DESIGN COMPLIANCE WITH

EMI/EMC

GROUP 4
DESIGN COMPLIANCE WITH EMI/EMC

Electromagnetic Interference (EMI) and

Electromagnetic Compatibility (EMC) are
critical considerations in the design and
manufacturing of Printed Circuit Boards
(PCBs). Compliance with EMI/EMC
standards ensures that electronic devices
operate reliably without causing or
experiencing interference.

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EMI and EMC Basics

Electromagnetic Interference (EMI): This is

unwanted interference caused by
electromagnetic radiation from an electronic
device. It can disrupt the functioning of other
electronic devices.

Electromagnetic Compatibility (EMC): This refers

to the ability of a device to operate properly in its
electromagnetic environment without causing or
suffering from EMI.
Principles

1. PCB Layout: A well-designed Printed

Circuit Board (PCB) layout is crucial.
Minimize loop areas, maintain adequate
spacing between high-speed traces, and
implement proper grounding techniques
to reduce EMI

1. Shielding: Use metal enclosures or

conductive coatings to shield sensitive
components from external EMI and
prevent internal EMI from leaking out.
Principles
Filtering: Implement filters
on power lines and signal
lines to block unwanted
high-frequency noise.

Grounding: Ensure a single,

low-impedance ground path
to avoid ground loops that
can amplify EMI.
TESTING COMPLIANCES
TO ENSURE COMPLIANCE, DEVICES ARE TESTED FOR:

RADIATED EMISSIONS: MEASURES THE ELECTROMAGNETIC

ENERGY EMITTED BY THE DEVICE.

CONDUCTED EMISSIONS: MEASURES THE ELECTROMAGNETIC

NOISE CONDUCTED OUT THROUGH POWER LINES OR CABLES.

IMMUNITY TESTS: TESTS THE DEVICE'S ABILITY TO

WITHSTAND EXTERNAL ELECTROMAGNETIC DISTURBANCES, SUCH
AS ELECTROSTATIC DISCHARGE (ESD).
PCB LAYOUT AND
ARTWORK
PCB Layout
1. COMPONENT PLACEMENT: POSITIONING
COMPONENTS (ICS, RESISTORS, CAPACITORS, ETC.)
ON THE BOARD.

2. ROUTING: CONNECTING COMPONENTS WITH

COPPER TRACES (WIRES).

3. SIGNAL INTEGRITY: ENSURING SIGNAL QUALITY,

MINIMIZING NOISE, AND OPTIMIZING PERFORMANCE.
PCB Layout
4. POWER DISTRIBUTION: DESIGNING POWER
SUPPLY AND GROUND PLANES.

5. THERMAL MANAGEMENT: MANAGING HEAT

DISSIPATION AND THERMAL GRADIENTS.
PCB Artwork

1. Gerber files: Generating files for

manufacturing (layer information, silkscreen,
etc.).

2. Solder mask: Applying a layer to prevent

solder bridging.

3. Silkscreen: Adding component labels and

identifiers.
PCB Artwork

4. Assembly drawing: Creating a diagram for

PCB assembly.

5. Fabrication drawing: Providing

manufacturing instructions
 PCB Layout Considerations:

1. Component selection and placement

2. Signal routing and termination
3. Power distribution and decoupling
4. Thermal management and heat sinks
5. Electromagnetic interference (EMI)
mitigation
6. Manufacturing constraints (e.g., minimum
trace width)
 PCB Artwork Best Practices:
1. Use standardized layer naming
conventions.
2. Ensure accurate Gerber file
generation.
3. Verify solder mask and silkscreen
alignment.
4. Include assembly and fabrication
notes.
5. Review and validate PCB design rules.
 PCB Manufacturing Process:

1. PCB fabrication (etching, drilling, etc.)

2. Component assembly (SMT, through-hole,

etc.)

3. Soldering and inspection

4. Testing and quality control

Common PCB layout and
artwork
PCB LAYOUT
Single-Sided PCBs are the most basic type,
featuring a single layer of conductive
material on one side of the substrate.
They're cost-effective and suitable for simple
devices like calculators and sensors.

Double-Sided PCBs have two layers of

conductive material on both sides of the
substrate, allowing for increased component
density and more complex circuit designs.
PCB LAYOUT
- Multilayer PCBs have three or more
layers of conductive material sandwiched
between insulating layers. They're ideal for
high-speed, high-density, and high-power
applications like computer motherboards,
telecommunications equipment, and
medical devices.
When designing a PCB layout, it's essential to
consider factors like Component Placement,
Routing, and Grounding and Power Planes.
Proper placement of components ensures
optimal performance, manufacturability, and
signal integrity. Routing involves creating
conductive paths between components, while
grounding and power planes provide stable
voltage levels and minimize noise and
interference.
Additionally, Design Rule Check (DRC) is a
crucial step in the PCB design process,
ensuring that the layout adheres to
specific manufacturing and performance
requirements. This automated process
identifies potential issues like trace width
violations, spacing errors, or missing
connections, which could impact the
manufacturability and functionality of
the final PCB.
 Common PCB layouts for various machines:

General Purpose

1. Linear Layout: Components arranged in a straight

line.
2. Grid Layout: Components placed on a grid
pattern.
3. Radial Layout: Components arranged around a
central point.
 Specific Machine Examples

1. Computer Motherboard:
- Chipset-centric layout
- Peripheral components around the CPU
2. Robotics:
- Modular layout for easy component swapping
- Separate power and signal sections
3. Industrial Control Systems:
- Functional block layout (e.g., power, logic, I/O)
- Clear separation of high-voltage and low-voltage areas
4. Automotive Electronics:
- Compact, rugged layout for harsh environments
- Consideration for thermal management
5. Medical Devices:
- High-density layout for miniaturization
- Isolation of sensitive analog circuits
6. Audio/Video Equipment:
- Signal-path-centric layout for minimal noise
- Separate analog and digital sections
7. IoT Devices:
- Ultra-compact layout for wearable/small devices
- Low-power design considerations
 Layout Considerations
1. Signal Integrity: Minimize noise, crosstalk, and
electromagnetic interference (EMI).

2. Power Distribution: Efficient power delivery and

thermal management.

3. Thermal Management: Heat sinks, thermal pads,

and airflow optimization.
 Layout Considerations
4. Electromagnetic Compatibility (EMC): Shielding,
grounding, and filtering.

5. Manufacturing: Ease of assembly, testing, and

repair.

6. Cost and Space Constraints: Balancing

performance and budget.
 PCB Layout Tools
1. Autodesk Eagle
2. KiCad
3. Altium Designer
4. OrCAD
5. Proteus
 Best Practices
1. Follow industry standards (e.g., IPC, IEEE).
2. Use design-for-manufacturing (DFM)
guidelines.
3. Perform signal integrity and thermal
analysis.
4. Document and version control designs.
5. Collaborate with cross-functional teams.
Characteristics of
Property Design
 When designing Printed Circuit
Boards (PCBs), key characteristics
of property design include:
When designing Printed Circuit Boards (PCBs), key
characteristics of property design include:

Electrical Properties:

1. Impedance control
2. Signal integrity
3. Power distribution (PDN)
4. Electromagnetic interference (EMI) reduction
5. Radio-frequency interference (RFI)
suppression
Thermal Properties:

1. Heat dissipation
2. Thermal conductivity
3. Junction temperature (Tj) management
4. Thermal pad design
Mechanical Properties:

1. Board thickness and rigidity

2. Material selection (e.g., FR4, Rogers, polyimide)
3. Dimensional stability
4. Mounting hole and screw placement
Manufacturing Properties:

1. Design for manufacturability (DFM)

2. Assembly considerations (e.g., SMT, THT)
3. Testability (e.g., JTAG, boundary scan)
4. Inspection and quality control

Signal Integrity Properties:

1. Trace width and spacing

2. Via design and placement
3. Decoupling capacitors
4. Signal routing and topology
Reliability Properties:

1. Solder joint reliability

2. Component derating
3. Power cycling and thermal stress
4. Moisture and corrosion protection

Other Properties:

1. Cost optimization
2. Design for environment (DFE)
3. Electromagnetic compatibility (EMC)
4. Regulatory compliance (e.g., RoHS, REACH)
PCB Layout
PCB (Printed Circuit Board) layout is
the process of designing and
arranging electronic components
and their connections on a printed
circuit board. It involves:
 PCB Layout Steps:
1. Schematic design
2. Component selection and library creation
3. Board outline definition
4. Component placement
5. Routing and signal tracing
6. Signal integrity analysis
7. Power distribution and thermal analysis
8. Design rule check (DRC) and verification
9. Manufacturing file generation (Gerber,
ODB++)
PCB Layout Best Practices:
Tools:
1. Follow design-for-
manufacturability (DFM)
1. Autodesk Eagle guidelines
2. Altium Designer 2. Use grid-based design
3. KiCad 3. Group components by
4. OrCAD function
5. Cadence 4. Avoid right-angle traces
Allegro 5. Use power planes and
ground planes
6. Implement signal shielding
and filtering
A well-designed PCB
layout ensures: PCB layout is a critical
step in electronic
1. Reliable product development,
performance
2. Reduced requiring expertise in
production costs electronics, mechanics,
3. Improved time-to- and manufacturing
market processes.
4. Enhanced product
quality
5. Compliance with
regulatory
standards
The primary use of PCB (Printed Circuit
Board) layout is to design and
manufacture electronic circuits on a
board. Key applications:
Electronic Product Development:
1. Computers and smartphones
2. Medical devices and equipment
3. Automotive systems and controls
4. Aerospace and defense electronics
5. Industrial automation and control

PCB Layout Benefits:

1. Improved circuit performance and reliability

2. Reduced product size and weight
3. Increased manufacturing efficiency
4. Enhanced thermal management
5. Better electromagnetic compatibility (EMC)
Specific Uses:
1. Digital electronics (microcontrollers, CPUs)
2. Analog electronics (amplifiers, filters)
3. Power electronics (power supplies, motor control)
4. RF and microwave circuits (wireless communication)
5. Embedded systems and IoT devices

Industry-Specific Applications:
1. Medical: Pacemakers, insulin pumps, MRI machines
2. Automotive: Engine control units, infotainment systems
3. Aerospace: Flight control systems, navigation equipment
4. Industrial: PLCs, motor control centers, robotics
5. Consumer Electronics: Smart home devices, gaming
consoles
PCB Layout in Research and Development:
1. Prototyping and proof-of-concept
2. Electronic design automation (EDA)
3. Circuit simulation and analysis
4. Material science and nanotechnology research
Manufacturing and Assembly:
1. PCB fabrication and assembly
2. Surface mount technology (SMT) and through-hole
technology (THT)
3. Automated optical inspection (AOI) and testing
PCB layout plays a crucial role in the
development and manufacturing of
electronic products, enabling
innovative technologies and
improving product performance.