DAYANAND SAGAR COLLEGE OF ENGINEERING
(. An autonomous institute affiliated to VTU, Belagavi.) S. M. Hills. Kumaraswamy Layout, Bengaluru-560078
Department of Biotechnology
Course title:Biochemical Thermodynamics and Heat transfer.
Course Code: 22BT43
Optimization of Cooling Fins for Benchtop Bioanalytical
Instruments: Efficient heat dissipation systems for
temperature-sensitive laboratory equipment.
Group members:
Course Co- Abigail A Christopher (1DS23BT001)
Dr. Amit R ( 1DS23BT005)
di Priya S Praveen Arathi A. ( 1DS23BT011)
K S SUBHADRA DEVI. (1DS23BT022)
INTRODUCTION
Benchtop analytical instruments are widely used in laboratories and generate
heat due to continuous operation.
Overheating can lead to:
Reduced accuracy of results.
Decreased lifespan of components.
Efficient thermal management is essential for reliable and long-term
performance.
Passive cooling methods, such as optimized cooling fins, offer an effective
solution.
THERMODYNAMICS AND HEAT TRANSFER PRINCIPLES :
First Law of Thermodynamics: Energy conservation; heat generated must equal heat
dissipated.
Second Law of Thermodynamics: Heat flows naturally from hotter to cooler regions
Modes of Heat Transfer:
Conduction: Heat transfer within solids (e.g., from device to fins).
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Convection: Heat transfer from the fin surface to the surrounding air.
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Radiation: Transfer of heat via electromagnetic waves (minimal effect).
Thermal Resistance (‘R’):
Formula:
Lower thermal resistance indicates better heat dissipation.
COOLING FIN DESIGN
Material Selection:
Aluminum is chosen for its:
High thermal conductivity ( )
Lightweight and cost-effectiveness.
Geometry:
Circular pin fins:
Maximized surface area for heat transfer.
Optimal spacing to allow airflow.
Passive Cooling Benefits:
No additional energy consumption.
Quiet and maintenance-free operation.
METHODOLOGY
Simulation Software: ANSYS Fluent used for Computational Fluid
Dynamics (CFD).
Boundary Conditions:
Steady-state, natural convection setup.
Ambient temperature: .
Optimization Technique: TOPSIS (Technique for Order of Preference by
Similarity to Ideal Solution):
Evaluates designs based on thermal resistance and pressure drop.
Key Variables Studied:
Fin height and spacing.
Surface temperature distribution.
RESULT
Thermal Performance:
Optimized fin configuration resulted in a 20% reduction
in maximum surface temperature.
Uniform heat flux distribution minimized hotspots.
Thermal Resistance:
Achieved low resistance of .
Convective Heat Transfer:
Improved airflow around fins for effective cooling.
DATA VISUALIZTION
Figure 1: Heat Flux Figure 2: Cooling Fins Graph: Temperature vs. Fin
Distribution Arrangement Spacing.
CONCLUSION
The study concludes that integrating aluminum cooling fins significantly improves
thermal management in benchtop analytical instruments.
Improved heat dissipation leads to better instrument performance, reliability, and
longer lifespan.
FEM simulations using ANSYS provide a reliable, accurate method for thermal
design and optimization.
Passive cooling using fins is an effective, low-cost alternative to active cooling
methods in laboratory settings.
REFERENCES
Altaf, S. M., & Nagoorvali, S. (2015). Optimization of Circular Pin Fin Heat Sink for Electronic
Cooling Using CFD and TOPSIS Method. IJEIT, 5(4), 79–83. Retrieved from
https://www.ijeit.com/Vol%205/Issue%204/IJEIT1412201510_17.pdf
Kang, T., Ye, Y., Jia, Y., Kong, Y., & Jiao, B. (2020). Enhanced Thermal Management of GaN
Power Amplifier Electronics with Micro-Pin Fin Heat Sinks. Electronics, 9(11), 1778. Retrieved
from https://doi.org/10.3390/electronics9111778
Lee, Y. J., & Kim, S. J. (2021). Thermal Optimization of the Pin-Fin Heat Sink with Variable Fin
Density Cooled by Natural Convection. Applied Thermal Engineering, 190, 116692.
Retrieved from https://doi.org/10.1016/j.applthermaleng.2021.116692
THANK
YOU
