PRODUCT BRIEF

Western Digital® IX SN530 NVMe™

Industrial-Grade SSD
Empowering a new generation of data-rich industrial and
autonomous driving designs
Western Digital IX SN530 NVMe industrial-grade SSD (IX SN530) offers a high-performance,
wide–temperature range storage solution designed for the demanding requirements of
industrial and autonomous driving applications. With flexibility through high-capacity TLC
and high-endurance SLC options, the IX SN530 offers two M.2 form factors and up to 2TB2
of storage space.

Product Highlights
• High performance at industrial-grade
Built for Extreme Conditions
temperatures -40˚C to +85˚C The IX SN530 supports a wide range of environmental conditions, including operating
• Up to 2TB in M.2 2280 and up to 1TB in M.2 2230 temperatures and shock and vibration, which allow it to be used in systems placed in
• Available in TLC and SLC configurations various physical locations in a vehicle or other equipment, enabling placement flexibility for
system designers.
Applications
• Industrial PCs Robust and Reliable Design
• Factory automation A fully vertically integrated solid state drive, the IX SN530 is built with Western Digital’s
• Robotics 96-layer 3D NAND technology, in-house controller and firmware development, internal
• Fanless designs validation and qualification, and extensive testing; making it ideal for handling a wide
• Digital signage variety of industrial and automotive use cases. In addition, Western Digital supports
• Data logging and boot device for five-year longevity with controlled bill-of-material and provides product change
autonomous driving systems
notifications, for customers’ peace of mind.

Further, by offering SLC configurations, the IX SN530 supports write-intensive

applications, such as data recorder and data set management, saving the need to use
multiple high-capacity TLC devices by delivering 9 times the TLC endurance and up to
5 times the TLC sustained write performance.

Gearing Up with NVMe SSDs

The IX SN530 is available in two M.2 form factors—a compact M.2 2230 and M.2 2280—
addressing a variety of system designs and mechanical constraints. This compact solution
helps to reduce maintenance costs and enhance serviceability, making the transition to
industrial-grade PCIe NVMe SSDs easier.
PRODUCT BRIEF

Specifications
Generic Specifications
Interface1 PCIe Gen3 x4 NVMe v1.4
Form factors M.2 2280-S3-M / M.2 2230-S3-M M.2 2280-S3-M
3D NAND flash SLC 96-layer TLC 96-layer
Capacity2 85GB 170GB 340GB 256GB 512GB 1TB 2TB

Performance
Sequential Read up to (MB/s)3 2,400 2,400 2,400 2,400 2,400 2,400 2,500
Burst Sequential Write up to
900 1,750 1,950 900 1,750 1,950 1,800
(MB/s)4
Sustained Sequential Write up
900 1,750 1,950 140 280 540 525
to (MB/s)3
Random Read up to (IOPS) 3
160K 310K 410K 160K 310K 410K 370K
Random Write up to (IOPS)3 180K 330K 350K 85K 150K 350K 300K
Power (projected)
Average Power (W)5 3.3 3.3 3.5 3.5 3.5 3.5 3.9
Peak Power (W)6 5.5 5.5 5.5 5.5 5.5 5.5 5.5
Reliability
Endurance (TBW)7 (projected) 6,000 12,000 24,000 650 1,300 2,600 5,200
Mean Time To Failure (MTTF)8
3,000,000
(Hours) (projected)
Unrecoverable Bit Error Rate (UBER) 1 error per 1016 bits read
Data Retention (EOL) 1 year at +55°C
Environmental
Operating Temperature9 -40°C to +85°C
Non-Operating Temperature -40°C to +95°C
Operating Vibration 20GRMS, 7 to 2,000Hz, 30min/axis on 3 axes
Shock 1,500G, 0.5ms Half Sine pulse duration
Altitude -1500ft (-457m) to 40,000ft (12,192m)
Certifications FCC, CE, UL, TUV, BSMI, KCC, RCM, Morocco, VCCI and CAN ICES-3(B)/NMB-3(B)

Advanced Features
Functional Reliability Flash management Security
• DRAMless architecture with Host • End-to-end data path protection. • Dynamic and static wear-leveling, • TCG Pyrite security support for
Memory Buffer (HMB) support. • 3-gear LDPC engine with advanced bad block management and password protection (ATA-like).
• nCache 3.0 SLC tiered DSP capabilities in hardware. background garbage collection. • Secure Boot including RSA
caching technology. • NAND XOR protection for authentication and secure field
multi-page recovery. firmware upgrade.
• Automatic Data Refresh.
• NVMe S.M.A.R.T.

Physical Dimensions
Weight typical (gr) 2230: 3.2 ± 0.5 / 2280: 7.5 ± 1.0 2280: 7.5 ± 1.0
Width (mm)10 2230: 22 ± 0.15 / 2280: 22 ± 0.15 2280: 22 ± 0.15
Length (mm)10 2230: 30 ± 0.15 / 2280: 80 ± 0.15 2280: 80 ± 0.15
Thickness maximum (mm)10 2.38

Ordering Information 85GB 170GB 340GB 256GB 512GB 1TB 2TB

M.2 2230-S3-M SDBPTPZ-085G-XI SDBPTPZ-170G-XI SDBPTPZ-340G-XI SDBPTPZ-256G-XI SDBPTPZ-512G-XI SDBPTPZ-1T00-XI N/A
M.2 2280-S3-M SDBPNPZ-085G-XI SDBPNPZ-170G-XI SDBPNPZ-340G-XI SDBPNPZ-256G-XI SDBPNPZ-512G-XI SDBPNPZ-1T00-XI SDBPNPZ-2T00-XI

PCI Express 3.0 up to four lanes, and a bit rate of 2.5Gbps or 5Gbps or 8Gbps. Configurable lane width:
1 5
Average maximum power is measured while the SSD is continuously processing sequential read and write
x1, x2 and x4. NVM Express version 1.4 commands for at least 10 seconds, with a transfer size of 128KB per command, QD= 32 and 1 thread. Sampling
2
The capacities are based on IDEMA Standard LBA 1–03. One megabyte is equal to one billion bytes, one interval is 1 second. Measured at 25°C and can vary due to input voltage and ambient temperature variation.
gigabyte (GB) is equal to one billion bytes and one terabyte (TB) is equal to one trillion bytes. Actual user 6
Peak power is the maximum instantaneous power consumption measured while the SSD is continuously
capacity may be less due to operating environment. 2TB is supported by M.2 2280 form factor only. processing commands for at least 10 seconds, with a transfer size of 128KB per command, QD=32 and
Test Conditions: burst performance is measured by CrystalDiskMark 6.0.0, using 1000MB LBA range as
3  1 thread. The sampling interval is 10μs. Measured at 25°C and can vary due to input voltage and ambient
a secondary drive in desktop with Intel® Core™ i7 7700 CPU, 8GB RAM. OS: Windows 10 Pro 64-bit 20H1 temperature variation.
19041.208 with Microsoft StorNVMe driver. Sequential read performance refers for both burst and sustained 7
TBW = Terabytes Written. Projected endurance is calculated based on sustained sequential write operation
specifications. without frequent idle.
4
Test Conditions: sustained sequential performance is measured by FIO 1.97, using 100% LBA range as a 8
Based on Western Digital’s internal calculation, using a prediction methodology in accordance with
secondary drive in Dell Precision 7820, with Intel® Xeon® Silver 4208 CPU, 16GB RAM. OS: Cent OS 8, Kernel the Telcordia Special Report SR-332. The prediction is based on a Parts Stress Analysis, performed at a
4.18.0–193.6.3.el8_2.x86_64. temperature of 40°C in a GB (ground, benign) environment with duty cycle of 12 hours per day.
9
Operational temperature is defined such as -40°C refers to ambient temperature. +85°C refers to NAND
BGA case temperature. When SMART composite temperature reported by the drive exceeds 85°C, thermal
throttling will be initiated.
The form factor complies with PCI Express M.2 Specification, rev. 4.0. Components Z height above PCB
10 

<=1.5mm (S3).

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October 2023