Bluetooth Device （MHCB05P-B）
Specification
Rev 1.6
CMIIT ID（MHCB05P-B）：2019DP6424
Version update instructions
Date Version Update contents
2019-05-06 1.0 Initial
2019-05-22 1.1 Modify product coding rules
2019-08-22 1.2 Modify the module pin diagram
2019-08-28 1.3 CMIIT ID added
2020-03-13 1.4 Modify the serial port ID and
package size
2021-01-04 1.5 a. Modify pin definition diagram
b. Electrostatic level description;
c. Update time sequence
requirements for power-on;
d. Update the packaging
content;
e. Update module design
considerations.
2021-11-03 1.6 The ram space has been fixed
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Contents
Version update instructions…………..…………………………………………………………………………………….…..2
1 Product description........................................................................................................................4
1.2 Functional block diagram ....................................................................................................4
1.3 Product code .......................................................................................................................4
2 System hardware advantage ..........................................................................................................5
3 Pin description ...............................................................................................................................6
3.1 Pin layout.............................................................................................................................6
3.2 Pin definition .......................................................................................................................7
4 Electrical parameters .....................................................................................................................8
4.1 Absolute Maximum Ratings ................................................................................................8
4.2 BLE RF..................................................................................................................................9
4.2.1 Receiver....................................................................................................................9
4.2.2 Transmitter and emitter ...........................................................................................9
5 Reflow soldering temperature curve ...........................................................................................10
6 Electrostatic discharge voltage.....................................................................................................10
7 Mechanical Dimension.................................................................................................................11
8 MSL level / Storage conditions...................................................................................................12
9 Delivery Checklist........................................................................................................................12
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1 Product description
1.1 Solution overview
MHCB05P-B is a high-performance BLE wireless module based on Realtek XMB1R(RTL8762CMF) solution，built-
in ARM Cortex-M4F Core，High transmitting power. MHCB05P-B are suitable for many application scenarios such
as smart home and smart wearable. The module provides the highest integration in the industry, has significant
system performance, low power consumption and low cost, etc. MHCB05P-B an integrated PCB on-board antenna.
1.2 Functional block diagram
1-1 Functional block diagram
1.3 Product code
According to different customers, there will be different PN numbers, the rules are as follows:
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Product Differentiation Code （X ）
H MHCB05P-B model
06 on-board antenna
02 External antenna
2 System hardware advantage
Features of MHCB05P-B ：
Module size：13mm*23.5mm*3.4mm
High-performance 32-bit 40 MHz ARM Cortex®-M4
512KB flash，160KB RAM
Minimum receiving sensitivity：-97dBm
7.3mA current at RX
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2.6uA current at DLSP (Wakeup by GPIO Timer)
450nA current at Power down （Wakeup by GPIO）
3 Pin description
3.1 Pin layout
MHCB05P-B pin distribution of the Chip is shown in Figure 3-1
Figure 3-1 MHCB05P-B pin definition description
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3-2 MHCB05P-B pin definition description
3.2 Pin definition
MHCB05P-B have 35 pins, the pin definitions are as follows:
No. Pin Function Description
1 GND GND
2 P2_7 GPIO
3 P2_6 GPIO
4 P2_5 GPIO
5 P2_4 GPIO
6 P2_3 GPIO
7 P2_2 GPIO
8 P5_0 GPIO
9 GND GND
10 32K_XO 32K_XO
11 32K_XI 32K_XI
12 P3_0 TX
13 P3_1 RX
14 VDD 3.3V
15 P3_2 GPIO
16 P3_3 GPIO
17 NC NC
18 P0_0 GPIO
19 P0_1 GPIO
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20 P0_2 GPIO
21 P1_1 JTAG(SWDLCK)
22 P1_0 JTAG(SWDIO)
23 P0_3 LOG output
24 GND GND
25 VDD_IO 3.3V
26 GND GND
27 P0_4 GPIO
28 P0_5 GPIO
29 P0_6 GPIO
30 P4_0 JTAG(SWO)
31 P4_1 GPIO
32 P4_2 GPIO
33 P4_3 GPIO
34 RESET RESET
35 GND GND
Instruction:
suggest P0_3 is used as NC or pull-up, If the level is low immediately after the power-on, the chip enters
bypass flash mode;
PIN12，PIN13（UART0）Just used for Product Test，It is not recommended for use by users；
If UART serial port communication is required, UART1 is recommended. Other GPIO can be used. For
details, see the chip data manual.
4 Electrical parameters
Note: Unless otherwise specified, test conditions are as follows: VDD=3.3V, temperature 25℃.
4.1 Absolute Maximum Ratings
Figure 4-1 Absolute Maximum Ratings
Parameter Symbol Min. Typ. Max. Unit.
Power supply voltage VDD 1.8 3.3 3.6 V
Storage temperature TST R -55 - 125 °C
Operating temperature TOP R -40 - 85 °C
range
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4.2 BLE RF
4.2.1 Receiver
4.2.2 Transmitter and emitter
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5 Reflow soldering temperature curve
Figure 5-1 MHCB05P-B Reflow temperature curve
Soldering instructions: In double-sided SMT, after the T-side (top side) components are reflowed for the first time,
the circuit board needs to be flipped and reflow soldered on the other side. In the second reflow, the already
soldered T-side components will be fixed by the surface tension of the solder paste to prevent the components
from dropping under the effect of gravity. The design of the mother board and the yin and yang board are over-
furnace (furnace temperature 240-260℃) and verified that there is no defect. To ensure its stability, it is
recommended to dispense.
6 Electrostatic discharge voltage
Figure 6-1 ：Electrostatic discharge parameters
Name symbol Guideline Level Max Unit
Electrostatic discharge VESD (HBM) Temp：23 ± 5℃ 2 2000 V
voltage IEC 61000-4-2:2008
(Human body model)
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7 Mechanical Dimension
Figure 9-1 MHCB05P-B Mechanical Dimension
Figure 9-2 MHCB05P-B Mechanical Dimension
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8 MSL level / Storage conditions
• MSL level: Level 3-less than or equal to 30℃/ 60% RH 168 hours workshop life.
• Storage conditions: The products should be handled carefully during transportation,
And they should not be squeezed against each other to avoid being impacted and
Strongly vibrated. The storage environment should be kept dry and ventilated. The
ambient temperature should be between 5℃ and 35℃. It should not be stored with
Items that can generate corrosive gases.
9 Delivery Checklist
• Complete packaging
• Evaluation tool (SPI / UART / JTAG interface)
• The software supports customer integration and performance test certification.
• Unit test / Qualification report
• Product specifications
• Complete and clear identification, such as production serial number, MAC, etc.
• Agency certification report
Confidentiality, do not transmit without Xiaomi’s writtern permission
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Module design considerations
For the layout of the module antenna part, please refer to " Xiaoi module selection and application
environment suggestions".
The module is recommended to be placed at the corner of the bottom board with the antenna facing
outwards. The antenna should be far away from metal devices, sensors, high-frequency signal transmission
devices and high-frequency signal traces; increasing the distance from the position makes the energy of the
interference source increase with the increase in distance Attenuation, and then reduce the coupling of noise,
improve the overall performance of the antenna.
For the selection of the power supply chip for the module power supply, it is recommended that the output
current be at least 500mA.
An independent power supply is recommended for the power supply of the module.
It is forbidden for any object to interfere with the antenna.
It is forbidden for below PCB antenna banned walk the line, but do the clearance process.
Please use the same power supply network for all power interfaces and pull-up power supplies that need to
be supplied by the module to ensure that the power-on sequence of the power interface of the module is
consistent.
Power supply ripple requirement for the module: When sending data packets, the power supply ripple must
be less than 100mV.
When communicating between the module and the CPU through SDIO and UART, it is best to connect a 200
ohm resistor in series with the signal line (the resistance can be adjusted according to actual needs) to reduce
the drive current, reduce interference, and eliminate the interference. Timing problems caused by
inconsistent line lengths.
Avoid high-speed signals around and below the module. If it cannot be avoided, it is recommended to strictly
follow the high-frequency signal processing rules to route the high-speed signals as far as possible. When the
data or addr lines are involved, the ground will be packaged in groups handle.
If high-power devices such as motors are involved in the system design, the circuit return path (GND) of the
module must be separated from the return path (GND) of other high-power devices, and the two return paths
( GND ) are connected
When selecting the module, try not to use the PCB onboard antenna, because the PCB onboard antenna is
more interference, and it is easy to couple the interference source to affect the performance of the antenna.
It is best to use an external antenna, which can lead out the PCB through the cable. In this way, the influence
of high-frequency interference signals on the board on the antenna performance of the module will be
weakened.
After the product design is completed, it is recommended to test the antenna performance of the whole
machine according to the product definition to confirm whether the antenna performance meets the
requirements of the whole machine.
Module reference design circuit, please refer to the module schematic diagram.
Confidentiality, do not transmit without Xiaomi’s writtern permission
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FCC compliance statement
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against
harmful interference in a residential installation. This equipment generates, uses and can radiate radio
frequency energy and, if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications.
However, there is no guarantee that interference will not occur in a particular installation. If this
equipment does cause harmful interference to radio or television reception, which can be determined
by turning the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
- Reorient or relocate the receiving antenna.
- Increase the separation between the equipment and receiver.
- Connect the equipment into an outlet on a circuit different from that to which the receiver is
connected.
- Consult the dealer or an experienced radio/TV technician for help.
Changes or modifications not expressly approved by the party responsible for compliance could void the
user's authority to operate the equipment.
This device complies with FCC RF exposure limits set forth for an uncontrolled environment. This device
should be installed and operated with minimum distance 20cm (8 inches) between the device and user
body.
ISED compliance statement
This device complies with Innovation, Science and Economic Development Canada (ISED) licence-exempt RSS
standard(s). Operation is subject to the following two conditions: (1) This device may not cause harmful
interference, and (2) this device must accept any interference received, including interference that may
cause undesired operation.
This equipment complies with ISED radiation exposure limits set forth for an uncontrolled environment. This
equipment should be installed and operated with minimum distance 20cm between the radiator and your
body. This transmitter must not be co-located or operating in conjunction with any other antenna or
transmitter.
Cet appareil est conforme à la ou aux normes RSS exemptées de licence pour Innovation, Science et
développement économique Canada. Le fonctionnement est soumis aux deux conditions suivantes: (1) ce
dispositif ne peut pas causer d’interférence nocive, et (2) ce dispositif doit accepter toute interférence
reçue, y compris les interférences pouvant causer un fonctionnement indésirable.
Cet équipement respecte les limites d’exposition aux rayonnements ionisants fixées pour un environnement
non contrôlé. Cet équipement doit être installé et utilisé avec une distance minimale de 20cm entre le
radiateur et votre corps. Cet émetteur ne doit pas être localisé ou fonctionner en conjonction avec une autre
antenne ou un autre émetteur.
Important Note
This module contains one radio transmitter. It must not be installed to co-locate and operating simultaneously
with other radios in the host system except following FCC multi-transmitter product procedures. Additional
testing and device authorization may be required to operate simultaneously with other radios.
The availability of some specific channels and/or operational frequency bands are country dependent and are
firmware programmed at the factory to match the intended destination. The firmware setting is not accessible
by the end-user.
The host product manufacturer is responsible for compliance with any other FCC rules that apply to the host not
covered by the modular transmitter grant of certification. The final host product still requires Part 15 Subpart B
compliance testing with the modular transmitter installed.
The end-user manual shall include all required regulatory information/warnings as shown in this manual,
including “This product must be installed and operated with a minimum distance of 20 cm between the radiator
and user body”.
This device has got an FCC ID: 2A4GZ-MHCB05PB and IC: 28570-MHCB05PB. The end product must be labeled in
a visible area with the following: “Contains FCC ID: 2A4GZ-MHCB05PB” and/or “Contains IC: 28570-MHCB05PB”.
This device is intended only for OEM integrators under the following conditions:
The antenna must be installed such that 20cm is maintained between the antenna and users, and the
transmitter module may not be co-located with any other transmitter or antenna.
As long as the 2 conditions above are met, further transmitter tests will not be required. However, the OEM
integrator is still responsible for testing their end-product for any additional compliance requirements required
with this module installed.
Note importante
Ce module contient un émetteur radio. Il ne doit pas être installé de façon à se localiser et à fonctionner
simultanément avec d’autres radios dans le système hôte, sauf en suivant les procédures de produit FCC multi-
émetteur. Des essais supplémentaires et une autorisation de l’appareil peuvent être nécessaires pour
fonctionner simultanément avec d’autres radios.
La disponibilité de certains canaux spécifiques et/ou bandes de fréquences opérationnelles dépendent du pays
et sont programmés à l’usine pour correspondre à la destination prévue. Le paramètre du micrologiciel n’est pas
accessible par l’utilisateur final.
Le fabricant du produit hôte est responsable du respect de toute autre règle de la FCC qui s’applique à l’hôte
non couvert par l’octroi de la certification de l’émetteur modulaire. Le produit hôte final nécessite toujours des
essais de conformité de la partie 15 sous-partie B avec l’émetteur modulaire installé.
Le manuel de l’utilisateur final doit comprendre toutes les informations/avertissements réglementaires requis,
comme indiqué dans le présent manuel, y compris «ce produit doit être installé et utilisé à une distance
minimale de 20 cm entre le radiateur et le corps de l’utilisateur».
Cet appareil a une identification FCC: 2A4GZ-MHCB05PB et IC: 28570-MHCB05PB. Le produit final doit être
étiqueté dans une zone visible avec la mention suivante: «contient l’id FCC: 2A4GZ-MHCB05PB» et/ou «contient
IC: 28570-MHCB05PB».
Cet appareil est destiné uniquement aux intégrateurs OEM dans les conditions suivantes:
L’antenne doit être installée de telle sorte que 20cm soit maintenu entre l’antenne et les utilisateurs, et le
module émetteur ne peut pas être co-situé avec un autre émetteur ou antenne.
Tant que les 2 conditions ci-dessus sont remplies, d’autres tests d’émetteur ne seront pas nécessaires.
Cependant, l’intégrateur OEM est toujours responsable de tester leur produit final pour toute exigence de
conformité supplémentaire requise avec ce module installé.
OEM instructions
(Reference KDB 996369 D03 OEM Manual v01, 996369 D04 Module Integration Guide v02)
1. Applicable FCC rules
This device complies with part 15.247 of the FCC Rules.
2. The specific operational use conditions
This module can be used in IoT devices. The input voltage to the module is nominally
1.8~3.6VDC. The operational ambient temperature of the module is -20 °C ~ +45 °C. The
external antenna is NOT allowed.
3. Limited module procedures
N/A
4. Trace antenna design
N/A
5. RF exposure considerations
The equipment complies with FCC radiation exposure limits set forth for an uncontrolled
environment. This equipment should be installed and operated with minimum distance 20cm
between the radiator and your body.
6. Antenna
Antenna type: PCB antenna; Peak antenna gain:0.2 dBi
7. Label and compliance information
An exterior label on OEM’s end product can use wording such as the following: “Contains FCC
ID: 2A4GZ-MHCB05PB” and/or “Contains IC: 28570-MHCB05PB”
8. Information on test modes and additional testing requirements
1) The modular transmitter has been fully tested by the module grantee on the required number of
channels, modulation types, and modes, it should not be necessary for the host installer to re-
test all the available transmitter modes or settings. It is recommended that the host product
manufacturer, installing the modular transmitter, perform some investigative measurements to
confirm that the resulting composite system does not exceed the spurious emissions limits or
band edge limits (e.g., where a different antenna may be causing additional emissions).
2) The testing should check for emissions that may occur due to the intermixing of emissions with
the other transmitters, digital circuitry, or due to physical properties of the host product
(enclosure). This investigation is especially important when integrating multiple modular
transmitters where the certification is based on testing each of them in a stand-alone
configuration. It is important to note that host product manufacturers should not assume that
because the modular transmitter is certified that they do not have any responsibility for final
product compliance.
3) If the investigation indicates a compliance concern the host product manufacturer is obligated
to mitigate the issue. Host products using a modular transmitter are subject to all the applicable
individual technical rules as well as to the general conditions of operation in Sections 15.5,
15.15, and 15.29 to not cause interference. The operator of the host product will be obligated to
stop operating the device until the interference have been corrected .
4) Additional testing, Part 15 Sub part B disclaimer:
The device is only FCC authorized for the specific rule parts (i.e., FCC transmitter rules) listed on
the grant, and that the host product manufacturer is responsible for compliance to any other
FCC rules that apply to the host not covered by the modular transmitter grant of certification.
The final host / module combination need to be evaluated against the FCC Part 15B criteria for
unintentional radiators in order to be properly authorized for operation as a Part 15 digital
device.
The host integrator installing this module into their product must ensure that the final
composite product complies with the FCC requirements by a technical assessment or evaluation
to the FCC rules, including the transmitter operation and should refer to guidance in KDB
996369. For host products with certified modular transmitter, the frequency range of
investigation of the composite system is specified by rule in Sections 15.33(a)(1) through (a)(3),
or the range applicable to the digital device, as shown in Section 15.33(b)(1), whichever is the
higher frequency range of investigation When testing the host product, all the transmitters
must be operating. The transmitters can be enabled by using publicly-available drivers and
turned on, so the transmitters are active. When testing for emissions from the unintentional
radiator, the transmitter shall be placed in the receive mode or idle mode, if possible. If receive
mode only is not possible then, the radio shall be passive (preferred) and/or active scanning. In
these cases, this would need to enable activity on the communication BUS (i.e., PCIe, SDIO, USB)
to ensure the unintentional radiator circuitry is enabled. Testing laboratories may need to add
attenuation or filters depending on the signal strength of any active beacons (if applicable) from
the enabled radio(s). See ANSI C63.4, ANSI C63.10 for further general testing details. The
product under test is set into a link/association with a partnering device, as per the normal
intended use of the product. To ease testing, the product under test is set to transmit at a high
duty cycle, such as by sending a file or streaming some media content.
