Blu-ray Disc Player

BD-F5500
Application BD-F5500 / BD-F5500K /
Models BD-F5500Y / BD-F5500E /
BD-F5550
Application Area BAS,EN,KR,PE,PR,RU,SH,SJ,SQ,TK
UM,XA,XD,XE,XL,XM,XN,XP,XS,XT
XU,XV,XY,XZ,ZB,ZD,ZF,ZK,ZN,ZS
ZW,ZX,HC

SERVICE MANUAL
Blu-Ray Disc Player Contents

1. Precautions

2. Product Specifications

3. Disassembly and Reassembly

4. Troubleshooting

5. PCB Diagrams

6. Schematic Diagrams

Refer to the service manual in the GSPN (see the rear cover) for more information.
Contents

Contents
1. Precautions ...................................................................................................................................... 1 − 1
1.1. Safety Precautions ................................................................................................................... 1 − 1
1.2. Servicing Precautions ............................................................................................................... 1 − 3
1.2.1. General Servicing Precautions ....................................................................................... 1 − 3
1.2.2. Insulation Checking Procedure....................................................................................... 1 − 3
1.3. ESD Precautions...................................................................................................................... 1 − 4
1.4. Handling the optical pick-up ...................................................................................................... 1 − 5
2. Product Specifications ........................................................................................................................ 2 − 1
2.1. Product Specification................................................................................................................ 2 − 1
2.1.1. Player Features ........................................................................................................... 2 − 2
2.1.2. Blu-ray Disc Features................................................................................................... 2 − 2
2.1.3. Disc types and contents your player can play .................................................................... 2 − 3
2.1.4. Disc types that cannot be played..................................................................................... 2 − 4
2.1.5. Region code ............................................................................................................... 2 − 4
2.1.6. Logos of Discs that can be played ................................................................................... 2 − 5
2.1.7. Supported File Formats................................................................................................. 2 − 5
2.1.7.1. Notes on the USB connection .......................................................................... 2 − 5
2.1.7.2. AVCHD (Advanced Video Codec High Definition) .............................................. 2 − 7
2.2. Chassis Product Specification..................................................................................................... 2 − 9
2.3. Option Product Specification...................................................................................................... 2 − 11
3. Disassembly and Reassembly .............................................................................................................. 3 − 1
3.1. Cabinet and PCB ..................................................................................................................... 3 − 1
3.1.1. Top Cabinet Removal................................................................................................... 3 − 1
3.1.2. Assy Deck Removal..................................................................................................... 3 − 2
3.1.3. S.M.P.S PCB Removal ................................................................................................. 3 − 3
3.1.4. Main PCB Removal ..................................................................................................... 3 − 4
3.2. PCB Location ......................................................................................................................... 3 − 5
4. Troubleshooting ................................................................................................................................ 4 − 1
4.1. Troubleshooting ...................................................................................................................... 4 − 2
4.2. Software Update ...................................................................................................................... 4 − 13
4.2.1. Upgrade..................................................................................................................... 4 − 13
5. PCB Diagrams.................................................................................................................................. 5 − 1
5.1. Wiring Diagram....................................................................................................................... 5 − 1
5.2. Main PCB .............................................................................................................................. 5 − 2
5.3. S.M.P.S PCB........................................................................................................................... 5 − 4
5.4. Touch PCB ............................................................................................................................. 5 − 6
6. Schematic Diagrams .......................................................................................................................... 6 − 1
6.1. All Block Diagram................................................................................................................... 6 − 2

i Copyright© 1995-2013 SAMSUNG. All rights reserved.

 Contents

6.2. Power .................................................................................................................................... 6 − 3

6.2.1. About S.M.P.S (Ringing Choke Converter Method)............................................................ 6 − 3
6.2.2. Circuit descripcotion [FLY-Back RCC(Ringing Choke Converter)] Control ............................ 6 − 3
6.2.3. Internal Block Diagram (Internal Block Diagram of S.M.P.S Circuit) .................................... 6 − 5
6.3. S.M.P.S (S.M.P.S PCB) ............................................................................................................. 6 − 6
6.4. DC-DC Power (Main PCB) ....................................................................................................... 6 − 7
6.5. AV_ Karaoke (Main PCB) ......................................................................................................... 6 − 8
6.6. HDMI_SPDIF (Main PCB)........................................................................................................ 6 − 9
6.7. NAND_Ethernet_USB (Main PCB) ............................................................................................ 6 − 10
6.8. DDR3 Bank-0 (Main PCB)........................................................................................................ 6 − 11
6.9. DDR3 Bank-1 (Main PCB)........................................................................................................ 6 − 12
6.10. MISC_UART_STRAP (Main PCB) ............................................................................................ 6 − 13
6.11. F_E-0 (Main PCB)................................................................................................................... 6 − 14
6.12. F_E-1 (Main PCB)................................................................................................................... 6 − 15
6.13. Touch (Touch PCB).................................................................................................................. 6 − 16

Copyright© 1995-2013 SAMSUNG. All rights reserved. ii

1. Precautions

1. Precautions

1.1. Safety Precautions

1) Before returning an instrument to the customer, always make a safety check of the entire instrument, including, but not
limited to, the following items:
a) Be sure that no built-in protective devices are defective or have been defeated during servicing
i) Protective shields are provided to protect both the technician and the customer. Correctly replace all missing
protective shields, including any removed for servicing convenience.
ii) When reinstalling the chassis and/or other assembly in the cabinet, be sure to put back in place all protective
devices, including, but not limited to, nonmetallic control knobs, insulating fish papers, adjustment and
compartment covers/shields, and isolation resistor/capacitor networks. Do not operate this instrument or permit
it to be operated without all protective devices correctly installed and functioning.
b) Be sure that there are no cabinet openings through which adults or children might be able to insert their fingers and
contact a hazardous voltage. Such openings include, but are not limited to, excessively wide cabinet ventilation
slots, and an improperly fitted and/or incorrectly secured cabinet back cover.
c) Leakage Current Hot Check — With the instrument completely reassembled, plug the AC line cord directly into a
230V(220V ~ 240V) AC outlet. (Do not use an isolation transformer during this test.)
Use a leakage current tester or a metering system that complies with American National Standard Institute (ANSI)
C101.1 Leakage Current for Appliances and Underwriters Laboratories (UL) 1270 (40.7). With the instrument’s
AC switch first in the ON position and then in the OFF position, measure from a known earth ground (metal
water pipe, conduit, etc.) to all exposed metal parts of the instrument (antennas, handle brackets, metal cabinets,
screwheads, metallic overlays, control shafts, etc.), especially any exposed metal parts that offer an electrical
return path to the chassis.
Any current measured must not exceed 0.5mA.
Reverse the instrument power cord plug in the outlet and repeat the test. See
Any measurements not within the limits specified herein indicate a potential shock hazard that must be eliminated
before returning the instrument to the customer.

Figure1.1 AC Leakage Test

1-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 1. Precautions

d) Insulation Resistance Test Cold Check — (1) Unplug the power supply cord and connect a jumper wire between
the two prongs of the plug. (2) Turn on the power switch of the instrument. (3) Measure the resistance with
an ohmmeter between the jumpered AC plug and all exposed metallic cabinet parts on the instrument, such as
screwheads, antenna, control shafts, handle brackets, etc. When an exposed metallic part has a return path to the
chassis, the reading should be between 1 and 5.2 megohm. When there is no return path to the chassis, the reading
must be infinite. If the reading is not within the limits specified, there is the possibility of a shock hazard, and the
instrument must be repaired and rechecked before it is returned to the customer. See

2) Read and comply with all caution and safety related notes on or inside the cabinet, or on the chassis.

3) Design Alteration Warning — Do not alter or add to the mechanical or electrical design of this instrument.
Design alterations and additions, including but not limited to, circuit modifications and the addition of items such as
auxiliary audio output connections, might alter the safety characteristics of this instrument and create a hazard to the
user. Any design alterations or additions will make you, the servicer, responsible for personal injury or property
damage resulting therefrom.

4) Observe original lead dress. Take extra care to assure correct lead dress in the following areas:
(1) near sharp edges, (2) near thermally hot parts (be sure that leads and components do not touch thermally hot parts),
(3) the AC supply, (4) high voltage, and (5) antenna wiring. Always inspect in all areas for pinched, out-of-place, or
frayed wiring, Do not change spacing between a component and the printed-circuit board. Check the AC power cord
for damage.

5) Components, parts, and/or wiring that appear to have overheated or that are otherwise damaged should be replaced with
components, parts and/or wiring that meet original specifications.
Additionally, determine the cause of overheating and/or damage and, if necessary, take corrective action to remove
any potential safety hazard.

6) Product Safety Notice — Some electrical and mechanical parts have special safety-related characteristics which are
often not evident from visual inspection, nor can the protection they give necessarily be obtained by replacing them with
components rated for higher voltage, wattage, etc. Parts that have special safety characteristics are identified by shading,
an ( ) schematics and parts lists. Use of a substitute replacement that does not have the same safety characteristics
as the recommended replacement part might create shock, fire and/or other hazards. Product safety is under review
continuously and new instructions are issued whenever appropriate.

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1. Precautions

1.2. Servicing Precautions

CAUTION

Before servicing units covered by this service manual and its supplements, read and follow the Safety Precautions
section of this manual.

NOTE

If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions,
always follow the safety precautions. Remember: Safety First.

1.2.1. General Servicing Precautions

1) a. Always unplug the instrument’s AC powercord from the AC power source before (1) removing or reinstalling any
component, circuit board, module or any other instrument assembly, (2) disconnecting any instrument electrical plug or
other electrical connection, (3) connecting a test substitute in parallel with an electrolytic capacitor in the instrument.
b. Do not damage any plug/socket B+ voltage interlocks with which instruments covered by this service manual
might be equipped.
c. Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid-state device heat
sinks are correctly installed.
d. Always connect a test instrument’s ground lead to the instrument chassis ground before connecting the test instrument
positive lead. Always remove the test instrument ground lead last.

NOTE

Refer to the Safety Precautions section ground lead last.

2) The service precautions are indicated or printed on the cabinet, chassis or components. When servicing, follow the
printed or indicated service precautions and service materials.

3) The components used in the unit have a specified flame resistance and dielectric strength. When replacing components,
use components which have the same. Components identified by shading, in the circuit diagram are important for safety
or for the characteristics of the unit. Always replace them with the exact replacement components.

4) An insulation tube or tape is sometimes used and some components are raised above the printed wiring board for
safety. The internal wiring is sometimes clamped to prevent contact with heating components. Install such elements
as they were.

5) After servicing, always check that the removed screws, components, and wiring have been installed correctly and that
the portion around the serviced part has not been damaged and so on.
Further, check the insulation between the blades of the attachment plug and accessible conductive parts.

1.2.2. Insulation Checking Procedure

Disconnect the attachment plug from the AC outlet and turn the power ON. Connect the insulation resistance meter (500V)
to the blades of the attachment plug. The insulation resistance between each blade of the attachment plug and accessible
conductive parts(see note) should be more than 1 Megohm.

NOTE

Accessible conductive parts include metal panels, input terminals, earphone jacks, etc.

1-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 1. Precautions

1.3. ESD Precautions

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity.

Such components commonly are called Electrostatically Sensitive Devices(ESD). Examples of typical ESD devices are
integrated circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.

1) Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any
electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially
available discharging wrist strap device, which should be removed for potential shock reasons prior to applying power
to the unit under test.

2) After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3) Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4) Use only an anti-static solder removal devices. Some solder removal devices not classified as “anti-static” can generate
electrical charges sufficient to damage ESD devices.

5) Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD devices.

6) Do not remove a replacement ESD device from its protective package until immediately before installing it. (Most
replacement ESD devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or
comparable conductive materials).

7) Immediately before removing the protective materials from the leads of a replacement ESD device, touch the protective
material to the chassis or circuit assembly into which the device will be installed.

CAUTION

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8) Minimize body motions when handling unpackaged replacement ESD devices.

(Otherwise harmless motions such as the brushing together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity sufficient to damage an ESD device).

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1. Precautions

1.4. Handling the optical pick-up

The laser diode in the optical pick up may suffer electrostatic breakdown because of potential static electricity from
clothing and your body.

The following method is recommended.

1) Place a conductive sheet on the work bench (The black sheet used for wrapping repair parts.)

2) Place the set on the conductive sheet so that the chassis is grounded to the sheet.

3) Place your hands on the conductive sheet(This gives them the same ground as the sheet.)

4) Remove the optical pick up block

5) Perform work on top of the conductive sheet. Be careful to let your clothes or any other static sources touch the unit.

NOTE

• Be sure to put on a wrist strap grounded to the sheet.

• Be sure to lay a conductive sheet, that is grounded to the table, made of copper.

Fig.1-3

6) Short the short terminal on the PCB, which is inside the Pick-Up ASS’Y, before replacing the Pick- Up. (The short
terminal is shorted when the Pick- Up Ass’y is being lifted or moved.)

7) After replacing the Pick-up, open the short terminal on the PCB.

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 2. Product Specifications

2. Product Specifications

2.1. Product Specification

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2. Product Specifications

2.1.1. Player Features

• Supports a Variety of Disc Types

- Blu-ray (BD-ROM, BD-RE, BD-R), DVD Video, DVD-RW/-R (V mode and finalized only) discs and Audio CD.
- CD-RW/CD-R, DVD-RW/-R and USB storage device content such as MP3, JPEG and DivX files.
• HDMI (High Definition Multimedia Interface)
HDMI reduces picture noise by allowing a pure digital video/audio signal path from the player to your TV.

2.1.2. Blu-ray Disc Features

Blu-ray Discs can store 25 GB (single layer) or 50 GB (dual layer) on a single sided disc - about 5 to 10 times the capacity
of a DVD. Blu-ray Discs also support the highest quality HD video available in the industry (up to 1920 x 1080 at 40
Mbit/sec) –Large capacity means no compromise on video quality. Furthermore, a Blu-ray Disc has the same familiar size
and look as DVD.

NOTE

The following Blu-ray Disc features are disc dependant and will vary.
Appearance and navigation of features will also vary from disc to disc.
Not all discs will have the features described below.

• Video highlights
The BD-ROM format for movie distribution supports three highly advanced video codecs, including AVC, VC-1,
and MPEG-2.
HD video resolutions are also available:
- 1920 x 1080 HD
- 1280 x 720 HD
• For High-Definition Playback
To view high-definition contents in BD discs, an HDTV (High Definition Television) is required. Some discs may
require using the player's HDMI OUT to view high-Definition content. The ability to view high-Definition content on
BD discs may be limited depending on the resolution of your TV.

• Graphic planes
Two individual, full HD resolution (1920x1080) video layers are available on top of the HD video layer.
One layer is assigned to video-related graphics (like subtitles), and the other layer is assigned to interactive elements,
such as buttons or menus. Various wipes, fades and scroll effects may be available on both layers.

• Menu graphics
Support 256 full color resolution graphics and animation, thereby greatly surpassing the capabilities of DVDVideo.
Unlike DVD, Menus can be accessed during video playback.

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 2. Product Specifications

• Menu sounds
When you highlight or select a menu option on a Blu-ray disc, sounds can be heard such as button clicks or a voice
over explaining the highlighted menu choice.

• Multi-page/PopUp Menus
With DVD-Video, playback is interrupted each time a new menu screen is accessed. Due to Blu-ray Disc's ability to
preload data from the disc without interrupting playback, a menu may consist of several pages.
You can browse through the menu pages or select different menu paths, while the audio and video remain playing
in the background.

• Interactivity
Certain Blu-ray Discs may contain Animated menus and Trivia games.

• User Browsable Slideshows

With Blu-ray Discs, you can browse through various still pictures while the audio remains playing.

• Subtitles
Depending on what is contained on the Blu-ray Disc, you may be able to select different font styles, sizes and colors for
the subtitles, Subtitles may also be animated, scrolled or faded in and out.

• BD-LIVE
You can use a Blu-ray Disc supporting BD-LIVE through network connection to enjoy various contents provided
by the disc manufacturer.

2.1.3. Disc types and contents your player can play

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2. Product Specifications

NOTE

• The player may not play certain CD-RW/-R and DVD-R because of the disc type or recording conditions.

• If a DVD-RW/-R has not been recorded properly in DVD video format, it will not be playable.

• Your player will not play content that has been recorded on a DVD-R at a bit-rate that exceeds 10 Mbps.

• Your player will not play content that has been recorded on a BD-R or USB device at a bit rate that exceeds 25Mbps.

• Playback may not work for some types of discs, or when you use specific operations, such as angle change and aspect ratio
adjustment. Information about the discs is written in detail on the disc box. Please refer to this if necessary.

• When you play a BD-J title, loading may take longer than a normal title or some functions may perform slowly.

2.1.4. Disc types that cannot be played

• HD DVD
• DVD-RAM
• DVD-RW(VR mode)
• 3.9 GB DVD-R for Authoring.
• DVD-ROM/PD/MV, etc
• Super Audio CD (except CD layer)
• CVD/CD-ROM/CDV/CD-G/CD-I/LD (CD-Gs play audio only, not graphics.)

2.1.5. Region code

Both the product and the discs are coded by region. These regional codes must match in order to play the disc. If the codes
do not match, the disc will not play. The Region Number for this product is described on the rear panel of the product.

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 2. Product Specifications

2.1.6. Logos of Discs that can be played

2.1.7. Supported File Formats

2.1.7.1. Notes on the USB connection

• Your player supports USB storage media, MP3 players, digital cameras, and USB card readers.
• The player does not support folder or file names longer than 128 characters.
• Some USB/External HDD/digital camera devices may not be compatible with the player.
• Your player supports the FAT16, FAT32, and NTFS files systems.

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2. Product Specifications

• Connect USB devices directly to the player’s USB port. Connecting through a USB cable may cause compatibility
prolems.

• Inserting more than one memory device into a multi-card reader may cause the reader to operate improperly.
• The player does not support the PTP protocol.
• Do not disconnect a USB device during a “loading” process.
• The bigger the image resolution, the longer the image takes to display.
• This player cannot play MP3 files with DRM (Digital Rights Management) downloaded from commercial sites.
• Your player only supports the video that is under 30fps (frame rate).
• Your player only supports USB Mass Storage Class (MSC) devices such as thumb drives and USB HDD. (HUB
is not supported.)

• Certain USB HDD Devices, multi-card readers and thumb drives may not be compatible with this player.
• If some USB devices require excessive power, they may be limited by the circuit safety device.
• If playback from a USB HDD is unstable, provide additional power by plugging the HDD into a wall socket. If the
problem continues, contact the USB HDD manufacturer.

• You must remove the USB storage device safely by performing the "Safely Remove USB" function to prevent possible
damage to the USB memory. Press the HOME button to move to the home screen, press the YELLOW button, and
then press the button.

• SAMSUNG is not responsible for any data file damage or data loss.
• Your player does not support NTFS compressed files, sparse files, or encrypted files.
• You can repair or format a USB device on your Desktop PC. (MS-Windows OS only)
Video File Support

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 2. Product Specifications

• Limitations
- Even when the file is encoded by a supported codec mentioned above, a file might not be played if its content has
a problem.
- Normal playback is not guaranteed if the file’s container information is wrong or the file itself is corrupted.
- Files having higher Bitrate/frame rate than standard may stutter when played back.
- The Seek (skip) function is not available if the file’s index table is damaged.
• Video decoder
- Supports up to H.264 Level 4.1 and AVCHD
- Does not support H.264 FMO/ASO/RS and VC1 SP/MP/AP L4
- MPEG4 SP, ASP :
Below 1280 x 720 : 60 frames max
Above 1280 x 720 : 30 frames max

- Does not support GMC 2 or higher

• Audio decoder
- Supports WMA 7, 8, 9 and STD
- Does not support WMA sampling rate of 22050Hz mono.
Supported DivX subtitle file formats

*.ttxt, *.smi, *.srt, *.sub, *.txt

NOTE

• Some DivX, MKV and MP4 format discs may not play, depending on their video resolution and frame rate.

Music File Support

Picture File Support

2.1.7.2. AVCHD (Advanced Video Codec High Definition)

• This player can play back AVCHD format discs. These discs are normally recorded and used in camcorders.
• The AVCHD format is a high definition digital video camera format.

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2. Product Specifications

• The MPEG-4 AVC/H.264 format compresses images with greater efficiency than the conventional image compressing
format.

• Some AVCHD discs use the “x.v.Color” format. This player can play back AVCHD discs that use “x.v.Color” format.
• “x.v.Color” is a trademark of Sony Corporation.
• “AVCHD” and the AVCHD logo are trademarks of Matsushita Electronic Industrial Co., Ltd. and Sony Corporation.

NOTE

• Some AVCHD format discs may not play, depending on the recording condition. AVCHD format discs need to be finalized.

• “x.v.Color” offers a wider color range than normal DVD camcorder discs.

• Some MKV and MP4 format discs may not play, depending on the video resolution and frame rate condition.

2-8 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 2. Product Specifications

2.2. Chassis Product Specification

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2. Product Specifications

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 2. Product Specifications

2.3. Option Product Specification

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3. Disassembly and Reassembly

3. Disassembly and Reassembly

3.1. Cabinet and PCB

NOTE

Connector Must be removed with care

3.1.1. Top Cabinet Removal

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 3. Disassembly and Reassembly

3.1.2. Assy Deck Removal

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3. Disassembly and Reassembly

3.1.3. S.M.P.S PCB Removal

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 3. Disassembly and Reassembly

3.1.4. Main PCB Removal

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3. Disassembly and Reassembly

3.2. PCB Location

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 4. Troubleshooting

4. Troubleshooting

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4. Troubleshooting

4.1. Troubleshooting

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 4. Troubleshooting

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4. Troubleshooting

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 4. Troubleshooting

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4. Troubleshooting

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 4. Troubleshooting

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4. Troubleshooting

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 4. Troubleshooting

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4. Troubleshooting

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 4. Troubleshooting

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4. Troubleshooting

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 4. Troubleshooting

4.2. Software Update

4.2.1. Upgrade

The Software Upgrade menu allows you to upgrade the player’s software for performance improvements or additional
services.

• By Online

To upgrade By Online, follow these steps:

1) Select By Online, and then press the button. The Connecting to Server message appears.

2) A popup message will appear if an update is available.

3) automatically before restarting. (Never turn the player on during an upgrade.)

4) The update progress popup will appear. When the update is completed, the player will turn off automatically.

5) Press the POWER button to turn on the player.

NOTE

• The Update is complete when the player turns off after restarting. Press the POWER button to turn on the updated player
for your use.

• Never turn the player off or back on manually during the update process.

• Samsung Electronics takes no legal responsibility for player malfunction caused by an unstable Internet connection or
consumer negligence during a software upgrade.

• If you want to cancel the upgrade while the upgrade software is downloading, press the button.

•By USB

To upgrade by USB, follow these steps:.

1) Visit www.samsung.com/bluraysupport.

2) Download the latest USB software upgrade zip archive to your computer.

3) Unzip the zip archive to your computer. You should have a single RUF file with the same name as the zip file.

4) Copy the RUF file to a USB flash drive.

5) Make sure there is no disc in the player, and then insert the USB flash drive into the USB port of the player.

6) In the player’s menu, go to Settings > Support > Software Upgrade.

7) Select By USB.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-13

4. Troubleshooting

NOTE

• No disc should be inserted in the product when you upgrade the software using the USB Host jack.

• When the software upgrade is done, check the software details in the software Upgrade menu.

• Do not turn off the player during the software upgrade. It may cause the player to malfunction.

• Software upgrades using the USB Host jack must be performed with a USB flash memory stick only.

• By Disc

To upgrade by Disc, follow these steps:

1) Visit www.samsung.com/bluraysupport.

2) Download the latest disc software upgrade zip archive to your computer.

3) Unzip the zip archive to your computer. You should have a single RUF file with the same name as the zip file.

4) Write the RUF file onto a disc. We recommend a CD-R or DVD-R.

5) Finalize the disc before you remove it from your computer.

6) Insert the disc into player.

7) In the player’s menu, go to Settings > Support > Software upgrade.

8) Select By Disc.

NOTE

• When the system upgrade is done, check the software details in the software Upgrade menu. `` Do not turn off the player
during the Software Upgrade. It may cause the player malfunction.

• Auto Upgrade Notification

If you have connected the player to your network, and then set Auto Upgrade Notification on, the player automatically
notifies you when a new software version is available for the player.

To set Auto Upgrade Notification on, follow these steps:

1) Select Auto Upgrade Notification, and then press the button.

2) Use the buttons to select On, and then press the button.

If there is a new software version available, the player notifies you with a popup message.

1) To upgrade the firmware, select Yes in the Pop-up. The player turns off automatically, then restarts, and begins the
download. (Never turn on the player manually here.)

2) The update progress popup appears.

3) When the update is complete, the player turns off again automatically.

4) Press the POWER button to turn on the player.

4-14 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 4. Troubleshooting

NOTE

• The update is complete when the player turns off after restarting. Press the POWER button to turn on the updated player
for your use.

• Never turn the player off or on manually during the update process.

• Samsung Electronics takes no legal responsibility for player malfunction caused by an unstable Internet connection or
consumer negligence during software upgrade.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 4-15

5. PCB Diagrams

5. PCB Diagrams

5.1. Wiring Diagram

5-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagrams

5.2. Main PCB

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-2

5. PCB Diagrams

5-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagrams

5.3. S.M.P.S PCB

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-4

5. PCB Diagrams

5-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 5. PCB Diagrams

5.4. Touch PCB

Copyright© 1995-2013 SAMSUNG. All rights reserved. 5-6

6. Schematic Diagrams

6. Schematic Diagrams
NOTE

• For schematic Diagram

- Resistors are in ohms, 1/8W unless otherwise noted.

NOTE

Do not use the part number shown on this drawing for ordering. The correct part number is shown in the parts list (may be slightly different or amended since this drawing was prepared).

CAUTION

Most semiconductor devices are electrostatically sensitive and therefore require the special handling techniques described under the “electrostatically sensitive (ES) devices” section of this service manual.

WARNING

Components identified with the mark have the special characteristics for safety. When replacing any of these components. Use only the same type.

6-1 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.1. All Block Diagram

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-2

6. Schematic Diagrams

6.2. Power

6.2.1. About S.M.P.S (Ringing Choke Converter Method)

Terms

1) 1st : Common power input to 1st winding.

2) 2nd : Circuit followings output winding of transformer.

3) f (Frequency) : Switching frequency (T : Switching cycle)

4) Duty : (Ton/T) x 100

6.2.2. Circuit descripcotion [FLY-Back RCC(Ringing Choke Converter)] Control

1) AC Power Rectification/Smoothing Terminal

a) BD01 ~ 04 : Convert AC power to DC(Wave rectification).
b) C1S05B : Smooth the voltage converted to DC.
c) L1S01, C1S03, C1S04 : Noise removal at power input/output.
d) R1S02 : Rush current limit resistance at the moment of power cord insertion.
Without P1S02, the bridge diode might be damaged as the rush current increases.

2) SNUBBER Circuit : D1S10, C1S10, R1S10

a) Prevent residual high voltage at the terminals of switch during switch off/Suppress noise. High inverted power occurs at switch off, because of the 1st winding of transformer : (V=-L1 xdi/dt. L1 : Leakage Induction) A very high residual voltage exist on both
terminals of IC1 because dt is a very short.
b) SNUBBER circuit protects IC1 from damage through leakage voltage suppression by RC, (Charges the leakage voltage to DIS10 and CIS10 and discharges to R1S10).

6-3 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

3) IC1S01 Vcc circuit

a) ICIS01, RIS05, RIS07,RIS08 : ICIS01 driving resistance (ICIS01 works through driving resistance at power cord in)
b) ICIS01 Vcc : RIS05, RIS07, RIS08
i) Use the output of transformer as Vcc, because the current starts to flow into transformer while ICIS01 is active
ii) Rectify to DIS07 and smooth to CIS09.
iii) Use the output of transformer as ICIS01 Vcc : The loads are different before and after ICIS01 driving. (Vcc of ICIS01 decreases below OFF voltage , using only the resistance dut to lode increase after ICIS01 driving.)

4) Feedback Control Circuit

a) F/B Terminal of IC1 determines output duty cycle.

b) C-E (Collector-Emitter) of and F/B potential of PQIZ1 are same.

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-4

6. Schematic Diagrams

6.2.3. Internal Block Diagram (Internal Block Diagram of S.M.P.S Circuit)

6-5 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.3. S.M.P.S (S.M.P.S PCB)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-6

6. Schematic Diagrams

6.4. DC-DC Power (Main PCB)

6-7 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.5. AV_ Karaoke (Main PCB)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-8

6. Schematic Diagrams

6.6. HDMI_SPDIF (Main PCB)

6-9 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.7. NAND_Ethernet_USB (Main PCB)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-10

6. Schematic Diagrams

6.8. DDR3 Bank-0 (Main PCB)

6-11 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.9. DDR3 Bank-1 (Main PCB)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-12

6. Schematic Diagrams

6.10. MISC_UART_STRAP (Main PCB)

6-13 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.11. F_E-0 (Main PCB)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-14

6. Schematic Diagrams

6.12. F_E-1 (Main PCB)

6-15 Copyright© 1995-2013 SAMSUNG. All rights reserved.

 6. Schematic Diagrams

6.13. Touch (Touch PCB)

Copyright© 1995-2013 SAMSUNG. All rights reserved. 6-16

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Area Web Site

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This Service Manual is a property of Samsung Electronics

Co.,Ltd.
© 2013 Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under
All rights reserved.
applicable International and/or domestic law.
Printed in Korea