Freescale Semiconductor Technical Data

MPX12 Rev 7, 01/2007

10 kPa Uncompensated Silicon Pressure Sensors

The MPX12 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output directly proportional to the applied pressure. This standard, low cost, uncompensated sensor permits manufacturers to design and add their own external temperature compensating and signal conditioning networks. Compensation techniques are simplified because of the predictability of Freescale's single element strain gauge design. Features Low Cost Patented Silicon Shear Stress Strain Gauge Design Ratiometric to Supply Voltage Easy to Use Chip Carrier Package Options Differential and Gauge Options Durable Epoxy Package

MPX12 SERIES
UNCOMPENSATED PRESSURE SENSOR 0 TO 10 kPA (01.45 psi) 55 mV FULL SCALE SPAN (TYPICAL)

Application Examples Air Movement Control Environmental Control Systems Level Indicators Leak Detection Medical Instrumentation Industrial Controls Pneumatic Control Systems Robotics

MPX12D CASE 344-15

ORDERING INFORMATION(1)
Device Type Basic Element Ported Elements Options Differential Differential Gauge Case No. 344 344C 344B Order Number MPX12D MPX12DP MPX12GP Device Marking MPX12D MPX12DP MPX12GP

MPX12GP CASE 344B-01

1. MPX12 series pressure sensors are available in differential and gauge configurations. Devices are available in the basic element package or with pressure port fittings which provide printed circuit board mounting ease and barbed hose pressure connections.

MPX12DP CASE 344C-01

PIN NUMBERS
1 2 GND +Vout 3 4 VSS Vout

Freescale Semiconductor, Inc., 2007. All rights reserved.

+VS 2 Sensing Element 4 +VOUT

VOUT

1 GND

Figure 1. Uncompensated Pressure Sensor Schematic

VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE

The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Burst Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX PBURST TSTG TA Value 75 100 40 to +125 40 to +125 Unit kPa kPa C C

voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1).

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

MPX12 2 Sensors Freescale Semiconductor

Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Differential Pressure Range Supply Voltage(2)
(1)

Symbol POP VS Io

Min 0 45 0 0.5 0.22 0.28 400 750

Typ 3.0 6.0 55 20 5.5 0.1 0.5 15 1.0 20 0.5

Max 10 6.0 70 35 5.0 0.16 0.34 550 1250

Unit kPa Vdc mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS/C V/C %Zin/C W W ms ms %VFSS

Supply Current Full Scale Span Offset(4) Sensitivity Linearity(5) Pressure Hysteresis6 (0 to 10 kPa)
(5) (3)

VFSS Voff V/P TCVFSS TCVoff

(5)

Temperature Hysteresis

(40C to +125C) Span(5)

Temperature Coefficient of Full Scale Temperature Coefficient of Offset(5)

Temperature Coefficient of Resistance Input Impedance Output Impedance Response Time Warm-Up Time Offset Stability
(6)

TCR Zin Zout tR

(10% to 90%)

(7)

(8)

1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified pressure range. Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure Hysteresis: Output deviation at any pressure with the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure at 25C. TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85C, relative to 25C. TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. TCR: ZIN deviation with minimum rated pressure applied, over the temperature range of -40C to 125C, relative to 25C.

6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure is stabilized. 8. Offset stability is the products output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.

MPX12 Sensors Freescale Semiconductor 3

TEMPERATURE COMPENSATION Figure 2 shows the typical output characteristics of the MPX12 series over temperature. Because this strain gauge is an integral part of the silicon diaphragm, there are no temperature effects due to differences in the thermal expansion of the strain gauge and the diaphragm, as are often encountered in bonded strain gauge pressure sensors. However, the properties of the strain gauge itself are temperature dependent, requiring that the device be temperature compensated if it is to be used over an extensive temperature range. Temperature compensation and offset calibration can be achieved rather simply with additional resistive components, or by designing your system using the MPX2010D series sensor. Several approaches to external temperature compensation over both 40 to +125C and 0 to +80C ranges are presented in Applications Note AN840.

LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range (Figure 3). There are two basic methods for calculating nonlinearity: (1) end point straight line fit or (2) a least squares best line fit. While a least squares fit gives the best case linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the worst case error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescales specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure.

80 70 60 Output (mVdc) 50 40 30 20 10 0 PSI 0 kPa 0.3 2.0 0.6 4.0 VS = 3 VDC P1 > P2 -40C

+25C

+125C

Span Range (Typ)

Offset (Typ) 0.9 6.0 1.2 8.0 10 1.5

Pressure Differential

Figure 2. Output versus Pressure Differential

80 70 60 50 Output (mVdc) 40 30 20 10 0 0 Max Offset (Voff) Pressure (kPA) POP Theoretical Actual Span (VFSS) Linearity

Figure 3. Linearity Specification Comparison

MPX12 4 Sensors Freescale Semiconductor

Silicone Die Coat Wire Bond

Die P1

Stainless Steel Metal Cover Epoxy Case

Lead Frame P2

RTV Die Bond

Figure 4. Unibody Package Cross-Sectional Diagram (not to scale)

Figure 4 illustrates the differential or gauge configuration in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX12 series pressure sensor operating characteristics and internal reliability and qualification tests

are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application/

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table
Part Number MPX12D MPX12DP MPX12GP Case Type 344 344C 344B Pressure (P1) Side Identifier Stainless Steel Cap Side with Part Marking Side with Port Attached

MPX12 Sensors Freescale Semiconductor 5

PACKAGE DIMENSIONS
C R M
1

-AN
PIN 1
1 2 3 4

NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00

-TJ
SEATING PLANE

G
M

F Y

F D 4 PL 0.136 (0.005)

T A

DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL

STYLE 1: PIN 1. 2. 3. 4.

GROUND + OUTPUT + SUPPLY - OUTPUT

STYLE 2: PIN 1. 2. 3. 4.

VCC - SUPPLY + SUPPLY GROUND

STYLE 3: PIN 1. 2. 3. 4.

GND -VOUT VS +VOUT

CASE 344-15 ISSUE AA UNIBODY PACKAGE

SEATING PLANE

-TR H N
PORT #1 POSITIVE PRESSURE (P1)

-AU L

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC

-Q-

B
1 2 3 4

PIN 1

K
S

-P0.25 (0.010) J C
M

T Q

F G D 4 PL 0.13 (0.005)

T S

STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT

CASE 344B-01 ISSUE B UNIBODY PACKAGE

MPX12 6 Sensors Freescale Semiconductor

PACKAGE DIMENSIONS

V R
PORT #2 PORT #1

-AU W H N
PORT #2 VACUUM (P2)

NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38

PORT #1 POSITIVE PRESSURE (P1)

-QSEATING PLANE

SEATING PLANE

PIN 1

1 2 3 4

-P-TJ C -T0.25 (0.010)

M

K S

T Q

F G D 4 PL

0.13 (0.005)

T S

STYLE 1: PIN 1. 2. 3. 4.

GROUND + OUTPUT + SUPPLY - OUTPUT

CASE 344C-01 ISSUE B UNIBODY PACKAGE

MPX12 Sensors Freescale Semiconductor 7

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MPX12 Rev. 7 01/2007