SN 74 LVC 4245 A
SN 74 LVC 4245 A
The SN74LVC4245A is designed for asynchronous communication between data buses. The device transmits
data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the
direction-control (DIR) input. The output-enable (OE) input can be used to disable the device so the buses are
effectively isolated. The control circuitry (DIR, OE) is powered by VCCA.
The SN74LVC4245A pinout allows the designer to switch to a normal all-3.3-V or all-5-V 20-pin '245 device
without board re-layout. The designer uses the data paths for pins 2–11 and 14–23 of the SN74LVC4245A to
align with the conventional '245 pinout.
ORDERING INFORMATION
TA PACKAGE (1) ORDERABLE PART NUMBER TOP-SIDE MARKING
Tube of 25 SN74LVC4245ADW
SOIC – DW LVC4245A
Reel of 2000 SN74LVC4245ADWR
SSOP – DB Reel of 2000 SN74LVC4245ADBR LJ245A
–40°C to 85°C
Tube of 60 SN74LVC4245APW
TSSOP – PW Reel of 2000 SN74LVC4245APWR LJ245A
Reel of 250 SN74LVC4245APWT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OPERATION
OE DIR
L L B data to A bus
L H A data to B bus
H X Isolation
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 1994–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74LVC4245A
OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTER
WITH 3-STATE OUTPUTS www.ti.com
SCAS375H – MARCH 1994 – REVISED MARCH 2005
2
DIR
22
OE
3
A1
21
B1
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) This value is limited to 6 V maximum.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2
SN74LVC4245A
OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTER
www.ti.com
WITH 3-STATE OUTPUTS
SCAS375H – MARCH 1994 – REVISED MARCH 2005
(1)
Absolute Maximum Ratings
over operating free-air temperature range for VCCB = 2.7 V to 3.6 V (unless otherwise noted)
MIN MAX UNIT
VCCB Supply voltage range –0.5 4.6 V
VI Input voltage range B port (2) –0.5 VCCB + 0.5 V
VO Output voltage range B port (2) –0.5 VCCB + 0.5 V
IIK Input clamp current VI < 0 –50 mA
IOK Output clamp current VO < 0 –50 mA
IO Continuous output current ±50 mA
Continuous current through VCCB or GND ±100 mA
DB package 63
θJA Package thermal impedance (3) DW package 46 °C/W
PW package 88
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) This value is limited to 4.6 V maximum.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(1) All unused inputs of the device must be held at the associated VCC or GND to ensure proper device operation. Refer to the TI
application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
(1) All unused inputs of the device must be held at the associated VCC or GND to ensure proper device operation. Refer to the TI
application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
3
SN74LVC4245A
OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTER
WITH 3-STATE OUTPUTS www.ti.com
SCAS375H – MARCH 1994 – REVISED MARCH 2005
4
SN74LVC4245A
OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTER
www.ti.com
WITH 3-STATE OUTPUTS
SCAS375H – MARCH 1994 – REVISED MARCH 2005
Switching Characteristics
over recommended operating free-air temperature range, CL = 50 pF (unless otherwise noted) (see Figure 1 and Figure 2)
VCCA = 5 V ± 0.5 V,
FROM TO VCCB = 2.7 V to 3.6 V
PARAMETER UNIT
(INPUT) (OUTPUT)
MIN MAX
tPHL 1 6.3
A B ns
tPLH 1 6.7
tPHL 1 6.1
B A ns
tPLH 1 5
tPZL 1 9
OE A ns
tPZH 1 8.1
tPZL 1 8.8
OE B ns
tPZH 1 9.8
tPLZ 1 7
OE A ns
tPHZ 1 5.8
tPLZ 1 7.7
OE B ns
tPHZ 1 7.8
Operating Characteristics
VCCA = 4.5 V to 5.5 V, VCCB = 2.7 V to 3.6 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Outputs enabled 39.5
Cpd Power dissipation capacitance per transceiver CL = 0, f = 10 MHz pF
Outputs disabled 5
5
SN74LVC4245A
OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTER
WITH 3-STATE OUTPUTS www.ti.com
SCAS375H – MARCH 1994 – REVISED MARCH 2005
LOAD CIRCUIT
tw
VCC
Input 1.5 V 1.5 V
3V
0V Output 1.5 V 1.5 V
VOLTAGE WAVEFORMS Control
0V
PULSE DURATION
tPZL tPLZ
Output VCC
VCC Waveform 1 50% VCC
Input 1.5 V 1.5 V S1 at 2 × VCC VOL + 0.3 V
VOL
0V (see Note B)
tPZH tPHZ
tPLH tPHL Output
VOH Waveform 2 VOH
VOH - 0.3 V
Output 50% VCC 50% VCC S1 at GND 50% VCC
VOL (see Note B) ≈0 V
6
SN74LVC4245A
OCTAL BUS TRANSCEIVER AND 3.3-V TO 5-V SHIFTER
www.ti.com
WITH 3-STATE OUTPUTS
SCAS375H – MARCH 1994 – REVISED MARCH 2005
LOAD CIRCUIT
tw
3V
Input 1.5 V 1.5 V
0V 3V
Output 1.5 V 1.5 V
VOLTAGE WAVEFORMS Control
0V
PULSE DURATION
tPZL tPLZ
Output 3.5 V
3V Waveform 1 1.5 V
1.5 V 1.5 V S1 at 7 V VOL + 0.3 V
Input VOL
0V (see Note B)
tPZH tPHZ
tPLH tPHL
VOH Output VOH
VOH - 0.3 V
Output 1.5 V 1.5 V Waveform 2 1.5 V
VOL S1 at GND ≈0 V
(see Note B)
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES ENABLE AND DISABLE TIMES
NONINVERTING OUTPUTS LOW- AND HIGH-LEVEL ENABLING
7
PACKAGE OPTION ADDENDUM
www.ti.com 14-Feb-2012
PACKAGING INFORMATION
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 14-Feb-2012
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
0,38
0,65 0,15 M
0,22
28 15
0,25
0,09
5,60 8,20
5,00 7,40
Gage Plane
1 14 0,25
A 0°–ā8° 0,95
0,55
Seating Plane
PINS **
14 16 20 24 28 30 38
DIM
4040065 /E 12/01
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Copyright © 2012, Texas Instruments Incorporated