MPXV7002DP
MPXV7002DP
ORDERING INFORMATION
Package Case # of Ports Pressure Type Device
Device Name No. Marking
Options None Single Dual Gauge Differential Absolute
Small Outline Package (MPXV7002 Series)
MPXV7002GC6U Rails 482A • • MPXV7002G
MPXV7002GC6T1 Tape & Reel 482A • • MPXV7002G
MPXV7002GP Trays 1369 • • MPXV7002G
MPXV7002DP Trays 1351 • • MPXV7002DP
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet specification.)
Full Scale Output(4) (10 to 60°C) VFSO 4.25 4.5 4.75 Vdc
@ VS = 5.0 Volts
Full Scale Span(5) (10 to 60°C) VFSS 3.5 4.0 4.5 V Vdc
@ VS = 5.0 Volts
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Pressure
Maximum Ratings
Operating Temperature TA 10 to 60 °C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS 2
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Pressure
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING
The performance over temperature is achieved by performance and long-term reliability. Contact the factory for
integrating the shear-stress strain gauge, temperature information regarding media compatibility in your application.
compensation, calibration and signal conditioning circuitry Figure 3 shows the recommended decoupling circuit for
onto a single monolithic chip. interfacing the integrated sensor to the A/D input of a
Figure 2 illustrates the Differential or Gauge configuration microprocessor or microcontroller. Proper decoupling of the
in the basic chip carrier (Case 482). A gel die coat isolates the power supply is recommended.
die surface and wire bonds from the environment, while Figure 4 shows the sensor output signal relative to
allowing the pressure signal to be transmitted to the sensor pressure input. Typical, minimum, and maximum output
diaphragm. curves are shown for operation over a temperature range of
The MPXV7002 series pressure sensor operating 10° to 60°C using the decoupling circuit shown in Figure 3.
characteristics, and internal reliability and qualification tests The output will saturate outside of the specified pressure
are based on use of dry air as the pressure media. Media, range.
other than dry air, may have adverse effects on sensor
P1
Thermoplastic
Wire Bond Case
Lead
Frame
P2
Differential Sensing Die Bond
Element
+5 V
Vout OUTPUT
Vs
IPS
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Pressure
5.0
Transfer Function:
Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS
4.0 VS = 5.0 Vdc
TA = 10 to 60°C
MIN
1.0
0
-2 -1 0 1 2
Differential Pressure (kPa)
Freescale designates the two sides of the pressure sensor The Pressure (P1) side may be identified by using the
as the Pressure (P1) side and the Vacuum (P2) side. The following table:
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.
Pressure (P1)
Part Number Case Type
Side Identifier
Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a
design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design
the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and
between the board and the package. With the correct shorting between solder pads.
0.100 TYP 8X
0.660 2.54
16.76
0.060 TYP 8X
1.52 0.300
7.62
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PACKAGE DIMENSIONS
-A- D 8 PL
4 0.25 (0.010) M T B S A S NOTES:
5 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
8
1
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
S A 0.415 0.425 10.54 10.79
W B 0.415 0.425 10.54 10.79
C 0.500 0.520 12.70 13.21
D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
V J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
C M 0˚ 7˚ 0˚ 7˚
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
H V 0.245 0.255 6.22 6.48
J W 0.115 0.125 2.92 3.17
-T-
PIN 1 IDENTIFIER SEATING
M PLANE
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
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Pressure
PACKAGE DIMENSIONS
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PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
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Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
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How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor, Inc.
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
MPXV7002
Rev. 2
1/2009