Documentation Center

RAK3172 WisDuo LPWAN Module Datasheet

Overview
Description
RAK3172 is a low-power long-range transceiver module based on the STM32WLE5CC chip. It provides an easy-
to-use, small-size, low-power solution for long-range wireless data applications. This module complies with Class
A, B, & C of the LoRaWAN 1.0.3 specifications. It can easily connect to different LoRaWAN server platforms like
TheThingsNetwork (TTN), Chirpstack, Actility, etc. It also supports LoRa Point-to-Point (P2P) communication
mode, which helps you implement your own customized long-range LoRa network quickly.

You can configure the mode and operation of the module using AT commands via a UART interface. RAK3172
also offers low-power features, which are very suitable for battery-powered applications.

Features
Based on STM32WLE5CCU6
LoRaWAN 1.0.3 specification compliant
Supported bands: EU433, CN470, IN865, EU868, AU915, US915, KR920, RU864, and AS923-1/2/3/4
LoRaWAN activation via OTAA/ABP
LoRa Point-to-Point (P2P) communication
Custom firmware using Arduino via RUI3 API
Easy to use AT command set via UART interface
Long-range - greater than 15 km with optimized antenna
ARM Cortex-M4 32-bit
256 kbytes flash memory with ECC
64 kbytes RAM
Ultra-low-power consumption of 1.69 μA in sleep mode
Supply Voltage: 2.0 V ~ 3.6 V
Temperature Range:
RAK3172: -20° C ~ 85° C
RAK3172-T: -40° C ~ 85° C

📝 NOTE:
There are two certification variants available for the RAK3172 Module: (1) with the CE & UKCA
Certification Mark and (2) with FCC, IC, & RCM Certification Mark.

If you need LoRa module with BLE 5.0 capability, you can check RAK11720 which is pin-to-pin
compatible to RAK3172 with extra pins for additional ground and BLE RF antenna port.

⚠ WARNING
Temperature ratings:
RAK3172 is -20° C to 85° C
RAK3172-T is -40° C to 85° C

Specifications
 Documentation Center

This section covers the hardware and software specifications of RAK3172. Also, it includes the block diagram and
the updated firmware link of the RAK3172 WisDuo module.

Overview
Block Diagram

Figure 1: RAK3172 System Block Diagram

Hardware
The hardware specification discusses the interfaces, pinouts and its corresponding functions and diagrams. It also
covers the parameters of both RAK3172 modules in terms of RF, electrical, mechanical, and operating
characteristics.

Interfaces
Module Interfaces

RAK3172 UART2/LPUART1, UART1

Sub-GHz SPI interface

A dedicated internal SPI interface called SUBGHZSPI is used to communicate with the RF subsystem of the
STM32WLE5CCU6.

Pin Definition
 Documentation Center

Figure 2: Board Pinout for RAK3172

⚠ WARNING
When using RF pin for antenna connection and not the IPEX connector variant, make sure there is no
ground plane (in all layers of the PCB) under the RF trace path to eliminate the possible effects of
unwanted stray capacitance which can cause degradation of the RF signal levels.

Pin
Name Type Description
No.

Reserved - UART2/LPUART1 Interface (AT Commands and FW

1 PA3/UART2_RX I
Update)

Reserved - UART2/LPUART1 Interface (AT Commands and FW

2 PA2/UART2_TX O
Update)

3 PA15/PIN_A4 I/O GPIO and ADC

4 PB6/UART1_TX O UART1 Interface

5 PB7/UART1_RX I UART1 Interface

6 PA1 I/O GPIO only

7 PA13/SWDIO Reserved - SWD debug pin (SWDIO)

8 PA14/SWCLK Reserved - SWD debug pin (SWCLK)

9 PA12/I2C_SCL I/O GPIO and I2C (SCL)

10 PA11/I2C_SDA I/O GPIO and I2C (SDA)

 Documentation Center

Pin
Name Type Description
No.

11 GND Ground connections

RF Port (only available on RAK3172 No-IPEX connector

12 RF
variant)

13 PA7/SPI1_MOSI I/O GPIO and SPI (MOSI)

14 PA6/SPI1_MISO I/O GPIO and SPI (MISO)

15 PA5/SPI1_CLK I/O GPIO and SPI (CLK)

16 PA4/SPI1_NSS I/O GPIO and SPI (NSS)

17 GND Ground connections

18 GND Ground connections

19 PA8 I/O GPIO only

20 PA9 I/O GPIO only

21 BOOT0 Boot0 mode enable pin - high active

22 RST MCU Reset (NRST)

23 GND Ground connections

24 VDD VDD - Voltage Supply

25 PA10/PIN_A3 I/O GPIO and ADC

26 PB2/PIN_A2 I/O GPIO and ADC

10 kΩ internally pulled-up for high freq variant or pulled-down

27 PB12 I/O
for low freq variant

28 GND Ground connections

29 PA0 I/O GPIO only

30 PB5 I/O GPIO only

31 PB4/PIN_A1 I/O GPIO and ADC

32 PB3/PIN_A0 I/O GPIO and ADC

RF Characteristics
 Documentation Center

The RAK3172 supports two different frequency variations: RAK3172(L) Low Radio Frequency and RAK3172(H)
High Radio Frequency.

📝 NOTE:
Performance test and evaluation of RAK3172-T (with TXCO), can be found on the RAK3172-T TCXO
Verification Report )

Operating Frequencies
Module Region Frequency

RAK3172(L) Europe EU433

China CN470

RAK3172(H) Europe EU868

North America US915

Australia AU915

Korea KR920

Asia AS923-1/2/3/4

India IN865

Russia RU864

Electrical Characteristics
Operating Voltage
Feature Minimum Typical Maximum Unit

VCC 2.0 3.3 3.6 Volts (V)

Operating Current
Feature Condition Minimum Typical Maximum Unit

Operating Current TX Mode 87 (@ 20 dBm 868 Mhz) mA

RX Mode 5.22 mA

Sleep Current
Feature Condition Minimum (2.1 V) Typical (3.3 V) Maximum Unit

Current Consumption EU868 - 1.69 - μA

 Documentation Center

Feature Condition Minimum (2.1 V) Typical (3.3 V) Maximum Unit

US915 - 1.69 - μA

CN470 - 1.69 - μA

📝 NOTE:
For the reference application schematic of RAK3172 with minimum components requirements, refer to the
RAK3272S Breakout Board Datasheet.

Mechanical Characteristics
Module Dimensions

Figure 3: RAK3172 Physical Dimension

Layout Recommendation
 Documentation Center

Figure 4: RAK3172 Layout

Environmental Characteristics
Operating Temperature
Module Minimum Typical Maximum Unit

RAK3172 -20 25 85 °C

RAK3172-T -40 25 85 °C

Storage Temperature
Feature Minimum Typical Maximum Unit

Storage Temperature -40 85 °C

Recommended Reflow Profile

Figure 5: Reflow Profile for RAK3172

Standard conditions for reflow soldering:

 Documentation Center

Pre-heating Ramp (A) (Initial temperature: 150° C): 1~2.5° C/sec

Soaking Time (T2) (150~180° C): 60~100 sec
Peak Temperature (G): 230~250° C
Reflow Time (T3) (>220° C): 30~60 sec
Ramp-up Rate (B): 0~2.5° C/sec
Ramp-down Rate (C): 1~3° C/sec

Software
Download the latest RAK3172 WisDuo LPWAN Module firmware provided below. RAK3172(L) and RAK3172(H)
use the same firmware and it will automatically detect the variant of the module being used.

The bin file contains the application code only and you need the RAK DFU Tool to upload this file to the module.

The hex file contains both the bootloader and the application code. You need to use STM32CubeProgrammer to
upload this.

⚠ WARNING
Uploading the .hex file via STM32CubeProgrammer will erase all configured data on the device.

RAK3172 uses UART2 serial pins to upload the latest firmware.

📝 NOTE:
RAK3172 should automatically go to BOOT mode when the firmware is uploaded via RAK DFU Tool or
WisToolBox.

If BOOT mode is not initiated, you can manually send AT+BOOT command to start bootloader mode.

Firmware / OS
Model Version Source

RAK3172 (.bin) RUI3 Application Code only (default baudrate = 115200) Download

RAK3172 (.hex) RUI3 Bootloader and Application Code(default baudrate = 115200) Download

RAK3172-T (.bin) RUI3 Application Code only(default baudrate = 115200) Download

RAK3172-T (.hex) RUI3 Bootloader and Application Code (default baudrate = 115200) Download

RAK3172 (OLD) DEPRECATED V1.0.4 (default baudrate = 9600) Download

⚠ WARNING
There are RAK3172 devices loaded with old firmware versions which are not based on RUI3 (RAKwireless
Unified Interface V3). These devices have v1.0.4 and below.

If the host microcontroller code is based on this old firmware, we have a RAK3172 AT Command migration
guide that explain in detail the few differences between the two AT commands set.
 Documentation Center

Certification

Last Updated: 9/19/2023, 2:53:54 AM