LM317M, NCV317MA,

NCV317M

500 mA Adjustable Output,

Positive Voltage Regulator
The LM317M is an adjustable three−terminal positive voltage
regulator capable of supplying in excess of 500 mA over an output http://onsemi.com
voltage range of 1.2 V to 37 V. This voltage regulator is exceptionally
easy to use and requires only two external resistors to set the output
Heatsink surface
voltage. Further, it employs internal current limiting, thermal connected to Pin 2
shutdown and safe area compensation, making it essentially blow−out
proof.
The LM317M serves a wide variety of applications including local,
on−card regulation. This device also makes an especially simple
adjustable switching regulator, a programmable output regulator, or by TO−220AB
connecting a fixed resistor between the adjustment and output, the T SUFFIX
CASE 221AB
LM317M can be used as a precision current regulator.
1
Features 2
3
• Output Current in Excess of 500 mA
• Output Adjustable between 1.2 V and 37 V SOT−223
• Internal Thermal Overload Protection ST SUFFIX 1
• Internal Short Circuit Current Limiting CASE 318E 2
3
• Output Transistor Safe−Area Compensation
• Floating Operation for High Voltage Applications
4
• Eliminates Stocking Many Fixed Voltages DPAK
• NCV Prefix for Automotive and Other Applications Requiring DT SUFFIX
1 2
Unique Site and Control Change Requirements; AEC−Q100 CASE 369C 3
Qualified and PPAP Capable
• These are Pb−Free Devices Heatsink Surface (shown as terminal 4 in
case outline drawing) is connected to Pin 2.

Vin Vout
Vin LM317M Vout
PIN ASSIGNMENT
R1
240 1 Adjust
IAdj Adjust
* ** 2 Vout
Cin +C
O
0.1mF 1.0mF 3 Vin

R2
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.

* = Cin is required if regulator is located an appreciable distance from power supply filter.
** = CO is not needed for stability, however, it does improve transient response.
DEVICE MARKING INFORMATION
ǒR
Ǔ
Vout + 1.25V 1 ) 2 ) IAdjR2
R1
See general marking information in the device marking
section on page 11 of this data sheet.

Since IAdj is controlled to less than 100 mA, the error associated with this
term is negligible in most applications.

Figure 1. Simplified Application

© Semiconductor Components Industries, LLC, 2014 1 Publication Order Number:

August, 2014 − Rev. 24 LM317M/D
 LM317M, NCV317MA, NCV317M

MAXIMUM RATINGS (TA = 25°C, unless otherwise noted.)

Rating Symbol Value Unit
Input−Output Voltage Differential VI−VO 40 Vdc
Power Dissipation (Package Limitation) (Note 1)
Plastic Package, T Suffix, Case 221A
TA = 25°C PD Internally Limited
Thermal Resistance, Junction−to−Air qJA 70 °C/W
Thermal Resistance, Junction−to−Case qJC 5.0 °C/W
Plastic Package, DT Suffix, Case 369C
TA = 25°C PD Internally Limited
Thermal Resistance, Junction−to−Air qJA 92 °C/W
Thermal Resistance, Junction−to−Case qJC 5.0 °C/W
Plastic Package, ST Suffix, Case 318E
TA = 25°C PD Internally Limited
Thermal Resistance, Junction−to−Air qJA 245 °C/W
Thermal Resistance, Junction−to−Case qJC 15 °C/W
Operating Junction Temperature Range TJ −40 to +150 °C
Storage Temperature Range Tstg −65 to +150 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Figure 25 provides thermal resistance versus PC board pad size.
ELECTRICAL CHARACTERISTICS (VI − VO = 5.0 V; IO = 0.1 A, TJ = Tlow to Thigh (Note 2), unless otherwise noted.)
LM317M/LM317MB/NCV317MB
Characteristics Figure Symbol Min Typ Max Unit
Line Regulation (Note 3) (TA = 25°C, 3.0 V ≤ VI − VO ≤ 40 V) 3 Regline − 0.01 0.04 %/V
Load Regulation (Note 3) 4 Regload
TA = 25°C, 10 mA ≤ IO ≤ 0.5 A
VO ≤ 5.0 V − 5.0 25 mV
VO ≥ 5.0 V − 0.1 0.5 % VO

Adjustment Pin Current 5 IAdj − 50 100 mA

Adjustment Pin Current Change 3, 4 DIAdj − 0.2 5.0 mA
2.5 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
Reference Voltage 5 Vref 1.20 1.25 1.30 V
3.0 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
Line Regulation 3.0 V ≤ VI−VO ≤ 40 V (Note 3) 3 Regline − 0.02 0.07 %/V
Load Regulation 10 mA ≤ IO ≤ 0.5 A (Note 3) 4 Regload
VO ≤ 5.0 V − 20 70 mV
VO ≥ 5.0 V − 0.3 1.5 % VO
Temperature Stability (Tlow ≤ TJ ≤ Thigh) 5 TS − 0.7 − % VO
Minimum Load Current to Maintain Regulation (VI − VO = 40 V) 5 ILmin − 3.5 10 mA
Maximum Output Current 5 Imax A
VI − VO ≤ 15 V, PD ≤ Pmax 0.5 0.9 −
VI − VO = 40 V, PD ≤ Pmax, TA = 25°C 0.15 0.25 −
RMS Noise, % of VO (TA = 25°C, 10 Hz ≤ f ≤ 10 kHz) − N − 0.003 − % VO
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 4) 6 RR dB
Without CAdj − 65 −
CAdj = 10 mF 66 80 −
Thermal Shutdown (Note 5) − − − 180 − °C
Long−Term Stability, TJ = Thigh (Note 6) 5 S − 0.3 1.0 %/1.0
TA= 25°C for End−point Measurements kHrs.
2. Tlow to Thigh = 0° to +125°C for LM317M Tlow to Thigh = −40° to +125°C for LM317MB, NCV317MB.
3. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
4. CAdj, when used, is connected between the adjustment pin and ground.
5. Thermal characteristics are not subject to production test.
6. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot−to−lot.

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 LM317M, NCV317MA, NCV317M

ELECTRICAL CHARACTERISTICS (VI − VO = 5.0 V; IO = 0.1 A, TJ = Tlow to Thigh (Note 7), unless otherwise noted.)
LM317MA/LM317MAB/NCV317MAB
Characteristics Figure Symbol Min Typ Max Unit
Line Regulation (Note 8) (TA = 25°C, 3.0 V ≤ VI − VO ≤ 40 V) 3 Regline − 0.01 0.04 %/V
Load Regulation (Note 8) 4 Regload
TA = 25°C, 10 mA ≤ IO ≤ 0.5 A
VO ≤ 5.0 V − 5.0 25 mV
VO ≥ 5.0 V − 0.1 0.5 % VO

Adjustment Pin Current 5 IAdj − 50 100 mA

Adjustment Pin Current Change 3, 4 DIAdj − 0.2 5.0 mA
2.5 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
Reference Voltage 5 Vref 1.225 1.250 1.275 V
3.0 V ≤ VI − VO ≤ 40 V, 10 mA ≤ IL ≤ 0.5 A, PD ≤ Pmax
Line Regulation (Note 8) 3 Regline − 0.02 0.07 %/V
3.0 V ≤ VI−VO ≤ 40 V
Load Regulation (Note 8) 4 Regload
10 mA ≤ IO ≤ 0.5 A
VO ≤ 5.0 V − 20 70 mV
VO ≥ 5.0 V − 0.3 1.5 % VO

Temperature Stability (Tlow ≤ TJ ≤ Thigh) 5 TS − 0.7 − % VO

Minimum Load Current to Maintain Regulation (VI − VO = 40 V) 5 ILmin − 3.5 10 mA
Maximum Output Current 5 Imax A
VI − VO ≤ 15 V, PD ≤ Pmax 0.5 0.9 −
VI − VO = 40 V, PD ≤ Pmax, TA = 25°C 0.15 0.25 −
RMS Noise, % of VO (TA = 25°C, 10 Hz ≤ f ≤ 10 kHz) − N − − − % VO
Ripple Rejection, VO = 10 V, f = 120 Hz (Note 9) 6 RR dB
Without CAdj − 65 −
CAdj = 10 mF 66 80 −
Thermal Shutdown (Note 10) − − − 180 − °C
Long−Term Stability, TJ = Thigh (Note 11) 5 S − 0.3 1.0 %/1.0
TA= 25°C for End−point Measurements kHrs.
7. Tlow to Thigh = 0° to +125°C for LM317MA Tlow to Thigh = −40° to +125°C for LM317MAB, NCV317MAB.
8. Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be taken into account
separately. Pulse testing with low duty cycle is used.
9. CAdj, when used, is connected between the adjustment pin and ground.
10. Thermal characteristics are not subject to production test.
11. Since Long−Term Stability cannot be measured on each device before shipment, this specification is an engineering estimate of average
stability from lot−to−lot.

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 LM317M, NCV317MA, NCV317M

Vin

300 300 300 3.0k 300 70 6.8V

6.8V

350
18k

8.67k 500
130

400
5.1k
200k

180 180 2.0k 6.0k 10 60 1.25

6.3V pF 10
pF
Vout

2.4k
12.8k 50
Adjust

Figure 2. Representative Schematic Diagram

VCC
VOH - VOL
Line Regulation (%/V) = x 100
* VOL
VIH VOH
VIL Vin Vout VOL
LM317M

Adjust R1 240 RL
1%
+
Cin 0.1mF IAdj CO 1.0mF

*Pulse Testing Required: R2

1% Duty Cycle is suggested. 1%

Figure 3. Line Regulation and DIAdj/Line Test Circuit

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 LM317M, NCV317MA, NCV317M

Load Regulation (mV) = VO (min Load) -VO (max Load)

VO (min Load) - VO (max Load)
Load Regulation (% VO) = X 100
VO (min Load) VO (min Load)
VO (max Load)
Vin Vin Vout
LM317M IL

RL
(max Load)
Adjust 240 RL
R1 1% *
(min Load)
+
Cin 0.1mF IAdj CO 1.0mF

R2
1%

*Pulse Testing Required:

1% Duty Cycle is suggested. Figure 4. Load Regulation and DIAdj/Load Test Circuit

Vin Vout
LM317M IL

Adjust
240
VI R1 1% Vref RL
IAdj +
Cin 0.1mF CO 1mF VO

ISET

R2
1%

To Calculate R2:
*Pulse Testing Required: Vout = ISET R2 + 1.250 V
1% Duty Cycle is suggested. Assume ISET = 5.25 mA

Figure 5. Standard Test Circuit

24V
Vin Vout Vout = 10 V
14V LM317M
f = 120 Hz

D1 *
Adjust R1 240 RL
1% 1N4002
+
Cin 0.1mF CO 1.0mF VO

** +
1.65K CAdj 10mF
R2 1%

*D1 Discharges CAdj if Output is Shorted to Ground.

**CAdj provides an AC ground to the adjust pin.
Figure 6. Ripple Rejection Test Circuit

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 LM317M, NCV317MA, NCV317M

90
Δ V out , OUTPUT VOLTAGE CHANGE (%)
0.4 Vin = 45 V

RR, RIPPLE REJECTION (dB)

Vout = 5.0 V
0.2 80
IL = 5.0 mA to 40 mA Without CAdj = 10 mF
0

-0.2 70
Vin = 10 V
-0.4 Vout = 5.0 V
-0.6 IL = 5.0 mA to 100 mA 60 IL = 100 mA Without CAdj
f = 120 Hz
-0.8 Vout = 10 V
Vin = 14 V to 24 V
-1.0 50
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

Figure 7. Load Regulation Figure 8. Ripple Rejection

1.0 2.5

V in -Vout , INPUT-OUTPUT VOLTAGE

0.80 IL = 500 mA
Iout , OUTPUT CURRENT (A)

DIFFERENTIAL (V) 2.0

0.60 IL = 100 mA
1.5
TJ = 25°C
0.40

1.0
0.20 TJ = 125°C

0 0.5
0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150
Vin-Vout, INPUT-OUTPUT VOLTAGE DIFFERENTIAL (V) TJ, JUNCTION TEMPERATURE (°C)

Figure 9. Current Limit Figure 10. Dropout Voltage

5.0 100
4.5 90
IB , QUIESCENT CURRENT (mA)

RR, RIPPLE REJECTION (dB)

4.0 IL = 40 mA
80
Vin = 5.0 V ± 1.0 VPP
3.5 70 Vout = 1.25 V
3.0 TJ = 25°C 60
2.5 50
2.0 TJ = 125°C 40
1.5 30
1.0 20
0.5 10

0 10 20 30 40 10 100 1.0 k 10 k 100 k 1.0 M

Vin-Vout, INPUT-OUTPUT VOLTAGE DIFFERENTIAL (Vdc) f, FREQUENCY (Hz)

Figure 11. Minimum Operating Current Figure 12. Ripple Rejection versus Frequency

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 LM317M, NCV317MA, NCV317M

1.260 80

IAdj, ADJUSTMENT PIN CURRENT ( μA)

70 Vin = 6.25 V
Vref, REFERENCE VOLTAGE (V)
Vout = Vref
1.250 65  IL = 10 mA
IL = 100 mA
60

1.240 55

50

1.230 Vin = 4.2 V 45

Vout = Vref
IL = 5.0 mA 40

1.220 35
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

Figure 13. Temperature Stability Figure 14. Adjustment Pin Current

Δ Vout , OUTPUT VOLTAGE CHANGE (%)

0.4 Vin = 4.25 V to 41.25 V

Vout = Vref Bandwidth 100 Hz to 10 kHz
0.2 IL = 5.0 mA NOISE VOLTAGE ( μV) 10
0

-0.2 8.0

-0.4

-0.6 6.0

-0.8

-1.0 4.0
-50 -25 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)

Figure 15. Line Regulation Figure 16. Output Noise

Δ Vout , OUTPUT VOLTAGE

Δ Vout , OUTPUT VOLTAGE

3.0
DEVIATION (V)

1.5 2.0
DEVIATION (V)

1.0 1.0 CL = 1.0 mF; CAdj = 10 mF

0.5 CL = 1.0 mF 0
0 -1.0 Vin = 15 V
Vout = 10 V
-0.5 -2.0 INL = 50 mA
Vout = 10 V CL = 0.3 mF; CAdj = 10 mF
-1.0 -3.0 TJ = 25°C
Δ Vin , INPUT VOLTAGE

IL = 50 mA
-1.5 1.5
CURRENT (A)

TJ = 25°C CL = 0
CHANGE (V)

I L , LOAD

1.0 1.0
Vin IL
0.5 0.5
0 0
0 10 20 30 40 0 10 20 30 40
t, TIME (ms) t, TIME (ms)

Figure 17. Line Transient Response Figure 18. Load Transient Response

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 LM317M, NCV317MA, NCV317M

APPLICATIONS INFORMATION

Basic Circuit Operation External Capacitors

The LM317M is a three−terminal floating regulator. In A 0.1 mF disc or 1.0 mF tantalum input bypass capacitor
operation, the LM317M develops and maintains a nominal (Cin) is recommended to reduce the sensitivity to input line
1.25 V reference (Vref) between its output and adjustment impedance.
terminals. This reference voltage is converted to a The adjustment terminal may be bypassed to ground to
programming current (IPROG) by R1 (see Figure 19), and this improve ripple rejection. This capacitor (CAdj) prevents
constant current flows through R2 to ground. The regulated ripple from being amplified as the output voltage is
output voltage is given by: increased. A 10 mF capacitor should improve ripple
rejection about 15 dB at 120 Hz in a 10 V application.
R
ǒ
Vout + Vref 1 ) 2 ) IAdj R2
R1
Ǔ Although the LM317M is stable with no output
capacitance, like any feedback circuit, certain values of
external capacitance can cause excessive ringing. An output
Since the current from the terminal (IAdj) represents an capacitance (CO) in the form of a 1.0 mF tantalum or 25 mF
error term in the equation, the LM317M was designed to aluminum electrolytic capacitor on the output swamps this
control IAdj to less than 100 mA and keep it constant. To do effect and insures stability.
this, all quiescent operating current is returned to the output
terminal. This imposes the requirement for a minimum load Protection Diodes
current. If the load current is less than this minimum, the When external capacitors are used with any IC regulator
output voltage will rise. it is sometimes necessary to add protection diodes to prevent
Since the LM317M is a floating regulator, it is only the the capacitors from discharging through low current points
voltage differential across the circuit which is important to into the regulator.
performance, and operation at high voltages with respect to Figure 20 shows the LM317M with the recommended
ground is possible. protection diodes for output voltages in excess of 25 V or
high capacitance values (CO > 25 mF, CAdj > 5.0 mF). Diode
D1 prevents CO from discharging thru the IC during an input
Vin Vout
LM317M short circuit. Diode D2 protects against capacitor CAdj
+
discharging through the IC during an output short circuit.
R1 The combination of diodes D1 and D2 prevents CAdj from
Vref discharging through the IC during an input short circuit.
Adjust IPROG
Vout
D1
IAdj
R2
1N4002
Vref = 1.25 V Typical Vin Vout
LM317M Vout
+
Figure 19. Basic Circuit Configuration Cin R1 CO
D2
Adjust
Load Regulation 1N4002
The LM317M is capable of providing extremely good R2 CAdj
load regulation, but a few precautions are needed to obtain
maximum performance. For best performance, the
programming resistor (R1) should be connected as close to
the regulator as possible to minimize line drops which
effectively appear in series with the reference, thereby Figure 20. Voltage Regulator with
Protection Diodes
degrading regulation. The ground end of R2 can be returned
near the load ground to provide remote ground sensing and
improve load regulation.

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 LM317M, NCV317MA, NCV317M

+25V Vout R1 VO IO
LM317M
Vin 1.25k
D1

Adjust D1 1N4002
R2 1N914 Vin Vout
500 Vin LM317M Vout
* To provide current limiting of IO D2
1N914 +
to the system ground, the source of
the current limiting diode must be tied to 120 1.0mF
 a negative voltage below -7.25 V.
Adjust
1N5314 MPS2222
Vref
R2 ≥ TTL
IDSS 720
1.0k Control
Vref VSS*
R1 =
IOmax + IDSS
Minimum Vout = 1.25 V
VO < POV + 1.25 V + VSS
ILmin - IP < IO < 500 mA - IP
As shown O < IO < 495 mA D1 protects the device during an input short circuit.

Figure 21. Adjustable Current Limiter Figure 22. 5 V Electronic Shutdown Regulator

Iout
Vout R1 R2
Vin Vout Vin LM317M
LM317M
Vout
240 1N4001

Adjust IAdj
Adjust 50k

R2 MPS2907 + Vref 1.25 V

10mF Ioutmax = + IAdj ^ R + R
R1 + R2 1 2

5.0 mA < Iout < 500 mA

Figure 23. Slow Turn−On Regulator Figure 24. Current Regulator

100 2.4 280 2.50

R θ JA, THERMAL RESISTANCE, JUNCTION-TO-AIR (° C/W)

PD(max) for TA = 50°C PD(max) for TA = 50°C

Free Air Free Air
90 Mounted 2.0 240 Mounted 1.25
Vertically Vertically

ÎÎÎ ÎÎÎÎ
2.0 oz. Copper 2.0 oz. Copper
80 L 1.6 200 L 0.83

ÎÎÎ ÎÎÎÎ
Minimum Minimum

ÎÎÎ ÎÎÎÎ
70 Size Pad L 1.2 160 Size Pad 0.63
L

60 0.8 120 0.50

50 0.4 80 0.42
RqJA RqJA
40 0 40 0.35
0 5.0 10 15 20 25 30 0 5.0 10 15 20 25 30
L, LENGTH OF COPPER (mm) L, LENGTH OF COPPER (mm)

Figure 25. DPAK Thermal Resistance and Maximum Figure 26. SOT−223 Thermal Resistance and Maximum
Power Dissipation versus PCB Copper Length Power Dissipation versus PCB Copper Length

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 LM317M, NCV317MA, NCV317M

ORDERING INFORMATION
Output Voltage Operating Temperature
Device Tolerance Range Package Shipping†
LM317MABDTG DPAK 75 Units / Rail
(Pb−Free)
LM317MABDTRKG DPAK 2500 / Tape & Reel
(Pb−Free)
NCV317MABDTRKG*
TJ = −40°C to 125°C
NCV317MABSTT3G* 2% SOT−223 4000 / Tape & Reel
(Pb−Free)
LM317MABTG TO−220 50 Units / Rail
(Pb−Free)
LM317MADTRKG DPAK 2500 / Tape & Reel
TJ = 0°C to 125°C (Pb−Free)
LM317MBDTG DPAK 75 Units / Rail
(Pb−Free)
NCV317MBDTG*
LM317MBDTRKG DPAK 2500 / Tape & Reel
(Pb−Free)
NCV317MBDTRKG*
TJ = −40°C to 125°C
LM317MBSTT3G SOT−223 4000 / Tape & Reel
(Pb−Free)
NCV317MBSTT3G*
LM317MBTG TO−220 50 Units / Rail
(Pb−Free)
NCV317MBTG* 4%
LM317MDTG DPAK 75 Units / Rail
(Pb−Free)
LM317MDTRKG DPAK 2500 / Tape & Reel
(Pb−Free)
TJ = 0°C to 125°C
LM317MSTT3G SOT−223 4000 / Tape & Reel
(Pb−Free)
LM317MTG TO−220 50 Units / Rail
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specification Brochure, BRD8011/D.
*NCV devices: Tlow = −40°C, Thigh = +125°C. Guaranteed by design. NCV Prefix for Automotive and Other Applications Requiring Unique Site
and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.

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 LM317M, NCV317MA, NCV317M

MARKING DIAGRAMS

DPAK
DT SUFFIX
CASE 369C

317ABG 317MAG 317MBG 317MG

ALYWW ALYWW ALYWW ALYWW

TO−220 SOT−223
T SUFFIX ST SUFFIX
CASE 221A CASE 318E

AYW AYW AYW

317MA G 317MB G 317M G
LM LM LM G G G
317MABT 317MBT 317MT
AWLYWWG AWLYWWG AWLYWWG

A = Assembly Location
L, WL = Wafer Lot
Y = Year
WW, W = Work Week
G or G = Pb−Free Package
(Note: Microdot may be in either location)

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 LM317M, NCV317MA, NCV317M

PACKAGE DIMENSIONS

TO−220, SINGLE GAUGE

CASE 221AB
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
SEATING 2. CONTROLLING DIMENSION: INCHES.
−T− PLANE 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND
LEAD IRREGULARITIES ARE ALLOWED.
B F C 4. PRODUCT SHIPPED PRIOR TO 2008 HAD DIMENSIONS
T S S = 0.045 - 0.055 INCHES (1.143 - 1.397 MM)

4 INCHES MILLIMETERS
DIM MIN MAX MIN MAX
A 0.570 0.620 14.48 15.75
Q A B 0.380 0.405 9.66 10.28
C 0.160 0.190 4.07 4.82
1 2 3 U D 0.025 0.035 0.64 0.88
H F 0.142 0.147 3.61 3.73
G 0.095 0.105 2.42 2.66
K H 0.110 0.155 2.80 3.93
Z J 0.018 0.025 0.46 0.64
K 0.500 0.562 12.70 14.27
L 0.045 0.060 1.15 1.52
N 0.190 0.210 4.83 5.33
L R Q 0.100 0.120 2.54 3.04
R 0.080 0.110 2.04 2.79
V J S 0.020 0.024 0.508 0.61
T 0.235 0.255 5.97 6.47
G
U 0.000 0.050 0.00 1.27
D V 0.045 --- 1.15 ---
Z --- 0.080 --- 2.04
N

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 LM317M, NCV317MA, NCV317M

PACKAGE DIMENSIONS

DPAK
DT SUFFIX
CASE 369C
ISSUE D

NOTES:
C 1. DIMENSIONING AND TOLERANCING PER ASME
A Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
E A 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
MENSIONS b3, L3 and Z.
b3 B c2 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
4 5. DIMENSIONS D AND E ARE DETERMINED AT THE
L3 Z OUTERMOST EXTREMES OF THE PLASTIC BODY.
D 6. DATUMS A AND B ARE DETERMINED AT DATUM
DETAIL A H PLANE H.
1 2 3
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
L4 A 0.086 0.094 2.18 2.38
b2 A1 0.000 0.005 0.00 0.13
b c b 0.025 0.035 0.63 0.89
b2 0.030 0.045 0.76 1.14
e 0.005 (0.13) M C H b3 0.180 0.215 4.57 5.46
c 0.018 0.024 0.46 0.61
GAUGE SEATING c2 0.018 0.024 0.46 0.61
L2 PLANE C PLANE D 0.235 0.245 5.97 6.22
E 0.250 0.265 6.35 6.73
e 0.090 BSC 2.29 BSC
H 0.370 0.410 9.40 10.41
L L 0.055 0.070 1.40 1.78
A1
L1 L1 0.108 REF 2.74 REF
L2 0.020 BSC 0.51 BSC
DETAIL A L3 0.035 0.050 0.89 1.27
ROTATED 905 CW L4 −−− 0.040 −−− 1.01
Z 0.155 −−− 3.93 −−−

SOLDERING FOOTPRINT*
6.20 3.00
0.244 0.118
2.58
0.102

5.80 1.60 6.17

0.228 0.063 0.243

SCALE 3:1 ǒinches

mm Ǔ

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

http://onsemi.com
13
 LM317M, NCV317MA, NCV317M

PACKAGE DIMENSIONS

SOT−223 (TO−261)
ST SUFFIX
CASE 318E−04
ISSUE N
D
b1 NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.

4 MILLIMETERS INCHES
DIM MIN NOM MAX MIN NOM MAX
HE E A 1.50 1.63 1.75 0.060 0.064 0.068
1 2 3 A1 0.02 0.06 0.10 0.001 0.002 0.004
b 0.60 0.75 0.89 0.024 0.030 0.035
b1 2.90 3.06 3.20 0.115 0.121 0.126
c 0.24 0.29 0.35 0.009 0.012 0.014
b D 6.30 6.50 6.70 0.249 0.256 0.263
E 3.30 3.50 3.70 0.130 0.138 0.145
e1 e 2.20 2.30 2.40 0.087 0.091 0.094
e e1 0.85 0.94 1.05 0.033 0.037 0.041
L 0.20 −−− −−− 0.008 −−− −−−
C L1 1.50 1.75 2.00 0.060 0.069 0.078
q HE 6.70 7.00 7.30 0.264 0.276 0.287
A q 0° − 10° 0° − 10°
0.08 (0003)
A1 L L1

SOLDERING FOOTPRINT*
3.8
0.15

2.0
0.079

6.3
2.3 2.3
0.248
0.091 0.091

2.0
0.079

1.5 SCALE 6:1 ǒinches

mm Ǔ
0.059
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

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14