Jason Lee

PowerEdge R470 Supplementary

The PowerEdge R470 Supplementary document is intended as a supplementary document for the 17G PowerEdge
R470 Administration and Maintenance course.

Copyright © 2024 Dell Inc. or its subsidiaries. All Rights Reserved. Dell Technologies, Dell and other trademarks are trademarks of
Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.

Feature Comparison

Memory Population Rule

Risers

Thermal Components

Supported Operating System

Block Diagram
Lesson 1 of 6

Feature Comparison
Jason Lee

Feature HS5610 R470

2x Sapphire Rapids (SPR) CPU (Socket E) –

XCC/MCC 1x Intel SRF Processor LGA 4710 Socket E2, up to 350 W
CPU
Up to 250 W TDP with HW configuration (Max TDP)
restriction

PCH Chipset Emmitsburg PCH-less

16x DDR5 DIMMs @4800 MT/s, RDIMM, 128 16x DDR5 16 DIMM @ 6400 MT/s (1 DPC), 5200 MT/s (2
Memory
GB DPC)

Front: 3.5”, 2.5”

Front: E3.S
– 12Gb SAS, 6Gb SATA; 2.5”
– GEN5 EDSFF 2.5”
Storage – GEN3/4 NVMeRear: 2.5”
– 24 Gb SAS4, SATA; 2.5”
– 12 Gb SAS, 6 Gb SATA; 2.5”
– GEN4 NVMe
– GEN3/4 NVMe

Front: Up to 10x 2.5” NVMe

PCIe Storage Front: Up to 8x E3.S; Up to 8x 2.5” NVMe
Rear: Up to 2x 2.5” NVMe

Front: 1 port (USB 2.0), 1 (micro-USB, iDRAC Front:

Direct) – 1x HOST/BMC Direct (USB2.0 type C)
Rear: 1 port (Bottom: USB 3.0) + 1 port (Top: – 1x USB 2.0 type A (optional- LCP KVM)
USB
USB 2.0)
Internal: 1 port (USB 3.0) for IDSDM/internal Rear: DC-SCM two port (USB3.1 type A)
USB card up sell option. Internal: One port (USB 3.1)

Internal: (PERC11) HBA355i, H355, H755,

H755N
External: HBA355e Internal: PERC H965i with DC-MHS compliance
Storage
SW RAID: S160 (Chipset SATA/NVMe) None of SW RAID
Controller
BOSS-N1: Monolithic type for HS5610 6x2.5” BOSS-N1 DCMHS
only, other 1U configurations use Modular
type

Network 2x 1 GbE LOM OCP 3.0 x16

1 CPU: Up to 2 PCIe slots (1 x16 Gen4 + 1

PCIe Slots Up to 2 x16 FH Gen5 PCIe, up to 2x OCP x16
x8 Gen5)

AC (Platinum): 600 W (PE only), 800 W,

1400 W
PSU 800 W Platinum, 1500 W Titanium 60 mm M-CRPS
AC (Titanium): 700 W, 1100 W, 1800 W
LVDC @-48 VDC Input: 1100 W

System – iDRAC iDRAC 10

Management – (CSP only) OSM 2.1 (OpenBMC+)

– Hot plug redundant Hard drives, PSUs

Hot plug redundant Hard drives, Fans, PSUs, BOSS-N1
Hot Access – Cold-plug Redundant Cooling, Hot-plug
Flatbread’s Media (M.2 carrier)
for upsell

Security
15G-class Security (SPI interface) 17G-class Security TPM 2.0 (NPCT760JABYX)
(TPM)

GPU No L4 GPU card

Linux and Windows based OS, SLES, Ubuntu,

OS Linux, SLES, Ubuntu
VMware ESXi
Lesson 2 of 6

Memory Population Rule

Jason Lee

Supported RDIMM configurations (DIMMs per CPU)

1 DIMM (only 32 GB allowed during minimum to POST)

8 DIMMs

16 DIMMs (only 64 GB module is supported)

Sierra Forest 1x 4x 8x (1 DPC) 12x 16x (2 DPC)

Cell 1 Yes - Yes - -

Cell 6 - - Yes - Yes

Ranks per DIMM and Data Width Capacity 1 DPC Speed 2 DPC Speed

1Rx8 16 GB - -

2Rx8 32 GB 6400 -
 2Rx4 64 GB 6400 5200

2Rx4 96 GB - -

2Rx4 128 GB - -

The figure below illustrates the high level DDR5 implementation plan for the 1-socket platform with two slots per channel.
Intel’s convention is to have DIMM slot0 further away from the CPU than slot1 within the same channel. The population
rule should follow DDR5 Memory diagram as shown as below.

Population rules for PowerEdge R470

Lesson 3 of 6

Risers
Jason Lee

Slot Mapping

Front Rear
Location Card Support RF1d R2q R4b
BOSS BOSS

PCIe Slot 31 (FLOP

n/a x16
OCP)

PCIe Slot 32 (FLOP

n/a x16
OCP)

PCIe Slot 34 (Front

n/a x4
BOSS)

Low Profile Half

PCIe Slot 1
Length

Full Height Half

PCIe Slot 1 x16
Length

PCIe Slot 2 (FLOP Full Height Half

OCP) Length

PCIe Slot 3 (Rear

n/a x4
BOSS)
 Full Height Half
PCIe Slot 4 x16
Length

PCIe Slot 5 (Onboard

n/a
OCP)

Riser Configuration Slot Mapping

Slot Form Board

Configuration Riser/OCP/BOSS Category Bandwidth Power Port
# Factor Location

PCIe Gen4
RC0 BOSS (optional) BOSS 3 BOSS x4 (1C 25.2 W BOSS J_BOSS
connector)
Rear:
x4 optional
BOSS PCIe Gen5
and 1 x16 Onboard OCP x16 (OCP OCP_NIC
onboard OCP OCP 5 OCP 75 W J_OCPNIC
(optional) 4C+ 3.0
connector)

PCIe Gen5
31 OCP x16 (OCP J_SL1,
Flop OCP 75 W SL1, SL2
4C+ J_SL2
connector)
RC3 RF1d
PCIe Gen5
Front: 2 x16
32 OCP x16 (OCP SL11,
FLOP OCP Flop OCP 75 W J_R5
4C+ SL12
(Gen5) and x4
connector)
optional BOSS

PCIe Gen4
BOSS (optional) BOSS 34 BOSS x4 (1C 25.2 W BOSS J_BOSS
connector)
 Hybrid Full PCIe Gen5 SL11,
R2Q 1 75 W J_R5
Riser Height x16 SL12

3 PCIe Gen4
RC6 BOSS (optional) BOSS BOSS 25.2 W BOSS J_BOSS
x4
Rear: 2 x16 FH
(Gen5) with x4
optional boss Full
and x16 R4b Cabled 4 PCIe Gen5 SL13,
75 W J_R4
onboard OCP Riser Height x16 SL14

OCP (optional) 5 OCP PCIe Gen4 OCP_NIC

OCP 75 W J_OCPNIC
x4 3.0

Riser Configuration
 Riser Configuration for RC0, RC1, RC2 RC3 and RC4.

Riser Configuration for RC5, RC6, RC7 and RC8.

Front Riser Types

R1d
 R1d is created for front OCP cards.

RF1c

RF1c is created for front PCIe cards.

Riser 2 Types

R2K Riser

R2U

R2V
R2q

R2t
Riser 4 Types

R4a

R4b
Lesson 4 of 6

Thermal Components
Jason Lee

Fan Type

Fan Type DPN Description Usage

4056 VHP fan (HPR Silver) J7DTN ASSY,FAN,HPR,SLVR,40X56,1U,17G CPU TDP <=350 W

4056 STD fan (Brickfielder) 9P02K ASSY,FAN,STD,40X56,1U,17G CPU TDP <= 250 W
 (Left) VHP fan and (Right) STD fan

Air Shroud Type

Air Shroud Type DPN Description Usage

EXT HSK front shroud 5PTF0 SHRD,FRONT,EXT,R470 Bundled with EXT HSK configuration

Remote HSK front shroud FFX7G SHRD,FRONT,REMOTE,R470 Bundled with Remote HSK configuration

(Left) EXT HSK air shroud and (Right) Remote HSK air shroud.

Thermal Restriction
 Configuration

8x E3.S (Cold Aisle Front 8x 2.5" SAS/SATA; NVMe

Front Storage 10x 2.5" SAS/SATA
Node) RAID/Direct

Fan Type and VHP/Brickfielder fan

VHP/Brickfielder fan x8 VHP/Brickfielder fan x8
Quantity x8

Extended HSK Extended HSK Extended HSK

200 W
Brickfielder Fan Brickfielder Fan Brickfielder Fan

Extended HSK Extended HSK Extended HSK

205 W
Brickfielder Fan Brickfielder Fan Brickfielder Fan

Extended HSK Extended HSK Extended HSK

225 W
Brickfielder Fan Brickfielder Fan Brickfielder Fan

Extended HSK Remote HSK Extended HSK

250 W
Brickfielder Fan VHP Fan Brickfielder Fan

Remote HSK Remote HSK Remote HSK

300 W
VHP Fan VHP Fan VHP Fan

Remote HSK Remote HSK Remote HSK

330 W
VHP Fan VHP Fan VHP Fan

Remote HSK Remote HSK Remote HSK

350 W
VHP Fan VHP Fan VHP Fan

Legend:

Supported at 35 °C

Maximum 30 °C support

Maximum 25 °C support
Not supported

Extended HSK and VHP fan is required for a 350 W CPU TDP supporting at
35 °C ambient.

Supports CPU TDP up to 250 W with extended HSK and Brickfielder fan in
8x E3.S cold aisle config and 8x2.5” SAS/SATA (NVMe RAID/direct) config

at 35 °C ambient.

Supports CPU TDP up to 225 W with extended HSK and Brickfielder fan on

the 10x 2.5” SAS/SATA configuration at 35 °C ambient.

Lesson 5 of 6

Supported Operating System

Jason Lee

Red Hat Enterprise Linux (RHEL) 9.4

Ubuntu 22.04

SUSE Linux Enterprise Server (SLES) 15 SP6 support for 17G

Lesson 6 of 6

Block Diagram
Jason Lee

System Block Diagram

System block diagram of Sierra Forest (SRP)

PCIe Connection Diagram

 PCIe connection diagram

Block Diagram – 8xE3.S NVMe Direct (Cold Aisle)

 Storage Block Diagram 01 - 8xE3.S NVMe Direct (Cold Aisle)

Block Diagram – 8xE3.S NVMe Direct

 Storage Block Diagram 02 - 8xE3.S NVMe Direct

Block Diagram – 8x2.5” NVMe Direct

 Storage Block Diagram 03 - 8x2.5” NVMe Direct

Block Diagram – 8x2.5” NVMe Direct

 Storage Block Diagram 04 - 8x2.5” NVMe Direct

Block Diagram – 8x2.5” NVMe RAID

 Storage Block Diagram 05 - 8x2.5” NVMe RAID

Block Diagram – 8x2.5” NVMe RAID

 Storage Block Diagram 06 - 8x2.5” NVMe RAID

Block Diagram – 8x2.5” SAS/SATA

Storage Block Diagram 07 - 8x2.5” SAS-SATA

DDR Connection Diagram

 DDR connection diagram

CPU Memory Architecture Comparison

CPU memory architecture comparison