DATA SHEET

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Switch-mode SCHOTTKY BARRIER

Power Rectifier RECTIFIER
15 AMPERES
D2PAK Surface Mount Power 45 VOLTS
Package

MBRB1545CTG,
SBRB1545CTG
D2PAK
The D2PAK Power Rectifier employs the Schottky Barrier principle CASE 418B
with a platinum barrier metal. These state-of-the-art devices have the STYLE 3
following features:

Features 1
 Center−Tap Configuration 4
3
 Guardring for Stress Protection
 Low Forward Voltage
 175C Operating Junction Temperature MARKING DIAGRAM
 Epoxy Meets UL 94, V−0 @ 0.125 in
 Short Heatsink Tab Manufactured − Not Sheared
AY WW
 Similar in Size to the Industry Standard TO220 Package B1545G
 SBRB Prefix for Automotive and Other Applications Requiring AKA
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
 These Devices are Pb−Free and are RoHS Compliant*
B1545 = Device Code
Mechanical Characteristics A = Assembly Location
 Case: Epoxy, Molded, Epoxy Meets UL 94, V−0 Y = Year
WW = Work Week
 Weight: 1.7 grams (approximately) G = Pb−Free Package
 Finish: All External Surfaces Corrosion Resistant and Terminal AKA = Diode Polarity
Leads are Readily Solderable
 Lead and Mounting Surface Temperature for Soldering Purposes: ORDERING INFORMATION
260C Max. for 10 Seconds
See detailed ordering and shipping information on page 3 of
 Device Meets MSL1 Requirements this data sheet.
 ESD Ratings: NOTE: Some of the devices on this data sheet have been
DISCONTINUED. Please refer to the table on page 3.
 Machine Model = C (> 400 V)
 Human Body Model = 3B (> 8000 V)

*For additional information on our Pb-Free strategy and soldering details, please
download the onsemi Soldering and Mounting Techniques Reference Manual,
SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012 1 Publication Order Number:

November, 2024 − Rev. 14 MBRB1545CT/D
 MBRB1545CTG, SBRB1545CTG

MAXIMUM RATINGS (Per Leg)

Symbol Rating Value Unit
VRRM Peak Repetitive Reverse Voltage 45 V
VRWM Working Peak Reverse Voltage
VR DC Blocking Voltage
IF(AV) Average Rectified Forward Current 7.5 A
(Rated VR, TC = 167C) Total Device 15

IFRM Peak Repetitive Forward Current A

(Rated VR, Square Wave, 20 kHz, TC = 166C) 15

IFSM Non−Repetitive Peak Surge Current A

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) 150

IRRM Peak Repetitive Reverse Surge Current (2.0 ms, 1.0 kHz) 1.0 A
Tstg Storage Temperature Range −65 to +175 C
TJ Operating Junction Temperature (Note 1) −65 to +175 C
dv/dt Voltage Rate of Change (Rated VR) 10,000 V/ms
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS (Per Leg)

Symbol Characteristic Value Unit
Thermal Resistance C/W
RqJC Junction to Case 2.0
RqJA Junction to Ambient (Note 2) 50
2. When mounted using minimum recommended pad size on FR−4 board.

ELECTRICAL CHARACTERISTICS (Per Leg)

Symbol Characteristic Value Unit
VF Maximum Instantaneous Forward Voltage (Note 3) V
(iF = 7.5 Amps, TJ = 125C) 0.57
(iF = 15 Amps, TJ = 125C) 0.72
(iF = 15 Amps, TJ = 25C) 0.84
iR Maximum Instantaneous Reverse Current (Note 3) mA
(Rated dc Voltage, TJ = 125C) 15
(Rated dc Voltage, TJ = 25C) 0.1
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2.0%.

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 MBRB1545CTG, SBRB1545CTG

TYPICAL CHARACTERISTICS
i F, INSTANTANEOUS FORWARD CURRENT (AMPS)

50

I R, REVERSE LEAKAGE CURRENT (mA)

30
20 10

10 125C
1

3 85C
2
0.1
1
0.5 25C
125C 85C 25C 0.01

0.001
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 10 20 30 40 50
vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage, Per Leg Figure 2. Typical Reverse Current, Per Leg
PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)

IF(AV), AVERAGE FORWARD CURRENT (A)

16 14
TJ = 125C IPK
=
12 DC
14 IAV
p
IPK
12 IPK =5 10
= 10 IAV
10 IPK IAV SQUARE
= 20 8
IAV
8
DC 6
6
SQUARE 4
4
WAVE
2
2

0 0
0 2 4 6 8 10 12 14 16 155 160 165 170 175
IF(AV), AVERAGE FORWARD CURRENT (AMPS) TC, CASE TEMPERATURE (C)
Figure 3. Typical Forward Power Dissipation Figure 4. Current Derating, Case, Per Leg

ORDERING INFORMATION
Device Package Shipping†
MBRB1545CTT4G D2PAK 800 / Tape & Reel
(Pb−Free)

SBRB1545CTT4G D2PAK 800 / Tape & Reel

(Pb−Free)

DISCONTINUED (Note 4)

MBRB1545CTG D2PAK 50 Units / Rail

(Pb−Free)

SBRB1545CTG D2PAK 50 Units / Rail

(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
4. DISCONTINUED: These devices are not recommended for new design. Please contact your onsemi representative for information. The
most current information on these devices may be available on www.onsemi.com.

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 MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS

D2PAK 3
CASE 418B−04
ISSUE L
DATE 17 FEB 2015

SCALE 1:1 NOTES:

C 1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
E 2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
V
−B− NEW STANDARD 418B−04.
W
4 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.340 0.380 8.64 9.65
B 0.380 0.405 9.65 10.29
A C 0.160 0.190 4.06 4.83
S D 0.020 0.035 0.51 0.89
1 2 3 E 0.045 0.055 1.14 1.40
F 0.310 0.350 7.87 8.89
G 0.100 BSC 2.54 BSC
−T− H 0.080 0.110 2.03 2.79
K J 0.018 0.025 0.46 0.64
SEATING W K 0.090 0.110 2.29 2.79
PLANE
G J L 0.052 0.072 1.32 1.83
M 0.280 0.320 7.11 8.13
H N 0.197 REF 5.00 REF
D 3 PL P 0.079 REF 2.00 REF
R 0.039 REF 0.99 REF
0.13 (0.005) M T B M
S 0.575 0.625 14.60 15.88
V 0.045 0.055 1.14 1.40

VARIABLE
CONFIGURATION
ZONE N P
R U
L L L

M M M

F F F

VIEW W−W VIEW W−W VIEW W−W

1 2 3

STYLE 1: STYLE 2: STYLE 3: STYLE 4: STYLE 5: STYLE 6:

PIN 1. BASE PIN 1. GATE PIN 1. ANODE PIN 1. GATE PIN 1. CATHODE PIN 1. NO CONNECT
2. COLLECTOR 2. DRAIN 2. CATHODE 2. COLLECTOR 2. ANODE 2. CATHODE
3. EMITTER 3. SOURCE 3. ANODE 3. EMITTER 3. CATHODE 3. ANODE
4. COLLECTOR 4. DRAIN 4. CATHODE 4. COLLECTOR 4. ANODE 4. CATHODE

MARKING INFORMATION AND FOOTPRINT ON PAGE 2

Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42761B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: D2PAK 3 PAGE 1 OF 2

onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

© Semiconductor Components Industries, LLC, 2019 www.onsemi.com

 D2PAK 3
CASE 418B−04
ISSUE L
DATE 17 FEB 2015
GENERIC
MARKING DIAGRAM*

xx AYWW
xxxxxxxxx xxxxxxxxG
xxxxxxxxG
AWLYWWG AYWW
AKA

IC Standard Rectifier

xx = Specific Device Code

A = Assembly Location
WL = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
AKA = Polarity Indicator
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “G”, may
or may not be present. Some products may
not follow the Generic Marking.

SOLDERING FOOTPRINT*
10.49

8.38

16.155

2X
3.504
2X
1.016
5.080
PITCH
DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the onsemi Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.

Electronic versions are uncontrolled except when accessed directly from the Document Repository.
DOCUMENT NUMBER: 98ASB42761B Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

DESCRIPTION: D2PAK 3 PAGE 2 OF 2

onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves
the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation
special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others.

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© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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