Placement and Routing
Placement and Routing
1
RTL design flow
HDL
RTL manual
Synthesis design
netlist a
b
0
1
d
q
Library/ s clk
module Logic
generators optimization
a 0 d
netlist b 1
q
s clk
physical
design
layout
Floorplanning
Placement
Improvement
Cost Estimation
Routing Region
Definition
Global Routing
Improvement
Cost Estimation
Detailed Routing
Improvement
Cost Estimation
Compaction/clean-up
* Sherwani 92
6.375 Spring 2007 L14 5
Partitioning example*
* Sherwani 92
* Sherwani 92
6.375 Spring 2007 L14 9
Partitioning methods
Top-down partitioning
Iterative improvement
Spectral based
Clustering methods
Network flow based
Analytical based
Multi-level
Bottom-up clustering
Unit delay model
General delay model
Sequential circuits with retiming
Floorplanning
Placement
Improvement
Cost Estimation
Routing Region
Definition
Global Routing
Improvement
Cost Estimation
Detailed Routing
Improvement
Cost Estimation
Compaction/clean-up
Floorplanning
Placement
Improvement
Cost Estimation
Routing Region
Definition
Global Routing
Improvement
Cost Estimation
Detailed Routing
Improvement
Cost Estimation
Compaction/clean-up
* Sherwani 92
6.375 Spring 2007 L14 22
Placement using simulated annealing
Use initial placement results e.g. random
placement
Two stage process*
Stage 1
Modules moved between different rows and same row
Module overlaps allowed
Stage two begins when temperature falls below a certain
value
Stage 2
Module overlaps removed
Annealing continued, but interchange adjacent modules
in the same row
* Sechen DAC86
6.375 Spring 2007 L14 23
Placement methods
Constructive methods
Cluster growth algorithm
Force-directed method
Algorithm by Goto
Min-cut based algorithm
Iterative improvement methods
Pairwise exchange
Simulated annealing Timberwolf
Genetic algorithm
Analytical methods
Gordian, Gordian-L
Floorplanning
Placement
Improvement
Cost Estimation
Routing Region
Definition
Global Routing
Improvement
Cost Estimation
Detailed Routing
Improvement
Cost Estimation
Compaction/clean-up
* Sherwani 92
6.375 Spring 2007 L14 36
Clock distribution - Encounter
Kaveh Shakeri
Noise in power supply
IR drop (static)
L di/dt (transient)
Electromigration
Solution: decoupling capacitance, wire
material