The document discusses two main types of ASIC designs: Full-Custom and Semi-Custom, detailing their advantages and disadvantages. Full-Custom ASICs offer high performance and small size but require longer design times and higher costs, while Semi-Custom designs like Gate Arrays and Standard Cell ASICs provide quicker design processes at the expense of some performance. Additionally, it outlines the ASIC design flow, including front-end and back-end design steps, and compares ASICs with FPGAs in terms of flexibility, power consumption, and production suitability.
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The document discusses two main types of ASIC designs: Full-Custom and Semi-Custom, detailing their advantages and disadvantages. Full-Custom ASICs offer high performance and small size but require longer design times and higher costs, while Semi-Custom designs like Gate Arrays and Standard Cell ASICs provide quicker design processes at the expense of some performance. Additionally, it outlines the ASIC design flow, including front-end and back-end design steps, and compares ASICs with FPGAs in terms of flexibility, power consumption, and production suitability.
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Full custom design
+ In Full-Custom ASIC, all the logic cells, circuits and layouts are designed
specifically for that particular ASIC from the ground up.
+ Chosen iff, either the existing libraries are not fast enough or the logic
cells are not small or the power consumption is high.
» Advantage : it delivers the highest possible performance at the smallest
possible die size.
* Disadvantage: High performance and small size comes at a price of
increased design time, complex design and overall cost of the IC itself.
*Examples : Microprocessors, Memories, Analog Processors,
Analog/ Digital Communication devices, Sensors, Transducers, high-
voltage ICs for Automobiles, etc.Semi custom Design : Gate Arrays
+ In Gate Array based ASICs, p and n types transistors are predefined on a
silicon wafer as arrays.
+ Based on the design from the customer and the interconnections obtained
from the design, the silicon vendor provides these base wafers.
+ Thus , the base wafer is specific to the customer as it is designed based on
the customer provided connections between the transistors of the gate array.
+ The gate arrays are again divided into two types called the Channelled Gate
Array and the Channel-less Gate Array.
+ In channelled gate arrays, the interconnections between the logic cells are
performed within the predefined channels between the rows of the logic
cells.
+ In case of channelless gate arrays, the connections are made on an upper
metal layer on top of the logic cells.Semi custom Design : Cell Based
+A Standard Cell based ASIC uses predesigned logic cells like Gates,
Multiplexers, Flip-flops, Adders etc.
+ These logic cells are known as Standard Cells that are already designed
and stored in a library.
+ This library is imported into the CAD tool and the design can performed
using the Components of the library as inputs.
+ Typically, Standard Cell based designs are organised as rows of constant
height cells on the chip, just like a row of bricks.
+ When combined with logic-level components, standard cell-based designs
gan be used to implement complex functions like Multipliers and Memory
rays.
* The standard cell design may also contain a larger and more complex
predesigned cells like Microcontrollers or Microprocessors. These larger
cells are called as Megacells.
NM
cH
| =Full Custom Vs Semi Custom (1/2)
Full Custom Semi CustomFull Custom Vs Semi Custom (2/2)
Full-custom Design
longer design time
until “maturity”
Semi-custom Design
More Opportunities
. Less Opportunities for performance
Shorter design for performance improvement
time until
y improvement
“maturity”
Circuit PerformanceASIC Design Flow
Gees
Pile)
|
EE _
eed
Packaging & testing
HULL
raFront End Design
Design Entry: |n the step, the logic design is created using a Hardware
Description Language (HDL) like VHDL or Verilog HDL or with the help of
Schematic entry.
RTL verification :In this step conformance of RTL Design to specification is
verified.
* To answer the question "Does this proposed design do what is
intended?“
* RTL verification is a complex task, and takes the majority of time and
effort in most VLSI Projects
+ Itis complex because of the sheer volume of > test-cases that
exist in even a simple design.
( <<Back End Design Steps (1/4)
+ Logic synthesis: The RTL is mapped into a gate-level netlist in the target
technology of the chip.
+ DFT: The technique which facilitates a design to become testable
after production.
+ Extra logic is along with the design logic during implementation
process which helps post production process.
* The DFT will make the testing easy at post production process
Floor planning: The process of determining the macro placement, power
grid generation and I/O placement.
+ Places blocks/macros in the chip/core area there by determining
routing areas between them.
+ It determines the size of the die and creates wire tracks for placement
of standard cells.
+ It also determines the I/O, pin/pad placement information. 7 |Back End Design Steps (2/4)
+ Placement: The gates in the net list are assigned to non-overlapping locations
on the die area.
+ Logic/placement refinement: Iterative logical and placement
transformations to achieve performance and power constraints.
+ Clock Tree Synthesis: The clock tree is built using inverters and buffers.
For balancing the clock skew and minimising insertion delay in order to meet timing and
power.
+ Routing: The wires that connect the gates in the net list are added.
+ Sign-off: Performance (timing closure), noise (signal integrity), and yield
(Design for manufacturability) violations are removed.Back End Design Steps (3/4)
+ Design for manufacturability: The design is modified, where possible, to make it as
easy and efficient as possible to produce.
+ This is achieved by adding extra vias or adding dummy (metal/diffusion/poly) layers
wherever possible, while complying to the design rules, set by the foundry.
+ Packaging & Testing: Since errors are expensive, time-consuming and hard to spot,
extensive testing is done, making sure the mapping to logic was done correctly,
and packaging the chip following manufacturing rules.
+ Post Silicon Validation: involves operating one or more manufactured chips in
actual application environments to validate correct behaviors over specified
operating conditions
+ Chip Tape-out: the design data is turned into photomasks in mask data preparation.ASIC Vs FPGA
exw»
a | > — 4 weeks for fab) of MHz)
High unit cost
(S1,000's)
‘Comments *Oftenused for | « Especially useful
FPGA shrink
in markets that
change fast or have
low volumesFPGA -A Conceptual View
= An FPGA is like an electronic breadboard that is wired together
by an automated synthesis tool
= Built-in components are called macros‘FPGA —AN inside Took
aFPGA Based Design — Xilinx Flow
Design [Design Verteaton
ay -}———5
Berard
—— Simdaton
Design }
Syntesis
Furctonal
[TP Lsindaton
Design (tae Ting
Implementation | Anaya
LT ba Toning
‘Ancataton [| Simulation
|
Programming | Nericatonesource (1/2): IEEE Standards
IEEE Standard for Verilog Hardware Description Language," in /EEE Std
1364-2005 (Revision of IEEE Std 1364-2001) , vol., no., pp.1-590, 7 April 2006,
doi: 10.1109/IEEESTD.2006.99495.
IEEE Standard for System Verilog--Unified Hardware Design, Specification, and
Verification Language," in IEEE Std 1800-2017 (Revision of IEEE Std
1800-2012) , vol., no., pp.1-1315, 22 Feb. 2018, doi: 10.1109/
IEEESTD.2018.8299595.