SGM7227

High Speed USB 2.0

(480Mbps) DPDT Analog Switch

GENERAL DESCRIPTION FEATURES

The SGM7227 is a high-speed, low-power double-pole/ z RON is Typically 5Ω at 3.0V
double-throw (DPDT) analog switch that operates from a z Voltage Operation: 1.8V to 4.3V
single 1.8V to 4.3V power supply. z Fast Switching Times:
tON 15ns
SGM7227 is designed for the switching of high-speed tOFF 20ns
USB 2.0 signals in handset and consumer applications, z Crosstalk: -30dB at 250MHz
such as cell phones, digital cameras, and notebooks with z Off-Isolation: -35dB at 250MHz
hubs or controllers with limited USB I/Os. z Rail-to-Rail Input and Output Operation
z Break-Before-Make Switching
The SGM7227 has low bit-to-bit skew and high z Extended Industrial Temperature Range:
channel-to-channel noise isolation, and is compatible with -40℃ to +85℃
various standards, such as high-speed USB 2.0 (480 z Available in Green UTQFN1.8×1.4-10L and
Mbps). Each switch is bidirectional and offers little or no MSOP10 Packages
attenuation of the high-speed signals at the outputs. Its
bandwidth is wide enough to pass high-speed USB 2.0
differential signals (480 Mb/s) with good signal integrity. BLOCK DIAGRAM
The SGM7227 contains special circuitry on the D+/D-
pins which allows the device to withstand a VBUS short to
HSD1+
D+ or D- when the USB devices are either powered off or D+
powered on. HSD2+

SGM7227 is available in Green UTQFN1.8×1.4-10L and HSD1-

MSOP10 packages. It operates over an ambient D-
HSD2-
temperature range of -40℃ to +85℃.

LOGIC
APPLICATIONS
Route Signals for USB 2.0 S
OE
MP3 and Other Personal Media Players
Digital Cameras and Camcorders
Portable Instrumentation
Set-Top Box
PDAs

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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
PACKAGE/ORDERING INFORMATION
SPECIFIED
PIN- ORDERING PACKAGE PACKAGE
MODEL TEMPERATURE
PACKAGE NUMBER MARKING OPTION
RANGE
MSOP10 -40℃ to +85℃ SGM7227YMS10G/TR SGM7227YMS10 Tape and Reel, 3000
SGM7227
UTQFN1.8×1.4-10L -40℃ to +85℃ SGM7227YUWQ10G/TR 7227 Tape and Reel, 3000

ABSOLUTE MAXIMUM RATINGS

VCC to GND................................................................ 0V to 4.6V Storage Temperature.........................................-65℃ to +150℃
Analog, Digital voltage range .....................-0.3V to (VCC) + 0.3V
Lead Temperature (soldering, 10s)...................................260℃
Continuous Current HSDn or Dn……..............................±50mA
ESD Susceptibility
Peak Current HSDn or Dn……......................................±100mA
HBM (UTQFN1.8×1.4-10L)…………………………………4000V
Operating Temperature Range............................-40℃ to +85℃
MM (UTQFN1.8×1.4-10L) …………………………………...400V
Junction Temperature....................................................... 150℃

NOTE:
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections
of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.

CAUTION
This integrated circuit can be damaged by ESD if you don’t pay attention to ESD protection. SGMICRO recommends that all
integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause
damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
PIN CONFIGURATIONS (TOP VIEW)
HSD2+ HSD2-
VCC 1 10 OE
7 6
OE 8 5 HSD1+
S 2 9 HSD2+
VCC 9 4 HSD1-
D+ 3 8 HSD2-
S 10 3 GND

D- 4 7 HSD1+
1 2

D+ D-
GND 5 6 HSD1-
UTQFN1.8×1.4-10L

MSOP10

PIN DESCRIPTION
PIN
NAME FUNCTION
UTQFN1.8×1.4-10L MSOP10
9 1 VCC Power Supply
3 5 GND Ground
10 2 S Select Input
8 10 OE Output Enable
5 7 HSD1+ Multiplexed Source Inputs
4 6 HSD1- Multiplexed Source Inputs
7 9 HSD2+ Multiplexed Source Inputs
6 8 HSD2- Multiplexed Source Inputs
1 3 D+ USB Data Bus
2 4 D- USB Data Bus

FUNCTION TABLE
OE S HSD1+, HSD1- HSD2+, HSD2-
0 0 ON OFF
0 1 OFF ON
1 × OFF OFF

Switches Shown For Logic “0” Input

SG Micro Limited 3
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
ELECTRICAL CHARACTERISTICS
(VCC = +3.3V, TA = +25℃, unless otherwise noted.)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
ANALOG SWITCH
Analog I/O Voltage
VIS 0 VCC V
(HSD1+, HSD1-, HSD2+, HSD2-)
VCC = 3.0V, VIS = 0V to 0.4V,
On-Resistance RON 5 9 Ω
ID = 8mA, Test Circuit 1
On-Resistance Match VCC = 3.0V, VIS = 0V to 0.4V,
∆RON 0.3 0.8 Ω
Between Channels ID = 8mA, Test Circuit 1
VCC = 3.0V, VIS = 0V to 1.0V,
On-Resistance Flatness RFLAT(ON) 1 2 Ω
ID = 8mA, Test Circuit 1
VCC = 0V, VD = 0V to 3.6V,
Power Off Leakage Current (D+, D-) IOFF 1 µA
VS , V OE = 0V or 3.6 V
Increase in ICC per Control Voltage ICCT VCC = 3.6V, VS or V OE = 2.6V 5 µA
IHSD2(OFF), VCC = 3.6V, VIS = 3.3V/ 0.3V,
Source Off Leakage Current 1 µA
IHSD1(OFF) VD = 0.3V/ 3.3V
IHSD2(ON), VCC = 3.6V, VIS = 3.3V/ 0.3V,
Channel On Leakage Current 1 µA
IHSD1(ON) VD = 3.3V/ 0.3V or floating
DIGITAL INPUTS
Input High Voltage VIH 1.6 V
Input Low Voltage VIL 0.5 V
Input Leakage Current IIN VCC = 3.0V, VS , V OE = 0V or VCC 1 µA
DYNAMIC CHARACTERISTICS
Turn-On Time tON VIS = 0.8V, RL = 50Ω, CL = 10pF, 15 ns
Turn-Off Time tOFF Test Circuit 2 20 ns
VIS = 0.8V, RL = 50Ω, CL = 10pF,
Break-Before-Make Time Delay tD 3.5 ns
Test Circuit 3
Propagation Delay tPD RL = 50Ω, CL = 10pF 0.5 ns
Signal = 0dBm, RL = 50Ω,
Off Isolation OISO -35 dB
f = 250MHz, Test Circuit 4
Signal = 0dBm, RL = 50Ω,
Channel-to-Channel Crosstalk XTALK -30 dB
f = 250MHz, Test Circuit 5
Signal = 0dBm, RL = 50Ω,
–3dB Bandwidth BW 550 MHz
CL = 5pF, Test Circuit 6
Channel-to-Channel Skew tSKEW RL = 50Ω, CL = 10pF 130 ps
Charge Injection Select Input to VG = GND, CL = 1.0nF, RG = 0Ω,
Q 10 pC
Common I/O Q = CL x VOUT, Test Circuit 7
HSD+, HSD-, D+, D- f = 1MHz 6.5
CON pF
ON Capacitance f = 250MHz 7
POWER REQUIREMENTS
Power Supply Range VCC 1.8 4.3 V
Power Supply Current ICC VCC = 3.0V, VS , V OE = 0V or VCC 1 µA

Specifications subject to changes without notice.

SG Micro Limited 4
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
TYPICAL PERFORMANCE CHARACTERISTICS

Response vs. Frequency Response vs. Frequency

20 20
0 0
-20 -20
On Response (dB)

On Response (dB)
CROSSTALK
-40 -40 OFF-ISOLATION
-60 -60
-80 -80
-100 -100
VCC = +3.3V VCC = +3.3V
-120 TA = +25℃ -120 TA = +25℃
-140 -140
0.1 1 10 100 1000 0.1 1 10 100 1000
Frequency (MHz) Frequency (MHz)

SG Micro Limited 5
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
TEST CIRCUITS

8mA

V1

HSDn Dn

RON = V1/8mA
GND

Test Circuit 1. On Resistance

VIH
HSD1n
Dn VS 50% 50%
VOUT
VIS HSD2n VIL
RL CL
VOH
0.1µF S 90%
90%
VS VOUT
GND VOL
tON tOFF

Test Circuit 2. Switching Times (tON, tOFF)

VIS VIH
HSD1n
VS 50%
HSD2n Dn VIL
0.1µF VOUT
VOH
S RL CL 90% of VOH
VOUT
VS
GND 0
tD

Test Circuit 3. Break-Before-Make Time (tD)

SG Micro Limited 6
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
TEST CIRCUITS (Cont.)

VCC
0.1µF

VCC
HSD1n
Dn
VOUT
HSD2n
Source RL S RL
Signal

GND

Test Circuit 4. Off Isolation

VCC
0.1µF

VCC

HSDn Dn

RL
Source
Signal

HSDn Dn
N.C. VOUT
RL

GND

VHSDn
Channel To Channel Crosstalk = -20 × log
VOUT

Test Circuit 5. Channel-to-Channel Crosstalk

SG Micro Limited 7
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
TEST CIRCUITS (Cont.)

VCC
0.1μF

VCC

HSDn Dn
VOUT

Source RL CL
S
Signal

GND

Test Circuit 6. -3dB Bandwidth

VIH
HSD1n VS
Dn VIL
RG VOUT
HSD2n
CL VOUT ΔOUT
S
VG
VS
GND
Q = ΔVOUT × CL

Test Circuit 7. Charge Injection (Q)

SG Micro Limited 8
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
APPLICATION NOTES
Meeting USB 2.0 VBUS Short Requirements
Power-Off Protection
For a VBUS short circuit the switch is expected to withstand such a condition for at least 24 hours. The SGM7227 has
specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability
during a power-down, over-voltage condition. The protection has been added to the common pins (D+, D-).

Power-On Protection
The USB 2.0 specification also notes that the USB device should be capable of withstanding a VBUS short during
transmission of data. This modification works by limiting current flow back into the VCC rail during the over-voltage event
so current remains within the safe operating range.

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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
SGM7227 USB2.0 Signal Quality Compliance Test Results
Figures 1 and 2 show the test results for USB eye diagram tests.

Figure 1. Waveform Plot

Figure 2. High Speed Signal Quality Eye Diagram Test (V+ = 3.3V)

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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
The following is a summary of the USB test Results. The SGM7227 passes the high speed signal quality, eye diagram
and jitter tests.

Required Tests
y Overall result:
Pass!
y Signal eye:
Eye passes
y EOP width: 7.91 bits
EOP width passes
y Measured signaling rate: 480.0551 MHz
Signal rate passes
y Rising Edge Rate: 901.28 V/us (710.10 ps equivalent risetime)
Passes
y Falling Edge Rate: 889.18 V/us (719.77 ps equivalent risetime)
Passes

Additional Information
Consecutive jitter range: -61.770 ps to 39.668 ps, RMS jitter 21.900 ps
Paired JK jitter range: -47.800 ps to 42.890 ps, RMS jitter 21.591 ps
Paired KJ jitter range: -50.590 ps to 49.704 ps, RMS jitter 23.281 ps

SG Micro Limited 11
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
PACKAGE OUTLINE DIMENSIONS

MSOP10
b
c

E1 E

A1
A2

Dimensions Dimensions
Symbol In Millimeters In Inches
Min Max Min Max
A 0.820 1.100 0.032 0.043
A1 0.020 0.150 0.001 0.006
A2 0.750 0.950 0.030 0.037
b 0.180 0.280 0.007 0.011
c 0.090 0.230 0.004 0.009
D 2.900 3.100 0.114 0.122
E 2.900 3.100 0.114 0.122
E1 4.750 5.050 0.187 0.199
e 0.500 BSC 0.020 BSC
L 0.400 0.800 0.016 0.031
θ 0° 6° 0° 6°

SG Micro Limited 12
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 High Speed USB 2.0
SGM7227 (480Mbps) DPDT Analog Switch
PACKAGE OUTLINE DIMENSIONS

UTQFN1.8×1.4-10L

1.800 ±0.050 PIN #1 IDENTIFICATION

0.400 TYP
0.400 ±0.050 CHAMFER 0.100×45°
(×9)
1.400 ± 0.050

0.800 REF

0.200±0.050
0.500±0.050

PIN #1 DOT
BY MARKING
TOP VIEW BOTTOM VIEW

0.152 REF
0.550±0.050

0.000-0.050

SIDE VIEW

NOTE: All linear dimensions are in millimeters.

REV. A

SGMICRO is dedicated to provide high quality and high performance analog IC products to customers. All SGMICRO products
meet the highest industry standards with strict and comprehensive test and quality control systems to achieve world-class
consistency and reliability.

For more information regarding SGMICRO Corporation and its products, please visit www.sg-micro.com

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