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11.00 dhr Lauwers

This document discusses micro-machining of ceramic components. It provides an overview of machining technologies for ceramics including electrical discharge machining, laser machining, water jet machining, and milling. It also describes the University of Leuven's activities in developing new ceramic materials and machining processes for ceramics. Examples of micro-machined ceramic components are given for different materials and processes.

Micro- en precisiebewerkingen Leuven, 10 Oktober 2010 Microbewerken van KeramiekMicrobewerken van Keramiek Micro Machining of Ceramic ComponentsComponents Prof Dr Ir B Lauwers K U LeuvenProf. Dr. Ir. B. Lauwers, K.U.Leuven bert.lauwers@mech.kuleuven.be
Introduction: ceramic materials ? • Ceramic materialCeramic material – is a inorganic, non-metallic solid prepared by the action of heat and subsequent cooling; – may have a crystalline or partly crystalline structure, or may be amorphous (e.g., a glass). • Examples• Examples – Pottery – Advanced ceramics • Medical applications • Mechanical applications
Advanced Technical Ceramics • Excellent propertiesExcellent properties – Hardness, wear resistance, strength (compressive !) – Chemical & electrical resistivity – High temperature resistance 3
Ceramic micro components • Some applicationsSome applications – Nozzles • Accuaracy Mi h l• Microholes Selected material: based on B4C Extremely hard material [ESK ceramics Germany] – Moulds & Dies • Micro punches [ESK ceramics, Germany] • Moulds – Lenses [SMS]– .. [SMS] [MLT]
Ceramic micro components • Some applications (2)Some applications (2) – Power unit with ceramic turbine [K.U.Leuven, Belgium] • Power: up to 1KW Ø i ll 20• Ø impeller: 20mm • Inlet temperature: 1200K • Rotational speed: up to 500.000 rpm • Max. Principle stress: 500 Mpa • Selected material – Based on Si3N4
Conventional ceramics processing • ProcedureProcedure – Powder synthesis – Green body forming – Green state machining (geometrical details) – Firing of the green body Fi l hi i ( )– Final machining (accuracy) • Problems Labour intensive and costly procedures– Labour intensive and costly procedures – Volume shrinkage and deformation – Sintering skinsg – Micro scale limits Tendency to machine ceramic components 6 Tendency to machine ceramic components directly out of a ceramic block in it’s final state
This presentation… • Give an overview of technologiesGive an overview of technologies to machine ceramic (micro) components in their final state • Importance to understand the “Process-Material” i t ti Ceramic component (shape) interaction Ceramic Material M hi i (composition, microstructure) Machining Process
Overview of this presentation • Introduction to (micro) ceramic components and itsIntroduction to (micro) ceramic components and its machining • Development & machining of ceramic materialsp g (components) at K.U.Leuven • Machining technologies for ceramic components – Overview – Electrical Discharge Machining L M hi i– Laser Machining – Water Jet Machining – MillingMilling – Hybrid Process Technologies • Conclusions
K.U.Leuven’s activities • Development and characterization of new multi-Development and characterization of new multi functional ceramic materials (Material Science Department) – Focus on ceramic composites • Adding one or more phases to enhance the mechanical properties as well as machinebility – ZrO2-WC, ZrO2-TiCN,… – Wire-EDM of ZrO2-WC faster and better surface roughness !! 2000 )11 2200 a) 4000 a) 4000 ess(kg/mm2) 1600 1800 ess(MPam1/2) 8 9 10 ength(MPa) 1400 1600 1800 2000 2000 2500 3000 trength(MPa WC/Co cermets 2000 2500 3000 ZrO2-WCZrO2-WC-Al2O3 trength(MPa WC/Co cermets VickersHardne 1200 1400 acturetoughne 5 6 7 Bendingstre 800 1000 1200 1400 Hardness Toughness 500 1000 1500 ZTA Mg-PSZ Y-TZP Si3N4SiC FlexuralSt 500 1000 1500 ZTA Mg-PSZ Y-TZP Si3N4SiC FlexuralSt ZrO2-TiN-Al2O3 WC content (vol %) 0 10 20 30 40 50 60 70 80 90 V 1000 Fra 4 600Strength 2 4 6 8 10 12 14 0 500 Mg-PSZ AlNAl2O3 Fracture Toughness (MPa m1/2 ) 2 4 6 8 10 12 14 0 500 Mg-PSZ AlNAl2O3 Fracture Toughness (MPa m1/2 ) ZrO2-TiCN-Al2O3 ZrO2-TiN-Al2O3
K.U.Leuven’s activities • Machining of various ceramicMachining of various ceramic materials (in hard state) – EDM • Various technologies: Wire EDM, Die Sinking EDM, Milling EDM • Micro EDM 12 Material removal rate improvement Standard system – Detailed analysis of the “process material” interaction • MRM’s (melting, spalling,..) 6 8 10 12 Removal (mm 3 /min) Standard system New system ( g, p g, ) – Development of new EDM technologies New generators 0 2 4 (mm /min) SSiC B4C B4C- ZrO2-TiN • New generators • New strategies – Machining of low conductive ceramics by combining milling SSiC B4C B4C TiB2 ZrO2 TiN Ceramic ceramics by combining milling EDM & die sinking EDM
K.U.Leuven’s activities • Machining of various ceramic materialsMachining of various ceramic materials (in hard state) – Vibration Assisted Grinding (UAG) B4C • Material removal mechanisms • Process modeling • Machining strategies SSiC
K.U.Leuven’s activities • Machining of various ceramic materials (in hard state)g ( ) – Vibration assisted turning (UAT) – ELID grindingg g – Downscaling to micro machining processes • Selective Laser Sintering of Ceramic Materials
Overview of this presentation • Introduction to (micro) ceramic components and itsIntroduction to (micro) ceramic components and its machining • Development & machining of ceramic materialsp g (components) at K.U.Leuven • Machining technologies for ceramic components – Overview – Electrical Discharge Machining L M hi i– Laser Machining – Water Jet Machining – MillingMilling – Hybrid Process Technologies • Conclusions
Machining technologies • Overview of possible methodsOverview of possible methods Source: Anoop N. Samant, Narendra B. Dahotre, Laser machining of structural ceramics - A review, Journal of the European Ceramic Society 29 (2009) 969–993
Micro-EDM of ceramics • Material should be electricallyMaterial should be electrically conductive – Guideline value: ρ < 100 Ω·cm – For non-conductive ceramics • Additional of conductive secondary metallic phase, such as:p – TiB2, TiN, or TiC • Increased hardness and strength • Toughness remains however modestg – Available commercial electro- conductive ceramics • Commercially: Si N TiN SiSiC• Commercially: Si3N4-TiN, SiSiC, TiB2, B4C… • Lab-scale: Al2O3-TiN, ZrO2-TiN, Si3N4-TiB2, ZrO2-WC…Si3N4 TiB2, ZrO2 WC…
Micro-EDM of ceramics • Material Removal MechanismsMaterial Removal Mechanisms – Different kinds • Melting (like in metal) S lli & th l h k• Spalling & thermal shock • Chemical reactions – Different MRM’s can occur at the same time, but the most dominant one is largely influenced by the material properties (composition, grain size,..) and the generator parameters   ZrO2-TiN - Spalling Si3N4-TiN – Chem. reactionZrO2-TiCN - Melting
Micro-EDM of ceramics • Si3N4-TiN was selected for theSi3N4 TiN was selected for the turbine component • MRM is largely influenced byg y y – Pulse duration (te) – Ratio (te/ie) Non Foamy • Micro-EDM machine ? – Low pulse energies used S i l t t i d MRM Vs. Pulse Parameter 25 30 e(A) Non-Foamy Mixture Foamy – Special strategies and generator adaptations have been developed 15 20 25 pulsecurrenti 5 10 Dischargep 0 0 0.5 1 1.5 2 2.5 3 3.5 4 Discharge pulse duration te (µs)
Micro-EDM of ceramics • Micro EDM milling of ∅20 mm turbineturbine – Machine: Sarix – WC rod electrode – Layer-by-layer milling (3 ~ 8 µm) • Properties: – No electrode pre-shape required – Slow EDMing: 20 hours/cavity A OK ( 2 )– Accuracy OK (< 2 µm) – Lower Ra achievable due to modified generator & stratgeyg g y
Alternative strategy using die sinking EDM • Roughing using relaxationRoughing using relaxation pulse types – High material removal rate for relaxation pulses, combined with low TWR – S-EDM fastest !S EDM fastest ! • Finishing using iso-energetic pulse types (only possible withp yp ( y p S-EDM) – Gives smooth surfaces (and with t bl MRR)acceptable MRR) 19
Micro-EDM of ceramics • ZrO2-TiN Ra 0.23 μm ZrO2 TiN – MRM • Melting as MRM – Application: spiral trust bearing surface 6mm Ø, 15 μm depthApplication: spiral trust bearing surface 6mm Ø, 15 μm depth • Layer by layer strategy → 0.5 μm depth of cut, 150 μm WC rod tool • Machining time ~40 min • Depth accuracy within 2 μmDepth accuracy within 2 μm 1mm
Micro-EDM of ceramics • Al3O2-TiCN Pa 0.24 μm Al3O2 TiCN – MRM • Melting as MRM, but also cracks & break off of particles even at low pulse energyoff of particles even at low pulse energy – Applications • Extrusion die 3 mm Ø Stategy Pocketing rough → 5 mm cutting depth, 200 mm WC rod tool Wall finishing → 0.5 mm cutting depth, 150 mm WC rod tool Machining time ~ 1h 15 min • Gear mould: 1 mm Ø Machining time 1h 15 min Strategy: Pocketing rough → 1 mm cutting depth, 200 mm WC rod tool Pocketing floor finishing → 0.5 mm cutting depth, 200 mm WC tool Wall finishing → 0.5 mm cutting depth, 110 mm WC rod tool Machining time ~ 2 h
Micro-EDM of ceramics • Si/SiC and SSiCSi/SiC and SSiC – MRM’s & process behaviour • Spalling at high energy M lti d ti i d i t h i d d• Melting and evaporation is dominant when energy is reduced • Si/SiC: higher electrical conductivity – Higher MRR, Higher Ra – For SSiC: higher voltage drop Lower speed – Applications Micro machining examples of SSiCMicro machining examples of SSiC 200 µm 20 µm 20 µm Micro EDM drilling: Material removal mechanisms of SSiC (left) and Si/SiC (right) at same energy input level Ø 0.5 mm hemisphere by micro-EDM milling Roughing tool Ø 0.18 mm, 3 µm cutting depth Finishing tool Ø 0.05 mm; 2 µm cutting depth 25 µm thin wall: Aspect ratio 25 No deformation of geometry observed Micro-EDM drilling: Ø 65 µm, Aspect ratio 20 Min. Ø 30 µm, fair accuracy and surface integrity
Laser Machining • Impact of the laser light on theImpact of the laser light on the ceramic material • Wave length & pulse durationg p – Short pulses and short wave lengths often give the best results Better absorption• Better absorption • Removal by ablation, evaporization • Excimer, Tripled Nd-YAG L l ( )– Longer pulses (μs, ms) can give melting resulting in a glassified layer micro cracks & HAZ Source:. Meijerl, J., et al. Laser Machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons
Laser Machining • ApplicationsApplications – Laser drilling Array of 40 μm diameter holes drilled in 250 μm thickArray of 40-μm-diameter holes drilled in 250-μm-thick alumina on a 60-μm-pitch using a CVL at 3 W with a 10- kHz pulse frequency and 6-s drill time – Laser milling / drilling Example of drilling, cutting and milling of alumina, using CVL M. R. H. Knowles & G. Rutterford & D. Karnakis & A. Ferguson, Micro-machining of metals, ceramics and polymers using nanosecond lasers, Int J Adv Manuf Technol (2007) 33:95–102
Laser machining • ApplicationsApplications – Laser structuring/milling Micro-structure generated in ceramic Si3N4 by ArF- • Influence of the energy density – 1,2J/cm2 g 3 4 y laser (5,3J/cm2) and pulse rate (3Hz) [1] 1,2J/cm – Laser structuring (surface modification) Micro-roughening of silicon carbide with KrF excimer laser for n (# pulses): 150, 300, 500 & energy density 1,6J/cm2 [2] [1] Source: J. Heitz, J.D. Pedarnig, D. Bäuerle, G. Petzow, Excimer-laser ablation and micro-patterning of ceramic Si3N4, Appl. Phys. A 65, 259–261 (1997) [2] Source: H.K. Tonshoff , H. Kappel, Surface Modification of Ceramics by Laser Machining, LZH, Hannover, Germany
Laser Machining • Other examplesOther examples 0.25 mm thick sapphire gear wheel used inpp g a fluid sensor made by multi passes 355 nm laser pulses for high precision and no microcracking. (LZH) [1][ Laser milling of a micro-part (Al2O3 and Si3N4) by Nd:YAG mm laser [2] 6m Source:. [1] Meijerl, J., et al. Laser Machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons [2] D.T. Pham, S.S. Dimov, P.V. Petkov, Laser milling of ceramic components, Int. J. of Machine Tools & Manufacture 47 (2007) 618–626 2.9mm
Water Jet Machining • ApplicationsApplications – Micro holes • E.g. Al2O3 plates thi k 635– thickness: 635μm 9mm/s 18 mm/s mm/s – Contouring Silicon wafer (525μm) Source: Thorbjörn Åklinta, Per Johandera, Klas Brinkfeldta Christian, Öjmertzb,Tony Rydb, Abrasive Waterjet Cutting for Micro Manufacturing Sapphire (500μm) Al2O3 (525μm)
Cutting/milling • Ceramic materials can beCeramic materials can be machined in ductile mode – Negative rake angle gives compressive stresses resulting in plastic deformation • Applications limited – Milling of WC-moulds [1]g [ ] PCD t l ∅2 k 20° [1] Source: H. Suzuki, T. Moriwaki, Y. Yamamoto , Y. Goto, Precision Cutting of Aspherical Ceramic Molds with Micro PCD Milling Tool, CIRP Vol. 56/1/2007 WC-mold for glass moulding PCD tool, ∅2mm, rake: -20°
Milling of ceramics at K.U.Leuven • Material: ZrO2Material: ZrO2 • Diamond coated tools (1 ∅mm) • Spindle rpm: 38000t/minSpindle rpm: 38000t/min – Cutting speed: ~ 120 m/min • Various cutting conditions has been tested – Lowest obtained surface roughness: 0,025 μm Ra
Hybrid process Technologies • Possible definition: “A combination of active process principles / energies having a large influence on theprinciples / energies having a large influence on the process characteristics • Addition of a an active le Addition of a an active principle – To increase the eprincipl Processes with additional energy Strategy 1 St t 2 machinability of the material (Strategy 1) • Ex. Laser Assisted icalactive Strategy 1 Strategy 2 Turning – To change/add a material removal Phys Technological Limitation material removal principle (Strategy 2) • Ex. EDM Grinding Conventional processes Machinability Source: Bachmann, F. et. al.
Hybrid Process Technologies • Laser assisted cutting (turning/milling)g ( g g) – E.g. for milling of Si3N4 How does it work Source: Rutgers – How does it work • At higher temperatures, the viscosity of the glassy grain-boundary phase decreases resulting in a chip formation by viscoplastic deformation. Above 1400°C, it is reasonable to believe that the glassy phase has become soft g g y p enough so that Si3N4 grains can slide and rotate with ease under the advancement of the cutting tool – Implementation certainly limited !
Hybrid Process Technologies • Vibration assisted cuttingVibration assisted cutting – A vibration (A 1…15µm, f: 10…80kHz) is added to the tool t ( k i )movement (or workpiece) – Today mostly used for the efficient machining of micro-holesg – Advantages: lower forces, higher tool life Microholes consecutively drilled with vibration using a single toolwith vibration using a single tool (tool diameter = 9 μm, penetration = 0.125 μm/s, drilling depth = 20 μm) T l bit i d b WEDGTool: obitained by WEDG Tool ∅: 9,5μm, feed: 0,05μm/s [Source:K. Egashira, K. Mizutani, Ultrasonic Vibration Drilling of Microholes in Glass
Hybrid Process Technologies • Other hybrid processesOther hybrid processes – Vibration assisted micro EDM drilling • Enhances flushing feed ↑, tool wear ↓ – Chemical assisted ultrasonicChemical assisted ultrasonic machining of glass Comparison of MRR (∅:1,5mm), left: USM, right CUSM [Source: J.P. Choi a, B.H. Jeon b, B.H. Kimc, Chemical-assisted ultrasonic machining of glass, J ournal of Materials Processing Technology 191 (2007) 153–156]
Hybrid Process Technologies • ELID-grinding (Electrolytic In process Dressing)ELID grinding (Electrolytic In process Dressing) – For precision grinding – Removal of metal binder by a electro-chemical process ! Grinding wheel Generator DC Workpiece Grinding wheel Brush contact El. coolant Set-up K.U.Leuven Prof. Ohmori, RIKEN, Japan ElectrodeElectrolytic coolant
- ELID-grinding – some results • Material: WC-Co (2 4%Co) • Material: Si3N4 Material: WC Co (2.4%Co) – Grain size: 0.2 ….0.5 μm – Hardness 2200 HV30 Material: Si3N4 – Grain size: “ultrafine” – Hardness 1530 HV30 GrindingGrinding Ra = 80nm Rz = 500 nm ELID grinding (19 m/s) ELID grinding , // Ra = 11nm, // Rz = 67 nm Grinding + (rough) polishing Ra = 35nm Rz = 240 nm // Ra = 10nm, Rz = 60 nm ⊥ Ra = 50 nm, Rz = 250 nm Small scallops ELID i di (28 / ) // Rz = 67 nm ⊥ Ra = 9nm, ⊥ Rz = 57 nm Grinding // Ra = 32nm, Rz = 233 nm ⊥ Ra = 208 nm, Rz = 1414 nm ELID grinding (28 m/s) // Parallel: Ra = 15nm, Rz = 122 nm ⊥ Ra = 130 nm, Rz = 600 nm Bigger scallops
Overview of this presentation • Introduction to (micro) ceramic components and itsIntroduction to (micro) ceramic components and its machining • Development & machining of ceramic materialsp g (components) at K.U.Leuven • Machining technologies for ceramic components – Overview – Electrical Discharge Machining L M hi i– Laser Machining – Water Jet Machining – MillingMilling – Hybrid Process Technologies • Conclusions
Conclusions • A number of technologies for the micro machining ofA number of technologies for the micro machining of ceramic components in the final state has been presented – Still a large number in R&D status but potential to be implemented Today important processes:– Today important processes: • Grinding • EDM L• Laser • The efficient implementation of these processes requires a good understanding of the “process-requires a good understanding of the process material” interaction

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11.00 dhr Lauwers

  • 1.
    Micro- en precisiebewerkingen Leuven,10 Oktober 2010 Microbewerken van KeramiekMicrobewerken van Keramiek Micro Machining of Ceramic ComponentsComponents Prof Dr Ir B Lauwers K U LeuvenProf. Dr. Ir. B. Lauwers, K.U.Leuven [email protected]
  • 2.
    Introduction: ceramic materials? • Ceramic materialCeramic material – is a inorganic, non-metallic solid prepared by the action of heat and subsequent cooling; – may have a crystalline or partly crystalline structure, or may be amorphous (e.g., a glass). • Examples• Examples – Pottery – Advanced ceramics • Medical applications • Mechanical applications
  • 3.
    Advanced Technical Ceramics •Excellent propertiesExcellent properties – Hardness, wear resistance, strength (compressive !) – Chemical & electrical resistivity – High temperature resistance 3
  • 4.
    Ceramic micro components •Some applicationsSome applications – Nozzles • Accuaracy Mi h l• Microholes Selected material: based on B4C Extremely hard material [ESK ceramics Germany] – Moulds & Dies • Micro punches [ESK ceramics, Germany] • Moulds – Lenses [SMS]– .. [SMS] [MLT]
  • 5.
    Ceramic micro components •Some applications (2)Some applications (2) – Power unit with ceramic turbine [K.U.Leuven, Belgium] • Power: up to 1KW Ø i ll 20• Ø impeller: 20mm • Inlet temperature: 1200K • Rotational speed: up to 500.000 rpm • Max. Principle stress: 500 Mpa • Selected material – Based on Si3N4
  • 6.
    Conventional ceramics processing •ProcedureProcedure – Powder synthesis – Green body forming – Green state machining (geometrical details) – Firing of the green body Fi l hi i ( )– Final machining (accuracy) • Problems Labour intensive and costly procedures– Labour intensive and costly procedures – Volume shrinkage and deformation – Sintering skinsg – Micro scale limits Tendency to machine ceramic components 6 Tendency to machine ceramic components directly out of a ceramic block in it’s final state
  • 7.
    This presentation… • Givean overview of technologiesGive an overview of technologies to machine ceramic (micro) components in their final state • Importance to understand the “Process-Material” i t ti Ceramic component (shape) interaction Ceramic Material M hi i (composition, microstructure) Machining Process
  • 8.
    Overview of thispresentation • Introduction to (micro) ceramic components and itsIntroduction to (micro) ceramic components and its machining • Development & machining of ceramic materialsp g (components) at K.U.Leuven • Machining technologies for ceramic components – Overview – Electrical Discharge Machining L M hi i– Laser Machining – Water Jet Machining – MillingMilling – Hybrid Process Technologies • Conclusions
  • 9.
    K.U.Leuven’s activities • Developmentand characterization of new multi-Development and characterization of new multi functional ceramic materials (Material Science Department) – Focus on ceramic composites • Adding one or more phases to enhance the mechanical properties as well as machinebility – ZrO2-WC, ZrO2-TiCN,… – Wire-EDM of ZrO2-WC faster and better surface roughness !! 2000 )11 2200 a) 4000 a) 4000 ess(kg/mm2) 1600 1800 ess(MPam1/2) 8 9 10 ength(MPa) 1400 1600 1800 2000 2000 2500 3000 trength(MPa WC/Co cermets 2000 2500 3000 ZrO2-WCZrO2-WC-Al2O3 trength(MPa WC/Co cermets VickersHardne 1200 1400 acturetoughne 5 6 7 Bendingstre 800 1000 1200 1400 Hardness Toughness 500 1000 1500 ZTA Mg-PSZ Y-TZP Si3N4SiC FlexuralSt 500 1000 1500 ZTA Mg-PSZ Y-TZP Si3N4SiC FlexuralSt ZrO2-TiN-Al2O3 WC content (vol %) 0 10 20 30 40 50 60 70 80 90 V 1000 Fra 4 600Strength 2 4 6 8 10 12 14 0 500 Mg-PSZ AlNAl2O3 Fracture Toughness (MPa m1/2 ) 2 4 6 8 10 12 14 0 500 Mg-PSZ AlNAl2O3 Fracture Toughness (MPa m1/2 ) ZrO2-TiCN-Al2O3 ZrO2-TiN-Al2O3
  • 10.
    K.U.Leuven’s activities • Machiningof various ceramicMachining of various ceramic materials (in hard state) – EDM • Various technologies: Wire EDM, Die Sinking EDM, Milling EDM • Micro EDM 12 Material removal rate improvement Standard system – Detailed analysis of the “process material” interaction • MRM’s (melting, spalling,..) 6 8 10 12 Removal (mm 3 /min) Standard system New system ( g, p g, ) – Development of new EDM technologies New generators 0 2 4 (mm /min) SSiC B4C B4C- ZrO2-TiN • New generators • New strategies – Machining of low conductive ceramics by combining milling SSiC B4C B4C TiB2 ZrO2 TiN Ceramic ceramics by combining milling EDM & die sinking EDM
  • 11.
    K.U.Leuven’s activities • Machiningof various ceramic materialsMachining of various ceramic materials (in hard state) – Vibration Assisted Grinding (UAG) B4C • Material removal mechanisms • Process modeling • Machining strategies SSiC
  • 12.
    K.U.Leuven’s activities • Machiningof various ceramic materials (in hard state)g ( ) – Vibration assisted turning (UAT) – ELID grindingg g – Downscaling to micro machining processes • Selective Laser Sintering of Ceramic Materials
  • 13.
    Overview of thispresentation • Introduction to (micro) ceramic components and itsIntroduction to (micro) ceramic components and its machining • Development & machining of ceramic materialsp g (components) at K.U.Leuven • Machining technologies for ceramic components – Overview – Electrical Discharge Machining L M hi i– Laser Machining – Water Jet Machining – MillingMilling – Hybrid Process Technologies • Conclusions
  • 14.
    Machining technologies • Overviewof possible methodsOverview of possible methods Source: Anoop N. Samant, Narendra B. Dahotre, Laser machining of structural ceramics - A review, Journal of the European Ceramic Society 29 (2009) 969–993
  • 15.
    Micro-EDM of ceramics •Material should be electricallyMaterial should be electrically conductive – Guideline value: ρ < 100 Ω·cm – For non-conductive ceramics • Additional of conductive secondary metallic phase, such as:p – TiB2, TiN, or TiC • Increased hardness and strength • Toughness remains however modestg – Available commercial electro- conductive ceramics • Commercially: Si N TiN SiSiC• Commercially: Si3N4-TiN, SiSiC, TiB2, B4C… • Lab-scale: Al2O3-TiN, ZrO2-TiN, Si3N4-TiB2, ZrO2-WC…Si3N4 TiB2, ZrO2 WC…
  • 16.
    Micro-EDM of ceramics •Material Removal MechanismsMaterial Removal Mechanisms – Different kinds • Melting (like in metal) S lli & th l h k• Spalling & thermal shock • Chemical reactions – Different MRM’s can occur at the same time, but the most dominant one is largely influenced by the material properties (composition, grain size,..) and the generator parameters   ZrO2-TiN - Spalling Si3N4-TiN – Chem. reactionZrO2-TiCN - Melting
  • 17.
    Micro-EDM of ceramics •Si3N4-TiN was selected for theSi3N4 TiN was selected for the turbine component • MRM is largely influenced byg y y – Pulse duration (te) – Ratio (te/ie) Non Foamy • Micro-EDM machine ? – Low pulse energies used S i l t t i d MRM Vs. Pulse Parameter 25 30 e(A) Non-Foamy Mixture Foamy – Special strategies and generator adaptations have been developed 15 20 25 pulsecurrenti 5 10 Dischargep 0 0 0.5 1 1.5 2 2.5 3 3.5 4 Discharge pulse duration te (µs)
  • 18.
    Micro-EDM of ceramics •Micro EDM milling of ∅20 mm turbineturbine – Machine: Sarix – WC rod electrode – Layer-by-layer milling (3 ~ 8 µm) • Properties: – No electrode pre-shape required – Slow EDMing: 20 hours/cavity A OK ( 2 )– Accuracy OK (< 2 µm) – Lower Ra achievable due to modified generator & stratgeyg g y
  • 19.
    Alternative strategy usingdie sinking EDM • Roughing using relaxationRoughing using relaxation pulse types – High material removal rate for relaxation pulses, combined with low TWR – S-EDM fastest !S EDM fastest ! • Finishing using iso-energetic pulse types (only possible withp yp ( y p S-EDM) – Gives smooth surfaces (and with t bl MRR)acceptable MRR) 19
  • 20.
    Micro-EDM of ceramics •ZrO2-TiN Ra 0.23 μm ZrO2 TiN – MRM • Melting as MRM – Application: spiral trust bearing surface 6mm Ø, 15 μm depthApplication: spiral trust bearing surface 6mm Ø, 15 μm depth • Layer by layer strategy → 0.5 μm depth of cut, 150 μm WC rod tool • Machining time ~40 min • Depth accuracy within 2 μmDepth accuracy within 2 μm 1mm
  • 21.
    Micro-EDM of ceramics •Al3O2-TiCN Pa 0.24 μm Al3O2 TiCN – MRM • Melting as MRM, but also cracks & break off of particles even at low pulse energyoff of particles even at low pulse energy – Applications • Extrusion die 3 mm Ø Stategy Pocketing rough → 5 mm cutting depth, 200 mm WC rod tool Wall finishing → 0.5 mm cutting depth, 150 mm WC rod tool Machining time ~ 1h 15 min • Gear mould: 1 mm Ø Machining time 1h 15 min Strategy: Pocketing rough → 1 mm cutting depth, 200 mm WC rod tool Pocketing floor finishing → 0.5 mm cutting depth, 200 mm WC tool Wall finishing → 0.5 mm cutting depth, 110 mm WC rod tool Machining time ~ 2 h
  • 22.
    Micro-EDM of ceramics •Si/SiC and SSiCSi/SiC and SSiC – MRM’s & process behaviour • Spalling at high energy M lti d ti i d i t h i d d• Melting and evaporation is dominant when energy is reduced • Si/SiC: higher electrical conductivity – Higher MRR, Higher Ra – For SSiC: higher voltage drop Lower speed – Applications Micro machining examples of SSiCMicro machining examples of SSiC 200 µm 20 µm 20 µm Micro EDM drilling: Material removal mechanisms of SSiC (left) and Si/SiC (right) at same energy input level Ø 0.5 mm hemisphere by micro-EDM milling Roughing tool Ø 0.18 mm, 3 µm cutting depth Finishing tool Ø 0.05 mm; 2 µm cutting depth 25 µm thin wall: Aspect ratio 25 No deformation of geometry observed Micro-EDM drilling: Ø 65 µm, Aspect ratio 20 Min. Ø 30 µm, fair accuracy and surface integrity
  • 23.
    Laser Machining • Impactof the laser light on theImpact of the laser light on the ceramic material • Wave length & pulse durationg p – Short pulses and short wave lengths often give the best results Better absorption• Better absorption • Removal by ablation, evaporization • Excimer, Tripled Nd-YAG L l ( )– Longer pulses (μs, ms) can give melting resulting in a glassified layer micro cracks & HAZ Source:. Meijerl, J., et al. Laser Machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons
  • 24.
    Laser Machining • ApplicationsApplications –Laser drilling Array of 40 μm diameter holes drilled in 250 μm thickArray of 40-μm-diameter holes drilled in 250-μm-thick alumina on a 60-μm-pitch using a CVL at 3 W with a 10- kHz pulse frequency and 6-s drill time – Laser milling / drilling Example of drilling, cutting and milling of alumina, using CVL M. R. H. Knowles & G. Rutterford & D. Karnakis & A. Ferguson, Micro-machining of metals, ceramics and polymers using nanosecond lasers, Int J Adv Manuf Technol (2007) 33:95–102
  • 25.
    Laser machining • ApplicationsApplications –Laser structuring/milling Micro-structure generated in ceramic Si3N4 by ArF- • Influence of the energy density – 1,2J/cm2 g 3 4 y laser (5,3J/cm2) and pulse rate (3Hz) [1] 1,2J/cm – Laser structuring (surface modification) Micro-roughening of silicon carbide with KrF excimer laser for n (# pulses): 150, 300, 500 & energy density 1,6J/cm2 [2] [1] Source: J. Heitz, J.D. Pedarnig, D. Bäuerle, G. Petzow, Excimer-laser ablation and micro-patterning of ceramic Si3N4, Appl. Phys. A 65, 259–261 (1997) [2] Source: H.K. Tonshoff , H. Kappel, Surface Modification of Ceramics by Laser Machining, LZH, Hannover, Germany
  • 26.
    Laser Machining • OtherexamplesOther examples 0.25 mm thick sapphire gear wheel used inpp g a fluid sensor made by multi passes 355 nm laser pulses for high precision and no microcracking. (LZH) [1][ Laser milling of a micro-part (Al2O3 and Si3N4) by Nd:YAG mm laser [2] 6m Source:. [1] Meijerl, J., et al. Laser Machining by short and ultrashort pulses, state of the art and new opportunities in the age of the photons [2] D.T. Pham, S.S. Dimov, P.V. Petkov, Laser milling of ceramic components, Int. J. of Machine Tools & Manufacture 47 (2007) 618–626 2.9mm
  • 27.
    Water Jet Machining •ApplicationsApplications – Micro holes • E.g. Al2O3 plates thi k 635– thickness: 635μm 9mm/s 18 mm/s mm/s – Contouring Silicon wafer (525μm) Source: Thorbjörn Åklinta, Per Johandera, Klas Brinkfeldta Christian, Öjmertzb,Tony Rydb, Abrasive Waterjet Cutting for Micro Manufacturing Sapphire (500μm) Al2O3 (525μm)
  • 28.
    Cutting/milling • Ceramic materialscan beCeramic materials can be machined in ductile mode – Negative rake angle gives compressive stresses resulting in plastic deformation • Applications limited – Milling of WC-moulds [1]g [ ] PCD t l ∅2 k 20° [1] Source: H. Suzuki, T. Moriwaki, Y. Yamamoto , Y. Goto, Precision Cutting of Aspherical Ceramic Molds with Micro PCD Milling Tool, CIRP Vol. 56/1/2007 WC-mold for glass moulding PCD tool, ∅2mm, rake: -20°
  • 29.
    Milling of ceramicsat K.U.Leuven • Material: ZrO2Material: ZrO2 • Diamond coated tools (1 ∅mm) • Spindle rpm: 38000t/minSpindle rpm: 38000t/min – Cutting speed: ~ 120 m/min • Various cutting conditions has been tested – Lowest obtained surface roughness: 0,025 μm Ra
  • 30.
    Hybrid process Technologies •Possible definition: “A combination of active process principles / energies having a large influence on theprinciples / energies having a large influence on the process characteristics • Addition of a an active le Addition of a an active principle – To increase the eprincipl Processes with additional energy Strategy 1 St t 2 machinability of the material (Strategy 1) • Ex. Laser Assisted icalactive Strategy 1 Strategy 2 Turning – To change/add a material removal Phys Technological Limitation material removal principle (Strategy 2) • Ex. EDM Grinding Conventional processes Machinability Source: Bachmann, F. et. al.
  • 31.
    Hybrid Process Technologies •Laser assisted cutting (turning/milling)g ( g g) – E.g. for milling of Si3N4 How does it work Source: Rutgers – How does it work • At higher temperatures, the viscosity of the glassy grain-boundary phase decreases resulting in a chip formation by viscoplastic deformation. Above 1400°C, it is reasonable to believe that the glassy phase has become soft g g y p enough so that Si3N4 grains can slide and rotate with ease under the advancement of the cutting tool – Implementation certainly limited !
  • 32.
    Hybrid Process Technologies •Vibration assisted cuttingVibration assisted cutting – A vibration (A 1…15µm, f: 10…80kHz) is added to the tool t ( k i )movement (or workpiece) – Today mostly used for the efficient machining of micro-holesg – Advantages: lower forces, higher tool life Microholes consecutively drilled with vibration using a single toolwith vibration using a single tool (tool diameter = 9 μm, penetration = 0.125 μm/s, drilling depth = 20 μm) T l bit i d b WEDGTool: obitained by WEDG Tool ∅: 9,5μm, feed: 0,05μm/s [Source:K. Egashira, K. Mizutani, Ultrasonic Vibration Drilling of Microholes in Glass
  • 33.
    Hybrid Process Technologies •Other hybrid processesOther hybrid processes – Vibration assisted micro EDM drilling • Enhances flushing feed ↑, tool wear ↓ – Chemical assisted ultrasonicChemical assisted ultrasonic machining of glass Comparison of MRR (∅:1,5mm), left: USM, right CUSM [Source: J.P. Choi a, B.H. Jeon b, B.H. Kimc, Chemical-assisted ultrasonic machining of glass, J ournal of Materials Processing Technology 191 (2007) 153–156]
  • 34.
    Hybrid Process Technologies •ELID-grinding (Electrolytic In process Dressing)ELID grinding (Electrolytic In process Dressing) – For precision grinding – Removal of metal binder by a electro-chemical process ! Grinding wheel Generator DC Workpiece Grinding wheel Brush contact El. coolant Set-up K.U.Leuven Prof. Ohmori, RIKEN, Japan ElectrodeElectrolytic coolant
  • 35.
    - ELID-grinding –some results • Material: WC-Co (2 4%Co) • Material: Si3N4 Material: WC Co (2.4%Co) – Grain size: 0.2 ….0.5 μm – Hardness 2200 HV30 Material: Si3N4 – Grain size: “ultrafine” – Hardness 1530 HV30 GrindingGrinding Ra = 80nm Rz = 500 nm ELID grinding (19 m/s) ELID grinding , // Ra = 11nm, // Rz = 67 nm Grinding + (rough) polishing Ra = 35nm Rz = 240 nm // Ra = 10nm, Rz = 60 nm ⊥ Ra = 50 nm, Rz = 250 nm Small scallops ELID i di (28 / ) // Rz = 67 nm ⊥ Ra = 9nm, ⊥ Rz = 57 nm Grinding // Ra = 32nm, Rz = 233 nm ⊥ Ra = 208 nm, Rz = 1414 nm ELID grinding (28 m/s) // Parallel: Ra = 15nm, Rz = 122 nm ⊥ Ra = 130 nm, Rz = 600 nm Bigger scallops
  • 36.
    Overview of thispresentation • Introduction to (micro) ceramic components and itsIntroduction to (micro) ceramic components and its machining • Development & machining of ceramic materialsp g (components) at K.U.Leuven • Machining technologies for ceramic components – Overview – Electrical Discharge Machining L M hi i– Laser Machining – Water Jet Machining – MillingMilling – Hybrid Process Technologies • Conclusions
  • 37.
    Conclusions • A numberof technologies for the micro machining ofA number of technologies for the micro machining of ceramic components in the final state has been presented – Still a large number in R&D status but potential to be implemented Today important processes:– Today important processes: • Grinding • EDM L• Laser • The efficient implementation of these processes requires a good understanding of the “process-requires a good understanding of the process material” interaction