Chapter 3 discusses various light sources used in optical communications, including semiconductor lasers and LEDs. It covers the principles of operation, such as energy band diagrams, emission processes, and device structures. The chapter also illustrates the performance characteristics and configurations of different laser types, including DFB, DBR, and VCSEL lasers.
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Chapter03
Chapter 3 discusses various light sources used in optical communications, including semiconductor lasers and LEDs. It covers the principles of operation, such as energy band diagrams, emission processes, and device structures. The chapter also illustrates the performance characteristics and configurations of different laser types, including DFB, DBR, and VCSEL lasers.
Fig. 3.1.1. (A) Band diagram of separate n- and p-type semiconductors, (B) energy diagram of a pn junction under equilibrium, and (C) band diagram of a pn junction with forward bias.
Fig. 3.1.3. Illustration of an energy band in semiconductors and the impact on the spectral width of radiative recombination. (A) Energy distributions of electrons and holes. (B) Probability distribution of the frequency of emitted photons.
Fig. 3.3.3. Photon density P(J) and carrier density N(J) as functions of injection current density J. Jth is the threshold current density and Nth is the threshold carrier density.
Fig. 3.3.6. Illustration of the laser turn-delay. Injection current is turned on at t=0 from JB to J2, but both photon density and carrier density will require a certain time delay to build up toward their final values.
Fig. 3.4.1. (A) Structure of a DFB laser with a corrugating grating just outside the active layer, and (B) an illustration of two counter- propagating waves in the cavity (the ordinate represents optical field amplitude).
Fig. 3.4.5. Structure of a DBR laser with an active section A, phase control section P, and Bragg reflector section B. The laser cavity is formed between the left-end facet with reflectivity R1 and the effective reflection from the Bragg section.
Fig. 3.4.7. Illustration of resonance losses between R1 and R2 (α2) and between R2 and R3 (α3). α1 is the reflection loss of the grating and αm is the combined mirror loss. Lasing threshold is reached only by one mode at λL.
Fig. 3.5.2. Performance of a 1550nm wavelength VCSEL with D=5μm active area aperture diameter and L=2.5μm vertical cavity length. (A) P–I curve for device operated at different temperature and the inset shows the emission optical spectrum. Dashed lines show current- voltage relations. (B) Modulation response as the function of the modulation frequency at different bias currents and at 20°C temperature (Rodes et al., 2013).
Fig. 3.5.4. (A) Illustration of a cross section through a single top-emitting VCSEL superimposed to a SEM picture. (1) vertical light emission, (2) active layer area without current injection, (3) active layer area with current injection, (4) conductive DBRs, (5) metallic ring contact, and (6) oxide layer. (B) Plan view image of VCSEL array (Moench et al., 2015).
Fig. 3.6.2. (A) Illustration of diode laser P–I curve at different junction temperatures and (B) threshold current as a function of junction temperature.
Fig. 3.6.5. (A) Configuration of a diode laser package used for fiber-optic communication systems, (B) pin assignment of a standard 14-pin butterfly package of a laser diode, (C) bench-top external cavity tunable laser instrument, and (D) integrated tunable laser assembly (ITLA) for optical communication systems. ((C) Used with permission from Keysight and Santec. (D) Used with permission from Neophotonics.)