Meridian Innovation MI0802

Thermal Camera Module

Data sheet (preliminary)

Revision 1.0.1 – February 2023

 MI0802 Data Sheet

Contents

1. OVERVIEW ............................................................................................................................................ 3

2. KEY FEATURES .................................................................................................................................... 3

3. ORDER INFORMATION ..................................................................................................................... 4

4. PIN INFORMATION ............................................................................................................................ 5

4.1. PCBA Package with FPC Extension ..................................................................................................................... 5

5. RECOMMENDED SYSTEM SETUP................................................................................................... 5

6. FUNCTIONAL DESCRIPTION ........................................................................................................... 6

7. TECHNICAL SPECIFICATION ........................................................................................................... 7

7.1. Thermal Imaging Sensor Characteristics ............................................................................................................ 7

7.1.1. General.............................................................................................................................................................. 7
7.1.2. Accuracy ............................................................................................................................................................ 9

7.2. Electrical Characteristics...................................................................................................................................10

7.2.1. Absolute Maximum Rating.............................................................................................................................. 10
7.2.2. Nominal Operating DC Characteristics............................................................................................................ 11

7.3. Dynamic Timing Characteristics ........................................................................................................................11

7.3.1. System Clock ................................................................................................................................................... 11
7.3.2. System Reset ................................................................................................................................................... 11
7.3.3. SPI Interface Timing for Register Access ......................................................................................................... 12
7.3.4. Timing Characteristics ..................................................................................................................................... 13

8. PACKAGE INFORMATION ............................................................................................................. 13

9. REVISION HISTORY......................................................................................................................... 14

10. LEGAL INFORMATION.................................................................................................................... 14

11. CONTACTS INFORMATION ........................................................................................................... 15

12. APPENDIX A – INTERFACING TO FPC CONNECTOR ON THE HOST SYSTEM ................ 15

13. APPENDIX B – ARRAY ORIENTATION AND DETECTOR ENUMERATION ...................... 16

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1. OVERVIEW
Meridian Innovation’s MI0802 is a long-wave infrared (LWIR) thermal imaging camera
module, powered by SenXorTM technology and featuring 4,960 pixels arranged in an 80 by
62 pixel focal point array (FPA).
SenXorTM technology is Meridian Innovation’s patented CMOS-compatible thermal sensor
array. Its hybrid architecture yields the synergy of microbolometer and thermopile pixel
technology. The sensor array is wafer-level vacuum-packaged (WLVP). WLVP refers to a
microchip that is made of two CMOS wafers bonded together with a vacuum cavity in
between. The base wafer – referred to as the active wafer -- contains the thermal sensor
array and the readout circuit. The top wafer – referred to as the cap wafer – transmits
LWIR radiation while keeping the pixels of the array in vacuum for optimal operation.
The WLVP chip is attached and wire-bonded to a reinforced flexible PCB substrate and its
housing includes a lens assembly designed to transmit LWIR radiation and focus it on the
thermal sensor array, as shown in Fig. 1. The flexible PCBA has an extension for interfacing
an FPC-connector on the host system.

Fig. 1. Schematic diagram of the MI0802xx camera module and a picture of the actual module
with a dual-element Si lens MI0802M5S.

2. KEY FEATURES
• Nearly 5,000 pixels arranged in an 80 (H) by 62 (V) pixel array, rendering sufficient
complexity in the thermal image to enable thermal data analytics and inference
• Radiometric output, i.e. per pixel temperature output
• Factory calibration per pixel, resulting in high uniformity and accuracy of the
temperature readout
• Continuous operation and thermal video stream due to shutterless design
• Intrinsic sensor protection due to WLVP
• Multiple lens options offering different field of view
• Cost effective

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3. ORDER INFORMATION
The MI0802 ordering code includes a three-symbol encoding of the specific lens and
packaging, as per the Table 1.

Table 1. ORDERING INFORMATION

Product Image Package Lens FoV Minimum
Code & HxWxH, mm (H/V/D), ° Quantity
Resolution
(HxV)
MI0802M5S 9.0 x 9.0 x 8.2 2-element, Si, fixed 45/34/56 1000
mount, F# 0.8
80 x 62

MI0802M6S 9.0 x 9.0 x 8.0 2-element, Si, fixed 90/67/122 1000

mount, F# 0.9
80 x 62

MI0802M7G 9.0 x 9.0 x 5.0 1-element, Ge, 105/79/134 1000

fixed mount, F# 0.8
80 x 62

Note: FoV figures are subject to up to ± 5% tolerance.

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4. PIN INFORMATION
4.1. PCBA Package with FPC Extension
The MI0802 interfaces to a host system via the integral FPC extension through a 10-pin
FPC-connector with 0.5 mm pitch. The pin information is shown in Table 2.

Table 2. FPC CONNECTOR PIN DESCRIPTION

Pin No Pin Name Type Description
1 VSS P Ground
(left-most when looked
at from the back)

2 VDD P 3.3 V Power supply

3 DATA_AV O Data Available signal
4 SSFLASHN I SPI Slave Select, Flash Memory on the MI0802 PCBA
(active low)
5 SCK I SPI Bus Clock
6 MISO I Master Input Slave Output of the SPI Bus
7 MOSI O Master Output Slave Input of the SPI Bus
8 SSN I SPI Slave Select (active low)
9 RSTN I System Reset (active low)
10 SYSCLK I System Clock

5. RECOMMENDED SYSTEM SETUP

The recommended usage of MI0802 camera module is in combination with its companion
integrated circuit MI48xx as seen in Fig. 2.
The MI48xx plays the role of a low-level thermal imaging processor, and handles the exact
control signalling necessary to capture raw sensor data from the thermal imaging array of
the MI0802. It also provides standard interfaces for communication with a host controller.
In the case of the MI48Ax for example, these interfaces are the Inter-Integrated Circuit
(I2C) bus – for conveying commands and obtaining status, and the serial peripheral
interface (SPI) – for the readout of thermal data obtained by the MI48Ax. In addition to the
I2C and SPI interfaces, the MI48Ax provides a digital signal to alert the host controller that
new thermal image data is available, as shown in Fig. 2.
The MI48Ax also performs low-level processing of the data read out from the camera
modules. Specifically, it handles the per-pixel calibration, performs bad pixel correction

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(BPC), and converts the raw camera data to temperature, and in this way greatly facilitates
the development of applications embedding the MI0802 camera module.
To ensure the best accuracy and stability of the temperature readout, a dedicated voltage
regulator for the camera module is also recommended.

Fig. 2. Recommended system architecture embedding the camera module MI0802, the thermal
imaging processor MI48Ax, and a host MCU.

6. FUNCTIONAL DESCRIPTION

Fig. 3. Block diagram of the MI0802 camera module, showing major elements of the SenXor chip,
the on-board flash memory and the SenXor Bus digital interface signals.

Table 3. FUNCTIONAL BLOCKS DESCRIPTION

Detector Array An array of 80 x 62 LWIR detectors, each of which produces a
voltage of magnitude that is dependent on the difference in
temperature between the objects in the field of view and the
die temperature.

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Clocking and Timing System clock related circuitry, responsible for all timing and
Logic reset signalling supplied to the Array Decode Logic.
SPI Address Decoder Address decoder for selecting the correct SPI slave device and
registers of the MI0802 Camera Module. Two SPI select pins are
supported.
SSN enables access to the internal registers for control and
status information, as well as to the output register through
which the ADC data corresponding to each detector is acquired.
SSFLASHN enables access to the 64 KB flash memory that is
located on the PCB assembly.
Array Decode Logic Row and column decode logic for the FPA, responsible for
accessing each detector in sequence and routing its output via
the Analogue Front End to the ADC.
Analogue Front End Amplification and filtering the signals from the individual
detectors so they are suitable for digitization by the ADC. This
stage includes gain control for conditioning the analogue signal
for digitization based on the scene temperature and frame rate.
ADC Analogue to Digital Converter of the voltage signal from the
Analogue Front End. Its output is buffered in the Output
Register.
Data FIFO The MI0802 implements a First-In-First-Out (FIFO) memory
buffer so as to ease the timing on the readout of the output
data from ADC.
Output Register The output register stores the ADC data that can be read by the
MI48xx chip or the host MCU through the SPI interface.
OTP Memory Embedded OTP ROM of factory programmed unique device ID.
Flash Memory Factory programmed FLASH memory storing the per-pixel
calibration look-up tables that are necessary for temperature
conversion and radiometric output by the host system.

7. TECHNICAL SPECIFICATION
7.1. Thermal Imaging Sensor Characteristics
7.1.1. General

The thermal sensor array operates in the long-wave infrared range (LWIR) of the
electromagnetic spectrum. Table 4 lists the essential characteristics of the sensor. Fig. 4
shows the spectral response of an individual detector within the array, including the
characteristics of the lens of the camera module.

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Table 4. THERMAL IMAGING SENSOR CHARACTERISTICS

Parameter Value Unit
Wavelength detection range 8 – 14 μm
Focal point array shape 80 (H) x 62 (V) Number of detectors
Total number of detectors 4960 Number of detectors
Non-functional detectors < 0.5 %
Detector pitch 35 (H) x 35 (V) μm
Noise-equivalent temperature 125 1) mK
difference (NETD)
Indicative Scene Temperature Module Gain factor 2)
(at ambient operational 1.0 0.5 0.25
temperature) (default)
−20 to
MI0802M5S −20 to −20 to °C
+175 +275 > 400
MI0802M6S −20 to −20 to −20 to °C
+300 +390 > 400
MI0802M7G −20 to −20 to −20 to °C
> 400 > 400 > 400
Operating temperature range −20 to +85 °C
Frame rate (maximum) 29.30 Frames per second
Power consumption 40.0 mW
Notes:
1) For MI0802M5S, defined at 1 FPS and achievable with the use of denoising filter in the
temporal domain, such as realised in the firmware of the companion thermal imaging
processor by Meridian Innovation, see MI48Dx specification.
2) Module gain is controlled via the companion thermal imaging processor MI48Dx.

Fig. 4. Spectral response of

MI0802M5S.

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7.1.2. Accuracy

Accuracy is defined for the MI0802M5S modules under isothermal conditions for both
module and ambience, power supply voltage 𝑉𝐷𝐷 = 3.3 ± 0.01 𝑉, and the area of the
target object exceeding the FOV of the module by 25 % or more, as shown in Fig. 5.
Relative humidity should be below 95 % and there should be no condensing vapor or
moisture on the lens.

Fig. 5. Setup for module verification. The emitter size of the blackbody must nearly fill or exceed
the field of view of the sensor.

Table 5. ACCURACY SPECIFICATION FOR MI0802M5S

Operational chip Scene temperature, ℃ Maximum deviation2), ℃
temperature 1), ℃
Frame Accuracy 3) 30.0 32.0 – 40.0 ±1.0 (center 32x24)
±1.2 (entire FPA)
30.0 10.0 – 32.0, ±1.5 (entire FPA)
40.0 – 70.0
30.0 < 10.0, the bigger of ±2.0 (entire
> 70.0 FPA) or 5%
Non-uniformity 4) 30.0 32.0 – 42.0 ±0.5 (center 32x24)
±0.7 (entire FPA)
30.0 10.0 – 32.0, ±1.0 (entire FPA)
42.0 – 70.0
30.0 < 10.0, the bigger of ±2.5 (entire
> 70.0 FPA) or 5%
Stability with respect to 30.0 32.0 – 40.0 𝑇𝐵𝐷
chip temperature
Stability with respect to 30.0 - 𝑇𝐵𝐷
𝑉𝐷𝐷

Noise 5 1 FPS 10 FPS 30 FPS

RMSE (standard deviation) ±0.2 ±0.63 ±1.09

Notes:
1. SenXor chip temperature

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2. Reported values are for MI0802M5S (dual element Si lens with 45° HFOV)
3. Frame Accuracy is defined as the mean of all pixels in the array, i.e. the frame-
average, for a frame that is obtained after averaging 1000 frames, i.e. not subject
to random noise
4. Deviation of individual pixels from the frame-average
5. Intrinsic noise for the center (32x24) pixels of the array without firmware or
software filtering, for a target at 60 ℃.

7.2. Electrical Characteristics

7.2.1. Absolute Maximum Rating

Exceeding the values reported below at any time may lead to a performance deterioration,
malfunction or destruction of the chip.
The values reported below are guaranteed by characterization results, not tested in
production.
All interface-related pins are referred to as I/O.

Table 6. ABSOLUTE VOLTAGE RATINGS

Symbol Parameter Min Max Unit
VDD-VSS DC Power Supply −0.3 3.6 V
VIN I/O voltage −0.3 3.6 V
ESD(HBM) ESD(HBM) 2 kV
ESD(CDM) ESD(CDM) 0.5 kV

Table 7. ABSOLUTE CURRENT RATINGS

Symbol Parameter Min Max Unit
IDD Maximum Current into VDD 200
ISS Maximum Current out of VSS 100
Maximum Current Sunk by a I/O pin 20
Maximum Current Sourced by a I/O pin 20
mA
IIO Maximum Current Sunk by total I/O pins 100
Maximum Current Sourced by total I/O 100
pins
LU Static latch-up class (at TA = 25°C) 200

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Table 8. ABSOLUTE ENVIRONMENTAL RATINGS

Symbol Parameter Min Max Unit
TA Ambient (Operating) Temperature −40 85 °C
TST Storage Temperature −40 85 °C
PA Ambient Pressure 110 kPa
RH Relative Humidity 95 %
GSH Mechanical Shock 1 G

7.2.2. Nominal Operating DC Characteristics

Table 9. VOLTAGE CHARACTERISTICS

Symbol Parameter Min Typical Max Unit
VDD Power Supply 3.2 3.3 3.4 V
VIO IO logic levels 3.0 3.3 3.6 V

Table 10. CURRENT CONSUMPTION 1)

Symbol Parameter Min Typical Max Unit
IDD_A Active (thermal image acquisition) 8 10 12 mA
IDD_S Stand-by 0.6 mA
1) Measured at VDD = 3.3 V and TA = 25 °C.

7.3. Dynamic Timing Characteristics

7.3.1. System Clock

The MI0802 timing is driven by an external oscillator of 3 MHz, with a tolerance not
exceeding 30 ppm. Internally, it generates all necessary timing for its operation and
interfaces. Typically, SYSCLK will be generated by the companion chip MI48XX, which
interfaces directly to the MI0802 via the SenXor bus.

7.3.2. System Reset

The MI0802 is reset by asserting 0 to the RSTN.

RSTN pin must be held low (below 0.2 VDD) for at least 10 SYSCLK cycles in order to take
effect, as shown in Fig. 6. When RSTN is asserted, there is no access to the SPI interface.
RSTN is considered released after the pin is held high (above 0.7 VDD) for at least 10 SYSCLK
µs. Thereafter, the SPI interface is accessible.
Immediately after power up the host MCU must assert and hold RST_N pin low for a
minimum of 10 SYSCLK cycles. During this time the SYSCLK must be enabled and running.
After this time the pin may be de-asserted, i.e. brought high for at least 10 SYSCLK cycles.

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Fig. 6. Power-ON reset timing diagram and time before SPI interface access.

7.3.3. SPI Interface Timing for Register Access

ADC output data for each detector, as well as the control and status registers are accessed
through the SPI interface as shown in the timing diagram in Fig. 7.

Fig. 7. SPI Timing diagram for write and read access.

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7.3.4. Timing Characteristics

Table 11. TIMING PARAMETERS

Symbol Parameter Min Typical Max Unit
FSYSCLK System clock frequency 3 MHz
FSCK SPI clock frequency 10 14 20 MHz
DutySCK SPI clock duty cycle 50 %
TDS SPI data setup time 2 ns
TDH SPI data hold time 5 ns

8. PACKAGE INFORMATION
Fig. 8. Shows the dimension details of the PCBA package of the MI0802 camera module.
The weight of the entire assembly is less than 3 g.
The base of the MI0802Mxx is a reinforced flexible PCB with an integral extension for
interfacing to an FPC connector with a pitch of 0.5 mm. A typical connector part number is
HiRose FH28-10S-0.5SH from Hirose Electric. Further details of the correspondence
between pin 1 on the MI0802Mxx and pin 1 on the FPC connector on the host system are
given in Appendix A. The detailed dimensions of the MI0802Mxx module are shown in Fig.
8. The figure indicates two parameters – H1 and H2 – the overall module height and lens
holder height respectively. The exact values of the parameters depend on the type of lens,
and are shown for each product number in Table 12.

Fig. 8. Dimension of PCBA, including the lens of MI0802Mxx. All dimensions are in mm, unless specified
otherwise.

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Table 12. ILENS-DEPENDENT MODULE DIMENSIONS

Product Code Lens H1, mm (tolerance) H2, mm (tolerance)
MI0802M5S 2-element, Si, fixed mount, F# 0.8 8.2 (±0.2) 3.7 (±0.1)
MI0802M6S 2-element, Si, fixed mount, F# 0.9 8.0 (±0.2) 3.7 (±0.1)
MI0802M7G 1-element, Ge, fixed mount, F# 0.8 5.0 (±0.2) 3.7 (±0.1)

9. REVISION HISTORY
Revisio Date Comment
n
0.0.1 15 Jul 2022 Template with preliminary information
0.0.2 26 Jul 2022 Most details revised. Lacking Module-level dimensions and Packaging detail for
miniCougar.
0.0.3 2 Aug 2022 Revised lens offering according to mini-package on FPC base
0.0.5 8 Aug 2022 Revised pin-out according to mini-package with integral FPC extension.
Added packaging details, and recommended FPC connector details. Updated
Appendix A and B.
0.0.6 9 Aug 2022 Product code, pinout (MISO/MOSI swap corrected)
0.0.7 10 Aug 2022 Revised scene temperature ranges per lens
0.0.8 18 Aug 2022 Updated OTP ROM description and block diagram for 16 byte ID field.
0.0.9 2 Sept 2022 Corrected sensor orientation in Fig. 10, Appendix B
0.0.10 ??? Updated module dimension
Removed old lens
1.0.0 28 Dec 2022 Revised product codes, dimensions and specification (NETD & scene range).
1.0.1 22 Feb 2023 Updated FoV figures and tolerance.

10. LEGAL INFORMATION

This document is for informational purposes only
No part of this document may be reproduced or transmitted in any form or by any means,
electronic or mechanical, including photocopying and recording, for any purpose without
the express written permission of Meridian Innovation Limited.
SenXor logo is a registered trademark of Meridian Innovation. All other trademarks are the
property of their respective owners.
Products furnished by Meridian are believed to be accurate and reliable. However,
Meridian reserves the right to make changes in its sole discretion, at any time to the
products.
MERIDIAN DISCLAIMS ALL EXPRESS OR IMPLIED WARRANTIES FOR THE PRODUCTS
PROVIDED HEREUNDER, INCLUDING WITHOUT LIMITATION THE WARRANTIES OF
MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, NOR DOES IT MAKE ANY

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WARRANTY FOR ANY INFRINGEMENT OF PATENTS OR OTHER RIGHTS OF THIRD PARTIES

WHICH MAY RESULT FROM THE PRODUCTS.
Meridian assumes no obligation to correct any errors contained in the products provided
hereunder or to advise users of the products of any correction if such be made. Customers
are advised to obtain the latest version of product specification, and Meridian makes no
assurance that Meridian’s products are appropriate for any application by any particular
customer. Meridian products provided hereunder are subject to the restrictions set forth
in the accompanying NDA.
Meridian products are not intended for use in life support appliances, devices, or systems.
Use of Meridian products for purposes other than those set forth in the accompanying
NDA without the written consent of an appropriate Meridian officer is prohibited.

11. CONTACTS INFORMATION

For more information, please visit www.meridianinno.com
For sales inquiries, please email [email protected]
Headquarters: Meridian Innovation Pte. Ltd., 2 Vision Exchange, #11-08, Singapore
Company Registration Number: 201611173R

12. APPENDIX A – INTERFACING TO FPC CONNECTOR ON THE HOST

SYSTEM
Figure 9-a) shows the schematic of the recommended HiRose FH28-10S-0.5SH FPC
connector with 0.5 mm pitch. Note the polarisation mark, which indicates Pin 1 of the
connector. This Pin 1 corresponds to Pin 1 of the FPC extension of the MI0802.
Accordingly, the recommended PCB layout of the connector is shown Fig. 9-b).

a) b)

Fig. 9. Polarisation mark and Pin 1 indicator on the recommended FPC connector for interfacing
the MI0802Mxx, and example layout of the soldering pads for the FPC connector on the host

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system.

13. APPENDIX B – ARRAY ORIENTATION AND DETECTOR ENUMERATION

The MI0802 module outputs the data of each detector of the focal point array in a serial
fashion. It is important to note the correct enumeration of the detectors, when
constructing a two-dimensional image from the serial stream of data.
The MI0802 contains 4960 detectors or pixels, arranged in 62 rows and 80 columns as
shown in Fig. 10, assuming that you are facing the lens of the module. The value of pixel 1
is output first, and the value of pixel 4960 is output last, in a row-by-row fashion.

Fig. 10. When facing the lens of the MI0802 module, the individual detectors of the focal point
array are enumerated as shown in the rectangular frame, from 1 to 4960. The temperature values
are output serially, starting from that of detector 1, ending with that of detector 4960.

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