Introduction to Die Attach

Chapter-1 (Lecture-4)

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Die Attach Introduction

❑ Course Objectives : To impart knowledge for Die Attach process, materials, piece parts,
process controls and systems

Course Contents:
❖ Assembly Process Flow
❖ What is Die Attach Process?
❖ Adhesive Materials
❖ Piece Parts / Production Logistic / Tooling
❖ Wafer Map & Substrate Map
❖ Die Attach Flow
❖ Key Die Attach Input Parameters
❖ Common Defects
❖ Process Controls

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Assembly Process Flow - Where is Die Attach Process?

Front End
Processes / Wafer Laser Mark Solder Ball Attach
Fabrication

1k Clean Room
Incoming Wafer Oven Bake Singulation
10k Clean Room

Non-Assembly
Die Preparation
(Thinning & Encapsulation Vision Inspection
Dicing)

Wire Bond Assembly

Die Attach Electrical Test
(Interconnect) Complete

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Die Attach Process (Ack: JinQuan)

What is Die Attach?

◼ Die attach is the process of removing singulated dies from the wafer and attaching them to the
interposer/substrate/Leadframe by use of some form of adhesive.

Source: Making Memory Chips – Process Steps

DAF : Die Attach Film; FOW :Film Over Wire

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Types of Adhesives (Ack: JinQuan)

◼ Epoxy paste Chip on Board:

- mainly for Chip-on-board (COB) packages wire Bond pad

Die/Chip

- dispensed onto the interposer before die bonding Adhesive

‘board’/interposer

- needs oven cure after die attach Ball pads

Source: https://www.resonac.com/products/semi-backend-process/76/006.html
◼ Stencil printed paste
- for Board-on-chip (BOC) packages
- printed onto the substrate by stencil printing tool
- needs oven cure after die attach
Board on Chip:
Ball pads wire Ball pads

◼ “LOC” (Lead-on-chip) Tape Source: Micron Inc Inclusive ‘board’/interposer

Adhesive
‘board’/interposer
Adhesive
Die/Chip

- for (Thin-Small-Outline-Package) TSOP packages ; pre-taped on metal Leadframe

- typically, tri-layer with a core film in the middle and 2 adhesive layers
- do not need oven cure after die attach
leadfingers tape

adhesive
Source: layer
https://www.pcmag.c
om/encyclopedia/ter die Source: Micron Inc Inclusive 5
m/lead-frame
Types of Adhesives (Ack: JinQuan)

◼ Die Attach Film (DAF)

- for single or stacked Chip on Board packages
- taped onto the back of the wafer/die Source: Micron Inc Inclusive
Die
- certain DAFs will need oven cure after die attach
DAF/FOW

Dicing tape

◼ Film Over Wire (FOW)

- allow die stacked onto wires of bottom die
- taped onto the back of the wafer/die
- needs oven cure after die attach
FOD

Source: springerlink

◼ Film Over Die (FOD)

- allow die stacked onto entire bottom die / its wires
- taped onto the back of the wafer/die
- needs oven cure after die attach

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Adhesive Material Overview (Ack: JinQuan)

Epoxy Paste Stencil Print Paste Lead on Chip (LOC) Tape Die Attach Film (DAF) Film Over Wire (FOW),
Film Over Die (FOD)
For conventional Thin For Board on Chip (BOC) For Thin Small Outline For Chip on Board (COB) For Chip on Board (COB)
Small Outline Package Packages Package (TSOP) packages with specific packages with specific
(TSOP) and Chip on Boar needs needs
(COB) Packages
For single & stack dies For single die For single die For single & stack dies For stack dies
Cheap Cheap Expensive More expensive Most expensive
Needs cure Needs cure (2X) No need cure Some needs cure Needs cure
Average Bond Line Good Bond Line Thickness Excellent Bond Line Excellent Bond Line Excellent Bond Line
Thickness (BLT) (BLT) consistency Thickness (BLT) Thickness (BLT) Thickness (BLT)
consistency consistency consistency consistency
No dicing related problems No dicing related problems No dicing related problems Dicing related problems Dicing related problems
(eg. incomplete cut, (eg. Film-Over-Wire fused
whiskers) back)
Applied at die attach Applied in separate Pretape at leadframe Applied to wafer backside Applied to wafer backside
process supplier during wafer mount during wafer mount

Bond Line Thickness:- Source: https://www.polytec.com/eu/surface-metrology/areas-of-

application/electronics-semiconductors-and-solar/die-bonding
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Common Piece Parts (Ack: JinQuan)

◼ Interposer / Substrate / Leadframe

- Acts as a carrier for the dies and interconnects to the
outside world
- 2 main types: lead frame, substrate
- Come in different column and row matrix (1 x 10, 20 x 5, 17
x 4, etc)
- Different designs for different devices and packages

Source: https://www.shinko.co.jp/english/product/package/

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Production Logistics (Ack: JinQuan)

◼ Wafer Cassette
◆ Used to store multiple diced wafers
◆ For wafer transportation purpose
◆ To be loaded onto die attach tool
◆ Die attach tool will process the wafer one by one by extracting the
wafer from the cassette

Source: https://s3-alliance.com/products/12-metal-frame-cassette/
◼ Substrate Magazine
◆ Used to store multiple substrates
◆ For substrate transportation purpose
◆ To be loaded into die attach’s loader and unloader platform
◆ Die attach tool will process substrate one by one by extracting
substrate from the magazine

Source: https://www.perfection-products.com/pp-substrate-mcm-magazines.html

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Die Attach Tooling -1 (Ack: JinQuan)

Pin/Needle Ejector Side View:

◼ Poker pin/Needle
Die
- Used to push out the dies from dicing tape. Poker pin
- Held by a needle holder.
‘Pepper Pot’
- Pins layout is different for different die size and packages

◼ Pin/Needle Holder / Vacuum Dome/‘Pepper Pot’ Pin moves up/down

- Used to hold down the dicing tape by vacuum during die pick up
- Different designs for different die size Pin-typed Ejector Side View:

◼ Slider
• Sliding motion enables die to be separated from tape with
vacuum holding down tape
Initial Peeling Final
• Different designs for different die size and packages
Ejector Tool (Multistage)

▪ Ejector Tool (Multistage):Used to push out the dies from

dicing tape. Non piercing.
• Multiple blocks ejected in sequence during pickup.
• Able to handle thinner die than pin typed ejector. Initial Peeling
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Final
• Number of blocks determined by die size. 10
Die Attach Tooling -2
◼ Middle Stage / Alignment Stage
Alignment Stage /
- Intermediate stage to handover die from pickup arm to bonding arm Middle Stage

- Die size dependent Vacuum Holes

Screws
- Coating on the surface to prevent die sticking onto it
Die

◼ Heater Blocks / Process blocks

- Heated stage for substrate to sit on during bonding process.
- Different block can have different temperature based on processing need. Substrate Clamper
Heater block
- Substrate size dependent

◼ Substrate Clamper
- To hold substrate flat, together with heater block’s vacuum
- Clamper design is depending on ‘space’ available on the substrate,
Substrate
substrate warp condition, and incoming height of stacked die. Die
Indexing Track /
Feeder Track
- Substrate size dependent Clamper Holder /
Clamper Assembly

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Die Attach Tooling -3

◼ Collet Adapter
- Used to holder the collet in place
- Different designs for different collet designs Collet holder/adapter

◼ Collet Vacuum Channels

Collet
- Used to pick up dies from the wafer. Die is held by vacuum.
Die
- Also known as rubber tip
- Different designs for different die size and packages

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Wafer Map (Ack: JinQuan)

◼ What is wafer map?

- An electronic map showing the locations of good and reject dies.
- Segregates good dies into various categories according to performance.
- Each wafer has a unique wafer map.

FTP ASSEMBLY
FAB
HOST

At wafer mount process

step, barcode on the wafer

RS232
frame is read as well as the
wafer scribe. These are then
matched with each other. At
die attach, barcode is read
and the correct map is
identified and pull down from Die Attach Die Attach Die Attach
host to the mounter. Machine
Machine Machine

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Wafer Map (Ack: JinQuan)

Sample map
Green: Good bins
Others: Reject bins

Reference die:
A location which the machine will use as the reference
(origin) when a wafer is loaded, to ensure it goes to
correct target die.

 Wafer on a wafer frame

Source: https://en.wikipedia.org/wiki/Substrate_mapping
Source: https://www.semanticscholar.org/paper/Considerations-and-benefits-of-plasma-etch-
based-Barnett-Ansell/5bcd38c50b87304a2e50d15443cecfaddffd1fc6/figure/6
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Substrate Map (Ack: JinQuan)

Sample map
Green: Good sites - bondable

barcode
Red: NG sites from substrate – skip/bond bad dies
Yellow: NG sites from previous processes – skip/bond
bad dies

For ‘inkless’ production, substrate is downloaded while is

it being scanned for NG sites, so die attach will skip bad
sites

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Die Attach Flow (Ack: JinQuan)

Epoxy dispense
(epoxy paste)

Interposer
Interposer Recognition, Die pick up, Interposer
loading Map download, Die attach unload
cleaning
1st pass

Collet Wafer loading,

Die Wafer map loading
DAF Die
Wafer alignment,
Interposer
Reference die match,
Die recognition Heated
Ejector plate

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Typical Die Attach Tool Layout Overview
Top View

vision vision vision

Substrate
Epoxy
Scan &
Substrate Clean
Dispense Bonding Area
Loader Substrate
(Magazine or
vision Unloader
Stacked lead frame)
vision
Alignment/
Middle Stage
(optional)
Wafer Table

Stacked Leadframe Loader User Interface

Picker Arm
Substrate/leadframe
Interleaf

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 (Ack: Jim M)
Die Attach Process (Schematic)

Pick and Place Process

Source: Micron Inc Inclusive

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Key Die Attach Parameters

• Mount/Bond Time
• Time held on die to interposer, to create adhesion between die to interposer
• Also known as bond time
• Die size, Die thickness, type of package config.

• Mount/Bond Force
• Also known as bond force
• Weight/ Load exerted on the die during the bonding process.
• Depends on the adhesion material, die size/ area.

• Mount/Bond Temperature
• Also known as bond temperature.
• Temperature applied during die attach.

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Common problems/defects (Ack: JinQuan)

• Common problems/defects
- Tape wetting/filleting Good wetting/filletting

Poor wetting/filletting

Source: Micron Inc Inclusive

Possible Root Cause Possible Corrective Actions
Mount force too low/high - Check mount force setting
- Check machine force sensor
Mount tool planarity out - Check whether mount tool is loose
- Check levelness of mount tool
Mount temperature too low/high - Check mount temperature setting
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- Check thermocouple wiring condition
Common problems/defects (Ack: JinQuan)

• Common problems/defects
- Tape bubbling
Good wetting Bubbles on tape

Source: Micron Inc Inclusive Source: Micron Inc Inclusive

Possible Root Cause Possible Corrective Actions

Overbaked Leadframes - Check prebake oven condition for any jam
- Check prebake time parameter setting
Mount temperature too high - Check mount temperature setting
- Check thermocouple wiring condition
Mount time too high - Check mount time setting
- Check indexer condition for any jam

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Common problems/defects (Ack: JinQuan)

• Common problems/defects
• Adhesive on die

Source: Micron Inc Inclusive

Possible Root Cause Possible Corrective Actions

Mount force too high - Check mount force setting
- Check machine force sensor
Mount tool planarity out - Check whether mount tool is loose
- Check levelness of mount tool
Viscosity of paste too low - Check expiry time of paste
- Check staging time of paste

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Common problems/defects (Ack: JinQuan)

• Common problems/defects
• Die placement Slant die

Source: Micron Inc Inclusive

Possible Root Cause Possible Corrective Actions

Pickup collet loose - Check whether pickup collet is loose
- Check collet shank condition
- Check for vacuum leak from machine vacuum
Machine vacuum malfunction tubings
- Check for debris stuck on collet shank
Machine bondhead malfunction - Check bondhead servo motor
- Check bondhead shaft movement

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Common problems/defects (Ack: JinQuan)

• Common problems/defects
• Chipped/crack/damaged die

Chipped die

Crack die

Source: Micron Inc Inclusive

Possible Root Cause Possible Corrective Actions

Ejector pins not level - Check whether ejector pins is loose
- Check height and levelness of ejector pins
Mount force too high - Check mount force setting
- Check machine force sensor
Machine rollers contact die - Check machine roller position
- Check whether machine roller loose 24
Offline Process Control – Example: Test for adhesion (Ack: JinQuan)

Peel test : Die is manually peeled off when necessary. Test passed if there is clear imprint of the
Leadframe features on the DAF surface.

Source: Micron Inc Inclusive

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Offline Process Control: Quality Inspection for Defects (Ack: JinQuan)

• Mount Defects
• Surveillance check
Mounted strip is inspected under microscope to check for any mount defects.
• Automatic scope is being used for some inspection for consistency and efficiency

Source: https://www.viontecmall.com/en/vi/product/semiconductor-inspection-microscope-mx63/ Source: https://www.gagesite.com/used-machines/yellow-tag-specials/ogp-smartscope250

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Offline Process Control – Example: Acoustic Scanning (Ack: JinQuan)

Source: https://wpo-altertechnology.com/how-it-works-scanning-acoustic-microscopy-c-sam/

• Acoustic scanning to find out potential die lamination issue

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Inline Process Control – Example: SPC Chart & FDC Chart (Ack: JinQuan)

Fault Detection Control (FDC)

• Tracking critical tool signals which may lead to quality issue
• Examples: bonding force, bonding temperature, etc
• Alert operators / technicians if there’s out of control events

Statistical Process Control (SPC)

• Tracking critical process output as indicator to potential
quality issue based on pre-defined trigger rule
• Examples: die placement accuracy, stack heights, etc
• Alert operators / engineers if there’s out of control events

Source: https://en.wikipedia.org/wiki/Control_chart

Y axis: die placement / temperature / force / heights / etc

X axis: sample / time

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Other Examples of Quality Control & Periodic Maintenance at Die Attach
(Ack:Process
JinQuan)

◼ Consumables (eg: Collet) change

Frequency: Every XXXX counts (X = number of bonding cycles used / number of dies mounted, etc)

◼ Poker pin height

Measure every XX with a dial gage (X = number of weeks, conversions, production shifts, package counts, etc)

◼ Mount Temperature
Check actual temperature
Measure every XX with a thermocouple (X = number of weeks, conversions, production shifts, package counts, tool
repairs etc)

◼ Ionizer Condition
Verify ionizer functionality and effectiveness
Check every XX with a thermocouple (X = number of weeks, conversions, tool repairs, etc)

◼ Bonding Tool Planarity

Verify bonding tool planarity
Measure every X with external / 3rd party gauge (X = number of weeks, conversions, tool repairs, etc)

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References (Ack: JinQuan)

• Some images courtesy to public web materials

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