ME 305 TFQ - Merged
ME 305 TFQ - Merged
1. (a) What are the Prandtl's boundary layer approximations? Using these
approximations, obtain Prandtl boundary layer equations for forced convection heat
transfer. (10)
(b) How are the hydrodynamic and the thermal entry lengths defined for flow in a
heated tube? What will be those energy lengths for both laminar and turbulent flow
leading edge of the plate to the critical length of the plate. (15)
2. (a) Consider a rectangular fin,that is used to cool a motorcycle engine. The fin is 0.15
m long and at a temperature of 250°C, while the motorcycle is moving at 80 km/h in
air at 27°C. The air is in parallel flow over both surfaces of the fin, and turbulent flow
conditions may be assumed to exist throughout. What is the rate of heat removal per
3. (a) Explain the cases of stable and unstable fluid circulation during the presence of
(positive/negative) temperature gradient across a fluid layer between hot and cold
surfaces. (13)
(b) Show the effect of Prandtl number on hydrodynamic and thermal boundary layer
thickness during natural convection over a vertical isothermal flat plate. (7)
(c) Consider a l5-cm x 20-cm printed circuit/ board (PCB) that has electronic
components on one side. The board is placed in a moon at 20°C. The heat loss from
the back surface of the board is negligible. If the circuit board is dissipating 8 W of
power in steady operations, determine the average temperature of the hot surface of
the board, assuming the board .is horizontal with hot surface facing up. Take the
emissivity of the surface of the board to be 0.8 and assume the surrounding surfaces
to be at the same temperature as the air in the room. (15)
Contd P/2
.
=2=
ME305
4. (a) Ethyl-alcohol (Sc = 103) spilled out from a flask on a smooth surface of a
laboratory table. A fan is used to evaporate that chemical from the table surface. If the
fan creates a uniform air flow at a speed of u'" over the surface, and the concentration
of ethyl-alcohol at the table is Cs and in the air is C'" draw and table the boundary
layers developed over the table surface for CsC'" and show the corresponding
boundary layer thickness for each boundary layer. (10)
(b) Define Nusselt and Sherwood numbers. Derive the relationship between
convection heat and mass transfer coefficient during simultaneous heat and mass
transfer using Chilton-Colburn analogy. (10)
(c) During a certain experiment involving the flow of dry air at 27°C and I atm over a
body covered with a layer of naphthalene, it is observed that 12g of naphthalene has
sublimated in 15 min. The surface area of the body is 0.3 m2• Both the body and the
air were kept at 27°C during the study. The vapor pressure of naphthalene at 27°C is
I I Pa. Determine the mass transfer coefficient under the same flow conditions over
the same geometry. Given that molecular weights of dry air and naphthalene are
28.96 and 128.2 glmol, respectively. (15)
SECTION -B
generating heat at a constant rate egen =5x107 W/m3 as shown in Fig. for Q.5(b). The
heat generated is dissipated to the environment steadily. The outer surface of the
sphere is maintained at a uniform temperature of 110°C and thermal conductivity of
6. (a) A thin silicon chip and an 8-mm-thick aluminum substrate by a 0.02 mm thick
epoxy joint. The chip and substrate are each 10 mm on a side, and their exposed
surfaces are cooled by air, which is at a temperature of 25°C and provides a
convection coefficient of 100 W/m2K. If the chip dissipates 104 W/m2 under normal
conditions, will it operate below a maximum allowable temperature of 85°C?
Consider the schematic of the system as delineated in the Fig. for Q. 6(a) and the
attached table for the appropriate thermal resistance solid/solid interfaces. (17)
Contd P/3
=3=
ME 305
Contd ..... Q. NO.6
7. (a) How can you differentiate among Black Body, Real Surface and Gray Surface?
Show their characteristics in terms of variation of spectral emissivity and spectral
emissive power with wavelength. (15)
(b) Define View factor used in radiation study. Determine the view factor F1z and FZ3
between rectangular surfaces a shown in Fig. for 7(b). (10)
(c) A thin aluminum sheet with an emissivity of 0.1 on both sides a placed between
two very large parallel plates that are maintained at uniform temperature T 1 = 800 K
and Tz = 500 K and have emissivities £1 = 0.2 and £z = 0.7, respectively, as shown in
Fig. for Q. 7 (c). Determine the net rate of radiation heat transfer between the two
plates per unit surface area of the plates and compare the result to that without the
shield. (10)
Symbols have their usual meaning. Use the enclosed tables for properties of water.
and water vapor.
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Summary of Correlation fO'r Forced Convection Flow over Flat Plates
Properties evaluated at Film temperature
,
Heat Transfer
Type Restrictions Fluid Flow Isothermal (Tw ==constant)
,
Isoflux (aw ==constant)
2
Nu x ==0,332Re1x'/2Pr1/3 Nu x ==0.453Re1/ Pr1/3
Laminar: Rex < 5 x 105; 0.6 < Pr < 50 C f,x == O.6 64Re~l/2 x .i
Local
Cf ==1.328Re~l/2 Nu L ==O.664Re~2Prl/3 Nu L ==0,680Re~2PrJ/3
Average Laminar: ReL < 5 x 105 ; 0.6 < Pr < 50
Turbulent: 5 x 105 :0; Rex :0; 107; C ==0 059Re-l/5 Nux == 0.0296Re~/5Prl/3 Nux ==0.0308Re~/5Prl/3
. f,x' x
Local 0.6 < Pr < 60
7 ,
==0.037Re~/5Prl/3
Turbulent: 5 x 105 :0; ReL :0; 10 ; C f ==0.074Re~l/5 NUL ==0.037Re~5Prl/3 NUL
Average
0.6 < Pr < 60
Partly Laminar, Partly Turbulent: 13
0.037Re~5Prl/3
Cf ==O.074Re~1/5-1742ReL ==(0.037Re~5_871)Pr
5 x 105:0; ReL :0; 107 ;0.6 :0; Pr :0; 60
NUL / NUL
Average 1+ 12.33x 106Re~6/5
Recr ==5 x 105
Ii
~,
Correlations for Fully Developed Turbulent Forced Convection Flow inside Circular Pipe
1 Properties evaluated at Mean Bulk Fluid temperature, Tb ==(Tj + Te)/2 otherwise mentioned
'.I) Restrictions
Colburn Equation
Nu ==0.023Re~8 PrJ/3 0.7 < Pr < 160; ReD> 10000; LID > 60; small to moderate temperature differences
7
n ==0.4 (Tw >Tb); n ==0.3 (Tw < Tb); 0.6 < Pr < 160; 6000 < ReD < 10 ; LID> 60; For duct flow,
n
Nu ==0.023Re~8 Pr Dis replaced by Dh
,
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~
r
Sieder and Tate Equation Restrictions III
' CJ.,:l i
14
0.7 < Pr < 10000; 6000 < ReD < 107 ; LID > 60; flw is, evaluated at wall (surface) temperature; ()
Nu ==0.027 Re~8 PrJ/3 (f.1b For duct flow, Dis replaced by Dh
<J"I
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f.1w
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----- T. = 25.C
II: 100 Wim>.K
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Aluminum/aluminum wilh indium foil . -0.Q7
filler (-100 kN/Ill')
Stailllcss!slainicss with indium foil -0.04
filler (-3500 kN/Ill')
Alumlnum/nlumlllllll1 \\'1111 fIlCllllliC (Pb) 0.01-0.! I
t.Oilling I,
Aluminum/aluminum wilh Dow Corning -0.07
340 grease (-100 kN/Ill')
SI<linh.'ss/slilinlcss with Do~\'Corning -0.04
340 grease (-3500 kN/Ill')
Silicon chiplnlumillUl1l with O.02.1lI111 0.2-0.9
epoxy
Brass/hmss with] 5.1-l1ll Un solder 0.025-0.14
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of 5 "-1M y",hd
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.. To. ble. ; propePh'u
Enthalpy Specific Thermal
Saturation Density of Heat Conductivity Dynamic Viscosity
p. kgtm3 Vaporization e,. J/kg.K k. W/m.K p. kg/m.,
Pressure
Temp.
VapOr Liquid Vapor Liquid Vapor Liquid Vapor
T, ~C Pal' kPa Liquid his' kJlkg