (2) Turn Off function: User can touch “Power” key, or use remote controller to turn off the projector. When MCU
receives the command, it will start the power down sequence. T1+ ASIC will be reset off, and then Lamp enable
signal will be turn off. The Lamp will be turned off. MCU will remain the cooling circuit operation for two
minute in order to cool down the lamp module. After the cooling procedure is end, then the whole system goes
to standby mode.

1.4 System Protection Function

(1) Lamp Door Open Protection: There is a Door interlock switch built at bottom case. When lamp door is opened,
the switch will send signal to T1+. Then the whole system will be shutdown immediately.
(2) Lamp Box Thermal Break Protection: There is a thermal break built around the lamp box. If the temperature of
lamp box goes too high, the thermal break will shutdown AC power. Then the lamp will be turned off
immediately.
(3) Ballast Over Heat Protection: There is an over heat protection circuit built on ballast board. When it alarm, the
ballast will shut down the lamp.
(4) Fan Spinning Abnormal Protection: There are 4 fans built on this system. MCU will do polling the fan spinning
status. If the speed of fan is abnormal, MCU will shut down the whole system.
(5) System Temperature Over Heat Protection: There are 2 temperature sensor built in the system. MCU will do
polling the temperature status. If the system temperature is over heat, MCU will shut down the whole system.

LCD Circuit Operation Theory

2.1 Overview
W500 LCD SOLUTION used Epson solution. It include L3E07110K0A , L3E01060P0A , and L3E06150S2A

The L3E07110K0A is a video signal processing IC for active matrix TFT panels with built-in drivers. This
IC uses digital processing to perform adjustments such as contrast, brightness, gamma correction, color
uniformity correction, and picture quality improvement. It also generates the timing signals that are used to
drive the panel.

The L3E01060P0A is an interface IC for driving TFT active matrix panels with built-in drivers. Its high
voltage circuit acts as an interface between the control IC and the drivers on the LCD panel. A circuit that uses
variation in the performance of transistors on the LCD panel to control delay timing is built into this IC in
order to adjust the delay timing of the LCD panels used for projectors.

The L3E06150S2A provides a fast 10bit latched decimating digital input, which drives 12 channel high
voltage drive outputs. Flexible digital input formats, allow several L3E06150S2As to be used in parallel for
higher resolution displays.

127
 LCD data LCD Image Display
formatting output
circuit

Color Light
sequence
module

Figure 4 LCD image display concept

Input Signal Processing Theory

3.1 Overview
The Projector signal input terminals consist of PC input, Component input, HDMI input, S-Video input, and
Video input.

3.2 Graphics Signal Processing

PC VGA (Component) Input: The PC VGA (Component) Inputs consist of PC analog RGB signal, PC HSYNC
signal, PC VSYNC signal, PC EDID/DDC signal, and Component YPBPR signal. RGB signal will be converted to digital
24 bits format and feed for T1+ ASIC by an Analog to Digital convert device built on main board. The HSYNC and
VSYNC will be rectified by a high speed Schmitt trigger inverter, and is fed to ADC device. PC DDC signal will link to an
EEPROM built on main board. The EDID function setting data please refer to C212 Software Specification. Component
signal is plugged in by a VGA to RCA convert cable. This signal will be also converted to digital data by ADC device.
Please refer figure 2.
ADC device consists of Analog interface, Sync processing, and Digital interface. The ADC device is the key
component for graphics signal processing. It is a fully integrated solution for capturing analog RGB signals and
digitizing them for display on projector. Please see Figure 8.

128
 A/D Digital RGB 24
Rin Gin Bin CLAMP Offset
converter bits output
gain

Hs Vs SOG Sync
processing

Figure 8 ADC device operation concept

129
3.3 Videos Signal Processing
Video and S-Video input: The Video and S-video signal will be fed to a Video Decoder (VDC) device built on main
board. The video decoder accepts NTSC/PAL/SECAM composite and s-video inputs. The output is formatted as YCrCb
and routed to the DDP3020.
The VDC device is the key component of video signal processing. It is an integrated device that consists of A/D
interface, Sync processing, Luma/Chroma decoding and processing, and Digital output interface. Please see Figure 9.

Video Digital
Luma/Chroma Digital YUV 16
S-Video A/D output
decoding bits output
Component interface

Sync
processing

Figure 9 VDC device operation concept

Cooling Circuit Operation Theory

4.1 Overview
The Projector cooling circuits consist of Fan driver devices, Fans, and Thermal sensors. The cooling purpose is for
protecting System Elements from over heat damage. Please see figure 8. The particular hot spot points are Lamp Tip,
Lamp Burner, DMD Heat-sink, and Lamp Box. There are three fans, blower fan, main fan 1, and main fan 2 for driving
airflow to cool down the system and hot spot point temperature.

130
 Fan Control & DC/DC Board
To PFC B+
board DC/DC To Main
VCC V12, VDD
board
2V5

To Main To Ballast
board
LAMP board
CONTROL

To Rear REAR FAN To Thermal

Fan DRIVER Break/lamp
box sensor

To Blower BLOWER FAN

Fan DRIVER

Figure 10 Fan Control & DC/DC board BLOCK DIAGRAM

131
4.2 Blower Fan
Blower fan is designed for cooling the lamp tip and lamp burner. The speed of blower fan is controlled and
monitoring by MCU.

4.3 Rear Fan

Rear fan is designed for cooling the whole system except tip and burner of lamp. The speed of rear fan is controlled
and monitoring by MCU.

4.4 Temperature Sensor

There are three temperature sensors built on the system. One is seated at fresh air intake area. One is seated on
DMD heat-sink. And the other one is near by the Lamp Box. The sensor is binary junction diode, and there is chopping
bias current on it. MCU will do polling for each sensor and fan speed, and execute cooling V-T curve control program in
order to feed the environment situation changing requirement.

4.5 Fan Controller

The fan driver device consists of I2C interface, thermal sensor interface, fan current output interface, and the
tachometer interface. MCU access fan driver device by I2C interface. Thermal sensor interface is analog small sensitive
signal. The temperature measurement principle is calculating the biasing current of diode to figure out the temperature
parameter of the diode.

Power Supply Circuit Operation Theory

5.1 Overview
The power supply unit includes EMI board, PFC board, DC/DC board (built on Fan board), and
Ballast board.
The EMI board has EMI filter circuit to reduce EMC noise coupling to AC line. The PFC board
circuit supply AC line power factor correction function. DC/DC board converts primary voltage to
secondary DC low level voltage for system using. And Ballast board generates the lamp ignition high
voltage to ignite the lamp, maintains the stable power consumption of lamp, and synchronizes the
lamp sequence with DLP color index sequence.

132
 Block Diagram

DC 380V

Ballast input :156W ballast 140W

AC input
Power factor
EMI filter Bridge diode correction ballas
η=90% η=90%

DC 380V
DC-DC input :26W

DC-D 5V/1
switching power
A
12V/0.83
η=80%
15.5V/0.36A

DC-DC output :21W

Input:202 PFC output:182W Total output :161W

5.2 General Specification

Input voltage : AC 90~264V
Input Frequency: 47~63Hz
Input power: 285W max
The power circuit shall supply DC power outputs as followings:

Output Voltage Typical load current

1 380V 1.73A
2 15.5V 0.36A
3 5V 1A
4 12V 0.83A

133
5.3 EMI filter

240U
4 3

CX603 6 1
0.6U L603

3
L602
3MH

2 CY 605
4700P

CY 604
CX602 4700P
0.22U M

L601
4 2

CN602
3 1
1
N 300UH

CX601
3 0.22U M
L

2K61007103

EMI components include common choke L601.L602, X CapacitorCX601. CX602.CX603, Y

Capacitor CY604.CY605. and differential choke L603. This circuit designed to inhibit electric and magnetic
interference for meet FCC class B and CISPR class B standard requirements.
5.4 Bridge rectifier and filter

Bridge converts the AC input into DC output, and the CAP is AC filter.

134
5.5 Power Factor Correction

The Power Factor Correction (PFC) like a Boost converter . The AC mains voltage is rectified by a bridge and the
rectified voltage delivered the the boost converter . This using a switching technique ,boost the recdtified input voltage
to a regulated DC output voltage Vo . The boost converter consists of a boost inductor (L) , a controlled power switch
(Q) , a catch diode (D) , an output capacitor (Co) ,and a PFC controller . PFC’s goal id to shape the input current in a
sinsoidal fashion , in-phase with the input sinusoidal voltage .

135
PFC schematic:

In

5
T601
350U

12

1
R611
332KF

HS612 HSink
3DJ1Y01001

2
G1

G2
B+ TP6
R612 CN603
332KF 3 1 1
1

1
1
2
D611 + C619 C618 3 2 TP7
SF10L60U 82U 1U K 3

D
450V 5KJ1B08001

1
L606 R624
R614 R613
Z80 Q611 332KF
G SPW20N60C3

D
D613
332KF 332KF
S

K
R619 P4KE440A Q651
20K G 2SK3677-01MRSC
R620
K

K
20K

S
ZD612 R625 R659 ZD651

A
ZCD TZMC27 332KF 10K TZMC27

R621
A

A
4.7
A

15VDC IC601
D612
1N4148 R658
8 5 300
VCC ZCD R630 R626
K

0.18 332KF Q652

3 7 15VDC Q653 PMBS3906
MULT GD
L6561D

PMBS3904 15VPFC
1

R622 E C C E
C612 + 2 4 22
10U 50V COMP CS R661
R627
7.5K F
2

B
C614 6 1 R660
0.01U K GND INV 1.2K
K

R617 R657
11KF TVS601 332KF 1
10K
SMAJ5.0A R656
C613 R623 2 10K
0.1U M C615 R618 8.66K
A

1U K 20K
3

IC652
R662 LM 431ACM 3(X)
1.5K F A

C616
4700P J R628
ZCD 11KF
C

Q612 B
2N3904LT1G
E

R629 C617
1K 1U K

136
L6561:

Description:

L6561 is the improved version of the L6561 standard Power Factor Corrector. Fully compatible
with the standard version, it has a superior performent multiplier making the device capable of
working in wide input voltage range applications (from 85V to 265V) with an excellent THD.
Furthermore the start up current has been reduced at few tens of mA and a disable function has been
implemented on the ZCD pin, guaranteeing lower current consumption in stand by mode.
Pin assignment:

137
5.6 Transformer and snubber circuit of Sub Power Board

A
ZD681 R681
P6KE250A-LF 15K R682 R683 C682
15K 15K 0.01U K T691
PQ2020

K
10 4

2
D682
US1M
1

1
D683 L604 9
ES1D Z80
2 1 6

D684 5
ES1D
2 1 7

L605
Z80
8 3

C684
1U K

In a flyback converter operated in the discontinuous mode, the energy stored in the flyback
transformer must be zero at the beginning and end of each switching period . During the on-time
energy is stored in the transformer and energy taken from the transformer when the switching
transistor turn-off, the stored energy is all delivered to the output .The flyback transformer is T691,
IC681 is the power module IC, it include PWM IC and MOSFET . R681 R682 R683 C682,ZD681,
D682 are the snubber circuit, which is reduce the spike voltage.

138
5.7 Power module IC

2
IC681
D

L
TOP247Y
1
C
S

F
R688
4

5 6.8

C686

1
C685 47U 25V
R687 0.1U M <Spec> +
27K

2
The Power module IC is TOP247Y , The function of each pins described as follow.
pin 1 : Control pin pin 5 : Frequency pin
pin 2 : Line-sense pin pin 6 : NA
pin 3 : External current limit pin pin 7 : Drain pin
pin 4 : Source pin

139
5.8 Feedback circuit and photo coupler
R707
5Vs

330

1
R711
IC682 1K R708
PC123FY 1 2.55K F
3

R710
20K

IC701 C713
C714
1

L M 4 3 1 A CM 3 (X ) 1U K 0.1U M
C706 + 2
10U 50V
<Spec>
2

R709
2.4K

The power supply adapt a single feedback circuit of 5V. It used IC702or voltage regulation and IC682 for
primary-secondary isolation. The output voltage will be controlled by IC702pin 1 (feedback) ,the duty cycle of
MOSFET will be decided to control the output voltage.

5.9 Secondary rectifier and filter

2.5V
D703
+
T651 C709

GND

Since the transformer T651 acts as a storing energy inductance , Diode D703 is rectifier and capacitor C709 is to
reduce the output ripple and noise.

140
Trouble Shooting Guide

Chapter 1 EE System Trouble Shooting Guide

Chapter 2 LED Messages Definition

Chapter 3 Error Count Messages Definition

141
Chapter 1 EE System Trouble Shooting Guide

142
143
144
145
Chapter 2 LED Messages Definition
Power Temp Lamp Status Action

O - - Stand-by

G - - Powering up

G - - Normal operation

O - - Normal power-down cooling

1. Turn off Power, then power on again
R - R Scaler reset fail
2. Change main board
O O O Download

Burn-In Messages

G G G Burn-in ON

O - O Burn-in OFF

G G G Burn-in powering up

O - O Burn-in power-down cooling

Lamp Error Messages

- - R Lamp error in normal operation Check Lamp

O - R Lamp is not lit up Check Lamp

Thermal Error Messages

Fan 1 error (the actual fan speed is ±25% outside the 1.Change Fan1
- R -
desired speed) 2.Change main board
Fan 2 error (the actual fan speed is ±25% outside the 1.Change Fan2
- R R desired speed) 2.Change main board
Fan 3 error (the actual fan speed is ±25% outside the 1.Change Fan3
- R G desired speed) 2.Change main board
Fan 4 error (the actual fan speed is ±25% outside the 1.Change Fan4
- R O desired speed) 2.Change main board

Thermal Sensor 1 open error (the remote diode has 1.Change Thermal sensor board
R R R 2.Check Thermal sensor board wire
an open-circuit condition) 3.Change main board
Thermal Sensor 2 open error (the remote diode has 1.Check Thermal sensor2
R R G 2.Change main board
an open-circuit condition)
Thermal Sensor 1 short error (the remote diode has 1.Change Thermal sensor board
G R R 2.Check Thermal sensor board wire
an short-circuit condition) 3.Change main board
Thermal Sensor 2 short error (the remote diode has 1.Check Thermal sensor2
G R G 2.Change main board
an short-circuit condition)
1.Change Thermal sensor board
O R R Temperature 1 error (over limited temperature) 2.Check Thermal sensor board wire
3.Change main board
1.Check Thermal sensor2
O R G Temperature 2 error (over limited temperature)
2.Change main board
- G R Fan IC #1 I2C connection error Change main board
1.Check fan
- O R Fans do not rotate in the process of powering up
2.Check main board
System Error Messages
1.Check Dust Filter lock or not
- O G Dust Filter error
2.Check Dust Filter wire OK or not
1.Turn off Power, then power on again
R - - Scaler’s shutdown fail
2.Change main board

146
Chapter 3 Error Count Messages Definition
Error message Define
Blower Fan Fail Blower Fan error
Front Fan Fail Front Fan error
Front Blower Fan Fail Front Blower Fan error
LCD Blower Fan Fail LCD Blower Fan error
Blower Fan error
Blower Fan Out off Ctrl
(the actual fan speed is ±25% outside the desired speed)
Front Fan error
Front Fan Out of Ctrl
(the actual fan speed is ±25% outside the desired speed)
Front Blower Fan error
Front Blower Fan Out of Ctrl
(the actual fan speed is ±25% outside the desired speed)
LCD Blower Fan error
LCD Bolwer Fan Out of Ctrl
(the actual fan speed is ±25% outside the desired speed)
G794 I2C Error Fan IC #1 I2C connection error
Turn On Fan Fail Fans do not rotate in the process of powering up
Thermal Sensor 1 open error
Diode 1 Open
(the remote diode has an open-circuit condition)
Thermal Sensor 2 open error
Diode 2 Open
(the remote diode has an open-circuit condition)
Thermal Sensor 1 short error
Diode 1 Short
(the remote diode has an short-circuit condition)
Thermal Sensor 2 short error
Diode 2 Short
(the remote diode has an short-circuit condition)
Temp 1 Over Temperature 1 error (over limited temperature)
Temp 2 Over Temperature 2 error (over limited temperature)
Lamp Fail Lamp turn off when system working
Light UP Lapm Fail Lamp not turn on
Dust Filter Error Dust Filer Open
Scaler Reset Fail Scaler turn on fail
Scaler Shutdown Scaler fail in normal mode
MCU WT61P7 Fail MCU fail in normal mode
Abnormal Power Off Power Off when system in normal working
Break off Cooling Power Off when system in Cooling

147
Appendix 1 – Screw List /Torque
Model name : W500

Description Torque
No. Screw P/N QTY Where use
Type Head Length Surface (kgf-cm)

8F.1A352.8R0
B-ZN
M2 1. SCRW MACH PH MACH PH 8.0 0.5~1 BKT_FILTER_SENSOR & FILTER_SWITCH(1)
1
NYL
M2*8L B-ZN NYL

8F.VA523.6R0

M2.5 2. SCRW TAP PAN TAP D-PT PAN 6.0 Ni 6~8 RC & LC(1)
1
M2.5*6L D-PT NI
NOZZLE_PANEL & LC (2)
TUNNEL OUTLET & LC (2)
8F.VA564.8R0 SHD_LOWER & PWR_BD (5)
SHD_LOWER & LC (1)
BOX_LAMP & LC (2)
M3 3. SCRW TAP PAN TAP D-PT PAN 8.0 Ni 6~8
24 SAFTY_INTER_LOCK & LC (1)
FILTER_SENSOR & LC (1)
M3*8L NI D-PT UC & LC (6)
BKT CEILING INSIDE & LC (3)
FC & LC (1)
8F.VA564.100
BLOWER PANEL(5025) & LC (2)
M3 4. SCRW TAP PAN TAP D-PT PAN 10.0 Ni 6~8
6 OPT_ENG & LC(4)
M3*10L NI D-PT

8F.TA524.100
RC & CNT (1)
M3 5. SCRW TAP FLAT TAP D-PT FLAT 10.0 Ni 6~8
3 FC & LC(2)
M3*10L NI

8F.VG564.350
PH
M3 6. SCRW TAP PH W/FL TAP D-PT 35.0 Ni 5~7 BLOWER_PANEL(7035) & LC(2)
2
W/FL
M3*35 NI D-PT

8F.1A524.6R0 NOZZLE_LAMP & BOX_LAMP (1)

SHD_LOWER & MAIN_BD , SHD_UPPER(7)
M3 7. SCRW MACH PAN MACH PAN 6.0 Ni 5~7 IGNITOR & BOX_LAMP(1)
11 DOOR_LAMP & LC (1)
M3*6L NI U/C & L/C(1)

8F.1G524.100
PH
M3 8. SCRW MACH PH MACH 10.0 Ni 1 5~7 BALLAST CNT & LAMP BOX (1)
W/FL
W/FL M3*10L NI

8F.1G524.240

M3 9.. SCRW MACH PH MACH PAN 24.0 Ni 2 5~7 SHD_LOWER & BLOWER_LAMP(2)

W/FL M3*24L NI

8F.1D526.6R0
POWER GND & Y/G WIRE(1)
M4 10 SCRW MACH PAN MACH PAN 6 Ni 6~8
4
BKT CEILING INSIDE & LC(3)
EXT-TOO M4*6L NI

148
 Model name : W500

Description Torque
No. Screw P/N QTY Where use
Type Head Length Surface (kgf-cm)

8F.00461.120
STAND STAND
11. STAND OFF MACH 3.0 Ni 2 3~5 D-SUB (2)
OFF OFF
XH4#-40X4+8.1 NI

=SUM 55

Power Board
Model name : W500

Description Torque
No. Screw P/N QTY Where use
Type Head Length Surface (kgf-cm)

8F.1A524.8R0 6K.J2K01.001 ASSY TOP247Y+HSINK W500(1)

6K.J2K02.001 ASSY TO-220+HSINK W500(1)
M3 1. SCRW MACH PAN MACH PAN 8.0 Ni 3~5 6K.J2K03.001 ASSY D3SBA60 +HSINK W500(1)
4 6K.J2K04.001 ASSY DIODE REC FMX +HSINK
M3*8L NI W500(1)

MODEL NAME: W500

DESCRIPTION TORQUE
NO SCREW P/N QTY
TYPE HEAD LENGTH (mm) SURFACE (Kgf-cm) WHERE USED

Ring Focus Inner & Optical Engine Lens(*4)

M1.7 1 8F.00408.3R5 TAP FLAT 3.5 NI 8 0.5~1
Ring Zoom Inner & Optical Engine Lens(*4)

M2 2 8F.1A352.3R0 MACH FPH 3.0 BNI 1 2~3 Clip Lens & Holder Lamp(*1)

M2.5 3 8F.1A523.4R0 MACH FPH 4.0 NI 1 2~3 Plate Lamp & Holder Lamp(*1)

M3 4 8F.1G524.8R0 MACH PAN 8.0 NI 2 3~4 Holder Lamp & Optical Engine(*2)

149
Appendix 2 –Optical Engine RMA

Optical Engine RMA - Criteria

RO NS
How Measure decay Measure decay
with color meter without color meter
What The Most
yellowish Yellow point
part pattern

The least
yellowish
part

Criteria ∆E>0.087 Compare (1)the most yellowish

part and (2) 5 points.
(“Level 4 Measurement”)
If (1) is worse than (2) any
point, it meets return criteria
Note: details refer to next page
BenQ Confidential (dd/mm/yyyy) ©2005, BenQ Corporation

Level 4 Measurement (With color meter)

• Measure condition :
1. Use a color sensor (Ex : Minolta CL200 )
2. Projection size : 40inch
3. Projection image: Full White
4. Picture mode : Dynamic mode
• Conditions :
Any 2 points in the projected image is OK (most yellowish and least
yellowish), but 13 points measurement is recommend (see picture)

<Formula>ΔE＝√（（ｘn－ｘ5）
＾2＋（ｙn－ｙ5）＾2）
*example case :
x,y5 is the most yellowish.
x,yn is the least yellowish.

BenQ Confidential (dd/mm/yyyy) ©2005, BenQ Corporation

150
 Level 4 Measurement (Without color meter )

• Measure condition :
1. Projection size:40inch
2. Projection image: Level 4 test pattern
3. Project picture mode : Dynamic mode
• Fail criteria :
If most yellowish area is more yellow than test pattern, it fails.

Yellow point
pattern

BenQ Confidential (dd/mm/yyyy) ©2005, BenQ Corporation

151
152
153
W500 service tool operation manual for color data

Setup

1.

2.

154
Operation

1.Start program
2.Click “Option”

3.Select data folder and change RS232 setting then click “Change” button.

ex :
File position = ” Z:\Ken\W500 Service Tool ”
Engine serial No. = “ ppr ”

155
4. Using function
A. Write Data
Reading data file from “File position” and writing to projector.
Operate mode :
Keyin engine serial No. and click “Write Data “button.
Data file format:

Panel Gamma : File position \ Engine serial No.\RGBBR.csv

Iris : File position \ Engine serial No.\IrisData.csv
3D Gamma : File position \ Engine serial No.\R.csv
File position \ Engine serial No.\G..csv
File position \ Engine serial No.\B..csv

156
B. Read Data
Reading data from projector and creating a “Read Data” folder then saving file in it.
Operate mode:
Keyin engine serial No. and click “Read Data “button.
Data file format

Panel Gamma : File position \ Engine serial No.\ Read Data \ RGBBR.csv
Iris : File position \ Engine serial No.\ Read Data \ IrisData.csv
3D Gamma : File position \ Engine serial No.\ Read Data \ R.csv
File position \ Engine serial No.\ Read Data \ G..csv
File position \ Engine serial No.\ Read Data \ B..csv

157
C. Recover
Reading data file from “File position \ Read Data” and writing to projector.
Operate mode:
You must use the “Read Data” function before recover.
Keyin engine serial No. and click “Recover “button.

158
Data file format :

Panel Gamma : File position \ Engine serial No.\ Read Data \ RGBBR.csv
Iris : File position \ Engine serial No.\ Read Data \ IrisData.csv
3D Gamma : File position \ Engine serial No.\ Read Data \ R.csv
File position \ Engine serial No.\ Read Data \ G..csv
File position \ Engine serial No.\ Read Data \ B..csv

159
Appendix 3 –DDC Data

160
161
162
163
164
165
166
167
Opening
Z
Pins
X
Y
Lamp
Washer
Hook
Weak Datum
Hook
Pins
Assembl
Clip_La
Clip_Cor
HLD_La
Plate_La
Screw
Groove
Ring_Zo
Ring_Fo
Orientati
Clip_Ca
Spring_
M3
mp
M2.5
yon
Mesh_L
ner_Lam
vs.
om_InneHole
cus_Inne
Clip_Ca
p_Lens
Opening
amp
p
rSpring
Protrusio
(3J.J2K0
Direction
4B.J2K1
p_Lens
n(3D
Opening
1 –8001)
001
J2K

168