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MPXV7002DP

The MPXV7002 series is an integrated silicon pressure sensor designed for applications requiring accurate pressure measurement, particularly in microcontroller-based systems. It features a pressure range of -2 to 2 kPa, a 0.5 to 4.5 V output, and operates effectively within a temperature range of +10°C to +60°C. The sensor is temperature compensated, calibrated, and offers a typical error of 2.5% with auto-zero functionality.

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0% found this document useful (0 votes)
36 views11 pages

MPXV7002DP

The MPXV7002 series is an integrated silicon pressure sensor designed for applications requiring accurate pressure measurement, particularly in microcontroller-based systems. It features a pressure range of -2 to 2 kPa, a 0.5 to 4.5 V output, and operates effectively within a temperature range of +10°C to +60°C. The sensor is temperature compensated, calibrated, and offers a typical error of 2.5% with auto-zero functionality.

Uploaded by

Oleg Net
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
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Pressure

Freescale Semiconductor MPXV7002


Rev 2, 1/2009
+

Integrated Silicon Pressure Sensor


On-Chip Signal Conditioned, MPXV7002
Temperature Compensated and Series
-2 to 2 kPa (-0.3 to 0.3 psi)
Calibrated 0.5 to 4.5 V Output

The MPXV7002 series piezoresistive transducers are state-of-the-art


monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thin- Application Examples
film metallization, and bipolar processing to provide an accurate, high level
• Hospital Beds
analog output signal that is proportional to the applied pressure.
• HVAC
• Respiratory Systems
Features
• Process Control
• 2.5% Typical Error over +10°C to +60°C with Auto Zero
• 6.25% Maximum Error over +10°C to +60°C without Auto Zero
• Ideally Suited for Microprocessor or Microcontroller-Based Systems
• Thermoplastic (PPS) Surface Mount Package
• Temperature Compensated over +10° to +60°C
• Patented Silicon Shear Stress Strain Gauge
• Available in Differential and Gauge Configurations

ORDERING INFORMATION
Package Case # of Ports Pressure Type Device
Device Name No. Marking
Options None Single Dual Gauge Differential Absolute
Small Outline Package (MPXV7002 Series)
MPXV7002GC6U Rails 482A • • MPXV7002G
MPXV7002GC6T1 Tape & Reel 482A • • MPXV7002G
MPXV7002GP Trays 1369 • • MPXV7002G
MPXV7002DP Trays 1351 • • MPXV7002DP

SMALL OUTLINE PACKAGE

MPXV7002GC6U/C6T1 MPXV7002GP MPXV7002DP


CASE 482A-01 CASE 1369-01 CASE 1351-01

© Freescale Semiconductor, Inc., 2005, 2009. All rights reserved.


Pressure
Operating Characteristics

Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet specification.)

Characteristic Symbol Min Typ Max Unit

Pressure Range(1) POP –2.0 — 2.0 kPa


(2)
Supply Voltage VS 4.75 5.0 5.25 Vdc

Supply Current Io — — 10 mAdc

Pressure Offset(3) (10 to 60°C) Voff 2.25 2.5 2.75 Vdc


@ VS = 5.0 Volts

Full Scale Output(4) (10 to 60°C) VFSO 4.25 4.5 4.75 Vdc
@ VS = 5.0 Volts

Full Scale Span(5) (10 to 60°C) VFSS 3.5 4.0 4.5 V Vdc
@ VS = 5.0 Volts

Accuracy(6) (10 to 60°C) — — ±2.5(7) ±6.25 %VFSS

Sensitivity V/P — 1.0 —- V/kPa

Response Time(8) tR — 1.0 —- ms

Output Source Current at Full Scale Output IO+ — 0.1 —- mAdc


(9)
Warm-Up Time — — 20 —- ms

1. 1.0 kPa (kiloPascal) equals 0.145 psi.


2. Device is ratiometric within this specified excitation range.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
6. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the
minimum or maximum rated pressure, at 25°C.
TcSpan: Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to
25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
7. Auto Zero at Factory Installation: Due to the sensitivity of the MPXV7002 Series, external mechanical stresses and mounting position can
affect the zero pressure output reading. Auto zero is defined as storing the zero pressure output reading and subtracting this from the
device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum
temperature change of ± 5°C between auto zero and measurement.
8. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
9. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.

MPXV7002
Sensors
2 Freescale Semiconductor
Pressure
Maximum Ratings

Table 2. Maximum Ratings(1)


Rating Symbol Value Unit

Maximum Pressure (P1 > P2) Pmax 75 kPa

Storage Temperature Tstg –30 to +100 °C

Operating Temperature TA 10 to 60 °C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

VS 2

Thin Film Gain Stage #2


Temperature and
Sensing Vout 4
Compensation Ground
Element and Reference
Gain Stage #1 Shift Circuitry

Pins 1, 5, 6, 7, and 8 are NO CONNECTS


GND for Small Outline Package Device

Figure 1. Integrated Pressure Sensor Schematic

MPXV7002
Sensors
Freescale Semiconductor 3
Pressure
ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING

The performance over temperature is achieved by performance and long-term reliability. Contact the factory for
integrating the shear-stress strain gauge, temperature information regarding media compatibility in your application.
compensation, calibration and signal conditioning circuitry Figure 3 shows the recommended decoupling circuit for
onto a single monolithic chip. interfacing the integrated sensor to the A/D input of a
Figure 2 illustrates the Differential or Gauge configuration microprocessor or microcontroller. Proper decoupling of the
in the basic chip carrier (Case 482). A gel die coat isolates the power supply is recommended.
die surface and wire bonds from the environment, while Figure 4 shows the sensor output signal relative to
allowing the pressure signal to be transmitted to the sensor pressure input. Typical, minimum, and maximum output
diaphragm. curves are shown for operation over a temperature range of
The MPXV7002 series pressure sensor operating 10° to 60°C using the decoupling circuit shown in Figure 3.
characteristics, and internal reliability and qualification tests The output will saturate outside of the specified pressure
are based on use of dry air as the pressure media. Media, range.
other than dry air, may have adverse effects on sensor

Fluoro Silicone Stainless


Gel Die Coat Die Steel Cap

P1
Thermoplastic
Wire Bond Case

Lead
Frame

P2
Differential Sensing Die Bond
Element

Figure 2. Cross-Sectional Diagram SOP


(not to scale)

+5 V

Vout OUTPUT
Vs

IPS

1.0 µF 0.01 µF GND 470 pF

Figure 3. Recommended Power Supply Decoupling and Output Filtering


(For additional output filtering, please refer to Application Note AN1646.)

MPXV7002
Sensors
4 Freescale Semiconductor
Pressure

5.0
Transfer Function:
Vout = VS × (0.2 × P(kPa)+0.5) ± 6.25% VFSS
4.0 VS = 5.0 Vdc
TA = 10 to 60°C

Output Voltage (V)


3.0
TYPICAL
MAX
2.0

MIN
1.0

0
-2 -1 0 1 2
Differential Pressure (kPa)

Figure 4. Output versus Pressure Differential

PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE

Freescale designates the two sides of the pressure sensor The Pressure (P1) side may be identified by using the
as the Pressure (P1) side and the Vacuum (P2) side. The following table:
Pressure (P1) side is the side containing a gel die coat which
protects the die from harsh media.

Pressure (P1)
Part Number Case Type
Side Identifier

MPXV7002GC6U/GC6T1 482A-01 Side with Port Attached

MPXV7002GP 1369-01 Side with Port Attached

MPXV7002DP 1351-01 Side with Part Marking

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the total footprint, the packages will self align when subjected to a
design. The footprint for the surface mount packages must be solder reflow process. It is always recommended to design
the correct size to ensure proper solder connection interface boards with a solder mask layer to avoid bridging and
between the board and the package. With the correct shorting between solder pads.

0.100 TYP 8X
0.660 2.54
16.76

0.060 TYP 8X
1.52 0.300
7.62

0.100 TYP 8X inch


2.54 mm SCALE 2:1

Figure 5. Small Outline Package Footprint

MPXV7002
Sensors
Freescale Semiconductor 5
Pressure
PACKAGE DIMENSIONS

-A- D 8 PL
4 0.25 (0.010) M T B S A S NOTES:
5 1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
N -B- 3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
G 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
8
1
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
S A 0.415 0.425 10.54 10.79
W B 0.415 0.425 10.54 10.79
C 0.500 0.520 12.70 13.21
D 0.038 0.042 0.96 1.07
G 0.100 BSC 2.54 BSC
H 0.002 0.010 0.05 0.25
V J 0.009 0.011 0.23 0.28
K 0.061 0.071 1.55 1.80
C M 0˚ 7˚ 0˚ 7˚
N 0.444 0.448 11.28 11.38
S 0.709 0.725 18.01 18.41
H V 0.245 0.255 6.22 6.48
J W 0.115 0.125 2.92 3.17
-T-
PIN 1 IDENTIFIER SEATING
M PLANE
K

CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE

MPXV7002
Sensors
6 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS

CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE

MPXV7002
Sensors
Freescale Semiconductor 7
Pressure
PACKAGE DIMENSIONS

MPXV7002
Sensors
8 Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS

CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE

MPXV7002
Sensors
Freescale Semiconductor 9
Pressure
PACKAGE DIMENSIONS

CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE

MPXV7002
Sensors
10 Freescale Semiconductor
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MPXV7002
Rev. 2
1/2009

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