Optical Interconnects for AI:
Components and Co-Packaged
Optics (CPO)
Broadcom
March 2024
Broadcom
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The Optical Interconnect for AI
The Optical Interconnect for AI
Spine
TOR TOR TOR
Spine
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The Optical Interconnect for AI
The Optical Interconnect for AI
Spine
TOR
VCSEL Multi-mode, short reach
EML Single-mode, long reach
CPO Power and cost leadership
(SiPho)
Spine
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Broadcom Component Use Cases in AI Optical Transceivers
4-channel VCSEL EML Die
Arrays
LD
Laser Optical
Driver Electrical I/O DSP
PHY Connector
Electrical I/O DSP Optical
PHY Connector TIA
TIA
PIN
Photodetector
4-channel PIN
Detector Arrays
Multimode 800G and 1.6T VCSEL Singlemode 800G and 1.6T EML
Based Transceivers Based Transceiver
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100G and 200G VCSELs
4x100G and 4x200G VCSEL Arrays
1.6T SR8 Transceiver Enablement
Up to 100m reach over Multi-Mode Fiber
Lowest Optical Transceiver Packaging Cost
Optimal for Back-End AI Network
4x100G: Production Now
4x200G: 2H 2024 Samples
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100G and 200G EMLs
100G and 200G Single Channel EMLs
1.6T DR8 and CWDM8 Transceiver Enablement
Up to 2km reach over Single-Mode Fiber
WDM Enables Lowest Fiber Cost
Flexible Use for Back-End and Front-End Networks
Production Now
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Optical Interconnect Dominates Fabric Silicon Spend
Current Customer Spend*
High-Performance
Switch Silicon
10x
Optics
Switch
Optical Transceivers
Opportunity for Step Function Improvement in Optical Connectivity
* Source: LightCounting, Dell'Oro, 650 Group and Broadcom internal estimates
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Complexity of Each Box in the Datacenter
High-Performance
Switch Silicon
Optical Transceivers
Standard Rack Appliance Standard Optical Transceiver
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Evolution of Optics: Discrete III-V to Co-Packaged SiPh
Conventional Module Design Integrated Module Design Based w/ Co-Packaged Optics
Silicon Photonics
SiPh Chiplets in Package (SCIP)
Phy IC
Fiber Jumper
30% fewer Piece Parts!
Engineering and manufacturing Module Integration = First step Highly Integrated Optical
limits to scale to improved scale Engines (3.2T to 6.4T)
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Why Co-Packaged Optics (CPO)?
POWER COMPARISON
100G/lane 200G/lane
Pluggable
Lowest Cost/Bit with massive reduction in
components and interconnects
14W/800G 25W/1.6T
LPO
Power/Performance/Latency by
9W/800G TBD
eliminating the electrical interconnect power
dissipation and variability CPO
5W/800G 10W/1.6T
Leverage Silicon Reliability and eliminate
practice of accepting high failure rate optics
due to simple replacement
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CPO Insertion Loss Savings vs. Pluggables
DSP
ASIC 1
4
Cage
DSP OSA
TX/RX
>30%
Substrate Cost Savings
Pluggable 5 6
PCB 2
3
LPO
ASIC 1
4
Cage
DRV/TIA OSA
TX/RX
>80%
Substrate Insertion Loss savings
5
Pluggable 6
PCB 2
3
•1 ASIC through substrate
•2 Via Losses
ASIC Optics •3 PCB Trace Loss
Substrate •4 Connector Losses
CPO TX/RX
•5 Module PCB Losses
PCB 1
•6 OSA Interconnect loss
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Sampling TH5-Bailly CPO today
64 channel EIC
Advanced
with CMOS
Packaging
driver and TIA
64 channel
ODM System FR4 PIC with
Integration integrated
mux/demux
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Systems Shipping with Bailly CPO with Pluggable Lasers
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The Broadcom Optics Advantage
The Broadcom Optics Advantage
2.5G EML and DML 10G EML and DML 50G EML and DML 100G EML
50M+ 10 Trillion
Device Service Hours in the field
High-Speed Communication Lasers
Shipped Annually with < 1 FIT
AI Data Center
1G VCSEL 10G VCSEL 25G VCSEL 50G VCSEL
1998 2004 2013 2019 2023 2025
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Thank You
Broadcom
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Proprietary
Proprietary
and Confidential.
and Confidential.
CopyrightCopyright
© 2023 Broadcom.
© 2023 Broadcom.
All RightsAll
Reserved.
Rights Reserved.
The term The
“Broadcom”
term “Broadcom”
refers to Broadcom
refers to Broadcom
Inc. and/or
Inc.
itsand/or
subsidiaries.
its subsidiaries.
