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Innodisk Selection Guide (2019 Edition)

Innodisk is a provider of flash memory, DRAM modules, and embedded peripherals for industrial applications. They have a wide range of products including SSDs, DRAM modules, M.2 storage solutions, and PoE expansion cards. Their products are designed for reliability in harsh industrial environments with features like wide temperature tolerance, data protection, and anti-sulfuration.

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1Product specifications are subject to change without prior notice. 2019 Edition Innodisk Selection Guide Flash Storage, DRAM Modules and Embedded Peripherals
3Product specifications are subject to change without prior notice. Innodisk is a service-driven provider of flash memory, DRAM modules, embedded peripherals and software solutions for industrial and enterprise applications. With satisfied customers across the embedded, server, in-vehicle, cloud storage markets and more, we have set ourselves apart with a commitment to dependable products and unparalleled service. This has resulted in solutions designed to supplement existing industrial solutions and high IOPS flash arrays for industrial and enterprise applications. The expanded business lines are leading our next steps in being a comprehensive solution and service provider in the industrial storage industry. Founded in 2005 and headquartered in Taipei, Taiwan, Innodisk services clients globally with engineering experts and sales teams in China, Europe, Japan, and the United States. With abundant experience and an unrivaled knowledge of the memory industry, Innodisk develops products with excellent quality, remarkable performance and the highest reliability. For more information about Innodisk, please visit http://www.innodisk.com. Our Advantages ABOUT US Technical Aptitude by Design We Are in It Together Deeply Rooted in the Market Our advantage lies in our portfolio of hardware, software and firmware technology and how we arrange these basic building blocks into new works of innovation. To reach the optimal solution, working together with our partner from day one is paramount. The best possible outcome can be managed by developing solutions jointly. The awareness of the pit falls and opportunities of vertical markets allow us to view the full picture when crafting the optimal solution.
4 ComprehensiveMemory,Storage,andCommunicationSolutionsfortheSurveillanceSector SurveillanceintheAIoTEra Application Theroleofsurveillanceandvideorecordingispoisedtoplayamajorroleinthefuturemarketsof whereAIandIoTmeet.AIrequiresmorecomputationalpower,whichputsabiggertollontheIoT device.AddingontheenvironmentalchallengesofIoTapplications,therequirementscanbedifficult tomeet.However,withrobustandoptimizedcomponents,thesechallengescanbemetheadon.
5Product specifications are subject to change without prior notice. Storage Optimized for Video Recording Compact Memory that Doesn’t Waver Rugged Power and Signal Transmission RECLine™istheexclusive firmwarealgorithm forvideorecording thatensuressteady performancewithoutany frame-loss. OurVeryLowProfile(VLP) andMiniDRAMmodules combinesmallformfactors withhighperformanceto makesuredatarecording goesoffwithoutahitch. Innodisk’sPoEextension cardsprovideruggedness andgalvanicisolation, ensuringuncompromised signalstrengthandpowerto yourdevices.
6 NAND Flash 3TE7 3TE7 3TE73TG6-P 3TG6-P and 3TE7 are Innodisk’s latest product lines with 3D TLC NAND Flash, and are targeted at industrial applications. The series have reliable design, self-developed firmware and MLC-like characteristics. 3TG6-P series is a performance-oriented product line, and offers high speed and high capacity; In terms of boot drive and small form factors storage, the 3TE7 is the perfect choice. Both3TG6-P&3TE7supportvariousformdesigns,including:2.5”SSD,M.2,SATADOMandmSATA. ▪ Reliability:AdvancedLDPCECCengine&internalRAIDengineofferadditionallevelofdataprotection ▪ DataIntegrity:Uniquepowermanagement&iDataGuardtoensuredataintegrityundervariousenvironmentalconditions ▪ Optimality:Extremesequentialandrandomperformancewith3DNANDsolution,noperformancedropconcern ▪ Security:256-bitAES&End-to-Enddatapathprotection* ▪ Quality:Originalindustrial-gradeNANDflashchips ▪ Manageability:iSMART&iCAPcompatibility Industrial3DTLCsolutionwithtopreliabilityandhighendurance EnteringtheEraof3DNAND Power Mgmt Thermal Sensor Cache SPI SATA Interface OCP/OVP LDPC RAID NAND CTL iCell™ Original industrial-grade NAND Flash 3D TLC 3D TLC 3D TLC 3D TLC H/W & F/W customization AES 64-layer 3D NAND Optional iCell™ HW/FW customized · LDPC · RAID Protection · 256-Bit AES Benefits Flash
7Product specifications are subject to change without prior notice. 3MV2-P InnoRECTM is Innodisk’s proprietary flash feature set designed specifically for surveillance applications. Through the smart integrationoffirmwareandhardware,thespeedandsteadyperformancerequiredbymodernsurveillancesolutionsisfullymet. RECLineTM RECLineTM is the exclusive firmware algorithm for video recording that ensures steady performancewithoutanyframe-loss iDataGuard iData Guard is our patented power cycling data management system, which helps to ensure surveillance data integrityduringandafterunexpectedpoweroutages QuickErase QuickErasecandeletealldatawithinafewseconds–preventingleakageofpotentiallysensitivedata PassiveCooling TheSSDlayoutisdesignformaximumheatdissipation–ensuringperformanceandenhanceddataretention ThermalSensor When the surveillance system threatens to overheat, an immediate warning is issued. The SSDwillautomaticallyadjustthetransmissionfrequencytoensurecontinued performanceandreliability FirmwareOptimizedfortheStrictRequirementsoftheSurveillanceIndustry InnoRECTM SurveillanceStorageSeries Flash iCell Ensures data is flushed from volatile storage to prevent the loss of valuable surveillance dataduringsuddenpowerfailures
AftertheM.2wasannouncedasthenextgenerationformfactor,therehasbeenasteadymigrationfromtheoldermPCIecards.This newformfactorisinstrumentalfornewIoTapplicationasmoreandmoreplatformsareadoptingitastheirmainport. To stay ahead of the curve, Innodisk has launched comprehensive M.2 solutions for both data storage and embedded expansions. Thiscompleteseriesincludes2230,2242,2260,and2280formfactorsthatsupportbothBandMkeyconfigurations,thusensuring compatibilitywiththenewestplatformsonthemarket. Innodisk M.2 solid state drives (SSD) are offered in a wide variety of models. The SATA III interface is a true and tested solution for standard applications, while PCIe 3.0 is the go-to for systems requiring exceptional performance. Furthermore, extensive firmware customization is also available: the M.2 SSD can be optimized for server and security environments, and it is also available with the newest3DNANDflash. Innodisk’scomprehensiveM.2storagesolutionsaretheperfectfitforthenextgenerationofIoTdevices. WideProductRange ▪ PCIeandSATASolutions ▪ SLC/iSLC/MLC/3DTLC Flexible Solutions ▪ MultipleFormFactors ▪ CompatiblewithBothBandMKey Industrial-Design ▪ WideTemperature-40~85°C ▪ HighDurability PowerLossProtection ▪ iDataGuard ▪ iCell(Optional) Type 2280Type 2260Type 2242Type 2230 8 DiverseM.2SolutionsforIndustrialandEmbeddedStorage ComprehensiveM.2solutions Flash
9Product specifications are subject to change without prior notice. The new Innodisk DDR4 2666-series introduces the industry-first 2666MT/s Registered DIMM for wide temperature industrial and embedded applications. The series boasts faster data transfer speed and increased efficiency, and is also designed for server applicationsontheIntel®Xeon®Scalableplatforms(alsoknownasPurley). 2666MT/sRDIMMReadytoTackletheHeatfromtheMostDemanding ServerEnvironments Server-ReadyDRAMDesignedforWide Temperatures DRAM Optimizationthrough Versatility All-in-One PlatformCompliance Industrial-grade •ThenewDRAMseries includebothregisteredand unbufferedmodulesboth withandwithoutECC •Availableinahostof differentformfactorsthat ensurecompatibilitywith yourplatform •Innodiskcanastheonly industrial-gradeprovider offeraWideTemperature DDR42666MT/smodule inaVLPformfactorwith bufferedmemory •Compatiblewiththe newestplatformsfrom Intel:MehlowandPurley serverandCoffeeLake •Ruggedmemorymodules withproventrack record,rigorouslytested towithstandsulfur,shock andvibration
Free-of-CostUpgrade ▪ AllInnodiskDDR4moduleswillbeupgradedwithoutanyaddedcosttoincluderobust anti-sulfurationmeasures Long-termProtection ▪DecreaseyourTCObyinvestinginmoduleswithlastingdurabilityinhostileenvironments The Innodisk Many Anti-Sulfuration DRAM modules are designed for operators that are facing increasing difficulty with high sulfur content in their surroundings. The sulfur can cause corrosion damage to DRAM modules and lead to complete module failure, and, most detrimental to the operator, costly downtime. These modules are protected against the high sulfur concentrations by a specialized design that shields the components, effectively sealing off the exposed parts of the module from the sulfur in the air. ▪ SulfurreactswithsilverusedinDRAMmodulesandcreates silversulfide(Ag2S) ▪ Thiscorrosionlowersconductivityandcanpotentiallyleadto modulefailure ▪ Sulfurationismostcommonlyencounteredinareaswith pollutionandvolcanicactivity;aswellasinthepetrochemical, miningandenergysector Whatissulfuration? 10 RobustModulesthatBringtheNeededEndurancetotheIndustrialMarket Anti-SulfurationDRAMforALLDDR4 DRAMModules DRAM
11Product specifications are subject to change without prior notice. PoE+ enables reliable connection to Powered Devices (PD) such as surveillance cameras and machine vision cameras, as well as point-of-salessystemsandvoice-over-IPequipment. These rugged expansion cards are highly compatible, and have been extensively tested at full loading with different camera types, on different platforms and operating systems. The high compatibility with machine vision cameras makes the PoE expansion cards an integralpartofqualityassurancesystemsandalsohelpspavethewayfordeeplearningapplications. Availableinspace-savingformfactorsandwithflexiblemountingoptions,theInnodiskPoEexpansioncardsareeasilyintegratedinto any Power Source Equipment (PSE). These expansion cards sports isolated, wide temperature design and is certified to withstand HiPOTandsurgeoccurrences,makingittheoptimalchoiceforoperationinharshconditions. WideCompatibility ▪ Testedandapprovedforsmalland largesizesurveillancecamerasaswell asmachinevisioncameras ▪ Compatibleacrossonawidearrayof platformsandoperatingsystems NewPoE+ExpansionCardsFurtherEnhancesPowerOutputandReliability BringingIndustrial-GradeMachineVision andSurveillancetotheForefrontt Embedded Peripherals
Cable-less Power Pin 7/ Pin8 iCell™ iSMART™ Innodisk’s patented Pin 7 and Pin 8 SATA power technologies take the cable- less concept to the next step by eliminating the need for power cables. Yielding a 100% cable-less, shock resistant, space saving plug-and- play storage solution that optimizes airflow and makes the best use of limited board space in embedded and rackmount server systems. iSMART is a powerful, easy-to-use SSD and HDD health monitoring tool. It allows system integrators to track important disk information, such as temperature, storage space, bad blocks, lifespan and firmware, all under one platform. With iSMART, system integrators can better manage disk usage and know exactly when to replace a disk before the end of its life cycle. iCell is a smart data protection technology that is built into Innodisk’s SSDs. iCell is crucial for mission-critical applications, where working under extreme conditions and without backup power is unavoidable. Our iCell technology provides a mechanism to instantaneously discharge data stored in temporary volatile DRAM buffers to flash storage, to ensure the safety of data during power failures. A Commitment to Technical Innovation Technical Innovation Innodisk continues to bring the most innovative products to a range of industries by developing outstanding proprietary tech- nologies. Here are just few examples of Innodisk’s breakthroughs and innovations.
13Product specifications are subject to change without prior notice. iSLC Stable Power Control iPower Guard™ Passive Cooling Innodisk’s stable power control is used to optimize power circuits and establish OCP/OVP mechanisms to prevent electronic components from burning out due to voltage and/or current surges. Innodisk’s Power on Protection is a new circuit protection feature that is dually designed to allow uninterrupted SSD functionality in an inconsistent power supply situation, as well as provide accelerated boot-up for emergency startups or system shutdowns. SSDs may easily lose data due to overheating. Innodisk has redesigned the cable layout by using copper to separate the controller and flash. This reduces the thermal conductivity rate and enhances data retention. iSLC is our exclusive technology designed to ensure longer-lasting and more reliable performance than conventional MLC NAND flash. Through the use of flash management algorithms, iSLC improves SSD endurance up to 20,000 cycles, increasing the lifespan to at least 7 times longer than MLC-based solutions.
Garbage Collection/TRIM iData Guard™ Thermal Sensor Innodisk’s iData Guard is a comprehensive data protection mechanism that functions before and after a sudden power outage to the SSD. Low-power detection terminates data writing before an abnormal power-off, while table-remapping after power-on deletes corrupt data and maintains data integrity. Innodisk’s iData Guard provides effective power cycling management, preventing data stored in flash from degrading with use. Innodisk’s Thermal Sensor is a robust heat and workload management technology that is built into our DRAM modules and flash storage. It is a crucial solution for industrial & aerospace and defense applications, which are often susceptible to extreme heat and performance stress. Innodisk’s Thermal Sensors help to lower the working temperature while distributing workloads, which prevents modules from overworking and overheating, and greatly enhances system performance and system stability. Innodisk’s Garbage Collection/TRIM technology is used to maintain data consistency and perform continual data cleansing on SSDs. It runs as a background process, freeing up valuable controller resources while sorting good data into available blocks, and deleting bad blocks. It also significantly reduces write operations to the drive, thereby increasing the SSD’s speed and lifespan. With Innodisk Garbage Collection/TRIM technology, an SSD’s health and performance is optimized. A Commitment to Technical Innovation Technical Innovation Innodisk continues to bring the most innovative products to a range of industries by developing outstanding proprietary tech- nologies. Here are just few examples of Innodisk’s breakthroughs and innovations.
15Product specifications are subject to change without prior notice. AES Hardware Encryption InnoRobustTM Data Security iTracker™ L3 Architecture The InnoRobust™ Data Security is comprised of Security Erase, Destroy, Physical Destroy and Quick Erase. These sophisticated technologies are aimed at quickly and efficiently erasing and destroying data that is in danger of being compromised. iTracker is Innodisk's dedicated software tool for SD 3.0 cards and USB products. It offers a customizable approach to accessing flash card SMART values. Compatibility with both Windows and Linux systems and an intuitive user interface ensures an easy system integration and user experience. Innodisk’s exclusive L³ Architecture firmware, which combines Long-Life with LDPC ECC, yields a prolonged lifespan, exceptional reliability and high performance. Innodisk’s exclusive industrial oriented firmware also provides a flexible customization service, making it perfect for a variety of industrial applications. Advanced Encryption Standard (AES) is the standard cipher used by the US government to protect confidential data on storage devices. By integrating the encryption-engine in the SSD controller, the encryption/ decryption process is done without affecting CPU performance. The encryption key is safely stored away in the SSD and can be destroyed in less than a second, rendering all stored data useless as it cannot be decrypted.
16 DRAM Solutions Conformal Coating Anti-Sulfuration Innodisk conformal coating refers to the chemical materials that are applied in layers to cover components. The thickness of the coating ranges between 0.03 mm and 0.13 mm thick. Conformal coating protects against moisture, contaminants, dust and acid-or- alkaline materials, meeting IPC-A-610 standards for electronic components. In the mining, petroleum and chemical industry, or installations in areas with volcanic activity, hydrogen sulfide gas is often a common challenge. The gas will react with the silver found in DRAM ICs, which can result in lower conductivity and eventual failure. This is effectively mitigated by covering the resistors with a sulfur resistant material, ensuring smooth operation in harsh environments. Ag Ag S
17Product specifications are subject to change without prior notice. Wide Temperature Innodisk’s wide temperature range design has extended the existing JEDEC standard range from -40°C to 85°C. Innodisk’s wide temperature Flash and DRAM modules are designed for industrial, and aerospace and defense applications. Wide temperature design is vital in ensuring operation and performance reliability in extreme temperatures. Side Fill Side Fill is value-added technology that can improve device reliability and extend product life. By applying resin on three sides of the DRAM IC, Side Fill can reinforce the joints between the BGA and the PCB. Tests show that when using Side Fill, DRAM IC can tolerate 1.5 times the amount of tension. If the device needs to remain operational during strong tremors or stringent thermal cycling, we highly recommend taking advantage of our Side Fill DRAM, especially so for these applications: factory automation, defense & aerospace and renewable energy.
18 Different Applications Embedded & Server Boot-up Solution In-Vehicle Computing SystemsSurveillance The Innodisk Boot-up series is designed for industrial and server applications. Due to its tiny form factors, M.2 and SATADOM® frees up a precious bay for other storage options. The SATADOM® easily fits in a 1U environment with an exclusive Cable-less design; it exemplifies true plug & play and eliminates messy cables. Innodisk’s Flash, DRAM and embedded peripheral products for in-vehicle computing systems are designed to operate under harsh conditions, while supporting the flexibility of the sealed system’s placement within the automobile. These reliable storage and memory solutions are heat and shock resistant and have low power consumption that can prevent vehicle challenges caused by power volatility. The number one concern for modern day surveillance applications is stable data recording. With our InnoREC™ feature set, firmware is optimized to ensure lasting and stable writing performance – ensuring zero loss of data quality. With restricted space and simultaneous read/write operations, high speed and compact memory solutions are also an imperative. Our Very Low Profile (VLP) and Mini DRAM modules combine small form factors with high performance to make sure data recording goes off without a hitch. Innodisk focuses on providing reliable memory and expansion solutions for mission-critical applications. We understand the importance of quality in industrial and embedded flash, DRAM, expansion card and software products. Therefore, our solutions are all crafted to meet the individual needs of each vertical market. Our experienced in-house firmware development team delivers fast turnaround and knowledgeable support whenever customization is required.
19Product specifications are subject to change without prior notice. New Flash Product Naming Rule G: EverGreen The EverGreen series is designed with an integrated external DRAM cache which significantly improves SSD random data transfer rate and extends lifespan. R: InnoRobust InnoRobust series meet all of today’s aerospace and defense application requirements. InnoRobust storage products are fully compliant with aerospace and defense standards, including MIL-STD-810G and MIL-I-46058C. InnoRobust products are fully protected against heat, dust, extreme temperatures, shock, vibration, and other environmental stresses. We also deliver industry- leading data protection technologies to keep sensitive information secure. E: Embedded Embedded series is the best solution for the industrial embedded system because it offers reliability, high performance and long endurance. We offer complete form factors to fulfill customer and business needs , including 2.5” SSD, 1.8” SSD, SAT.ADOM, mSATA, SATA Slim, SATADOM, iCF & CFast, EDC, and SD. V: InnoREC InnoREC SSDs are specifically designed for surveillance applications and boasts smart firmware algorithms that guarantees a continuous, stable data recording. S: Server The SATADOM® server boot-up devices are designed for an easy server integration, and reliable performance. The devices are certified for Windows Server 2016 Hyper V and VMware hypervisors. Flash Type S: SLC We offer a series of products with SLC-based flash, boasting faster write speeds, lower power consumption and higher cell endurance. SLC-based flash is more reliable and suitable of critical applications. M: MLC The primary benefit of MLC-based flash is its lower cost per unit of storage due to the higher data density. This benefit makes MLC-based flash a perfect replacement of traditional HDD. I: iSLC iSLC is Innodisk’s exclusive firmware technology, which improves the performance and data quality and boasts a similar write performance as that of SLC-based solutions. Through the use of flash management algorithms, iSLC improves SSD endurance up to 20,000 times. T: TLC TLC-based 3D NAND flash is a new technology with a novel architecture. The more concentrated die size provides higher density and lower cost. Application & Series E: Embedded G: EverGreen R: InnoRobust V: InnoREC S: Server Product Series Interface 3: Generation III 2: Generation II 1: Generation I Form Factor SSD Slim SSD SATADOM SATA Slim mSATA mini PCIeDOM M.2 CFast CF Card EDC SD microSD USB nanoSSD 2.5” SATA SSD 3TE7
20 Table of Contents Flash Memory Products M.2 .............................................................. 22 nanoSSD ................................................... 25 SSD .............................................................. 26 SATADOM® ............................................. 29 SATA Slim................................................... 31 mSATA .........................................................32 SD/micro SD .............................................34 CFast ............................................................34 CF Card ......................................................35 Mini PCIeDOM ..................................... 36 EDC...............................................................36 USB ...............................................................37 Software Solutions iCAPTM .........................................................39 iSMARTTM ................................................. 41 iTrackerTM .................................................. 42 iCover TM ......................................................43 iOpalTM .........................................................44 DRAM Module Products Embedded..................................................48 Server...........................................................50 Wide Temperature................................ 50 ECC DIMM ...............................................52 VLP DIMM ................................................53 Mini DIMM ...............................................54 Special / Customized............................ 55 Embedded Peripheral Modules Communication...................................... 59 Disk Array...................................................64 Display Card..............................................65 Storage.........................................................66 Testing Tool................................................67
21Product specifications are subject to change without prior notice. Flash Memory Innodiskflashmemoryproductsaredesignedtobehighlyreliable and stable, and provide longer life cycles for the embedded and industrial systems in which they are used. Innodisk offers the industry’swidestselectionofflashmemoryformfactors,including standard 1.8” and 2.5” Industrial SSDs, M.2, SATADOM® —the smallest high-speed SATA storage in the industry, CompactFlash Cards, mSATA , SATA Slim, and USB Flash Drives. Our products are available in 3D NAND triple-level cell (TLC), single-level cell (SLC), and multi-level cell (MLC) flash types, as well as iSLC – our own proprietary technology that merges the best features from MLC and SLC.
22 M.2 M.2 (NVMe) Highlights The Innodisk M.2 series pack a lot of performance into a thin, industrial grade form factor. The M.2 series includes both Non-Volatile Memory Express (NVMe) and SATA devices. The NVMe specification is designed specifically for flash devices and can deliver the fastest speeds in the industry. •PCIe Gen III x 2 and x 4 solution •Truly industrial grade PCIe NVMe SSD •Heatsink-less design •Wide range of form factors and dimensions available, including type 2242, 2260, and 2280 •Support industrial grade wide temperature -40°C ~ 85°C (only available in PCIe Gen III x2 solution) •iData GuardTM, iPower Guard and iCell technology for data protection and integrity while abnormal power failure happened •Support iSMART disk health monitoring •Support End-to-End Data Path Protection (ETEP) Model Name M.2(P42) 3ME2 M.2 (P42) 3TE2 M.2(P80) 3ME2 M.2 (P80) 3TE2 M.2(P80) 3TE4 Key Features 1. Type 2242-D2-B-M 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. Low power consumption 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. Low power consumption 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. Low power consumption 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. DRAM-less Solution 2. Supports NVMe 1.3 3. iData Guard Data Protection 4. End-to-End Data Path Protection Interface PCIe Gen3 x 2 PCIe Gen3 x 2 PCIe Gen3 x 2 PCIe Gen3 x 2 PCIe Gen3 x 4 Flash Type MLC 3D TLC MLC 3D TLC 3D TLC Capacity 32GB~256GB 64GB~512GB 32GB~512GB 64GB~1TB 128GB~1TB Max. Channel 4 4 4 4 4 Sequential R/W (MB/sec, max.) 1300/340 1300/680 1300/480 1300/680 2100/1700 Max. Power Consumption 2.9W(3.3 x 880mA) 2.3W(3.3 x 700mA) 3.72W(3.3 x 1125mA) 3W(3.3 x 910mA) TBD Thermal Sensor Y Y Y Y Y External DRAM Buffer N N N N N iData Guard Y Y Y Y Y iCell N N Optional Optional Optional TRIM Y Y Y Y Y ATA Security N N N N N S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.5 22.0 x 80.0 x 3.5 22.0 x 80.0 x 3.5 22.0 x 80.0 x 3.5 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM24-XXXM61BC*** DEM24-XXXM61EC*** DEM28-XXXM61BC*** DEM28-XXXM61EC*** DEM28-XXXIB1EC*** Wide Temp. OP (-40°C~+85°C) DEM24-XXXM61BW*** DEM24-XXXM61EW*** DEM28-XXXM61BW*** DEM28-XXXM61EW*** TBD Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type 2222 2222 2222 2222 8080 6060 4242 3030 Dimension (mm) Type 2242Type 2230 Type 2260 Type2280 Dimension(mm)
23Product specifications are subject to change without prior notice. M.2 (SATA) Highlights • Wide range of form factors and dimensions available, includeing type 2230, 2242, 2260, and 2280. • iData GuardTM, iPower Guard and iCell technology for data protection and intergraty while abnormal power failure happened • Support iSMART disk health monitoring 2222 2222 2222 2222 8080 6060 4242 3030 Dimension (mm) Type 2242Type 2230 Type 2260 Type2280 Model Name M.2 (S42) 3TE7 M.2 (S42) 3TG6-P M.2 (S42) 3SE4 M.2 (S42) 3IE4 Key Features 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 1. Type 2242-D2-B-M 2. High quality SLC-based solution 3. DRAM-less, high-level data integrity 4. LDPC technology secures SSD reliability 5. Excellent data transfer speed 1. Type 2242-D2-B-M 2. Designed with LDPC ECC engine 3. Lifespan 7 times longer tham MLC 4. Cost-effective industrial flash with iSLC Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC SLC iSLC Capacity 32GB~512GB 128GB~512GB 8GB~64GB 8GB~128GB Max. Channel 4 4 2 2 Sequential R/W (MB/sec, max.) 560/330 560/510 520/360 530/380 Max. Power Consumption 1.6W (3.3V x 475mA) 2.4W (3.3V x 739mA) 0.6W (3.3V x 185mA) 1.5W (3.3V x 460mA) Thermal Sensor Y Y Y Y External DRAM Buffer N Y N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.2 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM24-XXXDK1EC*** DGM24-XXXM71EC*** DEM24-XXXM41SC*** DHM24-XXXM41BC*** Wide Temp. OP (-40°C~+85°C) DEM24-XXXDK1EW*** DGM24-XXXM71EW*** DEM24-XXXM41SW*** DHM24-XXXM41BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Model Name M.2 (S30) 3ME4 M.2 (S60) 3ME3 Key Features 1. Type 2230-D2-B-M 2. Exclusive L3 architecture 3. Designed with LDPC ECC Engine 4. Budget-friendly MLC-based solution 1. Type 2260-D2-B-M 2. High IOPS 3. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC Capacity 8GB~128GB 32GB~512GB Max. Channel 2 4 Sequential R/W (MB/sec, max.) 530/210 380/200 Max. Power Consumption 1.6W (3.3V x 505mA) 1.3W (3.3V x 370mA) Thermal Sensor Y STD: N, W/T: Y External DRAM Buffer N N iData Guard Y Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 22.0 x 30.0 x 3.2 22.0 x 60.0 x 3.5 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/ MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM23-XXXM41BC*** DEM26-XXXD08%C*** Wide Temp. OP (-40°C~+85°C) DEM23-XXXM41BW*** DEM26-XXXD08%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
24 Model Name M.2 (S42) 3ME4 M.2 (S42) 3MG2-P M.2 (S80) 3TG6-P M.2 (S80) 3TE7 Key Features 1. Type 2242-D2-B-M 2. Exclusive L3 architecture 3. Designed with LDPC ECC Engine 4. Budget-friendly MLC-based solution 1. Type 2242-D2-B-M 2. High sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 4. AES 256-key ,end to end data path protection 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC 3D TLC 3D TLC Capacity 8GB~256GB 32GB~256GB 128GB~1TB 32GB~1TB Max. Channel 2 4 4 4 Sequential R/W (MB/sec, max.) 530/210 560/360 560/510 550/370 Max. Power Consumption 1.4W (3.3V x 422mA) 1.09 W (3.3V x 330mA) 2.6W (3.3V x 799mA) 2.0W (3.3V x 614mA) Thermal Sensor Y Y Y Y External DRAM Buffer N Y Y N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 22.0 x 42.0 x 3.2 22.0 x 42.0 x 3.5 22.0 x 80.0 x 3.5 22.0 x 80.0 x 3.5 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM24-XXXM41BC*** DGM24-XXX-D81%C*** DGM28-XXXM71EC*** DEM28-XXXDK1EC*** Wide Temp. OP (-40°C~+85°C) DEM24-XXXM41BW*** DGM24-XXX-D81%W*** DGM28-XXXM71EW*** DEM28-XXXDK1EW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Model Name M.2 (S80) 3SE4 M.2 (S80) 3IE4 M.2 (S80) 3ME4 M.2 (S80) 3MG2-P Key Features 1. Type 2280-S2-B-M (single side) 2. High quality SLC-based solution 3. DRAM-less, high-level data integrity 4. LDPC technology secures SSD reliability 5. Excellent data transfer speed 1. Type 2280-D2-B-M 2. Designed with LDPC ECC engine 3. Lifespan 7 times longer tham MLC 4. Cost-effective industrial flash with iSLC 1. Type 2280-D2-B-M 2. Exclusive L3 architecture 3. Designed with LDPC ECC Engine 4. Budget-friendly MLC-based solution 1. Type 2280-D2-B-M 2. High sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type SLC iSLC MLC MLC Capacity 8GB~64GB 8GB~128GB 8GB~256GB 16GB~1TB Max. Channel 2 2 2 4 Sequential R/W (MB/sec, max.) 520/360 530/360 530/210 530/450 Max. Power Consumption 1.6W (3.3V x 500 mA) 0.9 W (3.3V x 270mA) 0.9 W (3.3V x 270mA) 3.63W (3.3V x 1.1A) Thermal Sensor Y Y Y Y External DRAM Buffer N N N Y iData Guard Y Y Y Y iCell N N N Optional TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 22.0 x 80.0 x 3.2 22.0 x 80.0 x 3.2 22.0 x 80.0 x 3.2 22.0 x 80.0 x 3.5 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM28-XXXM41SC*** DHM28-XXXM41BC*** DEM28-XXXM41BC*** DGM28-XXXD81%C*** Wide Temp. OP (-40°C~+85°C) DEM28-XXXM41SW*** DHM28-XXXM41BW*** DEM28-XXXM41BW*** DGM28-XXXD81%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
25Product specifications are subject to change without prior notice. Model Name nanoSSD 3SE nanoSSD 3IE3 nanoSSD 3ME3 Key Features 1. Using BGA package to make controller and flash as single chip 2. Adopt SATA III interface,well Compatibility 3. Complaint with JEDEC MO-276 SPEC Interface SATA III 6.0Gb/s Flash Type SLC iSLC MLC Capacity 2GB~16GB 16GB~64GB 16GB~128GB Max. Channel 4 Sequential R/W (MB/sec, max.) 410/195 440/260 410/140 Max. Power Consumption 2.5W 2.3W Thermal Sensor N N External DRAM Buffer N N iData Guard Y Y iCell N N TRIM N Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 16.0 x 20.0 x 1.7 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DENSD-XXXD06SC*** DHNSD-XXXD08BC*** DENSD-XXXD08BC*** Wide Temp. OP (-40°C~+85°C) DENSD-XXXD06SW*** DHNSD-XXXD08BW*** DENSD-XXXD08BW*** Note xxx = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) nanoSSD The Innodisk nanoSSD is an integrated SATA storage device. It combines Innodisk's ID106/ID108 NAND flash controller and latest NAND flash in a JEDEC MO-276(SATA μSSD) form factor with one single ball grid array (BGA) package, giving the nanoSSD a compact size and making it very easy to design in. The Innodisk nanoSSD , supporting SATA III 6.0Gbp/s , offers excellent high data transfer rates, along with lower power consumption. It is an ideal solution for any kind of limited-space application. Benefits of nanoSSD Features • Chip type, easy to design in without mechanical interference • SATA interface, highly compatible with x86 system • Excellent data transfer rates • Fully compliant with industrial standards • Suitable for ultra-thin or compact systems • Zero peripheral circuits • Integrated NAND Flash controller with Flash in a single chip • Compliant with JEDEC MO-276 (SATA μSSD) specifications • SATA III interface with BGA package • Intelligent Flash management & real time garbage collection The Innodisk nanoSSD mechanical drawing 1.7
SSDInnodisk SSDs bring a whole new level of high performance to memory storage. Our wide selection of SSDs are designed for different applications, including industrial/embedded, enterprise server, aviation, defense, and other semi-industrial applications, such as thin clients, POS, and kiosk. Our SSDs come in 3D TLC, iSLC, SLC and MLC types, and support PATA/IDE 44 pin, SATA II (3.0Gb/s), and SATA III (6.0Gb/s). Model Name 2.5"SATA SSD 3TE7 2.5"SATA SSD 3TG6-P 2.5" SATA SSD 3SE4 Key Features 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC SLC Capacity 32GB~1TB 128GB~4TB 8GB~64GB *For128GB, please check 2.5"SATA SSD 3SE3 Max. Channel 4 4 2 SequentialR/W(MB/sec,max.) 560/525 540 /470 520/360 Max. Power Consumption 0.8W (5V x 160mA) 128GB~1TB 3.1W (5V x 620mA) 2TB~4TB 6W (5V x 1.2A) 1.1W (5V x 220 mA) Thermal Sensor Y External DRAM Buffer N Y N iData Guard Y Y Y iCell N Optional N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 69.85 x 100.1 x 6.9 69.8 x 100.1 x 6.9 69.85 x 100.1 x 6.9 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DES25-XXXDK1EC*** DGS25-XXXM71EC*** DES25-XXXM41SC*** WideTemp.OP(-40°C~+85°C) DES25-XXXDK1EW*** DGS25-XXXM71EW*** DES25-XXXM41SW*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash Model Name 2.5" SATA SSD 3SE2-P 2.5" SATA SSD 3SR3-P 2.5" SATA SSD 3IE4 Key Features 1. High IOPS performance with DRAM solution 2. High quality SLC-based solution 3. Support AES function 1. Compliant with MIL-STD-810G 2. HW/SW Data Security (Quick Erase/Destroy/ Security Erase/ Write Protect) 3. iCell supported, 100% data protection 1. Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Cost-effective industrial Flash with iSLC 4. Lifespan 7 times longer than MLC Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type SLC SLC iSLC Capacity 8GB~512GB 8GB~256GB 8GB-128GB *For 256GB, please check 2.5"SATA S SD 3IE3 Max. Channel 4 4 2 SequentialR/W(MB/sec,max.) 520/420 490/240 530/380 Max. Power Consumption 2.15W (5V x 430mA) 2.65W (5V x 530mA) 0.8W (5V x 160mA) Thermal Sensor Y External DRAM Buffer Y Y N iData Guard Y Y Y iCell Optional Y N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 69.8 x 99.8 x 9.2 69.8 x 99.8 x 9.2 69.8 x 100.1 x 6.9 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DES25-XXXD82SC*** DRS25-XXXD70SC*** DHS25-XXXM41%C*** WideTemp.OP(-40°C~+85°C) DES25-XXXD82SW*** DRS25-XXXD70SW*** DHS25-XXXM41%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash 26
27Product specifications are subject to change without prior notice. Model Name 2.5" SATA SSD 3MG2-P 2.5" SATA SSD 3ME4 Key Features 1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection 1. EverGreen L3 architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC Capacity 8GB-2TB 8GB-256GB Max. Channel 4 2 SequentialR/W(MB/sec,max.) 520/480 520/210 Max. Power Consumption 6W (5V x 1.2A) 0.8W (5V x 160mA) Thermal Sensor Y External DRAM Buffer Y N iData Guard Y Y iCell Optional N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 69.8 x 100.1 x 6.9 69.8 x 100.0 x 9.5 (2TB) 69.8 x 100.1 x 6.9 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DGS25-XXXD81%C***(P) DES25-XXXM41%C*** WideTemp.OP(-40°C~+85°C) DRS25-XXXD81%W***(P) DES25-XXXM41%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash Model Name 2,5" SATA SSD 3MR2-P 2.5" SATA SSD 3MR3-P 1.8 "SATA SSD 3TG6-P Key Features 1. Compliant with MIL-STD-810G 2. HW/SW Data Security (Quick Erase/ Destroy/ Security Erase/Write Protect) 3. High random performance 4. iCell supported, 100% data protection 1. Compliant with MIL-STD-810G 2. HW/SW Data Security (QEraser/ Destroy/ SEraser/ Write Protect) 3. iCell supported, 100% data protection 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 4. AES 256-key ,end to end data path protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC 3D TLC Capacity 8GB~2TB 64GB~512GB 32GB~1TB Max. Channel 4 4 4 SequentialR/W(MB/sec,max.) 520/450 490/270 540/470 Max. Power Consumption 6W (5V x 1.2mA) 4.5W (5V x 900mA) 0.8W (5V x 160mA) Thermal Sensor STD : N , W/T : Y Y External DRAM Buffer Y Y Y iData Guard Y Y Y iCell Y Y Optional TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 69.8 x 99.8 x 9.2 69.8 x 99.8 x 9.2 54.0 x 78.5 x 5.0 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DRS25-XXXD81%C***P DRS25-XXXD70%C*** DGS18-XXXM71EC1*** DGS18-XXXM71EC2*** *Edition 1: 5V, Edition 2: 3.3V WideTemp.OP(-40°C~+85°C) DRS25-XXXD81%W***P DRS25-XXXD70%W*** DGS18-XXXM71EW1*** DGS18-XXXM71EW2*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash
28 Model Name 1.8" SATA SSD 3SE2-P 1.8" SATA SSD 3SE3-P 1.8" SATA SSD 3MG3-P Slim SSD 3ME4 PATA 1MG3-P Key Features 1. High IOPS performance with DRAM solution 2. High quality SLC-based solution 3. Support AES function 4. iCell supported, 100% data protection 1. High quality SLC-based solution 2. Enhanced power cycling management 3. iSMART disk health monitoring 1. Built-in DRAM buffer 2. Intelligent error recovery system 3. Excellent data transfer speed and high IOPS performance 4. iData Guard for abnormal power failure 1. 1.8' housing, 50% space saving 2. Exclusive L3 architecture 3. Designed with LDPC ECC engine 1. Built-in DRAM buffer 2. Intelligent error recovery system 3. Excellent data transfer speed 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s PIO Mode 0~4 Ultra DMA 0~5 Flash Type SLC SLC MLC MLC MLC Capacity 8GB-512GB 8GB-512GB 32GB~1TB 8GB~256GB 8GB~512GB Max. Channel 4 4 4 2 4 Sequential R/W (MB/sec, max.) 540/360 490/230 520/450 530/210 90/90 Max. Power Consumption A: 2.9W (3.3V x 880mA)* B: 3.9W (5V x 780mA)* 1.5W (5V x 300 mA) 6W (5V x 1.2A) 0.8W (5V x 160mA) 2W (5V x 400mA) Thermal Sensor Y STD : N , W/T : Y Y STD : N , W/T : Y External DRAM Buffer Y Y Y Y Y iData Guard Y Y Y Y Y iCell Y N N N N TRIM Y Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 54.0 x 78.5 x 5.0 54.0 x 78.5 x 5.0 54.0 x 78.5 x 5.0 69.85 x 50.0 x 9.0 69.85 x 99.85 x 9.2 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DES18-XXXD82SCA**(P) DES18-XXXD82SCB**(P) *Edition A: 3.3V ; Edition B:5V DES18-XXXD70SC*** DGS18-XXXD81%C*** DEMLM-XXXM41%C*** DGP25-XXXD70%C*** WideTemp.OP(-40°C~+85°C) DES18-XXXD82SWA**(P) DES18-XXXD82SWB**(P) DES18-XXXD70SW*** DGS18-XXXD81%W*** DEMLM-XXXM41%W*** N/A Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash iCell Technology gives the SSD a power boost in the event of an abnormal power failure and ensures reliable and accurate data transfer from DRAM cache to NAND flash. The iSecurity function under iSMART allows the user to easily operate the data erase command. The user may select the data erase function, monitor erase progress and also compare data before and after the erasure. SSDs are made up of millions of NAND flash cells. They can be written into groups called pages (generally 4KB in size) but can only be erased in larger groups called blocks (generally 128 pages or 512KB). The addresses of the deleted files are sent along with the TRIM command to the SSD’s controller so the drive can function optimally. The TRIM commands allows the SSD to delete data more expediently, thus increasing overall performance. The TRIM command is generally sent from the OS when the system is idle. This cleans up invalid data from the blocks so the drive can perform like new. What is TRIM?What is iCell? What is iSecurity?
29Product specifications are subject to change without prior notice. SATADOM® Flexible power supply design SATADOM-SL 3ME4 Innodisk’s Serial ATA Disk on Module (SATADOM® ) is the world’s smallest form factor with exclusive built-in Pin 7 and Pin 8 VCC, which simplifies motherboard design. Since it has no external cables, it is more robust and enhances the disk functions of various industrial and enterprise applications. Innodisk’s SATADOM® also supports the SATA II and SATA III interface with faster data transfer rates and is available in capacities ranging from 512MB up to 256GB. • External power cable • SATA Pin 8 VCC • SATA Pin 7 VCC Innodisk, the service-driven flash and DRAM module provider, features the innovative SATADOM® patented Pin8 and Pin7 cable-less SATA power combined with exclusive L3 architecture, prolonging the lifespan of SATADOM-SL 3ME4 with exceptional performance and reliability. SATADOM-SL 3ME4 is the best storage design for industrial computers and server boot drives. SATADOM-SL 3ME won the Taiwan Excellence Award 2017 in the highly competitive category of "Computer Hardware and Peripheral Equipment.” Form Factor SATADOM-SV/SH Model Name SATADOM 3TE7 SATADOM 3SE4 SATADOM 3IE4 SATADOM 3ME4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Cost-effective industrial Flash with iSLC 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. Pin 8/Pin 7 supported 1. Vertical and low profile horizontal design 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type 3D TLC SLC iSLC MLC Capacity 32GB~256GB 8GB~32GB 8GB~64GB 8GB~128GB Max. Channel 2 2 2 2 SequentialR/W(MB/sec,max.) 510/300 520/260 530/350 530/120 Max. Power Consumption 1.55W (5V x 309mA) 1.58W (5V x 315mA) 0.95W (5V x 189mA) 1.27W (5V x 254mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) SV: 40.4 x 21.03 x 10.4 mm SH: 32.7 x 18 x 14.15 mm SV: 40.4 x 21.03 x 10.4 mm SH: 32.7 x 18 x 14.15 mm SV:40.4 x 21.03 x 10.4 SV: 40.4 x 21.03 x 10.4 SH: 32.7 x 18 x 15.15 Environment Vibration: 20G@7~2000Hz Shock: 1500G@0.5ms Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) SV: DESSV-XXXDK1EC***# SH: DESSH-XXXDK1EC***# SV: DESSV-XXXM41SC***# SH: DESSH-XXXM41SC***# SV: DHSSV-XXXM41BC***# SV: DESSV-XXXM41BC***# SH: DESSH-XXXM41BC***# WideTemp.OP(-40°C~+85°C) SV: DESSV-XXXDK1EW***# SH: DESSH-XXXDK1EW***# SV: DESSV-XXXM41SW***# SH: DESSH-XXXM41SW***# SV: DHSSV-XXXM41BW***# SV: DESSV-XXXM41BW***# SH: DESSH-XXXM41BW***# Notes xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 01GB~4GB, please check FF 3SE or 3SE3 3ME4 series • High performance • LDPC • Low WAI • SMART supported • Original MLC designed SATADOM-SL • Tiny size • Cable-less (Pin8 /Pin7 supported) • OS boot drive • Durable External power cable SATA Pin 8 power VCCSATA Pin 7 power VCC
30 Form Factor SATADOM-SL/SH Type D Model Name SATADOM 3TE7 SATADOM 3SE4 SATADOM 3IE4 SATADOM 3ME4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Below 1U best boot solution. 2. Cost-effective industrial Flash with iSLC 3. Exclusive L3 architecture 4. Latest LDPC ECC engine 5. Pin 8/Pin 7 supported 1. Below 1U best boot solution. 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type 3D TLC SLC iSLC MLC Capacity 32GB~256GB 8GB~32GB 8GB~64GB 8GB~128GB Max. Channel 2 2 2 2 SequentialR/W(MB/sec,max.) 510/300 520/260 530/350 530/120 Max. Power Consumption 1.5W (5V x 300mA) 0.95W (5V x 186mA) 1.02W (5V x 204mA) 1.02W (5V x 204mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) SL: 29.6 x 33.06 x 10.5 SH(D):30 x 20.79 x 15.20 SL: 29.6 x 33.06 x 10.5 SH(D):30 x 20.79 x 15.15 SL: 29.6 x 33.06 x 10.5 SL: 29.6 x 33.06 x 10.5 SH(D): 30 x 20.79 x 15.15 Environment Vibration: 20G@7~2000Hz Shock: 1500G@0.5ms Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) SL: DESSL-XXXDK1EC***# SH(D): DESSF-XXXDK1EC***# SL: DESSL-XXXM41SC***# SH(D): DESSF-XXXM41SC***# SL: DHSSL-XXXM41BC***# SL: DESSL-XXXM41BC***# SH(D): DESSF-XXXM41BC***# WideTemp.OP(-40°C~+85°C) SL: DESSL-XXXDK1EW***# SH(D): DESSF-XXXDK1EW***# SL: DESSL-XXXM41SW***# SH(D): DESSF-XXXM41SW***# SL: DHSSL-XXXM41BW***# SL: DESSL-XXXM41BW***# SH(D): DESSF-XXXM41BW***# Notes xxx = density ( 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 01GB~4GB, please check FF 3SE or 3SE3 Form Factor SATADOM-ML/MH Model Name SATADOM 3SE4 SATADOM 3IE4 SATADOM 3ME4 SATADOM 3TG6-P SATADOM 3MG2-P Key Features 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Hareware write protect supported 2. Cost-effective industrial Flash with iSLC 3. Exclusive L3 architecture 4. Latest LDPC ECC engine 5. High IOPS 6. Pin 8/Pin 7 supported 1. Hareware write protect supported 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offers addi tional level of data protection 4. AES 256-bit key, end-to- end data path protection 1. Hareware write protect supported 2. High IOPS 3. Write protect 4. High performance SATADOM Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type SLC iSLC MLC 3D TLC MLC Capacity 8GB~64GB 16GB~128GB 32GB~256GB 128GB~256GB 32GB~256GB Max. Channel 2 2 2 4 4 SequentialR/W(MB/sec,max.) 520/360 530/360 530/210 560/290 560/180 Max. Power Consumption 1.58W (5V x 315mA) 0.815W (5V x 163mA) 0.815W (5V x 163mA) 2.14W (5V x 428mA) 2.68W (5V x 535mA) Thermal Sensor Y Y Y Y Y External DRAM Buffer N N N Y Y iData Guard Y Y Y Y Y iCell N N N N N TRIM Y Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) ML: 36.7 x 31.2 x 10.7 ML: 31.2 x 36.7 x 10.7 MH: 23.5 x 33.6 x 14.8 ML: 31.2 x 36.7 x 10.7 MH: 23.5 x 33.6 x 14.8 ML: 37.17 x 31.5 x 12.6 ML: 37.17 x 31.5 x 12.6 Environment Vibration: 20G@7~2000Hz Shock: 1500G@0.5ms Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) ML: DESML-XXXM41SC***# ML: DHSML-XXX- M41BC***# MH: DHSMH-XXX- M41BC***# ML: DESML-XXX- M41BC***# MH: DESMH-XXX- M41BC***# ML: DGSML-XXXM71EC***# ML: DGSML-XXXD81BC***# WideTemp.OP(-40°C~+85°C) ML: DESML-XXXM- 41SW***# ML: DHSML-XXX- M41BW***# MH: DHSMH-XXX- M41BW***# ML: DESML-XXX- M41BW***# MH: DESMH-XXX- M41BW***# ML: DGSML-XXXM71EW***# ML: DGSML-XXXD- 81BW***# Notes xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 4GB, please check FF 3SE or 3SE3
31Product specifications are subject to change without prior notice. Form Factor SATADOM-SH Type C SATADOM-MV Model Name SATADOM 3SE4 SATADOM 3ME4 SATADOM 3IE4 SATADOM 3ME4 Key Features 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Low profile horizontal design 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported 1. Hareware write protect supported 2. Cost-effective industrial Flash with iSLC 3. Exclusive L3 architecture 4. Latest LDPC ECC engine 5. High IOPS 6. Pin 8/Pin 7 supported 1. Hareware write protect supported 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type SLC MLC iSLC MLC Capacity 8GB~32GB 8GB~128GB 8GB~64GB 8GB~128GB Max. Channel 2 2 2 2 SequentialR/W(MB/sec,max.) 520/260 530/120 530/340 530/210 Max. Power Consumption 1.49W (5V x 297mA) 1.02W (5V x 204mA) 1.72W (5V x 343mA) 1.08W (5V x 216mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 32.7 x 18 x 14.5 32.7 x 18 x 14.5 41.55 x 25.26 x 10.4 41.55 x 25.26 x 10.4 Environment Vibration: 20G@7~2000Hz Shock: 1500G@0.5ms Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DESSC-XXXM41SC***# DESSC-XXXM41BC***# DHSMV-XXXM41BC***# DESMV-XXXM41BC***# WideTemp.OP(-40°C~+85°C) DESSC-XXXM41SW***# DESSC-XXXM41BW***# DHSMV-XXXM41BW***# DESMV-XXXM41BW***# Notes xxx = density ( 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 01GB~4GB, please check FF 3SE or 3SE3 SATA SlimThe Innodisk SATA Slim is compliant with the JEDEC SFF-8156 standard form factor and ATA protocol. It does not require drivers, and can be configured as a boot device or a data storage device. It is also suitable for portable/hand-held devices, thin clients, and industrial applications that require the effective reduction of operation system boot time and power consumption. With a 7+15 pin SATA interface, the Innodisk SATA Slim supports most platforms with a standard SATA port. Model Name SATA Slim 3TE7 SATA Slim 3TG6-P SATA Slim 3SE4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offers additional level of data protection 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC SLC Capacity 32GB~1TB 128GB~1TB 8GB~64GB *For128GB, please check SATA Slim 3SE3 Max. Channel 4 4 2 SequentialR/W(MB/sec,max.) 560/525 540/470 530/360 Max. Power Consumption 0.8W (5V x 160mA) 3.1W (5V x 620mA) 1.1 W (5V x 220mA) Thermal Sensor Y Y Y External DRAM Buffer N Y N iData Guard Y Y Y iCell N N N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million StandardTemp.OP(0°C~+70°C) DESLM-XXXDK1EC*** DGSLM-XXXM71EC*** DESLM-XXXM41SC*** WideTemp.OP(-40°C~+85°C) DESLM-XXXDK1EW*** DGSLM-XXXM71EW*** DESLM-XXXM41SW*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
32 mSATA mSATA, which is compliant with the JEDEC MO300/MO300B standard, was announced by the Serial ATA International Organization on September 21, 2009. Applications include netbooks, portable devices and other devices that require a smaller solid-state drive. The connector is similar in appearance to a PCI Express Mini Card interface and is electrically compatible; however, the data signals need a connection to the SATA host controller instead of the PCI-express host controller. Innodisk’s mSATA supports high-performance data transfer rates of 1.5 Gb/s, 3.0 Gb/s and 6.0 Gb/s. Model Name mSATA 3TE7 mSATA 3TG6-P Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offers additional level of data protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC Capacity 32GB~1TB 128GB~1TB Max. Channel 4 4 Sequential R/W (MB/sec, max.) 560/525 560/510 Max. Power Consumption 2.2 W (3.3V x 674mA) 2.64 W (3.3V x 800mA) Thermal Sensor Y Y External DRAM Buffer N Y iData Guard Y Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSR-XXXDK1EC*** DGMSR-XXXM71EC*** Wide Temp. OP (-40°C~+85°C) DEMSR-XXXDK1EW*** DGMSR-XXXM71EW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type Model Name SATA Slim 3IE4 SATA Slim 3ME4 SATA Slim 3MG2-P Key Features 1. Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Cost-effective industrial Flash with iSLC 1. Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Compatible with JEDEC MO-297 1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type iSLC MLC MLC Capacity 8GB~128GB 8GB~128GB 8GB~256GB Max. Channel 2 2 4 SequentialR/W(MB/sec,max.) 530/360 530/210 520/290 Max. Power Consumption 0.8W (5V x 160mA) 0.8W (5V x 160mA) 2.6W (5V x 520mA) Thermal Sensor Y Y STD : N, W/T : Y External DRAM Buffer N N Y iData Guard Y Y Y iCell N N N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million StandardTemp.OP(0°C~+70°C) DHSLM-XXXM41%C*** DESLM-XXXM41%C*** DGSLM-XXXD81%C*** WideTemp.OP(-40°C~+85°C) DHSLM-XXXM41%W*** DESLM-XXXM41%W*** DGSLM-XXXD81%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
33Product specifications are subject to change without prior notice. Model Name mSATA 3SE4 mSATA 3SE-P mSATA 3IE4 mSATA 3MG2-P mSATA 3ME4 Key Features 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Excellent data transfer speed and IOPS 2. Support TRIM command 3. Built-in DRAM buffer 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC 4. Excellent data transfer speed 5. LDPC technology secures SSD reliability 1. High IOPS by on-board DRAM design 2. Featuring L² architecture, expanding the lifespan 3. DEVSLP supported 1. LDPC technology secures SSD reliability 2. DRAM-less, high-level data integrity Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type SLC SLC iSLC MLC MLC Capacity 8GB~64GB *For 4GB/ 128GB, please check mSATA 3SE3 8GB~64GB 8GB~128GB 8GB~512GB 8GB~256GB *For 512 GB, please check mSATA 3ME3 Max. Channel 2 4 2 4 2 Sequential R/W (MB/sec, max.) 525/350 490/260 530/365 520/450 535/210 Max. Power Consumption 1.32W(3.3V x 400mA) 1.2 W(3.3V x 360mA) 0.6W(3.3V x 200mA) 2.2 W(3.3 V x 660 mA) 0.6W (3.3V x 205mA) Thermal Sensor Y STD : N, W/T : Y Y Y Y External DRAM Buffer N Y N Y N iData Guard Y Y Y Y Y iCell N N N N N TRIM Y Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSR-XXXM41SC*** DEMSR-XXXD67SC*** DHMSR-XXXM41BC*** DGMSR-XXXD81SC*** DEMSR-XXXM41BC*** Wide Temp. OP (-40°C~+85°C) DEMSR-XXXM41SW*** DEMSR-XXXD67SW*** DHMSR-XXXM41BW*** DGMSR-XXXD81SW*** DEMSR-XXXM41BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type Model Name mSATA mini 3TE7 mSATA mini 3SE4 mSATA mini 3IE4 mSATA mini 3ME4 Key Features 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC 4. Excellent data transfer speed 5. LDPC technology secures SSD reliability 1. LDPC technology secures SSD reliability 2. DRAM-less, high-level data integrity Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC SLC iSLC MLC Capacity 32GB~512GB 8GB~64GB *For 4GB, please check mSATA mini 3SE3 8GB~64GB 8GB~128GB Max. Channel 4 2 2 2 Sequential R/W (MB/sec, max.) 560/520 525/360 530/340 430/125 Max. Power Consumption 0.6W (3.3V x 190mA) 1.3W (3.3 V x 400mA) 0.6W (3.3V x 200mA) 0.6W (3.3V x 190mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 30 x 26.8 x 3.6 30 x 26.8 x 3.4 30 x 26.8 x 3.4 30 x 26.8 x 3.4 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSM-XXXDK1EC*** DEMSM-XXXM41SC*** DHMSM-XXXM41BC*** DEMSM-XXXM41BC*** Wide Temp. OP (-40°C~+85°C) DEMSM-XXXDK1EW*** DEMSM-XXXM41SW*** DHMSM-XXXM41BW** DEMSM-XXXM41BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type
34 SD/micro SD Innodisk SD and microSD cards are single-level flash devices built for rugged applications in the embedded field. As an industrial-grade SD/ microSD card, these cards deliver outstanding performance of up to 54MB per second as well as excellent endurance and reliability, especially compared to other cards used in the mobile market. The Innodisk SD and microSD cards are compatible with SD 2.0 /SD 3.0 standards and support SDHC Class 10(UHS-I). They also feature SMART technology, which monitors the reliability of these SD cards. Model Name Industrial micro SD Card Micro SD 3SE3 MicroSD 3ME2 Industrial SD Card Industrial SD Card 3ME3 Key Features Enhanced power cycling management Power cycling enhancement 1. Support Class 10 with UHS-I 2. High performance 3. SPI mode supported 1. Designed for industrial applications 2. High reliability 3. Customizeable 4. Power fail mangement 5. AES (Optional) 1. High performance 2. Power fail management 3. BCH ECC implement Interface SD 1.01/2.0 SD 3.0 SD 3.0 SD 3.0 SD 3.0 Flash Type SLC SLC MLC SLC/iSLC/MLC MLC Capacity 1GB~4GB 4GB~8GB 8GB~64GB SLC: 128MB~32GB iSLC: 8GB~64GB MLC: 8GB~128GB 8GB~128GB Max. Channel 1 1 1 1 1 Sequential R/W (MB/sec, max.) 23/20 30/23 75/31 SLC: 23/21 iSLC: 61/36 MLC: 54/18 80/46 Max. Power Consumption 0.17W ( 3.3V x 50mA) 1.2W (3.3V x 387mA) 0.7W (3.3V x 219mA) 0.22W (3.3V x 69mA )(SLC) 0.34W (3.3V x 105mA )(MLC) 0.56W (3.6V x 158mA) S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 11.0 x 15.0 x 1.0 11.0 x 15.0 x 1.0 11.0 x 15.0 x 1.0 24.0 x 32.0 x 2.1 24.0 x 32.0 x 2.1 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (-25°C~+85°C) DS2M- XXXI81AC*** DESDM-XXXS02AE*** DESDM-XXXE21SEASK DESDC-XXXY81%C*** DHSDC-XXXY81%C***(iSLC) DESDC-XXXS02BC*** Wide emp. OP (-40°C~+85°C) DS2M- XXXI81AW*** DESDM-XXXS02AW*** NA DESDC-XXXY81%W*** DHSDC-XXXY81%W***(iSLC) DESDC-XXXS02BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G)*** = flash configuration (internal control code) %=Flash Type The Innodisk CFast is a small form factor card standard with high data storage capacity. It is suitable for semi-industrial applications. Compliant with the CFast 2.0 standard, it is designed with a 7+17 pin connector and is SATA compatible. The Innodisk CFast offers data transfer rates of sequential read up to 560 MB/sec and of sequential write up to 520MB/sec. CFast Model Name CFast 3TE7 CFast 3SE4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Connector 7pin+17pin 7pin+17pin Flash Type 3D TLC SLC Capacity 32GB~512GB 8GB~64GB Max. Channel 4 2 Sequential R/W (MB/sec, max.) 560/330 530/360 Max. Power Consumption 1.81W (3.3V x 550mA) 1.59W (3.3V x 480mA) Thermal Sensor Y Y External DRAM Buffer N N iData Guard Y Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 42.8 x 36.4 x 3.6 42.8 x 36.4 x 3.6 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DECFA-XXXDK1EC*** DHCFA-XXXM41SC*** Wide Temp. OP (-40°C~+85°C) DECFA-XXXDK1EW*** DECFA-XXXM41SW*** Note xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) %=Flash Type
35Product specifications are subject to change without prior notice. l Model Name CFast 3IE4 CFast 3ME4 CFast 3MG2-P Key Features 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Excellent IOPS performance 4. Designed with LDPC ECC engine 5. Support hardware write protect 1.Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Excellent IOPS performance 4.Support hardware write protect 1. Compliant with CFast 2.0 satndard 2. EverGreen L² architecture 3. High Sequential/IOPS performance 4. Support DEVSLP 5. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Connector 7pin+17pin 7pin+17pin 7pin+17pin Flash Type iSLC MLC MLC Capacity 8GB~128GB 8GB~256GB 32GB~256GB Max. Channel 2 2 4 Sequential R/W (MB/sec, max.) 530/360 530/210 560/350 Max. Power Consumption 0.76W (3.3V x 230mA) 0.86W (3.3V x 260mA) 2.51W (3.3V x 760mA) Thermal Sensor Y Y Y External DRAM Buffer N N Y iData Guard Y Y Y iCell N N N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 42.8 x 36.4 x 3.6 42.8 x 36.4 x 3.6 42.8 x 36.4 x 3.6 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHCFA-XXXM41BC*** DECFA-XXXM41BC*** DGCFA-XXXD81BC*** Wide Temp. OP (-40°C~+85°C) DHCFA-XXXM41BW*** DECFA-XXXM41BW*** DGCFA-XXXD81BW*** Note xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56 ) ***= flash configuration (internal control code) %=Flash Type Model Name iCF 9000 iCF 1SE iCF 1ME Key Features 1. High sustained data transfer speed 2. Enhanced power cycling management High quality SLC-based solution 1. Budget friendly MLC-based solution 2. Enhanced power cycling management Interface PATA PATA PATA Connector 50pin CF connector 50pin CF connector 50pin CF connector Flash Type SLC SLC MLC Capacity 1GB~64GB 512MB~8GB 8GB~256GB Max. Channel 4 2 2 Sequential R/W (MB/sec, max.) 110/100 40/30 110/110 Max. Power Consumption 0.95W (5V x 190mA) 0.63W (3.3V x 190mA) 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 0.76W (5V x 155mA) 0.52W (3.3V x 155 mA) Thermal Sensor N N N ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 42.8 x 36.4 x 3.3 42.8 x 36.4 x 3.3 42.8 x 36.4 x 3.3 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DC1M-XXXD71AC*** DC1M-XXXD41AC*** DECFC-XXXD53BC*** Wide Temp. OP (-40°C~+85°C) DC1M-XXXD71AW*** DC1M-XXXD41AW*** DECFC-XXXD53BW*** Note PIO mode 0-6 UDMA mode 0-7 PIO mode 0-6 UDMA mode 0-4 PIO mode 0-6 UDMA mode 0-7 Notes XXX = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56) ***= flash configuration (internal control code) % =Flash Type CF Card Innodisk’s Industrial CompactFlash Memory Card (iCF) complies with the PCMCIA* ATA standard. Designed to replace traditional rotating disk drives, Innodisk iCFs are embedded solid-state data storage systems that are designed for mobile computing and the industrial work place.
36 Model Name Mini PCIeDOM 1SE Mini PCIeDOM 1ME3 Key Features 1. Standard Mini PCIe form factor 2. Driver-less 3. PCIe Gen.1x1 1. Standard Mini PCIe form factor 2. Driver-less 3. PCIe Gen.1x1 Interface PCI Express Gen.1x1 PCI Express Gen.1x1 Flash Type SLC MLC Capacity 4GB~64GB 16GB~256GB Max. Channel 4 2 Sequential R/W (MB/sec, max.) 85/85 130/100 Max. Power Consumption 2.3 W (3.3V x 700mA) 2 W (3.3V x 620mA) Thermal Sensor STD : N, W/T : Y External DRAM Buffer N N iData Guard Y Y iCell N N TRIM N N ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 30.0 x 50.95 x 5.0 30.0 x 50.9 x 5.0 Environment Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DEEDM-XXXJ30AC*** DEEDM-XXXD09BC*** Wide Temp. OP (-40°C~+85°C) DEEDM-XXXJ30AW*** DEEDM-XXXD09BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Mini PCIeDOM The Innodisk Mini PCIeDOM is a Flash based disk module with standard Mini PCIe form factor, and PCI Express Gen.1 interface. It is suitable for board maker or SI to design in the product as a boot drive or a storage device. Meanwhile, it supports multiple operating systems with no driver needed, including Windows XP, Windows 7, and Linux based OS. Model Name EDC 1SE Vertical Type EDC 1SE Horizontal Type EDC 1ME Vertical Type EDC 1ME Horizontal Type Key Features 1. Dust prevention 2. High quality SLC-based solution 1. High quality SLC-based solution 2. Supported mounting hole 1. Budget- friendly MLC-based solution 2. High performacne PATA solution 1. Budget- friendly MLC-based solution 2. High performacne PATA solution Connector 40/44 pin 40/44 pin 44 pin 44 pin Interface PATA PATA PATA PATA Flash Type SLC SLC MLC MLC Capacity 512MB~4GB 512MB~8GB 8GB~128GB 8GB~256GB Max. Channel 2 2 2 2 Sequential R/W (MB/sec, max.) 40/28 40/28 110/75 110/75 Max. Power Consumption 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 1.05W (5V x 150mA) 0.69W (3.3V x 150mA) 1.05W (5V x 150mA) 0.69W (3.3V x 150mA) Thermal Sensor N N N N External DRAM Buffer N N N N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 40 pin: 60.2 x 27.3 x 6.4 44 pin: 50.3 x 27.3 x 5.8 40 pin (A,B type): 55 x 32.4 x 12.9 40 pin (C,D type): 55 x 32.4 x 14.6 40 pin (E,F type): 55 x 32.4 x 18.3 44 pin (A,B type): 48 x 32.6 x 6.7 44 pin (C,D type): 48 x 32.6 x 12.8 44 pin (E,F type): 48 x 32.6 x 12.9 50.3 x 27.3 x 7.5 A,B type: 48 x 32.6 x 7.3 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) 40PIN DE0H-XXXD41AC*** 44PIN DE4H-XXXD41AC*** 40PIN DE0P%-XXXD41AC*** 44PIN DE4P%-XXXD41AC*** DEE4H-XXXD53BC*** DEE4%-XXXD53BC*** Wide Temp. OP (-40°C~+85°C) 40PIN DE0H-XXXD41AW*** 44PIN DE4H-XXXD41AW*** 40PIN DE0P%-XXXD41AW*** 44PIN DE4P%-XXXD41AW*** DEE4H-XXXD53BW*** DEE4%-XXXD53BW*** Note xxx = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A2, 256GB=B56) ***= flash configuration (internal control code), %=Horizonyal type(A,B,C,D,E,F) EDC The Innodisk Embedded Disk Card (EDC) complies with PCMCIA* ATA standards and fits into all platforms with an IDE connector. The Innodisk Embedded Disk Card comes in capacities ranging from 512MB to 256GB and is available in 40-pin and 44-pin connector packages.
37Product specifications are subject to change without prior notice. USB The Innodisk industrial-grade USB series is built using SLC NAND flash and features an attractive small form factor. It provides high-capacity flash memory storage while delivering faster data transmission with high reliability. It also complies with the high-speed USB 3.0 interface and is backward compatible with USB 1.1. The Innodisk USB series has a variety of special features, from plastic and metal housing to secure mounting holes to EDC choices. Model Name USB Drive 3SE USB Drive 3ME USB Drive 2SE Key Features 1. Metal housing to enhance ESD protection 2. 30μ golden finger for highly reliable data transfer quality 1. Metal housing to enhance ESD protection 2. 30μ golden finger for highly reliable data transfer quality Interface USB 3.0 USB 2.0 Connector Type A Type A Flash Type SLC MLC SLC Capacity 4GB~32GB 8GB~64GB 512MB~16GB Max. Channel 1 1 1 Sequential R/W (MB/sec, max.) 100/85 100/50 28/24 Max. Power Consumption 0.70W (5V x 140mA) 0.85W (5V x 170mA) Dimension (WxLxH/mm) 16.5 x 45.8 x 7.6 16.5 x 45.8 x 7.4 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEUA1-XXXI61SC*** DEUA1-XXXI61BC*** DEUA1-XXXI72AC*** WideTemp.OP(-40°C~+85°C) DEUA1-XXXI61SW*** DEUA1-XXXI61BW*** DEUA1-XXXI72AW*** Notes XXX = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) Model Name USB EDC Vertical 3SE USB EDC Vertical 3ME USB EDC Horizontal 2SE USB EDC Horizontal 2ME USB EDC Vertical 2SE USB EDC Vertical 2ME Key Features 1. High performance with USB 3.0 interface 2. Low power consumption 3. Wear-Leveling supported 1. Supported mounting hole 2. 2.0/2.54 pin pitch 1. Very low profile 2. Low power consumption Interface USB 3.0 USB 2.0 USB 2.0 Connector Standard, 20pin, 2.00mm Standard 9pin, 2.54mm Low profile 9pin, 2.00mm Standard, 9pin, 2.54mm Flash Type SLC MLC SLC MLC SLC MLC Capacity 4GB~32GB 8GB~64GB 512MB~32GB 8GB~128GB 512MB~16GB 8GB~64GB Max. Channel 1 1 1 1 1 1 Sequential R/W (MB/sec, max.) 110/85 100/50 28/24 27/18 28/24 26/18 Max. Power Consumption 0.79W (5V x 158mA) 0.85W (5V x 170mA) 0.85W (5V x 170mA) Dimension (WxLxH/mm) 24.0 x 22.0 x 5.0 26.6 x 36.9 x 9.6 (Pin Pitch2.54) 26.6 x 36.9 x 6.6 (Pin Pitch2.00) 15.2 x 34.1 x 6.4 Environment Vibration: 20G@7~2000Hz/Shock: 1500G@0.5ms/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEUV1-XXXI61SC*** DEUV1-XXXI61BC*** DEUH1-XXXI72AC*** DEUH2-XXXI72AC*** DEUH1-XXXI72BC*** DEUH2-XXXI72BC*** DEUV1- XXXI72AC*** DEUV1- XXXI72BC*** WideTemp.OP(-40°C~+85°C) DEUV1-XXXI61SW*** DEUV1-XXXI61BW*** DEUH1-XXXI72AW*** DEUH2-XXXI72AW*** DEUH1-XXXI72BW*** DEUH2-XXXI72BW*** DEUV1- XXXI72AW*** DEUV1- XXXI72BW*** Notes XXX = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, ) ***= flash configuration (internal control code)
38 Software Solutions With our newest Innodisk Cloud Administration Platform (iCAP™) we offer complete storage monitoring services for IoT applications. In addition, our extensive software portfolio is designed to meet the growing needs of integration in the embedded and industrial market. Software portfolio: • iCAPTM – Cloud Administration Platform • iSMARTTM –Flash Device Management • iTrackerTM –SD Card and USB Management • iCoverTM – System Recovery • iOpalTM – Self-Encrypting Drive Management
39Product specifications are subject to change without prior notice. Innodisk Cloud Administration Platform iCAP™ iCAP™ is a browser-accessed management platform that allows you to monitor the status of solid state drives (SSD), memory and other components in edge devices. It does this by gathering data from all connected devices and storing it on a central server, either on the cloud or on a company intranet. From here the data is easily accessible from your cell phone, pad or laptop with online access. System Architecture iCAP Dashboard Management Interface Effectively monitor remote device status Keep tabs on current CPU and Memory loading By analyzing the read/ write behavior of connected storage devices, iCAP can accurately predict remaining storage device lifetime User-friendly monitoring function allowing the user to manage and analyze storage information in detail Customizable widgets including gauges, Google Maps, and various tables presenting device data The web page dashboard enables the user to easily manage connected devices through supported browsers · Cloud · On-premise iCAP Dashboard iCAP Server AIoT Devices (iCAP Agent) Data Collection Smart Management Remote Control
40 iCAP Advantage System Requirements Web Service Server Agent Web browsers that supports HTML5, CSS3, JavaScript: Microsoft Internet Explorer 10+ I Google Chrome:9.0+ I Firefox:15.0+ I Safari:5.1+ Hardware Minimum Requirements: IntelR Core™ i3 2.3 Ghz CPU or above I 4 GB RAM I 20 GB root partition for the system I 100 GB data storage Operating System: Ubuntu 14.04+ I Docker 17.03+ Hardware: Bundled with Innodisk Storage products Operating System: Windows 10/8.1/7/XP kernel 32/64-bits I Ubuntu 16.04 64-bits I Debian 8 64-bits I Others by request High Compatibility The iCAP agent application supports devices running on both Windows and Linux and will seamlessly integrate any device not already supported by iCAP. Flexible Dashboard User can freely alter the dashboard and choose the parameters and widgets relevant to their application. Easy Access iCAP can be run on a long list of supported web browsers, allowing quick access with internet connectivity, no matter where you are located. Effective Event Tracker The event notification tracker will log all changes and keep the user up to speed, enabling a swift resolution to any issues that might occur. System Backup & Recovery iCAP integrates Innodisk’s proprietary iCover tool that allows for remotely initialized system backup and recovery
41Product specifications are subject to change without prior notice.41 iSMART iSMART is designed to simplify SMART information and provide an easy to read interface for the user. The iSMART tool monitors the health and lifespan of Innodisk's SSDs and also provides details on usage patterns. Alerts are easily configured to issue warnings before any critical errors can occur. With iSMART, the user is able to properly integrate Innodisk's SSDs into their solutions by carefully monitoring behavior and lifespan during development, integration, and mass production. Dashboard The Dashboard’s home tab aims to provide a summary or quick snapshot of each installed disks in the system. This page offers accurate data information regarding Temperature, Health, Capacity, Lifespan, iAnalyzer, and Notifications. Device Information The Device Information page provides additional functions, such as Power Status, Partitions, and detailed information of the device such as Serial Number, Firmware Vision, Interface, and Features. To learn more about SMART information, go to SMART values and refer to the SMART tab. iAnalyzer When activated, the iAnalyzer tab displays the read/ write behaviors of the SSD in real time. This allows the user to understand their application usage of the SSD. Sequential and Random I/Os are easily broken down into percentages making them easy to read. Alert The Alert tab helps the user set trigger points with Temperature, Health percentage, Remaining Capacity or Life Remaining. If these trigger points exceed their boundaries, the iSMART utility can send a warning and email to the user notifying them that something may fail. PCIe NVMe Support iSMART supports logging for PCIe NVMe devices. The user can easily check the PCIe storage device health status. iSMART for Linux The iSMART Linux version provides every storage device’s SMART values by vender command, and also fully supports the iAnalyzer function.
42 iTracker is Innodisk's dedicated software tool for SD 3.0 cards and USB products. It offers a customizable approach to accessing flash card SMART values. Compatibility with both Windows and Linux systems and an intuitive user interface ensures an easy system integration and user experience. Features: • Dedicated Innodisk Industrial SD Card and USB Management Software • Intuitive visualized SMART information • Flexible widgets for customized requirements • Support for both Windows & Linux systems iTracker SD Information ž iTracker enables easy access to SD card and USB series information ž SD 3.0 (Hyperstone) - Product name - FW version - Correction capability for flash - Total number of flash block ž SD 3ME3 (SM2702) - Product name - Bus width - Speed class - Speed grade USB Information ž USB series product (SM3268) - Product name - Manufacture - Serial number - Firmware version - Package version - P/E cycles SMART ž The iTracker SMART page shows more details about device health status and helps the user predict remaining lifespan ž Write protect feature can also easily be enabled and disabled System Page ž iTracker system page enables the user to easily check system information
43Product specifications are subject to change without prior notice.43 Reliable backup and recovery for your industrial system through intuitive and simple one-key software iCover is an easy-to-use, highly-customized backup and recovery software tool designed for industrial computers. iCover will not only recover the operation system, but also all of the applications, drivers and personal data by using the recovery image. It is fully compatible with Microsoft Windows and Linux operating systems. Even if the system should become unresponsive, this quick recovery tool will restore it to its original state. Advantage iCover One-key recovery Easy partition backup Support backup and recovery of operating system to network files system Replaceable logo Remote Backup and Recovery Support SMB/CIFS protocol to backup and recover system image Intelligent disk management Create and manage the partitions of your system System Requirements Items iCover Processor 1GHz or faster RAM 2GB Supported Devices Innodisk Storage Devices OS Support Windows: Windows XP/7/8.1/10 I Windows Embedded Series Linux: Ubuntu/Yotco/CentOS File System Windows: NTFS/FAT32 Linux: Ext4/Ext3/Ext2 UEFI BIOS Support Supports legacy/ UEFI BIOS recovery Intuitive GUI operation Switch between user mode and recovery mode with the touch of a button
44 Advantages User-friendly Gives an intuitive user interface to the TCG Opal 2.0 specifications and SED management while supporting up to 5 devices simultaneously. Multi-function iOpal's data storage management features are designed to enhance data security and communication with the host system. From Factor 3MG2-P with AES 2.5” SSD, M.2(S42,S80), mSATA, SATA Slim 3SE2-P with AES 2.5” SSD, 1.8” SSD TCG Opal-Compliant Software The TCG defined standard for self-encrypting drives (SED) emphasizes data security and ease of use. Innodisk’s software conforms to this standard and can provide a simple and intuitive way to handle SED management. The software allows the user to easily define different ranges for different users – allowing for a system where data is shared on a strictly need-to-know basis. Windows 7 / Windows 10 / Linux Ubuntu / Linux Fedora Supported OS List iOpal Revert function can be divided into two levels, which are representative of different reverting contents. Limits permissions toward self-encrypting drives, need correspondence to the relevant credentials or passwords for the different levels of functions Pre Boot-up Authorization(PBA) is a process used to add a shadow Master Boot Record (MBR) region and implement the boot-up authoriza- tion procedure by entering correct password Set locking range allows setting up divided locking range for different authorizations Device locking setting information High compatibility: iOpal is available in both Windows and Linux versions for a much broader applicability
45Product specifications are subject to change without prior notice. DRAM DRAM Modules Innodisk’s industrial-grade DRAM series features high-quality memory modules that have been specifically designed and developed for industrial computers and similar applications. Our specialized SPD team is ready to provide system designers with a complete turn-key solution for any engineering requirements. Innodisk’s DRAM modules are categorized to meet different systems’ needs, and supports DDR4, DDR3, DDR2, DDR, and SDRAM. Our DRAM modules are available in 4 product lines: Embedded, Server, Wide Temperature, and Special Customized. Innodisk’s comprehensive range of DRAM modules includes: Unbuffered DIMM, Unbuffered SO-DIMM, Unbuffered ECC DIMM, Unbuffered ECC SO-DIMM, Mini DIMM, and registered DIMM, conformal coated DRAM, and side filled DRAM.
46 iRAMTM iRAMAdvantages • Exclusive: Unique software developed by Innodisk • Precise: iRAM can detect IC failure within every piece of IC, including ECC IC status • Reliable & Stringent: iRAM integrates several tier 1 testing patterns for server platforms. This accurately simulates high-stress and heavy-loading condition and can filter out the potential unqualified modules efficiently • Authentic: iRAM is a web-based diagnostic tool that not only simulates multipoint servers and workstation computing scenarios but also detects unexpected issues where other software falls short Chamber test Packing Visual Inspection iRAM test Vibration test1 2 Open/ Short Test3 456 An Innodisk Exclusive Testing Software The testing quality and strictness of iRAM easily surpasses that of similar testing software. With this exclusive Innodisk tool, any underperforming components will be quickly be identified and weeded out. Innodisk ECC & RDIMM Modules Testing Process Innodisk performs comprehensive quality checks after production. For ECC and RDIMM modules, we can ensure the highest quality, reliability, and performance that ultimately will reduce your maintenance cost. The Strengths of iRAM Precise Exclusive Stringent Reliable Authentic iRAM
47Product specifications are subject to change without prior notice. IC Grade IC Hierarchy Distinguishing Original from Lower Grade IC Why do we only use “Original IC”? Original IC Original IC (Innodisk) -Fully tested by major IC suppliers Effectively Tested DRAM - Effectively tested but test patterns can vary by suppliers - Logo unmarked or only marked with partial IC part number Untested DRAM - Untested - Logo unmarked Low Grade - DRAM IC with unknown quality confirmed as not having full data sheet parts eTT uTT Low Grade 1.TopQuality Environmental and Application Challenges: The areas Innodisk operates in are industrial in nature. These areas give rise to harsh environments and a demand for long-lasting devices, which are the principal challenges we face. Innodisk uses original IC, not just for the quality guarantees, but also for the international expertise and experience of the manufacturer. Together, the original IC manufacturer and Innodisk offer the customer the most thorough dual guarantee that ensures that you are equipped to face any challenges in your way. Technology and market development: IoT, AI and AIoT are already solid trends that are actively pursued by the actors in the industrial and embedded markets. High-quality original ICs are necessary to meet the needs of heavy workloads and the high-performance requirements seen in these applications. 2.OriginalManufacturerReport Any device operating under long periods of time will be susceptible to break down and damage. Original man can not only help recycle faulty products and repair damaged ICs, but also provides a complete repair report. This will allow the customer to better understand the reason behind the malfunction and take the necessary steps to avoid future occurrences. However, the original manufacturer will not acknowledge lower grade ICs (as these are third party) and will neither provide a repair report. Samsung Manufacturer logo for example IC P/N 1. No Manufacturer Logo 2. Incomplete IC P/N 3. Incomplete Manufacturer Code Manufacture code Original IC Lower Grade IC
48 Embedded UDIMM modules are DRAM modules meant to be used as standard products for general embedded applications. These modules are compliant with JEDEC standards and available in DDR1, DDR2, DDR3, and DDR4. Embedded UDIMM Series Standard Solution Module Type DDR4 UDIMM DDR3 UDIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 2GB/4GB/8GB/16GB/32GB 2GB/4GB/8GB Function Non-ECC Unbuffered Memory Pin Number 288pin 240pin Width 64Bits 64Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Anti-Sulfuration √ — Value-Added Service (Optional) Conformal Coating / Side Fill Series Standard Solution Module Type DDR2 UDIMM DDR UDIMM Data Rate 533 MT/s, 667 MT/s, 800 MT/s 333 MT/s, 400 MT/s Capacity 1GB/2GB/4GB 512MB/1GB Function Non-ECC Unbuffered Memory Pin Number 240pin 184pin Width 64Bits 64Bits Voltage 1.8V 2.6V PCB Height 1.18 Inches 1.16 Inches Operating Temperature 0 ~ 85°C 0 ~ 70°C Anti-Sulfuration — — Value-Added Service (Optional) Conformal Coating / Side Fill
49Product specifications are subject to change without prior notice. Small-outline DIMMs (SODIMM) modules are general DRAM modules meant to be usesd as standard products for embedded applications with limited space. These modules are compliant with JEDEC standards and help in eliminating the need for changing designs due to limited space. Embedded SODIMM Series Standard Solution Module Type DDR4 SODIMM DDR3 SODIMM DDR2 SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 533 MT/s, 667 MT/s, 800 MT/s Capacity 2GB/4GB/8GB/16GB/32GB 1GB/2GB/4GB/8GB 512MB/1GB/2GB/4GB Function Non-ECC Unbuffered Memory Pin Number 260pin 204pin 200pin Width 64Bits 64Bits 64Bits Voltage 1.2V 1.5V/1.35V 1.8V PCB Height 1.18 Inches 1.18 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Anti-Sulfuration √ — — Value-Added Service (Optional) Conformal Coating / Side Fill Series Standard Solution Module Type DDR SODIMM SDRAM SODIMM Data Rate 333 MT/s, 400 MT/s 100 MT/s, 133 MT/s Capacity 256MB/512MB/1GB 128MB/256MB/512MB Function Non-ECC Unbuffered Memory Pin Number 200pin 144pin Width 64Bits 64Bits Voltage 2.6V 3.3V PCB Height 1.25 Inches 1.25 Inches Operating Temperature 0 ~ 70°C 0 ~ 70°C Anti-Sulfuration — — Value-Added Service (Optional) Conformal Coating / Side Fill
50 Server Registered DIMM modules are designed to ensure data integrity at both the device and system level of the server. In addition, all Innodisk Registered DIMM modules are tested by our exclusive iRAM testing software to ensure stable performance. Registered DIMM Series Server Solution Module Type DDR4 RDIMM DDR3 RDIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB/16GB/32GB* 2GB/4GB/8GB Function Registered Memory with ECC Pin Number 288pin 240pin Width 72Bits 72Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ (*With exception of the 32GB module) — Wide Temperature Designed for industrial systems, Innodisk’s Wide Temperature DRAM modules are the best choice for applications operating in harsh conditions. Our wide temperature modules use industrial-grade SDRAM components with 30u” Gold fingers to ensure that the memory maintains its high-quality signal, even at temperatures as low as -40ºC or as high as 85ºC. Wide Temperature Unbuffered DIMM Series Wide Temperature Solution Module Type DDR4 WT UDIMM DDR3 WT UDIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB/16GB/32GB 2GB/4GB/8GB Function Non-ECC Unbuffered Memory Pin Number 288pin 240pin Width 64Bits 64Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ — Value-Added Service (Optional) Conformal Coating / Side Fill
51Product specifications are subject to change without prior notice. Series Wide Temperature Solution Module Type DDR4 WT SODIMM DDR3 WT SODIMM DDR2 WT SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 533 MT/s, 667 MT/s, 800 MT/s Capacity 4GB/8GB/16GB/32GB 2GB/4GB/8GB 1GB/2GB Function Non-ECC Unbuffered Memory Pin Number 260pin 204pin 200pin Width 64Bits 64Bits 64Bits Voltage 1.2V 1.5V/1.35V 1.8V PCB Height 1.18 Inches 1.18 Inches 1.18 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration √ — — Value-Added Service (Optional) Conformal Coating / Side Fill Wide Temperature Unbuffered DIMM with ECC Series Wide Temperature Solution Module Type DDR4 WT ECC UDIMM DDR4 WT ECC SODIMM DDR3 WT ECC UDIMM DDR3 WT ECC SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB/16GB/32GB 4GB/8GB/16GB/32GB 2GB/4GB/8GB 2GB/4GB/8GB Function ECC Unbuffered Memory Pin Number 288pin 260pin 240pin 204pin Width 72Bits 72Bits 72Bits 72Bits Voltage 1.2V 1.2V 1.5V/1.35V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches 1.18 Inches 1.18 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ √ √ Anti-Sulfuration √ √ — — Value-Added Service (Optional) Conformal Coating / Side Fill Wide Temperature ECC DIMMs are designed for both industrial systems and servers, Innodisk’s Wide Temperature DRAM modules are best suited for applications that must work in extreme temperatures. With the ECC function, the Wide Temperature DIMMs also ensure that data is corrected when corrupted data bits are found during data retrieval.
52 Series ECC Unbuffered DIMM Solution Module Type DDR4 ECC UDIMM DDR4 ECC SODIMM DDR4 ECC UDIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB/16GB/32GB 4GB/8GB/16GB/32GB 4GB/8GB/16GB Function ECC Unbuffered Memory Pin Number 288pin 260pin 288pin Width 72Bits 72Bits 72Bits Voltage 1.2V 1.2V 1.2V PCB Height 1.23 Inches 1.18 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration √ √ √ Value-Added Service (Optional) Conformal Coating / Side Fill ECC modules are designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend original data. ECC DIMM Series ECC Unbuffered DIMM Solution Module Type DDR4 ECC SODIMM VLP DDR3 ECC UDIMM DDR3 ECC SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB 2GB/4GB/8GB 2GB/4GB/8GB Function ECC Unbuffered Memory Pin Number 260pin 240pin 204pin Width 72Bits 72Bits 72Bits Voltage 1.2V 1.5V/1.35V 1.5V/1.35V PCB Height 0.7 Inches 1.18 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration √ Value-Added Service (Optional) Conformal Coating / Side Fill Designed for industrial systems, Innodisk’s Wide Temperature DRAM modules are best suited for applications that must work in extreme temperatures. These modules use industrial-grade SDRAM components with 30u” gold finger to ensure that the memory maintains its high- quality signal, even at temperatures as low as -40ºC or as high as 85ºC. Wide Temperature Registered DIMM Series Wide Temperature Solution Module Type DDR4 WT RDIMM DDR4 WT RDIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB/16GB/32GB* 32GB* is only for 2133MT/s and 2400MT/s 4GB*/8GB/16GB 4GB* is only for 2133MT/s and 2400MT/s Function Registered Memory with ECC Pin Number 288pin 288pin Width 72Bits 72Bits Voltage 1.2V 1.2V PCB Height 1.23 Inches 0.738 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ √ Value-Added Service (Optional) Conformal Coating / Side Fill
53Product specifications are subject to change without prior notice. Series ECC Unbuffered Memory Solution Module Type DDR3 ECC UDIMM VLP DDR3 ECC SODIMM ULP DDR2 ECC UDIMM Data Rate 1333 MT/s, 1600 MT/s, 1866 MT/s 1333 MT/s, 1600 MT/s 667 MT/s, 800 MT/s Capacity 2GB/4GB/8GB 2GB/4GB 1GB/2GB Function ECC Unbuffered Memory ECC Unbuffered Memory ECC Unbuffered Memory Pin Number 240pin 204pin 240pin Width 72Bits 72Bits 72Bits Voltage 1.5V/1.35V 1.5V/1.35V 1.8V PCB Height 0.738  Inches 0.709  Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill Very Low-Profile (VLP) DIMM modules and Ultra Low-Profile (ULP) DIMM modules are specialized for use in 1U systems, such as blade server data centers, where the system height is lower than 1.18 inches. The design of these modules improves air flow inside a compact system and reduces thermal impact. Very Low-Profile (VLP) DIMM and Ultra Low-Profile (ULP) DIMM Series Very Low-Profile (VLP) Solution Module Type DDR4 UDIMM VLP DDR4 ECC UDIMM VLP DDR4 SODIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB/16GB 4GB/8GB/16GB 4GB/8GB Function Non-ECC Unbuffered Memory ECC Unbuffered Memory Non-ECC Unbuffered Memory Pin Number 288pin 288pin 260pin Width 64Bits 72Bits 64Bits Voltage 1.2V 1.2V 1.2V PCB Height 0.738 Inches 0.738 Inches 0.7 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ Anti-Sulfuration √ √ √ Value-Added Service (Optional) Conformal Coating / Side Fill Series Very Low-Profile (VLP) Solution Module Type DDR4 ECC SODIMM VLP DDR4 RDIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB 4GB/8GB/16GB/32GB Function ECC Unbuffered Memory Registered Memory with ECC Pin Number 260pin 288pin Width 72Bits 72Bits Voltage 1.2V 1.2V PCB Height 0.7 Inches 0.738  Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ √ Value-Added Service (Optional) Conformal Coating / Side Fill
54 Series Ultra Low-Profile (ULP) Solution Very Low-Profile (VLP) Solution Module Type DDR3 ECC SODIMM ULP DDR3 RDIMM VLP Data Rate 1333 MT/s, 1600 MT/s 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 2GB/4GB 4GB/8GB Function ECC Unbuffered Memory Registered Memory with ECC Pin Number 204pin 240pin Width 72Bits 72Bits Voltage 1.5V/1.35V 1.5V/1.35V PCB Height 0.709 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill All Mini DIMMs are targeted for high speed, high density, high performance telecommunication and cloud systems. The 0.72 inch high ULP Mini DIMM module is specifically designed for networking applications. They are compliant with JEDEC standards and are designed to improve airflow and thermal resistance. With the ECC function, the Mini DIMMs also ensure that data is corrected when corrupted data bits are found during data retrieval. Mini DIMM Series Mini DIMM Solution Module Type DDR4 Mini ECC VLP DDR4 Mini RDIMM VLP Data Rate 2133MT/s, 2400 MT/s Capacity 4GB/8GB/16GB 4GB/8GB Function ECC Unbuffered Memory Registered Memory with ECC Pin Number 288pin Width 72Bits Voltage 1.2V 1.2V PCB Height 0.738 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ √ Value-Added Service (Optional) Conformal Coating / Side Fill Series Very Low-Profile (VLP) Solution Module Type DDR3 UDIMM VLP DDR3 ECC UDIMM VLP DDR3 SODIMM VLP Data Rate 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 1333 MT/s, 1600 MT/s, 1866 MT/s 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 2GB/4GB/8GB 2GB/4GB/8GB 2GB/4GB/ 8GB Function Non-ECC Unbuffered Memory ECC Unbuffered Memory Non-ECC Unbuffered Memory Pin Number 240pin 240pin 204pin Width 64Bits 72Bits 64Bits Voltage 1.5V/1.35V 1.5V/1.35V 1.5V/1.35V PCB Height 0.738 Inches 0.738 Inches 1.0 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill
55Product specifications are subject to change without prior notice. Series Mini DIMM Solution Module Type DDR3 Mini DIMM ECC ULP DDR3 Mini DIMM RDIMM DDR3 Mini RDIMM VLP Data Rate 1066 MT/s, 1333 MT/s, 1600 MT/s Capacity 2GB/4GB 8GB 2GB/4GB Function ECC Unbuffered Memory Registered Memory with ECC Registered Memory with ECC Pin Number 244pin Width 72Bits Voltage 1.5V/1.35V 1.5V/1.35V 1.5V/1.35V PCB Height 0.7 Inches 1.18 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill Special / Customized In order to meet the high standards of the aerospace and defense industry, our XR-DIMM comes equipped with several advantages which will satisfy your expectation for robust DRAM modules. We offer three densities of DDR4 XR-DIMM, 4GB, 8GB & 16GB, both with an integrated error checking and correction function. With its 300-pin socket connector, Innodisk’s XR-DIMM exceeds the pin number standard established by the SFF Special Interest Group (SFF-SIG), ensuring a firm connection between the CPU and DRAM module. This customized design enables XRDIMM to be highly resistant to shock and vibration, providing a more reliable performance for the aerospace and defense vertical market. XR-DIMM Series XR-DIMM Solutions Module Type DDR4 XR-DIMM DDR3 XR-DIMM Data Rate 2400 MT/s 1600MT/s, 1866 MT/s Capacity 8GB/16GB 4GB/8GB Function ECC Unbuffered Memory Non-ECC Unbuffered Memory ECC Unbuffered Memory Non-ECC Unbuffered Memory Pin Number 300pin 300pin Width 72Bits 64Bits 72Bits 64Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.18 Inches 1.49 Inches Anti-sulfuration √ √ Mounting Hole 2 2 2 2 Value-Added Service (Optional) Conformal Coating / Side Fill/Wide Temperature
56 Embedded Peripheral Modules Embedded Peripheral Modules provide LAN, PoE, CANBus, DIO, Serial Port, Storage, RAID and Display functionality to embedded systems. In order to enrich industrial customer’s embedded solutions with flexibility at the best TCO (Total Cost of Ownership), we are dedicated to creating expandable, space-efficient expansion modules. Innodisk is experienced with the most common interface which include PCIe, USB, SATA and is able to provide this functionality in the wide range of space-saving form factors available today. Just like Innodisk's esteemed memory solutions, our Standard PCIe, mPCIe, 2.5” SSD and M.2(NGFF) modules fit perfectly into any industrial system.
57Product specifications are subject to change without prior notice. When it comes to motherboards, adding additional input/ output ports will often require costly re-design. Innodisk can offer solutions that allow for easily implemented expansions on already existing motherboards, saving the system integrator from costly and time-consuming re-design. In other words, using a standard motherboard as a basis, Innodisk can assist you in creating various products according to different specifications. Through expansion slots such as PCIe, M.2, mPCIe, SATA and USB pin header Innodisk modules can easily expand to various I/O devices. Benefits 1. One motherboard for multiple products 2. Efficient components sharing 3. Accelerate the process of new products to the market 4. Significantly reduce development costs Traditional scenario : Standard mother board with different fixed I/O Innodisk Solution: Standard motherboard with Innodisk Efficient Modular Expansion Expansion Card Solutions Innodisk Efficient Modular Expansion Product Categories and I/O Descriptions Industrial design Industrial temperature (-40 ºC to 85 ºC) Up to ESD contact 8KV and air 15KV protection Up to 2.5 KV isolation to prevent damage your system
58 Fulfilling the Needs of Various Vertical Markets Transportation Transportation includes interfaces such as Power over Ethernet (PoE), CANbus and LAN. With Innodisk expansion cards, the system integrator can facilitate seamless connectivity and data safety for in-vehicle systems. Medical Medical industrial devices link to a variety of other devices, such as: VOIP phones, web cameras, high quality speakers, MSR and bar code scanners. These devices commonly use USB and serial interfaces. A RAID solution offers strong data integrity for critical applications. Automation Industrial control units using RS422/485 signals to control devices requires solid Ethernet network extensions. HMI devices are used to display important data regarding ongoing operations. Retail Retail industry includes point-of-sales, kiosk and digital signage products. This kind of equipment runs on Serial and USB expansions. In addition, digital signage usually need to support multi-screen, can use Innodisk’s display expansion card which supports up to three screens at the same time.
59Product specifications are subject to change without prior notice. Innodisk expansion modules aim to provide flexible connectivity and bandwidth to industrial systems. With our mPCIe GbE LAN, PoE, CANBus and serial communication modules, users can expand the existing system to meet dynamic connectivity under IoT. CANBus (Controller Area Network) is a type of serial communication that is widely used in automation, embedded systems and the automotive industry. Innodisk has developed the EMUC-B202 CANbus expansion card specifically to fulfill these needs. It provides dual-port CAN 2.0B/ J1939 connectivity with an isolation design, and supports a wide temperature range in order to enhance system security and reliability. Based on an inbuilt Linux CDC-ACM, the Innodisk EMUC-B202 uses a custom-made SocketCAN network driver that allows two ports on a single card. Thus, it provides maximum compatibility for customers when developing programs. Other than SocketCAN, Innodisk also provides complete Windows/Linux software API, test utility and sample code for traditional character drivers. Complete Software Support Model Name EMUC-B202 EGPC-B201 Module Type USB to dual isolated CANbus 2.0B/J1939 Module M.2 to dual isolated CANbus 2.0B/J1939 Module Key Features 1. CANbus 2.0B backward compatible with 2.0A 2. Support baud rate 100/125/250/500(default)/800/1000K 3. Support CAN message acceptance filter 4. Keep configuration after hardware reboot 5. Up to 6000 CAN messages per second (receive data) 6. Support Listen-only mode 7. Additional driver to support Linux SocketCAN 8. Support SAE J1939 high layer protocol (Optional) 9. Termination resistor enabled/disabled by jumper 10. Supports 3rd  mounting hole and USB Pin header for out-of-minicard installation 11. Complies with EN61000-4-5 2.5kV Surge protection 12. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 13. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 14. Industrial temperature -40 ºC to 85 ºC 1. Alternative M.2 2260 or 2280 B-M key 2. CANbus 2.0B backward compatible with 2.0A 3. Support baud rate 100/125/250/500(default)/800/1000K 4. Support CAN message acceptance filter 5. Keep configuration after hardware reboot 6. Up to 6000 CAN messages per second (receive data) 7. Support Listen-only mode 8. Additional driver to support Linux SocketCAN 9. Support SAE J1939 high layer protocol (Optional) 10. Termination resistor enabled/disabled by jumper 11. Complies with EN61000-4-5 2.5kV Surge protection 12. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 13. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 14. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe M.2 2260/2280 Input I/F USB 2.0 PCI Express 2.0 Input Connector mPCIe or 5Pin Header M.2 B-M Output I/F CANbus 2.0B/J1939 x 2 CANbus 2.0B/J1939 x 2 Output Connector DB-9 x 2 DB-9 x 2 Dimension (WxLxH/mm) 30 x 50.9 x 6.1 22 x 60 x 6.1 22 x 80 x 6.1 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Order Info. EMUC-B202-W1 (CAN 2.0B) EMUC-B202-W2 (J1939) EGPC-B201-W1 (2280, CAN2.0B) EGPC-B201-W2 (2280, J1939) EGPC-B201-W3 (2260, CAN2.0B) EGPC-B201-W4 (2260, J1939) Communication 1-1 CANbus SocketCAN CAN 2.0A/2.0B Galvanic Isolation SAE J1939 SAE J1939CAN bus H L ISOLATION API Sample Code By using GUI or Command base test utility the user can easily verify modules Test Utility Provides C/C++/C# sample code to speed up program integration Platform Support API can be used in Windows, Linux and QNX. Other than x86 system, a cross-compiler service for ARM system is also available.
60 Model Name EMPL-G2P1 EMPL-G2P2 EGPL-G2P1 ESPL-G4P1 Module Type mPCIe to dual Isolated PoE Module mPCIe to dual Isolated PoE+ Module M.2 to dual Isolated PoE Module PCIe to four isolated PoE/PoE+ Module Key Features 1. Supports dual isolated GbE LAN ports 2. Two independent PSE channels 3. Supports 12V~24V power input via 4pin header or DC-Jack 4. Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port 5. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 1.7KV HiPOT protection 6. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. Supports dual isolated GbE LAN ports 2. Two independent PSE channels 3. Supports 19V~24V power input via 4pin header 4. Complies with IEEE 802.3at, up to 25.5W at 52V per PoE port 5. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 1.7KV HiPOT protection 6. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. Supports dual isolated GbE LAN ports 2. Two independent PSE channels 3. Supports 12V~24V power input via 4pin header or DC-Jack 4. Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port. 5. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 1.7KV HiPOT protection 6. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. Supports four isolated GbE LAN ports 2. Four independent PSE channels 3. Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port 4. Complies with IEEE 802.3at, up to 25.5W at 54V per PoE port 5. Supports 12V~24V power input via 6pin PCIE-ATX 6. Supplies total power up to 75W 7. Complies with EN61000-4-5 2kV Surge protection 8. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection Form-Factor mPCIe mPCIe M.2 2280 Standard PCIe Input I/F PCI Express 2.1 PCI Express 2.1 PCI Express 2.1 x 1 PCI Express 2.1 Input Connector mPCIe mPCIe M.2 B-M PCIe x 4 Output I/F PoE x 2 PoE+ x 2 PoE x 2 PoE/PoE+ x 4 Output Connector RJ45 x 2 RJ45 x 2 RJ45 x 2 RJ45 x 4 Dimension (WxLxH/mm) 30 x 50.9 x 7.6 30 x 50.9 x 7.6 22 x 80 x 7.1 169.55 x 111.15 x 19.6 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPL-G2P1-C1 (Mounting hole, 4pin header) EMPL-G2P1-W1 (Mounting hole, 4pin header) EMPL-G2P1-C2 (Bracket, 4pin header) EMPL-G2P1-W2 (Bracket, 4pin header) EMPL-G2P1-C3 (Mounting hole, DC Jack ) EMPL-G2P1-W3 (Mounting hole, DC Jack) EMPL-G2P1-C4 (Bracket, DC Jack) EMPL-G2P1-W4(Bracket, DC Jack) EMPL-G2P2-C1 (Mounting hole, 4pin header) EMPL-G2P2-W1 (Mounting hole, 4pin header) EMPL-G2P2-C2 (Bracket, 4pin header) EMPL-G2P2-W2 (Bracket, 4pin header) EGPL-G2P1-C1 (Mounting hole, 4pin header) EGPL-G2P1-W1 (Mounting hole, 4pin heade) EGPL-G2P1-C2 (Bracket, 4pin heade) EGPL-G2P1-W2 (Bracket, 4pin header) EGPL-G2P1-C3 (Mounting hole) EGPL-G2P1-W3 (Mounting hole, DC Jack) EGPL-G2P1-C4 (Bracket, DC Jack) EGPL-G2P1-W4 (Bracket, DC Jack) ESPL-G4P1-C1 ESPL-G4P1-W1 The Industrial-grade Power over Ethernet (PoE) series complies with IEEE 802.3af and 802.3at, ensuring reliable power and data transfer. These expansion cards feature isolated, wide temperature design and are certified to withstand HiPOT and surge occurrences, making it the optimal choice for operation in extreme conditions. 1-2 Power over Ethernet (PoE) Complete Form factor ž Compact and easily integrated form factors: PCIe / mPCIe / M.2 2280 Flexible Expansion ž Supports 12~24V power input via internal 4 pin header or external DC Jack ž Supports alternative fixed approach of mounting hole or bracket for daughter board Industrial Design ž Supports wide temperature -40° ~ +85°C ž Complies with EN61000-4-2 (ESD) Air up to 15kV, Contact up to 8kV ž Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 HiPOT protection ž Complies with EN61000-4-5 Surge protection
61Product specifications are subject to change without prior notice. Model Name EMPL-G101 EMPL-G201 EMPL-G102 EMPL-G202 Module Type mPCIe to single isolated GbE LAN Module mPCIe to dual isolated GbE mPCIe to single isolated GbE LAN horizontal Module mPCIe to dual isolated GbE LAN horizontal Module Key Features 1. Single isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Supports mounting terminal or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Supports mounting terminal or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Single isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe mPCIe mPCIe Input I/F PCI Express 2.1 PCI Express 2.1 PCI Express 2.1 PCI Express 2.1 Input Connector mPCIe mPCIe mPCIe mPCIe Output I/F GbE LAN x 1 GbE LAN x 2 GbE LAN x 1 GbE LAN x 2 Output Connector RJ45 x 1 RJ45 x 2 RJ45 x 1 RJ45 x 2 Dimension (WxLxH/mm) 30 x 50.9 x 7.6 30 x 50.9 x 7.6 30 x 50.9 x 5.8 30 x 50.9 x 5.8 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPL-G101-C1 EMPL-G101-W1 EMPL-G101-C2 (with bracket) EMPL-G101-W2 (with bracket) EMPL-G201-C1 EMPL-G201-W1 EMPL-G201-C2 (with bracket) EMPL-G201-W2 (with bracket) EMPL-G102-C1 (Terminal mounting hole, Standard Temp.) EMPL-G102-W1 (Terminal mounting hole , Wide Temp.) EMPL-G102-C2 (Bracket, Standard Temp.) EMPL-G102-W2 (Bracket, Wide Temp.) EMPL-G202-C1 (Terminal mounting hole, Standard Temp.) EMPL-G202-W1 (Terminal mounting hole , Wide Temp.) EMPL-G202-C2 (Bracket, Standard Temp.) EMPL-G202-W2 (Bracket, Wide Temp.) mPCIe and M.2 based GbE LAN cards using Intel Ethernet chip provide high performance 10/100/1000 Mbps network connectivity with an isolation design, and supports a wide temperature range in order to enhance system security and reliability. Small form factor with flexible daughter board can be suitable for smaller industrial computer by using alternative terminal mounting hole of bracket. 1-3 GbE LAN Model Name EGPL-G101 EGPL-G201 EGPL-G102 EGPL-G202 Module Type M.2 to single isolated GbE LAN Module M.2 to dual isolated GbE LAN Module M.2 to single isolated GbE LAN Module M.2 to dual isolated GbE LAN Module Key Features 1. Single isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Single isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible and small daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible and small daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC Form-Factor M.2 2280 M.2 2280 M.2 2242 M.2 2242 Input I/F PCI Express 2.1 x 1 PCI Express 2.1 PCI Express 2.1 x 1 PCI Express 2.1 x 1 Input Connector M.2 B-M M.2 B-M M.2 B-M M.2 B-M Output I/F Gbe LAN x 1 GbE LAN x 2 Gbe LAN x 1 GbE LAN x 2 Output Connector RJ45 x 1 RJ45 x 2 RJ45 x 1 RJ45 x 2 Dimension (WxLxH/mm) 22 x 80 x 7.1 22 x 80 x 7.1 22 x 42 x 9.15 22 x 42 x 9.15 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EGPL-G101-C1 EGPL-G101-W1 EGPL-G101-C2 (with bracket) EGPL-G101-W2 (with bracket) EGPL-G201-C1 EGPL-G201-W1 EGPL-G201-C2 (with bracket) EGPL-G201-W2 (with bracket) EGPL-G102-C1 EGPL-G102-W1 EGPL-G202-C1 EGPL-G202-W1
62 Model Name EMP2-X202 EMP2-X402 EMP2-X203 EMP2-X403 Module Type mPCIe to dual RS-422/485 Module mPCIe to four RS-422/485 Module mPCIe to dual RS-232 Module mPCIe to four RS-232 Module Key Features 1. PCIe 2.0 compliant. RS-422/485 mode configurable by switch. Supports 485HD(Half Duplex) and 485FD (Full Duplex) 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable. 4. Termination Resistor by jumper setting. 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 compliant. RS-422/485 mode configurable by switch. Supports 485HD(Half Duplex) and 485FD (Full Duplex) 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable 4. Termination Resistor by jumper setting 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 16550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable 4. Supports CTS/RTS hardware flow control 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 16550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable 4. Supports CTS/RTS hardware flow control 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe mPCIe mPCIe Input I/F PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 Input Connector mPCIe mPCIe mPCIe mPCIe Output I/F RS-422/485 x 2 RS-422/485 x 4 RS-232 x 2 RS-232 x 4 Output Connector DB-9 x 2 DB-9 x 4 DB-9 x 2 DB-9 x 4 Dimension (WxLxH/mm) 30 x 50.9 x 8.2 30 x 50.9 x 8.2 30 x 50.9 x 6.7 30 x 50.9 x 6.7 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation EMP2-X202-W1 EMP2-X402-W1 EMP2-X203-W1 EMP2-X403-W1 Model Name EMP2-X404 EMP2-X801 EMU2-X1S1 EMU2-X2S1 Module Type mPCIe to four RS-232/422/485 Module mPCIe to eight RS-232/422/485 Module USB to single Isolated RS-232 Module USB to dual Isolated RS-232 Module Key Features 1. PCIe 2.0 compliant. RS-232/422/485 mode configurable by software 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Full RS-232 functions with DB9 connector 4. Termination resistor enabled/disabled by DIP switch 5. RI/5V/12V output switched by Jumper 6. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 compliant. RS-232/422/485 mode configurable by software 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Flexible design with cable and daughter board x 8 (with DB-9 connectors) 4. Termination Resistor and 5V/12V output by jumper setting on daughterboard 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. USB specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 512-byte FIFOs 3. Full RS232 functions with DB9 connector 4. Supports port-to-port and port-to- computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 5. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 6. Power LED, UART TX/RX access LED 7. Supports 3rd  mounting hole and USB Pin header for out-of-minicard installation 8. Industrial temperature -40 ºC to 85 ºC 1. USB specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 512-byte FIFOs 3. Full RS232 functions with DB9 connector 4. Supports port-to-port and port-to- computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Power LED, UART TX/RX access LED 7. Supports 3rd  mounting hole and USB Pin header for out-of-minicard installation 8. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe mPCIe mPCIe Input I/F PCI Express 2.0 PCI Express 2.0 USB 2.0 USB 2.0 Input Connector mPCIe mPCIe mPCIe or 5Pin Header mPCIe or 5Pin Header Output I/F RS-232/422/485 x 4 RS-232/422/485 x 8 RS-232 x 1 RS-232 x 2 Output Connector DB-9 x 4 DB-9 x 8 DB-9 x 1 DB-9 x 2 Dimension (WxLxH/mm) 30 x 50.9 x 6.1 30 x 50.9 x 6.1 30 x 50.9 x 6.1 30 x 50.9 x 6.1 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation EMP2-X404-W1 EMP2-X801-W1 EMU2-X1S1-W1 EMU2-X2S1-W1 Various mPCIe-expanded serial cards provide the combination of 2/4/8 ports RS232/RS422/RS485 with PCIe or USB input and ISOLATION/ ESD provides efficient system expansions. Software switches that can help switch the serial port RS232/RS422/485 without the need to open system chassis. 1-4 Serial Port
63Product specifications are subject to change without prior notice. Model Name EMP2-X4S1 EMP2-X4S2 EGP2-X401 Module Type mPCIe to four Isolated RS-485 Module mPCIe to dual Isolated RS-422 & RS-485 Module M.2 to four RS-232/422/485 Module Key Features 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 10 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Supports port-to-computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Termination Resistor by switch setting 6. Industrial temperature -40 ºC to 85 ºC 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 10 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Supports port-to-computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Termination Resistor by switch setting 6. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 compliant. RS-232/422/485 mode configurable by software 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Alternative vertical or horizontal connector 4. Full RS-232 functions with DB9 connector 5. Termination resistor enabled/disabled by DIP switch 6. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe M.2 2242 Input I/F PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 x 1 Input Connector mPCIe mPCIe M.2 B-M Output I/F RS-485 x 4 RS-422 x 2, RS-485 x 2 RS-232/422/485 x 4 Output Connector DB-9 x 4 DB-9 x 4 DB-9 x 4 Dimension (WxLxH/mm) 30 x 50.9 x 12.55 30 x 50.9 x 12.55 Vertical : 22 x 42 x 6.45 Horizontal : 22 x 42 x 7.65 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation EMP2-X4S1-W1 EMP2-X4S2-W1 EGP2-x401-W1 (Vertical connector) EGP2-x401-W2 (Horizontal connector) Model Name EMUI-0D01 Module Type USB to 32bit Digital I/O Module Key Features 1. 32bit digital I/O in 4 ports(each port 8bit) 2. Programmable I/O 3. Selectable VCCIO 3.3V or 5V by DIP switch 4. Buffered I/O (Output 5V, 32mA source, 32mA sink) (Output 3.3V, 24mA source, 24mA sink) 5. 4 external interrupts with rising/falling edge on port D 6. Keep configuration after hardware reboot 7. Supports 3rd mounting hole and USB Pin header for out-of-minicard installation 8. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 9. Industrial temperature(-40 ºC to 85 ºC) operation Form-Factor mPCIe Input I/F USB 2.0 Input Connector mPCIe or 5Pin Header Output I/F 32bit Digital I/O Output Connector 40pin 1.25mm (40DP-1.25 ) with DB37 male cable Dimension (WxLxH/mm) 30 x 50.9 x 8.2 Operating Temperature Wide temp : -40°~85°C Order Infomation EMUI-0D01-W1 1-5 DIO Digital I/O (Digital Input and Output). Digital Inputs allow a host system to detect logic states, and Digital Outputs allow a host system to output logic states. Innodisk digital input/output expansion cards aim to fulfil the IoT communication needs of industrial systems. We provide API, which supports Windows and Linux as well as test utilities and sample codes. Users can quickly verify the functionality of the card and easily integrate it into their applications. The Utility Console Programmable DIO Configurable Input / Output Status Setting Supports External Interrupt Input Status Change Notification
64 Innodisk provides RAID (Redundant Array of Independent Disks) modules to combine multiple types of embedded flash for the purposes of data redundancy or capacity aggregation. Model Name EMSS-32R1 EMPS-32R1 EGSS-32R1 Module Type mPCIe to dual SATA III RAID module mPCIe to dual SATA III RAID module M.2 2242 to SATA RAID module Key Features 1. Supports SATA to dual SATA III Port Multiplier 2. Supports H/W RAID 0/1 over SATA 3. optional USB 2.0 to dual SATA III 4. Industrial temperature -40 ºC to 85 ºC 1. PCIe to dual SATA III ports 2. Supports AHCI, Port-Multiplier 3. Supports Hardware RAID 0, RAID1 4. Industrial temperature -40 ºC to 85 ºC 1. Supports SATA to dual SATA III Port Multiplier 2. Supports H/W RAID 0/1 over SATA 3. Industrial temperature -40 ºC to 85 ºC Form-Factor mSATA mPCIe M.2 2242 Input I/F SATA III PCI Express 2.0 SATA III Input Connector mPCIe mPCIe M.2 B-M Output I/F SATA III SATA III SATA III Output Connector SATA 7 Pin x 2 SATA 7 Pin x 2 SATA 7 Pin x 2 Dimension (WxLxH/mm) 29.8 x 50.8 x 11.5 30.0 x 50.9 x 10.7 22.0 x 42.0 x 10.8 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMSS-32R1-C1 EMSS-32R1-W1 EMPS-32R1-C1 EMPS-32R1-W1 EGSS-32R1-C1 EGSS-32R1-W1 Model Name E2SS-32R1 E2SS-32R2 ELPS-32R1 Module Type 2.5" SSD to dual mSATA RAID module 2.5" SSD to dual M.2 RAID Module PCIe x 4 to dual M.2 RAID Module Key Features 1. 2.5” SSD to dual mSATA slots 2. Supports SATA III to SATA III port multiplier 3. Supports H/W RAID 0/1 over SATA 4. Excellent data transfer speed 1. 2.5” SSD to dual M.2 slots. 2. Supports M.2 Key-B 2242/2260/2280 3. Supports SATA III to SATA III Port Multiplier. 4. Supports H/W RAID 0/1 over SATA 5. Excellent data transfer speed 1. PCIe x 4 to dual M.2 ports. 2. Supports M.2 Key-B 2242/2260/2280/22110 3. Support wide temp 4. Supports AHCI, Port-Multiplier. 5. Supports Native Command Queuing 6. Support Hardware RAID 0, RAID 1 Form-Factor 2.5" SSD 2.5" SSD Low Profile PCIe Input I/F SATA III SATA III PCI Express 2.0 x 2 Input Connector SATA 7+15 Pin SATA 7+15 Pin PCIe x 4 Output I/F SATA III SATA III SATA III Output Connector mSATA x 2 M.2 Key-B x 2 M.2 Key-B x 2 Dimension (WxLxH/mm) 69.85 x 100.1 x 11.0 69.85 x 100.1 x 11.0 130.35 x 68.9 x 12.0 Operating Temperature STD temp : 0°~70°C STD temp : 0°~70°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation E2SS-32R1-C1 E2SS-32R2-C1 ELPS-32R1-C1 ELPS-32R1-W1 Disk Array
65Product specifications are subject to change without prior notice. iRAID Simplifying the configuration and management of innodisk’s RAID controller Innodisk’s iRAID is a Redundant Array of Independent Disks (RAID) management tool that enables system integrators to configure, monitor, and manage RAID 0 and RAID 1 storage configurations on Solid State Drives (SSDs). When used in combination with innodisk’s RAID cards and compatible SSDs, iRAID becomes a powerful monitoring tool that provides detailed Self-Monitoring, and Reporting Technology information (SMART info). We provide RAID card for embedded flash modules in standard PCIe, 2.5" and minicard form factor, alongside the software "iRAID" dedicated to the management and configuration of RAID volume. Features • Monitor RAID status • Change RAID mode • Get S.M.A.R.T information • Notification by Email • Supports Windows and Linux Model Name EMPV-1201 EMPV-1202 EGPV-1101 Module Type mPCIe to dual VGA & HDMI(DVI) module mPCIe to VGA & 18/24 bit LVDS module M.2 to to HDMI or DVI & Single/Dual Channel LVDS Module Key Features 1. mPCIe to dual VGA & HDMI Graphic Card. 2. VGA Output: 1920x1080, up to 75Hz vertical rate. 3. HDMI/DVI up to 1080p, Ultra low power consumption. 4. Optional VGA/HDMI/DVI cable 5. 90º, 180º, and 270º rotation of on-screen images 6. Industrial temperature -40 ºC to 85 ºC 1. VGA Output up to 1920x1080, up to 75Hz vertical rate 2. LVDS resolution supports up to 1600 x 1200 3. EMPV-1202-C1 supports 18/24 bit JEIDA LVDS 4. EMPV-1202-C2 supports 24 bit VESA LVDS 5. Allow for 90º, 180º, and 270º rotation of on-screen images. 6. Industrial temperature -40 ºC to 85 ºC 1. Support display output of HDMI 1.4 or DVI-D, single/ dual 24bit LVDS channel 2. Single HDMI/DVI-D display resolution up to 4K UHD (3840x2160@30p) 3. Dual LVDS display resolution up to FHD (1920x1080@60p) 4. HW video decoder supports multiple formats H264AVCDIVXXVIDMPEG-4MPEG-2 5. Built-in 256MB DDR 3 memory. 6. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe M.2 2280 Input I/F PCI Express 1.0 PCI Express 1.0 PCI Express 2.0 x 2 Input Connector mPCIe mPCIe M.2 B-M Output I/F VGA x 2, HDMI x 1(Optional DVI x 1) VGA, 18/24 bit LVDS HDMI or DVI-D x 1 , Single & Dual LVDS Output Connector 40pin 1.25mm x 2 (40DP-1.25) 40pin 1.25mm x 1 (40DP-1.25) 20 pin x 1(HDMI), 20 pin x 2 (LVDS) Dimensions(W*L*H/mm) 31.5 x 50.9 x 8.2 30.0 x 50.9 x 8.2 30.0 x 50.9 x 8.2 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPV-1201-C1 EMPV-1201-W1 EMPV-1202-C1, EMPV-1202-W1 EMPV-1202-C2, EMPV-1202-W2 EGPV-1101-C1, EGPV-1101-W1 EGPV-1101-C2, EGPV-1101-W2 1TB 1TB 1TB 1TB 1TB iRAID Innodisk’s embedded graphic card features a 2D graphic engine and supports resolutions up to 1920 x 1080. With a fanless design, our mPCIe graphic cards can operate at temperatures ranging from -40°C to 85°C. With support for both Windows and Linux drivers, Innodisk's Display Cards are suitable for a wide variety of industrial platforms. Display Card
66 Innodisk specializes in wide range of storage interface including PCIe/SATA/USB/PATA. Our modules allow system integrator to expand or convert those interfaces in embedded system. Model Name EMPU-3401 ELPS-3201 ESPS-3401 Module Type mPCIe to four USB 3.0 module PCIe x 4 to dual M.2 Module PCIe to four SATA III card Key Features 1. PCI Express 2.0 to 4 x USB ports with SuperSpeed (5Gbps) data rate 2. Independent 1.5A overcurrent protection (OCP) for each port 3. Compliant with xHCI 1.0, USB 3.0 Rev 1.0 4. Supports USB Battery Charging Specification Revision 1.2 5. Industrial temperature -40 ºC to 85 ºC 1. PCIe x 4 to dual M.2 ports 2. Supports M.2 Key-B 2242/2260/2280/22110 3. Supports AHCI, Port-Multiplier 4. Supports Native Command Queuing 5. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 to four SATA III ports 2. Supports AHCI, Port-Multiplier 3. Low power consumption Form-Factor mPCIe Standard PCIe Standard PCIe Input I/F PCI Express 2.0 PCI Express 2.0 x 2 PCI Express 2.0 Input Connector mPCIe PCIe x 4 PCIe x 1 Output I/F USB 3.0 SATA III SATA III Output Connector 19 Pin box header x 2 M.2 Key-B x 2 SATA 7 Pin x 4, mSATA x 1 Dimension (WxLxH/mm) 30.0 x 50.9 x 8.45 130.35 x 68.9 x 12.75 72.1 x 69.8 x 8.3 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Order Infomation EMPU-3401-C1 EMPU-3401-W1 ELPS-3201-C1 ELPS-3201-W1 ESPS-3401-C1 Model Name EMPS-3201 EMPS-3401 EGPS-3401 EMPU-3201 Module Type mPCIe to dual SATA III module mPCIe to four SATA III module M.2 3042 to four SATA module mPCIe to dual USB 3.0 module Key Features 1. PCIe 2.0 to dual SATA III ports 2. Low power consumption 3. Supports AHCI, Port-Multiplier 4. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 to four SATA III ports 2. Supports AHCI, Port-Multiplier 3. Low power consumption 4. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 to four SATAIII ports 2. Supports AHCI, Port-Multiplier 3. Low power consumption 1. Compliant with PCI Express Base Specification Revision 2.0 2. Compliant with Universal Serial Bus 3.0 Specification Revision 1.0 3. Supports 2 downstream USB 3.0 ports 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. 30µ golden finger, 3 year warranty. Form-Factor mPCIe mPCIe M.2 3042 mPCIe Input I/F PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 x 1 PCI Express 2.0 Input Connector mPCIe mPCIe M.2 B-M mPCIe Output I/F SATA III SATA III SATA III USB 3.0 Output Connector SATA 7 Pin x 2 SATA 7 Pin x 4 SATA 7 Pin x 4 19 Pin box header x 1 Dimension (WxLxH/mm) 30.0 x 50.9 x 10.7 30.0 x 50.9 x 10.9 30 x 42 x 10.4 30.0 x 50.9 x 8.45 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPS-3201-C1 EMPS-3201-W1 EMPS-3401-C1 EMPS-3401-W1 EGPS-3401-C1 EMPU-3201-C1 EMPU-3201-W1 Storage
67Product specifications are subject to change without prior notice. Model Name ESXS-2301 ESXS-2302 ELPP-0101 ELPP-0102 EMXX-0101 EMXX-0102 Module Type Multipurpose PCIe to mSATA & M.2 card (Backside mSATA ) Multipurpose PCIe to mSATA & M.2 card (Backside mPCIe ) PCIe x 1 to mPCIe Module PCIe to M.2 Module mPCIe to M.2 A-E key module mPCIe to M.2 B key module Key Features 1. Supports low profile/ standard PCIe form factor 2. Supports external SATA III and USB 2.0 signal to mSATA & M.2 2242/2260/2280 slot. (Front side) 3. Supports mSATA converted from PCIe signal(Backside) 1. Supports low profile/ standard PCIe form factor 2. Supports external SATA III and USB 2.0 signal to mSATA & M.2 242/2260/ 2280(Front Side) 3. PCIe to mPCIe pass-through design (BackSide) 1. PCI-Express specification Rev. 2.0 compliant 2. PCIe x1 to mPCIe pass-through design 1. PCI-Express specification Rev. 3.0 compliant 2. PCIe x4 to M.2 pass-through design 3. Supports M.2 Key-M 2221/ 2230/2242/2260/ 2280/22110 4. Low profile PCI Express form factor 5. Industrial temperature -40 ºC to 85 ºC 1. PCIe and USB signal pass-through design 2. Supports M.2 A-E key wireless module such as 3G, 4G, WLAN, WWAN, Bluetooth 3. Supports M.2 2230/2242 form factor 4. Supports M.2 PCIe Lane #0 & Lane 1 by pin header setting 5. Industrial temperature -40 ºC to 85 ºC 1. Support M.2 2230/2242 B key form factor 2. Compliant with PCI Express Base Specification 3. Compliant with Universal Serial Bus 2.0 Specification 4. Compliant with SATA III Specification 5. Optional NANO SIM slot on the back side 6. Industrial temperature -40 ºC to 85 ºC Form-Factor Standard PCIe Standard PCIe Low profile PCIe Low profile PCIe mPCIe mPCIe Input I/F PCI Express 1.0, SATA II, USB 2.0 PCI Express 1.0, SATA II, USB 2.0 PCI Express 2.0 PCI Express 3.0 PCI Express , USB 2.0 PCI Express, USB 2.0, SATA Input Connector PCIe x 1 PCIe x 1 PCIe x 1 PCIe x 4 mPCIe mPCIe Output I/F USB 2.0, SATA III(frontside) SATA II(backside) USB 2.0, SATA III(frontside) PCI Express 1.0(backside) PCI Express 2.0 PCI Express 3.0 PCI Express , USB 2.0 PCI Express , USB 2.0, SATA Output Connector mSATA x 2 (Front and Back) M.2 x 1(2242/2260/2280) mPCIe x 1(backside), mSATA x 1 M.2 x 1(2242/2260/2280) mPCIe x 1 M.2 Key-M M.2 Key-A-E M.2 Key B Dimensions(W*L*H/mm) 110.0 x 68.9 x 12.3 110.0 x 68.9 x 12.3 72.1 x 68.9 x 10.2 143.3 x 68.9 x 5.65 30 x 54.4 x 8.15 30 x 54.4 x 6.4 Operating Temperature STD temp : 0°~70°C STD temp : 0°~70°C STD temp : 0°~70°C Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation ESXS-2301-C1 ESXS-2302-C1 ELPP-0101-C2 ELPP-0102-W1 EMXX-0101-W1 (M.2 Key-A) EMXX-0101-W2 (M.2 Key-E) EMXX-0101-W1 EMXX-0101-W2 (SIM slot included) Innodisk provides flash storage with different interfaces and form factors. In order to help customers, we also design the signal converter for testing purposes. The customer can test different types of embedded flash modules with one card. Testing Tool Product Overview Form Factor Output PCIe SATA PATA USB POE VGA Display LAN CAN BUS DIO Serial 232/422.. mPCIe (mSATA) Input PCIe EMPS-3401 EMPS-3201 EMPS-32R1 EMPU-3401 EMPU-3201 EMPL-G2P1 EMPL-G2P2 EMPV-1201 EMPV-1202 EMPL-G101 EMPL-G201 EMPL-G102 EMPL-G202 EMP2-X801 EMP2-X402 EMP2-X403 EMP2-X404 EMP2-X4S1 EMP2-X4S2 SATA EMSS-32R1 USB EMUI-0D01 EMUC-B202 EMU2-X1S1 EMU2-X1S2 PCIe Standard Input PCIe ESPS-3401 ELPS-3201 ELPS-32R1 ELPS-32R1 SATA USB M.2 (NGFF) Input PCIe EGPS-3401 EGPL-G2P1 EGPV-1101 EGPL-G101 EGPL-G201 EGPL-G102 EGPL-G202 EGP2-X401 SATA EGSS-32R1 USB 2.5" Input SATA E2SS-32R1 E2SS-32R2 PATA
68Copyright © 2019 Jan. Innodisk Corporation. All rights reserved. 8CATALOG-001 For more warranty details, please contact the Innodisk Sales Department or visit our website: www.innodisk.com Headquarters Innodisk Corporation 5F., No.237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City, 221, Taiwan T +886-2-7703-3000 F +886-2-7703-3555 E sales@innodisk.com Branch Offices Japan K.I Bldg 2F/4F, 1-1-14, Nihonbashiningyocho Chuo-ku, Tokyo 103-0013 Japan T +81-3-6667-0161 F +81-3-6667-0162 E jpsales@innodisk.com USA 42996 Osgood Road, Fremont, CA 94539 USA T +1-510-770-9421 F +1-510-770-9424 E usasales@innodisk.com 9 Timber Ln, Marlboro NJ 07746 T +1-732-8530455 F +1-732-7846401 China 807, 8 Floor, Building B, Hengyue Center, Dengliang Road, Nanshan District, Shenzhen, China T +86-0755-2167-3689 +86-0755-2167-3690 F +86-0755-2167-3691 E sales_cn@innodisk.com Shanghai T +86-021-315-93340 Beijing T +86-010-82458120 Chengdu T +86-28-66320052 Europe Insulindelaan 115A, 5642CV, Eindhoven The Netherlands T +31-(0)40 3045 400 F +31-(0)40 3045 419 E eusales@innodisk.com T +86-021-315-93341 Our Vision Absolute Integration™ Absolute Integration™ is our envisioned path that moves toward a more interconnected world. “To us, integration is not merely the combination of hardware, software and firmware; it is a philosophy that assimilates all relevant elements to create an optimal solution.”

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Innodisk Selection Guide (2019 Edition)

  • 1.
    1Product specifications aresubject to change without prior notice. 2019 Edition Innodisk Selection Guide Flash Storage, DRAM Modules and Embedded Peripherals
  • 3.
    3Product specifications aresubject to change without prior notice. Innodisk is a service-driven provider of flash memory, DRAM modules, embedded peripherals and software solutions for industrial and enterprise applications. With satisfied customers across the embedded, server, in-vehicle, cloud storage markets and more, we have set ourselves apart with a commitment to dependable products and unparalleled service. This has resulted in solutions designed to supplement existing industrial solutions and high IOPS flash arrays for industrial and enterprise applications. The expanded business lines are leading our next steps in being a comprehensive solution and service provider in the industrial storage industry. Founded in 2005 and headquartered in Taipei, Taiwan, Innodisk services clients globally with engineering experts and sales teams in China, Europe, Japan, and the United States. With abundant experience and an unrivaled knowledge of the memory industry, Innodisk develops products with excellent quality, remarkable performance and the highest reliability. For more information about Innodisk, please visit http://www.innodisk.com. Our Advantages ABOUT US Technical Aptitude by Design We Are in It Together Deeply Rooted in the Market Our advantage lies in our portfolio of hardware, software and firmware technology and how we arrange these basic building blocks into new works of innovation. To reach the optimal solution, working together with our partner from day one is paramount. The best possible outcome can be managed by developing solutions jointly. The awareness of the pit falls and opportunities of vertical markets allow us to view the full picture when crafting the optimal solution.
  • 4.
  • 5.
    5Product specifications aresubject to change without prior notice. Storage Optimized for Video Recording Compact Memory that Doesn’t Waver Rugged Power and Signal Transmission RECLine™istheexclusive firmwarealgorithm forvideorecording thatensuressteady performancewithoutany frame-loss. OurVeryLowProfile(VLP) andMiniDRAMmodules combinesmallformfactors withhighperformanceto makesuredatarecording goesoffwithoutahitch. Innodisk’sPoEextension cardsprovideruggedness andgalvanicisolation, ensuringuncompromised signalstrengthandpowerto yourdevices.
  • 6.
    6 NAND Flash 3TE7 3TE7 3TE73TG6-P 3TG6-P and3TE7 are Innodisk’s latest product lines with 3D TLC NAND Flash, and are targeted at industrial applications. The series have reliable design, self-developed firmware and MLC-like characteristics. 3TG6-P series is a performance-oriented product line, and offers high speed and high capacity; In terms of boot drive and small form factors storage, the 3TE7 is the perfect choice. Both3TG6-P&3TE7supportvariousformdesigns,including:2.5”SSD,M.2,SATADOMandmSATA. ▪ Reliability:AdvancedLDPCECCengine&internalRAIDengineofferadditionallevelofdataprotection ▪ DataIntegrity:Uniquepowermanagement&iDataGuardtoensuredataintegrityundervariousenvironmentalconditions ▪ Optimality:Extremesequentialandrandomperformancewith3DNANDsolution,noperformancedropconcern ▪ Security:256-bitAES&End-to-Enddatapathprotection* ▪ Quality:Originalindustrial-gradeNANDflashchips ▪ Manageability:iSMART&iCAPcompatibility Industrial3DTLCsolutionwithtopreliabilityandhighendurance EnteringtheEraof3DNAND Power Mgmt Thermal Sensor Cache SPI SATA Interface OCP/OVP LDPC RAID NAND CTL iCell™ Original industrial-grade NAND Flash 3D TLC 3D TLC 3D TLC 3D TLC H/W & F/W customization AES 64-layer 3D NAND Optional iCell™ HW/FW customized · LDPC · RAID Protection · 256-Bit AES Benefits Flash
  • 7.
    7Product specifications aresubject to change without prior notice. 3MV2-P InnoRECTM is Innodisk’s proprietary flash feature set designed specifically for surveillance applications. Through the smart integrationoffirmwareandhardware,thespeedandsteadyperformancerequiredbymodernsurveillancesolutionsisfullymet. RECLineTM RECLineTM is the exclusive firmware algorithm for video recording that ensures steady performancewithoutanyframe-loss iDataGuard iData Guard is our patented power cycling data management system, which helps to ensure surveillance data integrityduringandafterunexpectedpoweroutages QuickErase QuickErasecandeletealldatawithinafewseconds–preventingleakageofpotentiallysensitivedata PassiveCooling TheSSDlayoutisdesignformaximumheatdissipation–ensuringperformanceandenhanceddataretention ThermalSensor When the surveillance system threatens to overheat, an immediate warning is issued. The SSDwillautomaticallyadjustthetransmissionfrequencytoensurecontinued performanceandreliability FirmwareOptimizedfortheStrictRequirementsoftheSurveillanceIndustry InnoRECTM SurveillanceStorageSeries Flash iCell Ensures data is flushed from volatile storage to prevent the loss of valuable surveillance dataduringsuddenpowerfailures
  • 8.
    AftertheM.2wasannouncedasthenextgenerationformfactor,therehasbeenasteadymigrationfromtheoldermPCIecards.This newformfactorisinstrumentalfornewIoTapplicationasmoreandmoreplatformsareadoptingitastheirmainport. To stay aheadof the curve, Innodisk has launched comprehensive M.2 solutions for both data storage and embedded expansions. Thiscompleteseriesincludes2230,2242,2260,and2280formfactorsthatsupportbothBandMkeyconfigurations,thusensuring compatibilitywiththenewestplatformsonthemarket. Innodisk M.2 solid state drives (SSD) are offered in a wide variety of models. The SATA III interface is a true and tested solution for standard applications, while PCIe 3.0 is the go-to for systems requiring exceptional performance. Furthermore, extensive firmware customization is also available: the M.2 SSD can be optimized for server and security environments, and it is also available with the newest3DNANDflash. Innodisk’scomprehensiveM.2storagesolutionsaretheperfectfitforthenextgenerationofIoTdevices. WideProductRange ▪ PCIeandSATASolutions ▪ SLC/iSLC/MLC/3DTLC Flexible Solutions ▪ MultipleFormFactors ▪ CompatiblewithBothBandMKey Industrial-Design ▪ WideTemperature-40~85°C ▪ HighDurability PowerLossProtection ▪ iDataGuard ▪ iCell(Optional) Type 2280Type 2260Type 2242Type 2230 8 DiverseM.2SolutionsforIndustrialandEmbeddedStorage ComprehensiveM.2solutions Flash
  • 9.
    9Product specifications aresubject to change without prior notice. The new Innodisk DDR4 2666-series introduces the industry-first 2666MT/s Registered DIMM for wide temperature industrial and embedded applications. The series boasts faster data transfer speed and increased efficiency, and is also designed for server applicationsontheIntel®Xeon®Scalableplatforms(alsoknownasPurley). 2666MT/sRDIMMReadytoTackletheHeatfromtheMostDemanding ServerEnvironments Server-ReadyDRAMDesignedforWide Temperatures DRAM Optimizationthrough Versatility All-in-One PlatformCompliance Industrial-grade •ThenewDRAMseries includebothregisteredand unbufferedmodulesboth withandwithoutECC •Availableinahostof differentformfactorsthat ensurecompatibilitywith yourplatform •Innodiskcanastheonly industrial-gradeprovider offeraWideTemperature DDR42666MT/smodule inaVLPformfactorwith bufferedmemory •Compatiblewiththe newestplatformsfrom Intel:MehlowandPurley serverandCoffeeLake •Ruggedmemorymodules withproventrack record,rigorouslytested towithstandsulfur,shock andvibration
  • 10.
    Free-of-CostUpgrade ▪ AllInnodiskDDR4moduleswillbeupgradedwithoutanyaddedcosttoincluderobust anti-sulfurationmeasures Long-termProtection ▪DecreaseyourTCObyinvestinginmoduleswithlastingdurabilityinhostileenvironments The InnodiskMany Anti-Sulfuration DRAM modules are designed for operators that are facing increasing difficulty with high sulfur content in their surroundings. The sulfur can cause corrosion damage to DRAM modules and lead to complete module failure, and, most detrimental to the operator, costly downtime. These modules are protected against the high sulfur concentrations by a specialized design that shields the components, effectively sealing off the exposed parts of the module from the sulfur in the air. ▪ SulfurreactswithsilverusedinDRAMmodulesandcreates silversulfide(Ag2S) ▪ Thiscorrosionlowersconductivityandcanpotentiallyleadto modulefailure ▪ Sulfurationismostcommonlyencounteredinareaswith pollutionandvolcanicactivity;aswellasinthepetrochemical, miningandenergysector Whatissulfuration? 10 RobustModulesthatBringtheNeededEndurancetotheIndustrialMarket Anti-SulfurationDRAMforALLDDR4 DRAMModules DRAM
  • 11.
    11Product specifications aresubject to change without prior notice. PoE+ enables reliable connection to Powered Devices (PD) such as surveillance cameras and machine vision cameras, as well as point-of-salessystemsandvoice-over-IPequipment. These rugged expansion cards are highly compatible, and have been extensively tested at full loading with different camera types, on different platforms and operating systems. The high compatibility with machine vision cameras makes the PoE expansion cards an integralpartofqualityassurancesystemsandalsohelpspavethewayfordeeplearningapplications. Availableinspace-savingformfactorsandwithflexiblemountingoptions,theInnodiskPoEexpansioncardsareeasilyintegratedinto any Power Source Equipment (PSE). These expansion cards sports isolated, wide temperature design and is certified to withstand HiPOTandsurgeoccurrences,makingittheoptimalchoiceforoperationinharshconditions. WideCompatibility ▪ Testedandapprovedforsmalland largesizesurveillancecamerasaswell asmachinevisioncameras ▪ Compatibleacrossonawidearrayof platformsandoperatingsystems NewPoE+ExpansionCardsFurtherEnhancesPowerOutputandReliability BringingIndustrial-GradeMachineVision andSurveillancetotheForefrontt Embedded Peripherals
  • 12.
    Cable-less Power Pin 7/Pin8 iCell™ iSMART™ Innodisk’s patented Pin 7 and Pin 8 SATA power technologies take the cable- less concept to the next step by eliminating the need for power cables. Yielding a 100% cable-less, shock resistant, space saving plug-and- play storage solution that optimizes airflow and makes the best use of limited board space in embedded and rackmount server systems. iSMART is a powerful, easy-to-use SSD and HDD health monitoring tool. It allows system integrators to track important disk information, such as temperature, storage space, bad blocks, lifespan and firmware, all under one platform. With iSMART, system integrators can better manage disk usage and know exactly when to replace a disk before the end of its life cycle. iCell is a smart data protection technology that is built into Innodisk’s SSDs. iCell is crucial for mission-critical applications, where working under extreme conditions and without backup power is unavoidable. Our iCell technology provides a mechanism to instantaneously discharge data stored in temporary volatile DRAM buffers to flash storage, to ensure the safety of data during power failures. A Commitment to Technical Innovation Technical Innovation Innodisk continues to bring the most innovative products to a range of industries by developing outstanding proprietary tech- nologies. Here are just few examples of Innodisk’s breakthroughs and innovations.
  • 13.
    13Product specifications aresubject to change without prior notice. iSLC Stable Power Control iPower Guard™ Passive Cooling Innodisk’s stable power control is used to optimize power circuits and establish OCP/OVP mechanisms to prevent electronic components from burning out due to voltage and/or current surges. Innodisk’s Power on Protection is a new circuit protection feature that is dually designed to allow uninterrupted SSD functionality in an inconsistent power supply situation, as well as provide accelerated boot-up for emergency startups or system shutdowns. SSDs may easily lose data due to overheating. Innodisk has redesigned the cable layout by using copper to separate the controller and flash. This reduces the thermal conductivity rate and enhances data retention. iSLC is our exclusive technology designed to ensure longer-lasting and more reliable performance than conventional MLC NAND flash. Through the use of flash management algorithms, iSLC improves SSD endurance up to 20,000 cycles, increasing the lifespan to at least 7 times longer than MLC-based solutions.
  • 14.
    Garbage Collection/TRIM iData Guard™ ThermalSensor Innodisk’s iData Guard is a comprehensive data protection mechanism that functions before and after a sudden power outage to the SSD. Low-power detection terminates data writing before an abnormal power-off, while table-remapping after power-on deletes corrupt data and maintains data integrity. Innodisk’s iData Guard provides effective power cycling management, preventing data stored in flash from degrading with use. Innodisk’s Thermal Sensor is a robust heat and workload management technology that is built into our DRAM modules and flash storage. It is a crucial solution for industrial & aerospace and defense applications, which are often susceptible to extreme heat and performance stress. Innodisk’s Thermal Sensors help to lower the working temperature while distributing workloads, which prevents modules from overworking and overheating, and greatly enhances system performance and system stability. Innodisk’s Garbage Collection/TRIM technology is used to maintain data consistency and perform continual data cleansing on SSDs. It runs as a background process, freeing up valuable controller resources while sorting good data into available blocks, and deleting bad blocks. It also significantly reduces write operations to the drive, thereby increasing the SSD’s speed and lifespan. With Innodisk Garbage Collection/TRIM technology, an SSD’s health and performance is optimized. A Commitment to Technical Innovation Technical Innovation Innodisk continues to bring the most innovative products to a range of industries by developing outstanding proprietary tech- nologies. Here are just few examples of Innodisk’s breakthroughs and innovations.
  • 15.
    15Product specifications aresubject to change without prior notice. AES Hardware Encryption InnoRobustTM Data Security iTracker™ L3 Architecture The InnoRobust™ Data Security is comprised of Security Erase, Destroy, Physical Destroy and Quick Erase. These sophisticated technologies are aimed at quickly and efficiently erasing and destroying data that is in danger of being compromised. iTracker is Innodisk's dedicated software tool for SD 3.0 cards and USB products. It offers a customizable approach to accessing flash card SMART values. Compatibility with both Windows and Linux systems and an intuitive user interface ensures an easy system integration and user experience. Innodisk’s exclusive L³ Architecture firmware, which combines Long-Life with LDPC ECC, yields a prolonged lifespan, exceptional reliability and high performance. Innodisk’s exclusive industrial oriented firmware also provides a flexible customization service, making it perfect for a variety of industrial applications. Advanced Encryption Standard (AES) is the standard cipher used by the US government to protect confidential data on storage devices. By integrating the encryption-engine in the SSD controller, the encryption/ decryption process is done without affecting CPU performance. The encryption key is safely stored away in the SSD and can be destroyed in less than a second, rendering all stored data useless as it cannot be decrypted.
  • 16.
    16 DRAM Solutions Conformal Coating Anti-Sulfuration Innodiskconformal coating refers to the chemical materials that are applied in layers to cover components. The thickness of the coating ranges between 0.03 mm and 0.13 mm thick. Conformal coating protects against moisture, contaminants, dust and acid-or- alkaline materials, meeting IPC-A-610 standards for electronic components. In the mining, petroleum and chemical industry, or installations in areas with volcanic activity, hydrogen sulfide gas is often a common challenge. The gas will react with the silver found in DRAM ICs, which can result in lower conductivity and eventual failure. This is effectively mitigated by covering the resistors with a sulfur resistant material, ensuring smooth operation in harsh environments. Ag Ag S
  • 17.
    17Product specifications aresubject to change without prior notice. Wide Temperature Innodisk’s wide temperature range design has extended the existing JEDEC standard range from -40°C to 85°C. Innodisk’s wide temperature Flash and DRAM modules are designed for industrial, and aerospace and defense applications. Wide temperature design is vital in ensuring operation and performance reliability in extreme temperatures. Side Fill Side Fill is value-added technology that can improve device reliability and extend product life. By applying resin on three sides of the DRAM IC, Side Fill can reinforce the joints between the BGA and the PCB. Tests show that when using Side Fill, DRAM IC can tolerate 1.5 times the amount of tension. If the device needs to remain operational during strong tremors or stringent thermal cycling, we highly recommend taking advantage of our Side Fill DRAM, especially so for these applications: factory automation, defense & aerospace and renewable energy.
  • 18.
    18 Different Applications Embedded &Server Boot-up Solution In-Vehicle Computing SystemsSurveillance The Innodisk Boot-up series is designed for industrial and server applications. Due to its tiny form factors, M.2 and SATADOM® frees up a precious bay for other storage options. The SATADOM® easily fits in a 1U environment with an exclusive Cable-less design; it exemplifies true plug & play and eliminates messy cables. Innodisk’s Flash, DRAM and embedded peripheral products for in-vehicle computing systems are designed to operate under harsh conditions, while supporting the flexibility of the sealed system’s placement within the automobile. These reliable storage and memory solutions are heat and shock resistant and have low power consumption that can prevent vehicle challenges caused by power volatility. The number one concern for modern day surveillance applications is stable data recording. With our InnoREC™ feature set, firmware is optimized to ensure lasting and stable writing performance – ensuring zero loss of data quality. With restricted space and simultaneous read/write operations, high speed and compact memory solutions are also an imperative. Our Very Low Profile (VLP) and Mini DRAM modules combine small form factors with high performance to make sure data recording goes off without a hitch. Innodisk focuses on providing reliable memory and expansion solutions for mission-critical applications. We understand the importance of quality in industrial and embedded flash, DRAM, expansion card and software products. Therefore, our solutions are all crafted to meet the individual needs of each vertical market. Our experienced in-house firmware development team delivers fast turnaround and knowledgeable support whenever customization is required.
  • 19.
    19Product specifications aresubject to change without prior notice. New Flash Product Naming Rule G: EverGreen The EverGreen series is designed with an integrated external DRAM cache which significantly improves SSD random data transfer rate and extends lifespan. R: InnoRobust InnoRobust series meet all of today’s aerospace and defense application requirements. InnoRobust storage products are fully compliant with aerospace and defense standards, including MIL-STD-810G and MIL-I-46058C. InnoRobust products are fully protected against heat, dust, extreme temperatures, shock, vibration, and other environmental stresses. We also deliver industry- leading data protection technologies to keep sensitive information secure. E: Embedded Embedded series is the best solution for the industrial embedded system because it offers reliability, high performance and long endurance. We offer complete form factors to fulfill customer and business needs , including 2.5” SSD, 1.8” SSD, SAT.ADOM, mSATA, SATA Slim, SATADOM, iCF & CFast, EDC, and SD. V: InnoREC InnoREC SSDs are specifically designed for surveillance applications and boasts smart firmware algorithms that guarantees a continuous, stable data recording. S: Server The SATADOM® server boot-up devices are designed for an easy server integration, and reliable performance. The devices are certified for Windows Server 2016 Hyper V and VMware hypervisors. Flash Type S: SLC We offer a series of products with SLC-based flash, boasting faster write speeds, lower power consumption and higher cell endurance. SLC-based flash is more reliable and suitable of critical applications. M: MLC The primary benefit of MLC-based flash is its lower cost per unit of storage due to the higher data density. This benefit makes MLC-based flash a perfect replacement of traditional HDD. I: iSLC iSLC is Innodisk’s exclusive firmware technology, which improves the performance and data quality and boasts a similar write performance as that of SLC-based solutions. Through the use of flash management algorithms, iSLC improves SSD endurance up to 20,000 times. T: TLC TLC-based 3D NAND flash is a new technology with a novel architecture. The more concentrated die size provides higher density and lower cost. Application & Series E: Embedded G: EverGreen R: InnoRobust V: InnoREC S: Server Product Series Interface 3: Generation III 2: Generation II 1: Generation I Form Factor SSD Slim SSD SATADOM SATA Slim mSATA mini PCIeDOM M.2 CFast CF Card EDC SD microSD USB nanoSSD 2.5” SATA SSD 3TE7
  • 20.
    20 Table of Contents FlashMemory Products M.2 .............................................................. 22 nanoSSD ................................................... 25 SSD .............................................................. 26 SATADOM® ............................................. 29 SATA Slim................................................... 31 mSATA .........................................................32 SD/micro SD .............................................34 CFast ............................................................34 CF Card ......................................................35 Mini PCIeDOM ..................................... 36 EDC...............................................................36 USB ...............................................................37 Software Solutions iCAPTM .........................................................39 iSMARTTM ................................................. 41 iTrackerTM .................................................. 42 iCover TM ......................................................43 iOpalTM .........................................................44 DRAM Module Products Embedded..................................................48 Server...........................................................50 Wide Temperature................................ 50 ECC DIMM ...............................................52 VLP DIMM ................................................53 Mini DIMM ...............................................54 Special / Customized............................ 55 Embedded Peripheral Modules Communication...................................... 59 Disk Array...................................................64 Display Card..............................................65 Storage.........................................................66 Testing Tool................................................67
  • 21.
    21Product specifications aresubject to change without prior notice. Flash Memory Innodiskflashmemoryproductsaredesignedtobehighlyreliable and stable, and provide longer life cycles for the embedded and industrial systems in which they are used. Innodisk offers the industry’swidestselectionofflashmemoryformfactors,including standard 1.8” and 2.5” Industrial SSDs, M.2, SATADOM® —the smallest high-speed SATA storage in the industry, CompactFlash Cards, mSATA , SATA Slim, and USB Flash Drives. Our products are available in 3D NAND triple-level cell (TLC), single-level cell (SLC), and multi-level cell (MLC) flash types, as well as iSLC – our own proprietary technology that merges the best features from MLC and SLC.
  • 22.
    22 M.2 M.2 (NVMe) Highlights TheInnodisk M.2 series pack a lot of performance into a thin, industrial grade form factor. The M.2 series includes both Non-Volatile Memory Express (NVMe) and SATA devices. The NVMe specification is designed specifically for flash devices and can deliver the fastest speeds in the industry. •PCIe Gen III x 2 and x 4 solution •Truly industrial grade PCIe NVMe SSD •Heatsink-less design •Wide range of form factors and dimensions available, including type 2242, 2260, and 2280 •Support industrial grade wide temperature -40°C ~ 85°C (only available in PCIe Gen III x2 solution) •iData GuardTM, iPower Guard and iCell technology for data protection and integrity while abnormal power failure happened •Support iSMART disk health monitoring •Support End-to-End Data Path Protection (ETEP) Model Name M.2(P42) 3ME2 M.2 (P42) 3TE2 M.2(P80) 3ME2 M.2 (P80) 3TE2 M.2(P80) 3TE4 Key Features 1. Type 2242-D2-B-M 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. Low power consumption 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. Low power consumption 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. Low power consumption 2. Less controller heat 3. Supports NVMe 1.3 4. End-to-End Data Path Protection 5. iData Guard Data Protection 1. DRAM-less Solution 2. Supports NVMe 1.3 3. iData Guard Data Protection 4. End-to-End Data Path Protection Interface PCIe Gen3 x 2 PCIe Gen3 x 2 PCIe Gen3 x 2 PCIe Gen3 x 2 PCIe Gen3 x 4 Flash Type MLC 3D TLC MLC 3D TLC 3D TLC Capacity 32GB~256GB 64GB~512GB 32GB~512GB 64GB~1TB 128GB~1TB Max. Channel 4 4 4 4 4 Sequential R/W (MB/sec, max.) 1300/340 1300/680 1300/480 1300/680 2100/1700 Max. Power Consumption 2.9W(3.3 x 880mA) 2.3W(3.3 x 700mA) 3.72W(3.3 x 1125mA) 3W(3.3 x 910mA) TBD Thermal Sensor Y Y Y Y Y External DRAM Buffer N N N N N iData Guard Y Y Y Y Y iCell N N Optional Optional Optional TRIM Y Y Y Y Y ATA Security N N N N N S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.5 22.0 x 80.0 x 3.5 22.0 x 80.0 x 3.5 22.0 x 80.0 x 3.5 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM24-XXXM61BC*** DEM24-XXXM61EC*** DEM28-XXXM61BC*** DEM28-XXXM61EC*** DEM28-XXXIB1EC*** Wide Temp. OP (-40°C~+85°C) DEM24-XXXM61BW*** DEM24-XXXM61EW*** DEM28-XXXM61BW*** DEM28-XXXM61EW*** TBD Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type 2222 2222 2222 2222 8080 6060 4242 3030 Dimension (mm) Type 2242Type 2230 Type 2260 Type2280 Dimension(mm)
  • 23.
    23Product specifications aresubject to change without prior notice. M.2 (SATA) Highlights • Wide range of form factors and dimensions available, includeing type 2230, 2242, 2260, and 2280. • iData GuardTM, iPower Guard and iCell technology for data protection and intergraty while abnormal power failure happened • Support iSMART disk health monitoring 2222 2222 2222 2222 8080 6060 4242 3030 Dimension (mm) Type 2242Type 2230 Type 2260 Type2280 Model Name M.2 (S42) 3TE7 M.2 (S42) 3TG6-P M.2 (S42) 3SE4 M.2 (S42) 3IE4 Key Features 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 1. Type 2242-D2-B-M 2. High quality SLC-based solution 3. DRAM-less, high-level data integrity 4. LDPC technology secures SSD reliability 5. Excellent data transfer speed 1. Type 2242-D2-B-M 2. Designed with LDPC ECC engine 3. Lifespan 7 times longer tham MLC 4. Cost-effective industrial flash with iSLC Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC SLC iSLC Capacity 32GB~512GB 128GB~512GB 8GB~64GB 8GB~128GB Max. Channel 4 4 2 2 Sequential R/W (MB/sec, max.) 560/330 560/510 520/360 530/380 Max. Power Consumption 1.6W (3.3V x 475mA) 2.4W (3.3V x 739mA) 0.6W (3.3V x 185mA) 1.5W (3.3V x 460mA) Thermal Sensor Y Y Y Y External DRAM Buffer N Y N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.5 22.0 x 42.0 x 3.2 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM24-XXXDK1EC*** DGM24-XXXM71EC*** DEM24-XXXM41SC*** DHM24-XXXM41BC*** Wide Temp. OP (-40°C~+85°C) DEM24-XXXDK1EW*** DGM24-XXXM71EW*** DEM24-XXXM41SW*** DHM24-XXXM41BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Model Name M.2 (S30) 3ME4 M.2 (S60) 3ME3 Key Features 1. Type 2230-D2-B-M 2. Exclusive L3 architecture 3. Designed with LDPC ECC Engine 4. Budget-friendly MLC-based solution 1. Type 2260-D2-B-M 2. High IOPS 3. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC Capacity 8GB~128GB 32GB~512GB Max. Channel 2 4 Sequential R/W (MB/sec, max.) 530/210 380/200 Max. Power Consumption 1.6W (3.3V x 505mA) 1.3W (3.3V x 370mA) Thermal Sensor Y STD: N, W/T: Y External DRAM Buffer N N iData Guard Y Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 22.0 x 30.0 x 3.2 22.0 x 60.0 x 3.5 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/ MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM23-XXXM41BC*** DEM26-XXXD08%C*** Wide Temp. OP (-40°C~+85°C) DEM23-XXXM41BW*** DEM26-XXXD08%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
  • 24.
    24 Model Name M.2(S42) 3ME4 M.2 (S42) 3MG2-P M.2 (S80) 3TG6-P M.2 (S80) 3TE7 Key Features 1. Type 2242-D2-B-M 2. Exclusive L3 architecture 3. Designed with LDPC ECC Engine 4. Budget-friendly MLC-based solution 1. Type 2242-D2-B-M 2. High sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 4. AES 256-key ,end to end data path protection 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC 3D TLC 3D TLC Capacity 8GB~256GB 32GB~256GB 128GB~1TB 32GB~1TB Max. Channel 2 4 4 4 Sequential R/W (MB/sec, max.) 530/210 560/360 560/510 550/370 Max. Power Consumption 1.4W (3.3V x 422mA) 1.09 W (3.3V x 330mA) 2.6W (3.3V x 799mA) 2.0W (3.3V x 614mA) Thermal Sensor Y Y Y Y External DRAM Buffer N Y Y N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 22.0 x 42.0 x 3.2 22.0 x 42.0 x 3.5 22.0 x 80.0 x 3.5 22.0 x 80.0 x 3.5 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM24-XXXM41BC*** DGM24-XXX-D81%C*** DGM28-XXXM71EC*** DEM28-XXXDK1EC*** Wide Temp. OP (-40°C~+85°C) DEM24-XXXM41BW*** DGM24-XXX-D81%W*** DGM28-XXXM71EW*** DEM28-XXXDK1EW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Model Name M.2 (S80) 3SE4 M.2 (S80) 3IE4 M.2 (S80) 3ME4 M.2 (S80) 3MG2-P Key Features 1. Type 2280-S2-B-M (single side) 2. High quality SLC-based solution 3. DRAM-less, high-level data integrity 4. LDPC technology secures SSD reliability 5. Excellent data transfer speed 1. Type 2280-D2-B-M 2. Designed with LDPC ECC engine 3. Lifespan 7 times longer tham MLC 4. Cost-effective industrial flash with iSLC 1. Type 2280-D2-B-M 2. Exclusive L3 architecture 3. Designed with LDPC ECC Engine 4. Budget-friendly MLC-based solution 1. Type 2280-D2-B-M 2. High sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type SLC iSLC MLC MLC Capacity 8GB~64GB 8GB~128GB 8GB~256GB 16GB~1TB Max. Channel 2 2 2 4 Sequential R/W (MB/sec, max.) 520/360 530/360 530/210 530/450 Max. Power Consumption 1.6W (3.3V x 500 mA) 0.9 W (3.3V x 270mA) 0.9 W (3.3V x 270mA) 3.63W (3.3V x 1.1A) Thermal Sensor Y Y Y Y External DRAM Buffer N N N Y iData Guard Y Y Y Y iCell N N N Optional TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 22.0 x 80.0 x 3.2 22.0 x 80.0 x 3.2 22.0 x 80.0 x 3.2 22.0 x 80.0 x 3.5 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEM28-XXXM41SC*** DHM28-XXXM41BC*** DEM28-XXXM41BC*** DGM28-XXXD81%C*** Wide Temp. OP (-40°C~+85°C) DEM28-XXXM41SW*** DHM28-XXXM41BW*** DEM28-XXXM41BW*** DGM28-XXXD81%W*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
  • 25.
    25Product specifications aresubject to change without prior notice. Model Name nanoSSD 3SE nanoSSD 3IE3 nanoSSD 3ME3 Key Features 1. Using BGA package to make controller and flash as single chip 2. Adopt SATA III interface,well Compatibility 3. Complaint with JEDEC MO-276 SPEC Interface SATA III 6.0Gb/s Flash Type SLC iSLC MLC Capacity 2GB~16GB 16GB~64GB 16GB~128GB Max. Channel 4 Sequential R/W (MB/sec, max.) 410/195 440/260 410/140 Max. Power Consumption 2.5W 2.3W Thermal Sensor N N External DRAM Buffer N N iData Guard Y Y iCell N N TRIM N Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 16.0 x 20.0 x 1.7 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DENSD-XXXD06SC*** DHNSD-XXXD08BC*** DENSD-XXXD08BC*** Wide Temp. OP (-40°C~+85°C) DENSD-XXXD06SW*** DHNSD-XXXD08BW*** DENSD-XXXD08BW*** Note xxx = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28) ***= flash configuration (internal control code) nanoSSD The Innodisk nanoSSD is an integrated SATA storage device. It combines Innodisk's ID106/ID108 NAND flash controller and latest NAND flash in a JEDEC MO-276(SATA μSSD) form factor with one single ball grid array (BGA) package, giving the nanoSSD a compact size and making it very easy to design in. The Innodisk nanoSSD , supporting SATA III 6.0Gbp/s , offers excellent high data transfer rates, along with lower power consumption. It is an ideal solution for any kind of limited-space application. Benefits of nanoSSD Features • Chip type, easy to design in without mechanical interference • SATA interface, highly compatible with x86 system • Excellent data transfer rates • Fully compliant with industrial standards • Suitable for ultra-thin or compact systems • Zero peripheral circuits • Integrated NAND Flash controller with Flash in a single chip • Compliant with JEDEC MO-276 (SATA μSSD) specifications • SATA III interface with BGA package • Intelligent Flash management & real time garbage collection The Innodisk nanoSSD mechanical drawing 1.7
  • 26.
    SSDInnodisk SSDs bringa whole new level of high performance to memory storage. Our wide selection of SSDs are designed for different applications, including industrial/embedded, enterprise server, aviation, defense, and other semi-industrial applications, such as thin clients, POS, and kiosk. Our SSDs come in 3D TLC, iSLC, SLC and MLC types, and support PATA/IDE 44 pin, SATA II (3.0Gb/s), and SATA III (6.0Gb/s). Model Name 2.5"SATA SSD 3TE7 2.5"SATA SSD 3TG6-P 2.5" SATA SSD 3SE4 Key Features 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC SLC Capacity 32GB~1TB 128GB~4TB 8GB~64GB *For128GB, please check 2.5"SATA SSD 3SE3 Max. Channel 4 4 2 SequentialR/W(MB/sec,max.) 560/525 540 /470 520/360 Max. Power Consumption 0.8W (5V x 160mA) 128GB~1TB 3.1W (5V x 620mA) 2TB~4TB 6W (5V x 1.2A) 1.1W (5V x 220 mA) Thermal Sensor Y External DRAM Buffer N Y N iData Guard Y Y Y iCell N Optional N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 69.85 x 100.1 x 6.9 69.8 x 100.1 x 6.9 69.85 x 100.1 x 6.9 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DES25-XXXDK1EC*** DGS25-XXXM71EC*** DES25-XXXM41SC*** WideTemp.OP(-40°C~+85°C) DES25-XXXDK1EW*** DGS25-XXXM71EW*** DES25-XXXM41SW*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash Model Name 2.5" SATA SSD 3SE2-P 2.5" SATA SSD 3SR3-P 2.5" SATA SSD 3IE4 Key Features 1. High IOPS performance with DRAM solution 2. High quality SLC-based solution 3. Support AES function 1. Compliant with MIL-STD-810G 2. HW/SW Data Security (Quick Erase/Destroy/ Security Erase/ Write Protect) 3. iCell supported, 100% data protection 1. Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Cost-effective industrial Flash with iSLC 4. Lifespan 7 times longer than MLC Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type SLC SLC iSLC Capacity 8GB~512GB 8GB~256GB 8GB-128GB *For 256GB, please check 2.5"SATA S SD 3IE3 Max. Channel 4 4 2 SequentialR/W(MB/sec,max.) 520/420 490/240 530/380 Max. Power Consumption 2.15W (5V x 430mA) 2.65W (5V x 530mA) 0.8W (5V x 160mA) Thermal Sensor Y External DRAM Buffer Y Y N iData Guard Y Y Y iCell Optional Y N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 69.8 x 99.8 x 9.2 69.8 x 99.8 x 9.2 69.8 x 100.1 x 6.9 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DES25-XXXD82SC*** DRS25-XXXD70SC*** DHS25-XXXM41%C*** WideTemp.OP(-40°C~+85°C) DES25-XXXD82SW*** DRS25-XXXD70SW*** DHS25-XXXM41%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash 26
  • 27.
    27Product specifications aresubject to change without prior notice. Model Name 2.5" SATA SSD 3MG2-P 2.5" SATA SSD 3ME4 Key Features 1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection 1. EverGreen L3 architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC Capacity 8GB-2TB 8GB-256GB Max. Channel 4 2 SequentialR/W(MB/sec,max.) 520/480 520/210 Max. Power Consumption 6W (5V x 1.2A) 0.8W (5V x 160mA) Thermal Sensor Y External DRAM Buffer Y N iData Guard Y Y iCell Optional N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 69.8 x 100.1 x 6.9 69.8 x 100.0 x 9.5 (2TB) 69.8 x 100.1 x 6.9 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DGS25-XXXD81%C***(P) DES25-XXXM41%C*** WideTemp.OP(-40°C~+85°C) DRS25-XXXD81%W***(P) DES25-XXXM41%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash Model Name 2,5" SATA SSD 3MR2-P 2.5" SATA SSD 3MR3-P 1.8 "SATA SSD 3TG6-P Key Features 1. Compliant with MIL-STD-810G 2. HW/SW Data Security (Quick Erase/ Destroy/ Security Erase/Write Protect) 3. High random performance 4. iCell supported, 100% data protection 1. Compliant with MIL-STD-810G 2. HW/SW Data Security (QEraser/ Destroy/ SEraser/ Write Protect) 3. iCell supported, 100% data protection 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offer additional level of data protection 4. AES 256-key ,end to end data path protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC 3D TLC Capacity 8GB~2TB 64GB~512GB 32GB~1TB Max. Channel 4 4 4 SequentialR/W(MB/sec,max.) 520/450 490/270 540/470 Max. Power Consumption 6W (5V x 1.2mA) 4.5W (5V x 900mA) 0.8W (5V x 160mA) Thermal Sensor STD : N , W/T : Y Y External DRAM Buffer Y Y Y iData Guard Y Y Y iCell Y Y Optional TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 69.8 x 99.8 x 9.2 69.8 x 99.8 x 9.2 54.0 x 78.5 x 5.0 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DRS25-XXXD81%C***P DRS25-XXXD70%C*** DGS18-XXXM71EC1*** DGS18-XXXM71EC2*** *Edition 1: 5V, Edition 2: 3.3V WideTemp.OP(-40°C~+85°C) DRS25-XXXD81%W***P DRS25-XXXD70%W*** DGS18-XXXM71EW1*** DGS18-XXXM71EW2*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash
  • 28.
    28 Model Name 1.8"SATA SSD 3SE2-P 1.8" SATA SSD 3SE3-P 1.8" SATA SSD 3MG3-P Slim SSD 3ME4 PATA 1MG3-P Key Features 1. High IOPS performance with DRAM solution 2. High quality SLC-based solution 3. Support AES function 4. iCell supported, 100% data protection 1. High quality SLC-based solution 2. Enhanced power cycling management 3. iSMART disk health monitoring 1. Built-in DRAM buffer 2. Intelligent error recovery system 3. Excellent data transfer speed and high IOPS performance 4. iData Guard for abnormal power failure 1. 1.8' housing, 50% space saving 2. Exclusive L3 architecture 3. Designed with LDPC ECC engine 1. Built-in DRAM buffer 2. Intelligent error recovery system 3. Excellent data transfer speed 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s PIO Mode 0~4 Ultra DMA 0~5 Flash Type SLC SLC MLC MLC MLC Capacity 8GB-512GB 8GB-512GB 32GB~1TB 8GB~256GB 8GB~512GB Max. Channel 4 4 4 2 4 Sequential R/W (MB/sec, max.) 540/360 490/230 520/450 530/210 90/90 Max. Power Consumption A: 2.9W (3.3V x 880mA)* B: 3.9W (5V x 780mA)* 1.5W (5V x 300 mA) 6W (5V x 1.2A) 0.8W (5V x 160mA) 2W (5V x 400mA) Thermal Sensor Y STD : N , W/T : Y Y STD : N , W/T : Y External DRAM Buffer Y Y Y Y Y iData Guard Y Y Y Y Y iCell Y N N N N TRIM Y Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 54.0 x 78.5 x 5.0 54.0 x 78.5 x 5.0 54.0 x 78.5 x 5.0 69.85 x 50.0 x 9.0 69.85 x 99.85 x 9.2 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DES18-XXXD82SCA**(P) DES18-XXXD82SCB**(P) *Edition A: 3.3V ; Edition B:5V DES18-XXXD70SC*** DGS18-XXXD81%C*** DEMLM-XXXM41%C*** DGP25-XXXD70%C*** WideTemp.OP(-40°C~+85°C) DES18-XXXD82SWA**(P) DES18-XXXD82SWB**(P) DES18-XXXD70SW*** DGS18-XXXD81%W*** DEMLM-XXXM41%W*** N/A Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12, 1TB=01T, 2TB=02T ) ***= flash configuration (internal control code) %=Flash iCell Technology gives the SSD a power boost in the event of an abnormal power failure and ensures reliable and accurate data transfer from DRAM cache to NAND flash. The iSecurity function under iSMART allows the user to easily operate the data erase command. The user may select the data erase function, monitor erase progress and also compare data before and after the erasure. SSDs are made up of millions of NAND flash cells. They can be written into groups called pages (generally 4KB in size) but can only be erased in larger groups called blocks (generally 128 pages or 512KB). The addresses of the deleted files are sent along with the TRIM command to the SSD’s controller so the drive can function optimally. The TRIM commands allows the SSD to delete data more expediently, thus increasing overall performance. The TRIM command is generally sent from the OS when the system is idle. This cleans up invalid data from the blocks so the drive can perform like new. What is TRIM?What is iCell? What is iSecurity?
  • 29.
    29Product specifications aresubject to change without prior notice. SATADOM® Flexible power supply design SATADOM-SL 3ME4 Innodisk’s Serial ATA Disk on Module (SATADOM® ) is the world’s smallest form factor with exclusive built-in Pin 7 and Pin 8 VCC, which simplifies motherboard design. Since it has no external cables, it is more robust and enhances the disk functions of various industrial and enterprise applications. Innodisk’s SATADOM® also supports the SATA II and SATA III interface with faster data transfer rates and is available in capacities ranging from 512MB up to 256GB. • External power cable • SATA Pin 8 VCC • SATA Pin 7 VCC Innodisk, the service-driven flash and DRAM module provider, features the innovative SATADOM® patented Pin8 and Pin7 cable-less SATA power combined with exclusive L3 architecture, prolonging the lifespan of SATADOM-SL 3ME4 with exceptional performance and reliability. SATADOM-SL 3ME4 is the best storage design for industrial computers and server boot drives. SATADOM-SL 3ME won the Taiwan Excellence Award 2017 in the highly competitive category of "Computer Hardware and Peripheral Equipment.” Form Factor SATADOM-SV/SH Model Name SATADOM 3TE7 SATADOM 3SE4 SATADOM 3IE4 SATADOM 3ME4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Cost-effective industrial Flash with iSLC 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. Pin 8/Pin 7 supported 1. Vertical and low profile horizontal design 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type 3D TLC SLC iSLC MLC Capacity 32GB~256GB 8GB~32GB 8GB~64GB 8GB~128GB Max. Channel 2 2 2 2 SequentialR/W(MB/sec,max.) 510/300 520/260 530/350 530/120 Max. Power Consumption 1.55W (5V x 309mA) 1.58W (5V x 315mA) 0.95W (5V x 189mA) 1.27W (5V x 254mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) SV: 40.4 x 21.03 x 10.4 mm SH: 32.7 x 18 x 14.15 mm SV: 40.4 x 21.03 x 10.4 mm SH: 32.7 x 18 x 14.15 mm SV:40.4 x 21.03 x 10.4 SV: 40.4 x 21.03 x 10.4 SH: 32.7 x 18 x 15.15 Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) SV: DESSV-XXXDK1EC***# SH: DESSH-XXXDK1EC***# SV: DESSV-XXXM41SC***# SH: DESSH-XXXM41SC***# SV: DHSSV-XXXM41BC***# SV: DESSV-XXXM41BC***# SH: DESSH-XXXM41BC***# WideTemp.OP(-40°C~+85°C) SV: DESSV-XXXDK1EW***# SH: DESSH-XXXDK1EW***# SV: DESSV-XXXM41SW***# SH: DESSH-XXXM41SW***# SV: DHSSV-XXXM41BW***# SV: DESSV-XXXM41BW***# SH: DESSH-XXXM41BW***# Notes xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 01GB~4GB, please check FF 3SE or 3SE3 3ME4 series • High performance • LDPC • Low WAI • SMART supported • Original MLC designed SATADOM-SL • Tiny size • Cable-less (Pin8 /Pin7 supported) • OS boot drive • Durable External power cable SATA Pin 8 power VCCSATA Pin 7 power VCC
  • 30.
    30 Form Factor SATADOM-SL/SHType D Model Name SATADOM 3TE7 SATADOM 3SE4 SATADOM 3IE4 SATADOM 3ME4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Below 1U best boot solution. 2. Cost-effective industrial Flash with iSLC 3. Exclusive L3 architecture 4. Latest LDPC ECC engine 5. Pin 8/Pin 7 supported 1. Below 1U best boot solution. 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type 3D TLC SLC iSLC MLC Capacity 32GB~256GB 8GB~32GB 8GB~64GB 8GB~128GB Max. Channel 2 2 2 2 SequentialR/W(MB/sec,max.) 510/300 520/260 530/350 530/120 Max. Power Consumption 1.5W (5V x 300mA) 0.95W (5V x 186mA) 1.02W (5V x 204mA) 1.02W (5V x 204mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) SL: 29.6 x 33.06 x 10.5 SH(D):30 x 20.79 x 15.20 SL: 29.6 x 33.06 x 10.5 SH(D):30 x 20.79 x 15.15 SL: 29.6 x 33.06 x 10.5 SL: 29.6 x 33.06 x 10.5 SH(D): 30 x 20.79 x 15.15 Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) SL: DESSL-XXXDK1EC***# SH(D): DESSF-XXXDK1EC***# SL: DESSL-XXXM41SC***# SH(D): DESSF-XXXM41SC***# SL: DHSSL-XXXM41BC***# SL: DESSL-XXXM41BC***# SH(D): DESSF-XXXM41BC***# WideTemp.OP(-40°C~+85°C) SL: DESSL-XXXDK1EW***# SH(D): DESSF-XXXDK1EW***# SL: DESSL-XXXM41SW***# SH(D): DESSF-XXXM41SW***# SL: DHSSL-XXXM41BW***# SL: DESSL-XXXM41BW***# SH(D): DESSF-XXXM41BW***# Notes xxx = density ( 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 01GB~4GB, please check FF 3SE or 3SE3 Form Factor SATADOM-ML/MH Model Name SATADOM 3SE4 SATADOM 3IE4 SATADOM 3ME4 SATADOM 3TG6-P SATADOM 3MG2-P Key Features 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Hareware write protect supported 2. Cost-effective industrial Flash with iSLC 3. Exclusive L3 architecture 4. Latest LDPC ECC engine 5. High IOPS 6. Pin 8/Pin 7 supported 1. Hareware write protect supported 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offers addi tional level of data protection 4. AES 256-bit key, end-to- end data path protection 1. Hareware write protect supported 2. High IOPS 3. Write protect 4. High performance SATADOM Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type SLC iSLC MLC 3D TLC MLC Capacity 8GB~64GB 16GB~128GB 32GB~256GB 128GB~256GB 32GB~256GB Max. Channel 2 2 2 4 4 SequentialR/W(MB/sec,max.) 520/360 530/360 530/210 560/290 560/180 Max. Power Consumption 1.58W (5V x 315mA) 0.815W (5V x 163mA) 0.815W (5V x 163mA) 2.14W (5V x 428mA) 2.68W (5V x 535mA) Thermal Sensor Y Y Y Y Y External DRAM Buffer N N N Y Y iData Guard Y Y Y Y Y iCell N N N N N TRIM Y Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) ML: 36.7 x 31.2 x 10.7 ML: 31.2 x 36.7 x 10.7 MH: 23.5 x 33.6 x 14.8 ML: 31.2 x 36.7 x 10.7 MH: 23.5 x 33.6 x 14.8 ML: 37.17 x 31.5 x 12.6 ML: 37.17 x 31.5 x 12.6 Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) ML: DESML-XXXM41SC***# ML: DHSML-XXX- M41BC***# MH: DHSMH-XXX- M41BC***# ML: DESML-XXX- M41BC***# MH: DESMH-XXX- M41BC***# ML: DGSML-XXXM71EC***# ML: DGSML-XXXD81BC***# WideTemp.OP(-40°C~+85°C) ML: DESML-XXXM- 41SW***# ML: DHSML-XXX- M41BW***# MH: DHSMH-XXX- M41BW***# ML: DESML-XXX- M41BW***# MH: DESMH-XXX- M41BW***# ML: DGSML-XXXM71EW***# ML: DGSML-XXXD- 81BW***# Notes xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 4GB, please check FF 3SE or 3SE3
  • 31.
    31Product specifications aresubject to change without prior notice. Form Factor SATADOM-SH Type C SATADOM-MV Model Name SATADOM 3SE4 SATADOM 3ME4 SATADOM 3IE4 SATADOM 3ME4 Key Features 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Low profile horizontal design 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported 1. Hareware write protect supported 2. Cost-effective industrial Flash with iSLC 3. Exclusive L3 architecture 4. Latest LDPC ECC engine 5. High IOPS 6. Pin 8/Pin 7 supported 1. Hareware write protect supported 2. Exclusive L3 architecture 3. Latest LDPC ECC engine 4. High IOPS 5. Pin 8/Pin 7 supported Interface SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s SATA III 6Gb/s Flash Type SLC MLC iSLC MLC Capacity 8GB~32GB 8GB~128GB 8GB~64GB 8GB~128GB Max. Channel 2 2 2 2 SequentialR/W(MB/sec,max.) 520/260 530/120 530/340 530/210 Max. Power Consumption 1.49W (5V x 297mA) 1.02W (5V x 204mA) 1.72W (5V x 343mA) 1.08W (5V x 216mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 32.7 x 18 x 14.5 32.7 x 18 x 14.5 41.55 x 25.26 x 10.4 41.55 x 25.26 x 10.4 Environment Vibration: 20G@7~2000Hz Shock: [email protected] Storage Temperature: -55°C ~ +95°C MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DESSC-XXXM41SC***# DESSC-XXXM41BC***# DHSMV-XXXM41BC***# DESMV-XXXM41BC***# WideTemp.OP(-40°C~+85°C) DESSC-XXXM41SW***# DESSC-XXXM41BW***# DHSMV-XXXM41BW***# DESMV-XXXM41BW***# Notes xxx = density ( 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 ) *For SLC 01GB~4GB, please check FF 3SE or 3SE3 SATA SlimThe Innodisk SATA Slim is compliant with the JEDEC SFF-8156 standard form factor and ATA protocol. It does not require drivers, and can be configured as a boot device or a data storage device. It is also suitable for portable/hand-held devices, thin clients, and industrial applications that require the effective reduction of operation system boot time and power consumption. With a 7+15 pin SATA interface, the Innodisk SATA Slim supports most platforms with a standard SATA port. Model Name SATA Slim 3TE7 SATA Slim 3TG6-P SATA Slim 3SE4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offers additional level of data protection 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC SLC Capacity 32GB~1TB 128GB~1TB 8GB~64GB *For128GB, please check SATA Slim 3SE3 Max. Channel 4 4 2 SequentialR/W(MB/sec,max.) 560/525 540/470 530/360 Max. Power Consumption 0.8W (5V x 160mA) 3.1W (5V x 620mA) 1.1 W (5V x 220mA) Thermal Sensor Y Y Y External DRAM Buffer N Y N iData Guard Y Y Y iCell N N N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million StandardTemp.OP(0°C~+70°C) DESLM-XXXDK1EC*** DGSLM-XXXM71EC*** DESLM-XXXM41SC*** WideTemp.OP(-40°C~+85°C) DESLM-XXXDK1EW*** DGSLM-XXXM71EW*** DESLM-XXXM41SW*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
  • 32.
    32 mSATA mSATA, which iscompliant with the JEDEC MO300/MO300B standard, was announced by the Serial ATA International Organization on September 21, 2009. Applications include netbooks, portable devices and other devices that require a smaller solid-state drive. The connector is similar in appearance to a PCI Express Mini Card interface and is electrically compatible; however, the data signals need a connection to the SATA host controller instead of the PCI-express host controller. Innodisk’s mSATA supports high-performance data transfer rates of 1.5 Gb/s, 3.0 Gb/s and 6.0 Gb/s. Model Name mSATA 3TE7 mSATA 3TG6-P Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. Extreme seq. and random performance with 3D NAND solution 2. Advanced LDPC ECC engine 3. RAID engine offers additional level of data protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC 3D TLC Capacity 32GB~1TB 128GB~1TB Max. Channel 4 4 Sequential R/W (MB/sec, max.) 560/525 560/510 Max. Power Consumption 2.2 W (3.3V x 674mA) 2.64 W (3.3V x 800mA) Thermal Sensor Y Y External DRAM Buffer N Y iData Guard Y Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSR-XXXDK1EC*** DGMSR-XXXM71EC*** Wide Temp. OP (-40°C~+85°C) DEMSR-XXXDK1EW*** DGMSR-XXXM71EW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type Model Name SATA Slim 3IE4 SATA Slim 3ME4 SATA Slim 3MG2-P Key Features 1. Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Cost-effective industrial Flash with iSLC 1. Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Compatible with JEDEC MO-297 1. EverGreen L² architecture 2. High Sequential/IOPS performance 3. Support DEVSLP 4. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type iSLC MLC MLC Capacity 8GB~128GB 8GB~128GB 8GB~256GB Max. Channel 2 2 4 SequentialR/W(MB/sec,max.) 530/360 530/210 520/290 Max. Power Consumption 0.8W (5V x 160mA) 0.8W (5V x 160mA) 2.6W (5V x 520mA) Thermal Sensor Y Y STD : N, W/T : Y External DRAM Buffer N N Y iData Guard Y Y Y iCell N N N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 54.0 x 39.0 x 4.0 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million StandardTemp.OP(0°C~+70°C) DHSLM-XXXM41%C*** DESLM-XXXM41%C*** DGSLM-XXXD81%C*** WideTemp.OP(-40°C~+85°C) DHSLM-XXXM41%W*** DESLM-XXXM41%W*** DGSLM-XXXD81%W*** Notes XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type
  • 33.
    33Product specifications aresubject to change without prior notice. Model Name mSATA 3SE4 mSATA 3SE-P mSATA 3IE4 mSATA 3MG2-P mSATA 3ME4 Key Features 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Excellent data transfer speed and IOPS 2. Support TRIM command 3. Built-in DRAM buffer 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC 4. Excellent data transfer speed 5. LDPC technology secures SSD reliability 1. High IOPS by on-board DRAM design 2. Featuring L² architecture, expanding the lifespan 3. DEVSLP supported 1. LDPC technology secures SSD reliability 2. DRAM-less, high-level data integrity Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type SLC SLC iSLC MLC MLC Capacity 8GB~64GB *For 4GB/ 128GB, please check mSATA 3SE3 8GB~64GB 8GB~128GB 8GB~512GB 8GB~256GB *For 512 GB, please check mSATA 3ME3 Max. Channel 2 4 2 4 2 Sequential R/W (MB/sec, max.) 525/350 490/260 530/365 520/450 535/210 Max. Power Consumption 1.32W(3.3V x 400mA) 1.2 W(3.3V x 360mA) 0.6W(3.3V x 200mA) 2.2 W(3.3 V x 660 mA) 0.6W (3.3V x 205mA) Thermal Sensor Y STD : N, W/T : Y Y Y Y External DRAM Buffer N Y N Y N iData Guard Y Y Y Y Y iCell N N N N N TRIM Y Y Y Y Y ATA Security Y Y Y Y Y S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 29.8 x 50.8 x 3.7 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSR-XXXM41SC*** DEMSR-XXXD67SC*** DHMSR-XXXM41BC*** DGMSR-XXXD81SC*** DEMSR-XXXM41BC*** Wide Temp. OP (-40°C~+85°C) DEMSR-XXXM41SW*** DEMSR-XXXD67SW*** DHMSR-XXXM41BW*** DGMSR-XXXD81SW*** DEMSR-XXXM41BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type Model Name mSATA mini 3TE7 mSATA mini 3SE4 mSATA mini 3IE4 mSATA mini 3ME4 Key Features 1. Truly industrial designed firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Performance and data quality congruent to SLC 4. Excellent data transfer speed 5. LDPC technology secures SSD reliability 1. LDPC technology secures SSD reliability 2. DRAM-less, high-level data integrity Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type 3D TLC SLC iSLC MLC Capacity 32GB~512GB 8GB~64GB *For 4GB, please check mSATA mini 3SE3 8GB~64GB 8GB~128GB Max. Channel 4 2 2 2 Sequential R/W (MB/sec, max.) 560/520 525/360 530/340 430/125 Max. Power Consumption 0.6W (3.3V x 190mA) 1.3W (3.3 V x 400mA) 0.6W (3.3V x 200mA) 0.6W (3.3V x 190mA) Thermal Sensor Y Y Y Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 30 x 26.8 x 3.6 30 x 26.8 x 3.4 30 x 26.8 x 3.4 30 x 26.8 x 3.4 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours*** Standard Temp. OP (0°C~+70°C) DEMSM-XXXDK1EC*** DEMSM-XXXM41SC*** DHMSM-XXXM41BC*** DEMSM-XXXM41BC*** Wide Temp. OP (-40°C~+85°C) DEMSM-XXXDK1EW*** DEMSM-XXXM41SW*** DHMSM-XXXM41BW** DEMSM-XXXM41BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G) ***= flash configuration (internal control code)%=Flash Type
  • 34.
    34 SD/micro SD Innodisk SDand microSD cards are single-level flash devices built for rugged applications in the embedded field. As an industrial-grade SD/ microSD card, these cards deliver outstanding performance of up to 54MB per second as well as excellent endurance and reliability, especially compared to other cards used in the mobile market. The Innodisk SD and microSD cards are compatible with SD 2.0 /SD 3.0 standards and support SDHC Class 10(UHS-I). They also feature SMART technology, which monitors the reliability of these SD cards. Model Name Industrial micro SD Card Micro SD 3SE3 MicroSD 3ME2 Industrial SD Card Industrial SD Card 3ME3 Key Features Enhanced power cycling management Power cycling enhancement 1. Support Class 10 with UHS-I 2. High performance 3. SPI mode supported 1. Designed for industrial applications 2. High reliability 3. Customizeable 4. Power fail mangement 5. AES (Optional) 1. High performance 2. Power fail management 3. BCH ECC implement Interface SD 1.01/2.0 SD 3.0 SD 3.0 SD 3.0 SD 3.0 Flash Type SLC SLC MLC SLC/iSLC/MLC MLC Capacity 1GB~4GB 4GB~8GB 8GB~64GB SLC: 128MB~32GB iSLC: 8GB~64GB MLC: 8GB~128GB 8GB~128GB Max. Channel 1 1 1 1 1 Sequential R/W (MB/sec, max.) 23/20 30/23 75/31 SLC: 23/21 iSLC: 61/36 MLC: 54/18 80/46 Max. Power Consumption 0.17W ( 3.3V x 50mA) 1.2W (3.3V x 387mA) 0.7W (3.3V x 219mA) 0.22W (3.3V x 69mA )(SLC) 0.34W (3.3V x 105mA )(MLC) 0.56W (3.6V x 158mA) S.M.A.R.T Y Y Y Y Y Dimension (WxLxH/mm) 11.0 x 15.0 x 1.0 11.0 x 15.0 x 1.0 11.0 x 15.0 x 1.0 24.0 x 32.0 x 2.1 24.0 x 32.0 x 2.1 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (-25°C~+85°C) DS2M- XXXI81AC*** DESDM-XXXS02AE*** DESDM-XXXE21SEASK DESDC-XXXY81%C*** DHSDC-XXXY81%C***(iSLC) DESDC-XXXS02BC*** Wide emp. OP (-40°C~+85°C) DS2M- XXXI81AW*** DESDM-XXXS02AW*** NA DESDC-XXXY81%W*** DHSDC-XXXY81%W***(iSLC) DESDC-XXXS02BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G)*** = flash configuration (internal control code) %=Flash Type The Innodisk CFast is a small form factor card standard with high data storage capacity. It is suitable for semi-industrial applications. Compliant with the CFast 2.0 standard, it is designed with a 7+17 pin connector and is SATA compatible. The Innodisk CFast offers data transfer rates of sequential read up to 560 MB/sec and of sequential write up to 520MB/sec. CFast Model Name CFast 3TE7 CFast 3SE4 Key Features 1. Industrial-grade firmware with 3D NAND 2. Advanced LDPC ECC engine 3. Internal RAID Technology 4. DRAM-less, high-level data integrity 5. Excellent data transfer speed 1. High quality SLC-based solution 2. DRAM-less, high-level data integrity 3. LDPC technology secures SSD reliability 4. Excellent data transfer speed Interface SATA III 6.0Gb/s SATA III 6.0Gb/s Connector 7pin+17pin 7pin+17pin Flash Type 3D TLC SLC Capacity 32GB~512GB 8GB~64GB Max. Channel 4 2 Sequential R/W (MB/sec, max.) 560/330 530/360 Max. Power Consumption 1.81W (3.3V x 550mA) 1.59W (3.3V x 480mA) Thermal Sensor Y Y External DRAM Buffer N N iData Guard Y Y iCell N N TRIM Y Y ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 42.8 x 36.4 x 3.6 42.8 x 36.4 x 3.6 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DECFA-XXXDK1EC*** DHCFA-XXXM41SC*** Wide Temp. OP (-40°C~+85°C) DECFA-XXXDK1EW*** DECFA-XXXM41SW*** Note xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) %=Flash Type
  • 35.
    35Product specifications aresubject to change without prior notice. l Model Name CFast 3IE4 CFast 3ME4 CFast 3MG2-P Key Features 1. Cost-effective industrial Flash with iSLC 2. Lifespan 7 times longer than MLC 3. Excellent IOPS performance 4. Designed with LDPC ECC engine 5. Support hardware write protect 1.Exclusive L3 architecture 2. Designed with LDPC ECC engine 3. Excellent IOPS performance 4.Support hardware write protect 1. Compliant with CFast 2.0 satndard 2. EverGreen L² architecture 3. High Sequential/IOPS performance 4. Support DEVSLP 5. iData Guard Protection Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Connector 7pin+17pin 7pin+17pin 7pin+17pin Flash Type iSLC MLC MLC Capacity 8GB~128GB 8GB~256GB 32GB~256GB Max. Channel 2 2 4 Sequential R/W (MB/sec, max.) 530/360 530/210 560/350 Max. Power Consumption 0.76W (3.3V x 230mA) 0.86W (3.3V x 260mA) 2.51W (3.3V x 760mA) Thermal Sensor Y Y Y External DRAM Buffer N N Y iData Guard Y Y Y iCell N N N TRIM Y Y Y ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 42.8 x 36.4 x 3.6 42.8 x 36.4 x 3.6 42.8 x 36.4 x 3.6 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DHCFA-XXXM41BC*** DECFA-XXXM41BC*** DGCFA-XXXD81BC*** Wide Temp. OP (-40°C~+85°C) DHCFA-XXXM41BW*** DECFA-XXXM41BW*** DGCFA-XXXD81BW*** Note xxx = density (08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56 ) ***= flash configuration (internal control code) %=Flash Type Model Name iCF 9000 iCF 1SE iCF 1ME Key Features 1. High sustained data transfer speed 2. Enhanced power cycling management High quality SLC-based solution 1. Budget friendly MLC-based solution 2. Enhanced power cycling management Interface PATA PATA PATA Connector 50pin CF connector 50pin CF connector 50pin CF connector Flash Type SLC SLC MLC Capacity 1GB~64GB 512MB~8GB 8GB~256GB Max. Channel 4 2 2 Sequential R/W (MB/sec, max.) 110/100 40/30 110/110 Max. Power Consumption 0.95W (5V x 190mA) 0.63W (3.3V x 190mA) 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 0.76W (5V x 155mA) 0.52W (3.3V x 155 mA) Thermal Sensor N N N ATA Security Y Y Y S.M.A.R.T Y Y Y Dimension (WxLxH/mm) 42.8 x 36.4 x 3.3 42.8 x 36.4 x 3.3 42.8 x 36.4 x 3.3 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DC1M-XXXD71AC*** DC1M-XXXD41AC*** DECFC-XXXD53BC*** Wide Temp. OP (-40°C~+85°C) DC1M-XXXD71AW*** DC1M-XXXD41AW*** DECFC-XXXD53BW*** Note PIO mode 0-6 UDMA mode 0-7 PIO mode 0-6 UDMA mode 0-4 PIO mode 0-6 UDMA mode 0-7 Notes XXX = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56) ***= flash configuration (internal control code) % =Flash Type CF Card Innodisk’s Industrial CompactFlash Memory Card (iCF) complies with the PCMCIA* ATA standard. Designed to replace traditional rotating disk drives, Innodisk iCFs are embedded solid-state data storage systems that are designed for mobile computing and the industrial work place.
  • 36.
    36 Model Name MiniPCIeDOM 1SE Mini PCIeDOM 1ME3 Key Features 1. Standard Mini PCIe form factor 2. Driver-less 3. PCIe Gen.1x1 1. Standard Mini PCIe form factor 2. Driver-less 3. PCIe Gen.1x1 Interface PCI Express Gen.1x1 PCI Express Gen.1x1 Flash Type SLC MLC Capacity 4GB~64GB 16GB~256GB Max. Channel 4 2 Sequential R/W (MB/sec, max.) 85/85 130/100 Max. Power Consumption 2.3 W (3.3V x 700mA) 2 W (3.3V x 620mA) Thermal Sensor STD : N, W/T : Y External DRAM Buffer N N iData Guard Y Y iCell N N TRIM N N ATA Security Y Y S.M.A.R.T Y Y Dimension (WxLxH/mm) 30.0 x 50.95 x 5.0 30.0 x 50.9 x 5.0 Environment Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours StandardTemp.OP(0°C~+70°C) DEEDM-XXXJ30AC*** DEEDM-XXXD09BC*** Wide Temp. OP (-40°C~+85°C) DEEDM-XXXJ30AW*** DEEDM-XXXD09BW*** Note XXX = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) %=Flash Type Mini PCIeDOM The Innodisk Mini PCIeDOM is a Flash based disk module with standard Mini PCIe form factor, and PCI Express Gen.1 interface. It is suitable for board maker or SI to design in the product as a boot drive or a storage device. Meanwhile, it supports multiple operating systems with no driver needed, including Windows XP, Windows 7, and Linux based OS. Model Name EDC 1SE Vertical Type EDC 1SE Horizontal Type EDC 1ME Vertical Type EDC 1ME Horizontal Type Key Features 1. Dust prevention 2. High quality SLC-based solution 1. High quality SLC-based solution 2. Supported mounting hole 1. Budget- friendly MLC-based solution 2. High performacne PATA solution 1. Budget- friendly MLC-based solution 2. High performacne PATA solution Connector 40/44 pin 40/44 pin 44 pin 44 pin Interface PATA PATA PATA PATA Flash Type SLC SLC MLC MLC Capacity 512MB~4GB 512MB~8GB 8GB~128GB 8GB~256GB Max. Channel 2 2 2 2 Sequential R/W (MB/sec, max.) 40/28 40/28 110/75 110/75 Max. Power Consumption 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 0.75W (5V x 150mA) 0.5W (3.3V x 150mA) 1.05W (5V x 150mA) 0.69W (3.3V x 150mA) 1.05W (5V x 150mA) 0.69W (3.3V x 150mA) Thermal Sensor N N N N External DRAM Buffer N N N N ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 40 pin: 60.2 x 27.3 x 6.4 44 pin: 50.3 x 27.3 x 5.8 40 pin (A,B type): 55 x 32.4 x 12.9 40 pin (C,D type): 55 x 32.4 x 14.6 40 pin (E,F type): 55 x 32.4 x 18.3 44 pin (A,B type): 48 x 32.6 x 6.7 44 pin (C,D type): 48 x 32.6 x 12.8 44 pin (E,F type): 48 x 32.6 x 12.9 50.3 x 27.3 x 7.5 A,B type: 48 x 32.6 x 7.3 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) 40PIN DE0H-XXXD41AC*** 44PIN DE4H-XXXD41AC*** 40PIN DE0P%-XXXD41AC*** 44PIN DE4P%-XXXD41AC*** DEE4H-XXXD53BC*** DEE4%-XXXD53BC*** Wide Temp. OP (-40°C~+85°C) 40PIN DE0H-XXXD41AW*** 44PIN DE4H-XXXD41AW*** 40PIN DE0P%-XXXD41AW*** 44PIN DE4P%-XXXD41AW*** DEE4H-XXXD53BW*** DEE4%-XXXD53BW*** Note xxx = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A2, 256GB=B56) ***= flash configuration (internal control code), %=Horizonyal type(A,B,C,D,E,F) EDC The Innodisk Embedded Disk Card (EDC) complies with PCMCIA* ATA standards and fits into all platforms with an IDE connector. The Innodisk Embedded Disk Card comes in capacities ranging from 512MB to 256GB and is available in 40-pin and 44-pin connector packages.
  • 37.
    37Product specifications aresubject to change without prior notice. USB The Innodisk industrial-grade USB series is built using SLC NAND flash and features an attractive small form factor. It provides high-capacity flash memory storage while delivering faster data transmission with high reliability. It also complies with the high-speed USB 3.0 interface and is backward compatible with USB 1.1. The Innodisk USB series has a variety of special features, from plastic and metal housing to secure mounting holes to EDC choices. Model Name USB Drive 3SE USB Drive 3ME USB Drive 2SE Key Features 1. Metal housing to enhance ESD protection 2. 30μ golden finger for highly reliable data transfer quality 1. Metal housing to enhance ESD protection 2. 30μ golden finger for highly reliable data transfer quality Interface USB 3.0 USB 2.0 Connector Type A Type A Flash Type SLC MLC SLC Capacity 4GB~32GB 8GB~64GB 512MB~16GB Max. Channel 1 1 1 Sequential R/W (MB/sec, max.) 100/85 100/50 28/24 Max. Power Consumption 0.70W (5V x 140mA) 0.85W (5V x 170mA) Dimension (WxLxH/mm) 16.5 x 45.8 x 7.6 16.5 x 45.8 x 7.4 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEUA1-XXXI61SC*** DEUA1-XXXI61BC*** DEUA1-XXXI72AC*** WideTemp.OP(-40°C~+85°C) DEUA1-XXXI61SW*** DEUA1-XXXI61BW*** DEUA1-XXXI72AW*** Notes XXX = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12 ) ***= flash configuration (internal control code) Model Name USB EDC Vertical 3SE USB EDC Vertical 3ME USB EDC Horizontal 2SE USB EDC Horizontal 2ME USB EDC Vertical 2SE USB EDC Vertical 2ME Key Features 1. High performance with USB 3.0 interface 2. Low power consumption 3. Wear-Leveling supported 1. Supported mounting hole 2. 2.0/2.54 pin pitch 1. Very low profile 2. Low power consumption Interface USB 3.0 USB 2.0 USB 2.0 Connector Standard, 20pin, 2.00mm Standard 9pin, 2.54mm Low profile 9pin, 2.00mm Standard, 9pin, 2.54mm Flash Type SLC MLC SLC MLC SLC MLC Capacity 4GB~32GB 8GB~64GB 512MB~32GB 8GB~128GB 512MB~16GB 8GB~64GB Max. Channel 1 1 1 1 1 1 Sequential R/W (MB/sec, max.) 110/85 100/50 28/24 27/18 28/24 26/18 Max. Power Consumption 0.79W (5V x 158mA) 0.85W (5V x 170mA) 0.85W (5V x 170mA) Dimension (WxLxH/mm) 24.0 x 22.0 x 5.0 26.6 x 36.9 x 9.6 (Pin Pitch2.54) 26.6 x 36.9 x 6.6 (Pin Pitch2.00) 15.2 x 34.1 x 6.4 Environment Vibration: 20G@7~2000Hz/Shock: [email protected]/Storage Temperature: -55°C ~ +95°C/MTBF: >3 million hours Standard Temp. OP (0°C~+70°C) DEUV1-XXXI61SC*** DEUV1-XXXI61BC*** DEUH1-XXXI72AC*** DEUH2-XXXI72AC*** DEUH1-XXXI72BC*** DEUH2-XXXI72BC*** DEUV1- XXXI72AC*** DEUV1- XXXI72BC*** WideTemp.OP(-40°C~+85°C) DEUV1-XXXI61SW*** DEUV1-XXXI61BW*** DEUH1-XXXI72AW*** DEUH2-XXXI72AW*** DEUH1-XXXI72BW*** DEUH2-XXXI72BW*** DEUV1- XXXI72AW*** DEUV1- XXXI72BW*** Notes XXX = density (512MB=512, 01GB=01G, 02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, ) ***= flash configuration (internal control code)
  • 38.
    38 Software Solutions With ournewest Innodisk Cloud Administration Platform (iCAP™) we offer complete storage monitoring services for IoT applications. In addition, our extensive software portfolio is designed to meet the growing needs of integration in the embedded and industrial market. Software portfolio: • iCAPTM – Cloud Administration Platform • iSMARTTM –Flash Device Management • iTrackerTM –SD Card and USB Management • iCoverTM – System Recovery • iOpalTM – Self-Encrypting Drive Management
  • 39.
    39Product specifications aresubject to change without prior notice. Innodisk Cloud Administration Platform iCAP™ iCAP™ is a browser-accessed management platform that allows you to monitor the status of solid state drives (SSD), memory and other components in edge devices. It does this by gathering data from all connected devices and storing it on a central server, either on the cloud or on a company intranet. From here the data is easily accessible from your cell phone, pad or laptop with online access. System Architecture iCAP Dashboard Management Interface Effectively monitor remote device status Keep tabs on current CPU and Memory loading By analyzing the read/ write behavior of connected storage devices, iCAP can accurately predict remaining storage device lifetime User-friendly monitoring function allowing the user to manage and analyze storage information in detail Customizable widgets including gauges, Google Maps, and various tables presenting device data The web page dashboard enables the user to easily manage connected devices through supported browsers · Cloud · On-premise iCAP Dashboard iCAP Server AIoT Devices (iCAP Agent) Data Collection Smart Management Remote Control
  • 40.
    40 iCAP Advantage System Requirements WebService Server Agent Web browsers that supports HTML5, CSS3, JavaScript: Microsoft Internet Explorer 10+ I Google Chrome:9.0+ I Firefox:15.0+ I Safari:5.1+ Hardware Minimum Requirements: IntelR Core™ i3 2.3 Ghz CPU or above I 4 GB RAM I 20 GB root partition for the system I 100 GB data storage Operating System: Ubuntu 14.04+ I Docker 17.03+ Hardware: Bundled with Innodisk Storage products Operating System: Windows 10/8.1/7/XP kernel 32/64-bits I Ubuntu 16.04 64-bits I Debian 8 64-bits I Others by request High Compatibility The iCAP agent application supports devices running on both Windows and Linux and will seamlessly integrate any device not already supported by iCAP. Flexible Dashboard User can freely alter the dashboard and choose the parameters and widgets relevant to their application. Easy Access iCAP can be run on a long list of supported web browsers, allowing quick access with internet connectivity, no matter where you are located. Effective Event Tracker The event notification tracker will log all changes and keep the user up to speed, enabling a swift resolution to any issues that might occur. System Backup & Recovery iCAP integrates Innodisk’s proprietary iCover tool that allows for remotely initialized system backup and recovery
  • 41.
    41Product specifications aresubject to change without prior notice.41 iSMART iSMART is designed to simplify SMART information and provide an easy to read interface for the user. The iSMART tool monitors the health and lifespan of Innodisk's SSDs and also provides details on usage patterns. Alerts are easily configured to issue warnings before any critical errors can occur. With iSMART, the user is able to properly integrate Innodisk's SSDs into their solutions by carefully monitoring behavior and lifespan during development, integration, and mass production. Dashboard The Dashboard’s home tab aims to provide a summary or quick snapshot of each installed disks in the system. This page offers accurate data information regarding Temperature, Health, Capacity, Lifespan, iAnalyzer, and Notifications. Device Information The Device Information page provides additional functions, such as Power Status, Partitions, and detailed information of the device such as Serial Number, Firmware Vision, Interface, and Features. To learn more about SMART information, go to SMART values and refer to the SMART tab. iAnalyzer When activated, the iAnalyzer tab displays the read/ write behaviors of the SSD in real time. This allows the user to understand their application usage of the SSD. Sequential and Random I/Os are easily broken down into percentages making them easy to read. Alert The Alert tab helps the user set trigger points with Temperature, Health percentage, Remaining Capacity or Life Remaining. If these trigger points exceed their boundaries, the iSMART utility can send a warning and email to the user notifying them that something may fail. PCIe NVMe Support iSMART supports logging for PCIe NVMe devices. The user can easily check the PCIe storage device health status. iSMART for Linux The iSMART Linux version provides every storage device’s SMART values by vender command, and also fully supports the iAnalyzer function.
  • 42.
    42 iTracker is Innodisk'sdedicated software tool for SD 3.0 cards and USB products. It offers a customizable approach to accessing flash card SMART values. Compatibility with both Windows and Linux systems and an intuitive user interface ensures an easy system integration and user experience. Features: • Dedicated Innodisk Industrial SD Card and USB Management Software • Intuitive visualized SMART information • Flexible widgets for customized requirements • Support for both Windows & Linux systems iTracker SD Information ž iTracker enables easy access to SD card and USB series information ž SD 3.0 (Hyperstone) - Product name - FW version - Correction capability for flash - Total number of flash block ž SD 3ME3 (SM2702) - Product name - Bus width - Speed class - Speed grade USB Information ž USB series product (SM3268) - Product name - Manufacture - Serial number - Firmware version - Package version - P/E cycles SMART ž The iTracker SMART page shows more details about device health status and helps the user predict remaining lifespan ž Write protect feature can also easily be enabled and disabled System Page ž iTracker system page enables the user to easily check system information
  • 43.
    43Product specifications aresubject to change without prior notice.43 Reliable backup and recovery for your industrial system through intuitive and simple one-key software iCover is an easy-to-use, highly-customized backup and recovery software tool designed for industrial computers. iCover will not only recover the operation system, but also all of the applications, drivers and personal data by using the recovery image. It is fully compatible with Microsoft Windows and Linux operating systems. Even if the system should become unresponsive, this quick recovery tool will restore it to its original state. Advantage iCover One-key recovery Easy partition backup Support backup and recovery of operating system to network files system Replaceable logo Remote Backup and Recovery Support SMB/CIFS protocol to backup and recover system image Intelligent disk management Create and manage the partitions of your system System Requirements Items iCover Processor 1GHz or faster RAM 2GB Supported Devices Innodisk Storage Devices OS Support Windows: Windows XP/7/8.1/10 I Windows Embedded Series Linux: Ubuntu/Yotco/CentOS File System Windows: NTFS/FAT32 Linux: Ext4/Ext3/Ext2 UEFI BIOS Support Supports legacy/ UEFI BIOS recovery Intuitive GUI operation Switch between user mode and recovery mode with the touch of a button
  • 44.
    44 Advantages User-friendly Gives an intuitiveuser interface to the TCG Opal 2.0 specifications and SED management while supporting up to 5 devices simultaneously. Multi-function iOpal's data storage management features are designed to enhance data security and communication with the host system. From Factor 3MG2-P with AES 2.5” SSD, M.2(S42,S80), mSATA, SATA Slim 3SE2-P with AES 2.5” SSD, 1.8” SSD TCG Opal-Compliant Software The TCG defined standard for self-encrypting drives (SED) emphasizes data security and ease of use. Innodisk’s software conforms to this standard and can provide a simple and intuitive way to handle SED management. The software allows the user to easily define different ranges for different users – allowing for a system where data is shared on a strictly need-to-know basis. Windows 7 / Windows 10 / Linux Ubuntu / Linux Fedora Supported OS List iOpal Revert function can be divided into two levels, which are representative of different reverting contents. Limits permissions toward self-encrypting drives, need correspondence to the relevant credentials or passwords for the different levels of functions Pre Boot-up Authorization(PBA) is a process used to add a shadow Master Boot Record (MBR) region and implement the boot-up authoriza- tion procedure by entering correct password Set locking range allows setting up divided locking range for different authorizations Device locking setting information High compatibility: iOpal is available in both Windows and Linux versions for a much broader applicability
  • 45.
    45Product specifications aresubject to change without prior notice. DRAM DRAM Modules Innodisk’s industrial-grade DRAM series features high-quality memory modules that have been specifically designed and developed for industrial computers and similar applications. Our specialized SPD team is ready to provide system designers with a complete turn-key solution for any engineering requirements. Innodisk’s DRAM modules are categorized to meet different systems’ needs, and supports DDR4, DDR3, DDR2, DDR, and SDRAM. Our DRAM modules are available in 4 product lines: Embedded, Server, Wide Temperature, and Special Customized. Innodisk’s comprehensive range of DRAM modules includes: Unbuffered DIMM, Unbuffered SO-DIMM, Unbuffered ECC DIMM, Unbuffered ECC SO-DIMM, Mini DIMM, and registered DIMM, conformal coated DRAM, and side filled DRAM.
  • 46.
    46 iRAMTM iRAMAdvantages • Exclusive: Uniquesoftware developed by Innodisk • Precise: iRAM can detect IC failure within every piece of IC, including ECC IC status • Reliable & Stringent: iRAM integrates several tier 1 testing patterns for server platforms. This accurately simulates high-stress and heavy-loading condition and can filter out the potential unqualified modules efficiently • Authentic: iRAM is a web-based diagnostic tool that not only simulates multipoint servers and workstation computing scenarios but also detects unexpected issues where other software falls short Chamber test Packing Visual Inspection iRAM test Vibration test1 2 Open/ Short Test3 456 An Innodisk Exclusive Testing Software The testing quality and strictness of iRAM easily surpasses that of similar testing software. With this exclusive Innodisk tool, any underperforming components will be quickly be identified and weeded out. Innodisk ECC & RDIMM Modules Testing Process Innodisk performs comprehensive quality checks after production. For ECC and RDIMM modules, we can ensure the highest quality, reliability, and performance that ultimately will reduce your maintenance cost. The Strengths of iRAM Precise Exclusive Stringent Reliable Authentic iRAM
  • 47.
    47Product specifications aresubject to change without prior notice. IC Grade IC Hierarchy Distinguishing Original from Lower Grade IC Why do we only use “Original IC”? Original IC Original IC (Innodisk) -Fully tested by major IC suppliers Effectively Tested DRAM - Effectively tested but test patterns can vary by suppliers - Logo unmarked or only marked with partial IC part number Untested DRAM - Untested - Logo unmarked Low Grade - DRAM IC with unknown quality confirmed as not having full data sheet parts eTT uTT Low Grade 1.TopQuality Environmental and Application Challenges: The areas Innodisk operates in are industrial in nature. These areas give rise to harsh environments and a demand for long-lasting devices, which are the principal challenges we face. Innodisk uses original IC, not just for the quality guarantees, but also for the international expertise and experience of the manufacturer. Together, the original IC manufacturer and Innodisk offer the customer the most thorough dual guarantee that ensures that you are equipped to face any challenges in your way. Technology and market development: IoT, AI and AIoT are already solid trends that are actively pursued by the actors in the industrial and embedded markets. High-quality original ICs are necessary to meet the needs of heavy workloads and the high-performance requirements seen in these applications. 2.OriginalManufacturerReport Any device operating under long periods of time will be susceptible to break down and damage. Original man can not only help recycle faulty products and repair damaged ICs, but also provides a complete repair report. This will allow the customer to better understand the reason behind the malfunction and take the necessary steps to avoid future occurrences. However, the original manufacturer will not acknowledge lower grade ICs (as these are third party) and will neither provide a repair report. Samsung Manufacturer logo for example IC P/N 1. No Manufacturer Logo 2. Incomplete IC P/N 3. Incomplete Manufacturer Code Manufacture code Original IC Lower Grade IC
  • 48.
    48 Embedded UDIMM modules areDRAM modules meant to be used as standard products for general embedded applications. These modules are compliant with JEDEC standards and available in DDR1, DDR2, DDR3, and DDR4. Embedded UDIMM Series Standard Solution Module Type DDR4 UDIMM DDR3 UDIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 2GB/4GB/8GB/16GB/32GB 2GB/4GB/8GB Function Non-ECC Unbuffered Memory Pin Number 288pin 240pin Width 64Bits 64Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Anti-Sulfuration √ — Value-Added Service (Optional) Conformal Coating / Side Fill Series Standard Solution Module Type DDR2 UDIMM DDR UDIMM Data Rate 533 MT/s, 667 MT/s, 800 MT/s 333 MT/s, 400 MT/s Capacity 1GB/2GB/4GB 512MB/1GB Function Non-ECC Unbuffered Memory Pin Number 240pin 184pin Width 64Bits 64Bits Voltage 1.8V 2.6V PCB Height 1.18 Inches 1.16 Inches Operating Temperature 0 ~ 85°C 0 ~ 70°C Anti-Sulfuration — — Value-Added Service (Optional) Conformal Coating / Side Fill
  • 49.
    49Product specifications aresubject to change without prior notice. Small-outline DIMMs (SODIMM) modules are general DRAM modules meant to be usesd as standard products for embedded applications with limited space. These modules are compliant with JEDEC standards and help in eliminating the need for changing designs due to limited space. Embedded SODIMM Series Standard Solution Module Type DDR4 SODIMM DDR3 SODIMM DDR2 SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 533 MT/s, 667 MT/s, 800 MT/s Capacity 2GB/4GB/8GB/16GB/32GB 1GB/2GB/4GB/8GB 512MB/1GB/2GB/4GB Function Non-ECC Unbuffered Memory Pin Number 260pin 204pin 200pin Width 64Bits 64Bits 64Bits Voltage 1.2V 1.5V/1.35V 1.8V PCB Height 1.18 Inches 1.18 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Anti-Sulfuration √ — — Value-Added Service (Optional) Conformal Coating / Side Fill Series Standard Solution Module Type DDR SODIMM SDRAM SODIMM Data Rate 333 MT/s, 400 MT/s 100 MT/s, 133 MT/s Capacity 256MB/512MB/1GB 128MB/256MB/512MB Function Non-ECC Unbuffered Memory Pin Number 200pin 144pin Width 64Bits 64Bits Voltage 2.6V 3.3V PCB Height 1.25 Inches 1.25 Inches Operating Temperature 0 ~ 70°C 0 ~ 70°C Anti-Sulfuration — — Value-Added Service (Optional) Conformal Coating / Side Fill
  • 50.
    50 Server Registered DIMM modulesare designed to ensure data integrity at both the device and system level of the server. In addition, all Innodisk Registered DIMM modules are tested by our exclusive iRAM testing software to ensure stable performance. Registered DIMM Series Server Solution Module Type DDR4 RDIMM DDR3 RDIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB/16GB/32GB* 2GB/4GB/8GB Function Registered Memory with ECC Pin Number 288pin 240pin Width 72Bits 72Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ (*With exception of the 32GB module) — Wide Temperature Designed for industrial systems, Innodisk’s Wide Temperature DRAM modules are the best choice for applications operating in harsh conditions. Our wide temperature modules use industrial-grade SDRAM components with 30u” Gold fingers to ensure that the memory maintains its high-quality signal, even at temperatures as low as -40ºC or as high as 85ºC. Wide Temperature Unbuffered DIMM Series Wide Temperature Solution Module Type DDR4 WT UDIMM DDR3 WT UDIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB/16GB/32GB 2GB/4GB/8GB Function Non-ECC Unbuffered Memory Pin Number 288pin 240pin Width 64Bits 64Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ — Value-Added Service (Optional) Conformal Coating / Side Fill
  • 51.
    51Product specifications aresubject to change without prior notice. Series Wide Temperature Solution Module Type DDR4 WT SODIMM DDR3 WT SODIMM DDR2 WT SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 533 MT/s, 667 MT/s, 800 MT/s Capacity 4GB/8GB/16GB/32GB 2GB/4GB/8GB 1GB/2GB Function Non-ECC Unbuffered Memory Pin Number 260pin 204pin 200pin Width 64Bits 64Bits 64Bits Voltage 1.2V 1.5V/1.35V 1.8V PCB Height 1.18 Inches 1.18 Inches 1.18 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration √ — — Value-Added Service (Optional) Conformal Coating / Side Fill Wide Temperature Unbuffered DIMM with ECC Series Wide Temperature Solution Module Type DDR4 WT ECC UDIMM DDR4 WT ECC SODIMM DDR3 WT ECC UDIMM DDR3 WT ECC SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB/16GB/32GB 4GB/8GB/16GB/32GB 2GB/4GB/8GB 2GB/4GB/8GB Function ECC Unbuffered Memory Pin Number 288pin 260pin 240pin 204pin Width 72Bits 72Bits 72Bits 72Bits Voltage 1.2V 1.2V 1.5V/1.35V 1.5V/1.35V PCB Height 1.23 Inches 1.18 Inches 1.18 Inches 1.18 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ √ √ Anti-Sulfuration √ √ — — Value-Added Service (Optional) Conformal Coating / Side Fill Wide Temperature ECC DIMMs are designed for both industrial systems and servers, Innodisk’s Wide Temperature DRAM modules are best suited for applications that must work in extreme temperatures. With the ECC function, the Wide Temperature DIMMs also ensure that data is corrected when corrupted data bits are found during data retrieval.
  • 52.
    52 Series ECC UnbufferedDIMM Solution Module Type DDR4 ECC UDIMM DDR4 ECC SODIMM DDR4 ECC UDIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB/16GB/32GB 4GB/8GB/16GB/32GB 4GB/8GB/16GB Function ECC Unbuffered Memory Pin Number 288pin 260pin 288pin Width 72Bits 72Bits 72Bits Voltage 1.2V 1.2V 1.2V PCB Height 1.23 Inches 1.18 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration √ √ √ Value-Added Service (Optional) Conformal Coating / Side Fill ECC modules are designed to detect and correct single-bit errors that occur during data storage and transmission. ECC modules use Hamming Code or Triple Modular Redundancy for error detection and correction, and manage error corrections on their own, without requesting that the data source resend original data. ECC DIMM Series ECC Unbuffered DIMM Solution Module Type DDR4 ECC SODIMM VLP DDR3 ECC UDIMM DDR3 ECC SODIMM Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 4GB/8GB 2GB/4GB/8GB 2GB/4GB/8GB Function ECC Unbuffered Memory Pin Number 260pin 240pin 204pin Width 72Bits 72Bits 72Bits Voltage 1.2V 1.5V/1.35V 1.5V/1.35V PCB Height 0.7 Inches 1.18 Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration √ Value-Added Service (Optional) Conformal Coating / Side Fill Designed for industrial systems, Innodisk’s Wide Temperature DRAM modules are best suited for applications that must work in extreme temperatures. These modules use industrial-grade SDRAM components with 30u” gold finger to ensure that the memory maintains its high- quality signal, even at temperatures as low as -40ºC or as high as 85ºC. Wide Temperature Registered DIMM Series Wide Temperature Solution Module Type DDR4 WT RDIMM DDR4 WT RDIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB/16GB/32GB* 32GB* is only for 2133MT/s and 2400MT/s 4GB*/8GB/16GB 4GB* is only for 2133MT/s and 2400MT/s Function Registered Memory with ECC Pin Number 288pin 288pin Width 72Bits 72Bits Voltage 1.2V 1.2V PCB Height 1.23 Inches 0.738 Inches Operating Temperature -40 ~ 85°C -40 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ √ Value-Added Service (Optional) Conformal Coating / Side Fill
  • 53.
    53Product specifications aresubject to change without prior notice. Series ECC Unbuffered Memory Solution Module Type DDR3 ECC UDIMM VLP DDR3 ECC SODIMM ULP DDR2 ECC UDIMM Data Rate 1333 MT/s, 1600 MT/s, 1866 MT/s 1333 MT/s, 1600 MT/s 667 MT/s, 800 MT/s Capacity 2GB/4GB/8GB 2GB/4GB 1GB/2GB Function ECC Unbuffered Memory ECC Unbuffered Memory ECC Unbuffered Memory Pin Number 240pin 204pin 240pin Width 72Bits 72Bits 72Bits Voltage 1.5V/1.35V 1.5V/1.35V 1.8V PCB Height 0.738  Inches 0.709  Inches 1.18 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill Very Low-Profile (VLP) DIMM modules and Ultra Low-Profile (ULP) DIMM modules are specialized for use in 1U systems, such as blade server data centers, where the system height is lower than 1.18 inches. The design of these modules improves air flow inside a compact system and reduces thermal impact. Very Low-Profile (VLP) DIMM and Ultra Low-Profile (ULP) DIMM Series Very Low-Profile (VLP) Solution Module Type DDR4 UDIMM VLP DDR4 ECC UDIMM VLP DDR4 SODIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB/16GB 4GB/8GB/16GB 4GB/8GB Function Non-ECC Unbuffered Memory ECC Unbuffered Memory Non-ECC Unbuffered Memory Pin Number 288pin 288pin 260pin Width 64Bits 72Bits 64Bits Voltage 1.2V 1.2V 1.2V PCB Height 0.738 Inches 0.738 Inches 0.7 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ Anti-Sulfuration √ √ √ Value-Added Service (Optional) Conformal Coating / Side Fill Series Very Low-Profile (VLP) Solution Module Type DDR4 ECC SODIMM VLP DDR4 RDIMM VLP Data Rate 2133 MT/s, 2400 MT/s, 2666 MT/s 2133 MT/s, 2400 MT/s, 2666 MT/s Capacity 4GB/8GB 4GB/8GB/16GB/32GB Function ECC Unbuffered Memory Registered Memory with ECC Pin Number 260pin 288pin Width 72Bits 72Bits Voltage 1.2V 1.2V PCB Height 0.7 Inches 0.738  Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ √ Value-Added Service (Optional) Conformal Coating / Side Fill
  • 54.
    54 Series Ultra Low-Profile(ULP) Solution Very Low-Profile (VLP) Solution Module Type DDR3 ECC SODIMM ULP DDR3 RDIMM VLP Data Rate 1333 MT/s, 1600 MT/s 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 2GB/4GB 4GB/8GB Function ECC Unbuffered Memory Registered Memory with ECC Pin Number 204pin 240pin Width 72Bits 72Bits Voltage 1.5V/1.35V 1.5V/1.35V PCB Height 0.709 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill All Mini DIMMs are targeted for high speed, high density, high performance telecommunication and cloud systems. The 0.72 inch high ULP Mini DIMM module is specifically designed for networking applications. They are compliant with JEDEC standards and are designed to improve airflow and thermal resistance. With the ECC function, the Mini DIMMs also ensure that data is corrected when corrupted data bits are found during data retrieval. Mini DIMM Series Mini DIMM Solution Module Type DDR4 Mini ECC VLP DDR4 Mini RDIMM VLP Data Rate 2133MT/s, 2400 MT/s Capacity 4GB/8GB/16GB 4GB/8GB Function ECC Unbuffered Memory Registered Memory with ECC Pin Number 288pin Width 72Bits Voltage 1.2V 1.2V PCB Height 0.738 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ Anti-Sulfuration √ √ Value-Added Service (Optional) Conformal Coating / Side Fill Series Very Low-Profile (VLP) Solution Module Type DDR3 UDIMM VLP DDR3 ECC UDIMM VLP DDR3 SODIMM VLP Data Rate 1066 MT/s, 1333 MT/s, 1600 MT/s, 1866 MT/s 1333 MT/s, 1600 MT/s, 1866 MT/s 1333 MT/s, 1600 MT/s, 1866 MT/s Capacity 2GB/4GB/8GB 2GB/4GB/8GB 2GB/4GB/ 8GB Function Non-ECC Unbuffered Memory ECC Unbuffered Memory Non-ECC Unbuffered Memory Pin Number 240pin 240pin 204pin Width 64Bits 72Bits 64Bits Voltage 1.5V/1.35V 1.5V/1.35V 1.5V/1.35V PCB Height 0.738 Inches 0.738 Inches 1.0 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill
  • 55.
    55Product specifications aresubject to change without prior notice. Series Mini DIMM Solution Module Type DDR3 Mini DIMM ECC ULP DDR3 Mini DIMM RDIMM DDR3 Mini RDIMM VLP Data Rate 1066 MT/s, 1333 MT/s, 1600 MT/s Capacity 2GB/4GB 8GB 2GB/4GB Function ECC Unbuffered Memory Registered Memory with ECC Registered Memory with ECC Pin Number 244pin Width 72Bits Voltage 1.5V/1.35V 1.5V/1.35V 1.5V/1.35V PCB Height 0.7 Inches 1.18 Inches 0.738 Inches Operating Temperature 0 ~ 85°C 0 ~ 85°C 0 ~ 85°C Golden finger 30µ” √ √ √ Anti-Sulfuration Value-Added Service (Optional) Conformal Coating / Side Fill Special / Customized In order to meet the high standards of the aerospace and defense industry, our XR-DIMM comes equipped with several advantages which will satisfy your expectation for robust DRAM modules. We offer three densities of DDR4 XR-DIMM, 4GB, 8GB & 16GB, both with an integrated error checking and correction function. With its 300-pin socket connector, Innodisk’s XR-DIMM exceeds the pin number standard established by the SFF Special Interest Group (SFF-SIG), ensuring a firm connection between the CPU and DRAM module. This customized design enables XRDIMM to be highly resistant to shock and vibration, providing a more reliable performance for the aerospace and defense vertical market. XR-DIMM Series XR-DIMM Solutions Module Type DDR4 XR-DIMM DDR3 XR-DIMM Data Rate 2400 MT/s 1600MT/s, 1866 MT/s Capacity 8GB/16GB 4GB/8GB Function ECC Unbuffered Memory Non-ECC Unbuffered Memory ECC Unbuffered Memory Non-ECC Unbuffered Memory Pin Number 300pin 300pin Width 72Bits 64Bits 72Bits 64Bits Voltage 1.2V 1.5V/1.35V PCB Height 1.18 Inches 1.49 Inches Anti-sulfuration √ √ Mounting Hole 2 2 2 2 Value-Added Service (Optional) Conformal Coating / Side Fill/Wide Temperature
  • 56.
    56 Embedded Peripheral Modules EmbeddedPeripheral Modules provide LAN, PoE, CANBus, DIO, Serial Port, Storage, RAID and Display functionality to embedded systems. In order to enrich industrial customer’s embedded solutions with flexibility at the best TCO (Total Cost of Ownership), we are dedicated to creating expandable, space-efficient expansion modules. Innodisk is experienced with the most common interface which include PCIe, USB, SATA and is able to provide this functionality in the wide range of space-saving form factors available today. Just like Innodisk's esteemed memory solutions, our Standard PCIe, mPCIe, 2.5” SSD and M.2(NGFF) modules fit perfectly into any industrial system.
  • 57.
    57Product specifications aresubject to change without prior notice. When it comes to motherboards, adding additional input/ output ports will often require costly re-design. Innodisk can offer solutions that allow for easily implemented expansions on already existing motherboards, saving the system integrator from costly and time-consuming re-design. In other words, using a standard motherboard as a basis, Innodisk can assist you in creating various products according to different specifications. Through expansion slots such as PCIe, M.2, mPCIe, SATA and USB pin header Innodisk modules can easily expand to various I/O devices. Benefits 1. One motherboard for multiple products 2. Efficient components sharing 3. Accelerate the process of new products to the market 4. Significantly reduce development costs Traditional scenario : Standard mother board with different fixed I/O Innodisk Solution: Standard motherboard with Innodisk Efficient Modular Expansion Expansion Card Solutions Innodisk Efficient Modular Expansion Product Categories and I/O Descriptions Industrial design Industrial temperature (-40 ºC to 85 ºC) Up to ESD contact 8KV and air 15KV protection Up to 2.5 KV isolation to prevent damage your system
  • 58.
    58 Fulfilling the Needsof Various Vertical Markets Transportation Transportation includes interfaces such as Power over Ethernet (PoE), CANbus and LAN. With Innodisk expansion cards, the system integrator can facilitate seamless connectivity and data safety for in-vehicle systems. Medical Medical industrial devices link to a variety of other devices, such as: VOIP phones, web cameras, high quality speakers, MSR and bar code scanners. These devices commonly use USB and serial interfaces. A RAID solution offers strong data integrity for critical applications. Automation Industrial control units using RS422/485 signals to control devices requires solid Ethernet network extensions. HMI devices are used to display important data regarding ongoing operations. Retail Retail industry includes point-of-sales, kiosk and digital signage products. This kind of equipment runs on Serial and USB expansions. In addition, digital signage usually need to support multi-screen, can use Innodisk’s display expansion card which supports up to three screens at the same time.
  • 59.
    59Product specifications aresubject to change without prior notice. Innodisk expansion modules aim to provide flexible connectivity and bandwidth to industrial systems. With our mPCIe GbE LAN, PoE, CANBus and serial communication modules, users can expand the existing system to meet dynamic connectivity under IoT. CANBus (Controller Area Network) is a type of serial communication that is widely used in automation, embedded systems and the automotive industry. Innodisk has developed the EMUC-B202 CANbus expansion card specifically to fulfill these needs. It provides dual-port CAN 2.0B/ J1939 connectivity with an isolation design, and supports a wide temperature range in order to enhance system security and reliability. Based on an inbuilt Linux CDC-ACM, the Innodisk EMUC-B202 uses a custom-made SocketCAN network driver that allows two ports on a single card. Thus, it provides maximum compatibility for customers when developing programs. Other than SocketCAN, Innodisk also provides complete Windows/Linux software API, test utility and sample code for traditional character drivers. Complete Software Support Model Name EMUC-B202 EGPC-B201 Module Type USB to dual isolated CANbus 2.0B/J1939 Module M.2 to dual isolated CANbus 2.0B/J1939 Module Key Features 1. CANbus 2.0B backward compatible with 2.0A 2. Support baud rate 100/125/250/500(default)/800/1000K 3. Support CAN message acceptance filter 4. Keep configuration after hardware reboot 5. Up to 6000 CAN messages per second (receive data) 6. Support Listen-only mode 7. Additional driver to support Linux SocketCAN 8. Support SAE J1939 high layer protocol (Optional) 9. Termination resistor enabled/disabled by jumper 10. Supports 3rd  mounting hole and USB Pin header for out-of-minicard installation 11. Complies with EN61000-4-5 2.5kV Surge protection 12. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 13. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 14. Industrial temperature -40 ºC to 85 ºC 1. Alternative M.2 2260 or 2280 B-M key 2. CANbus 2.0B backward compatible with 2.0A 3. Support baud rate 100/125/250/500(default)/800/1000K 4. Support CAN message acceptance filter 5. Keep configuration after hardware reboot 6. Up to 6000 CAN messages per second (receive data) 7. Support Listen-only mode 8. Additional driver to support Linux SocketCAN 9. Support SAE J1939 high layer protocol (Optional) 10. Termination resistor enabled/disabled by jumper 11. Complies with EN61000-4-5 2.5kV Surge protection 12. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 13. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 14. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe M.2 2260/2280 Input I/F USB 2.0 PCI Express 2.0 Input Connector mPCIe or 5Pin Header M.2 B-M Output I/F CANbus 2.0B/J1939 x 2 CANbus 2.0B/J1939 x 2 Output Connector DB-9 x 2 DB-9 x 2 Dimension (WxLxH/mm) 30 x 50.9 x 6.1 22 x 60 x 6.1 22 x 80 x 6.1 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Order Info. EMUC-B202-W1 (CAN 2.0B) EMUC-B202-W2 (J1939) EGPC-B201-W1 (2280, CAN2.0B) EGPC-B201-W2 (2280, J1939) EGPC-B201-W3 (2260, CAN2.0B) EGPC-B201-W4 (2260, J1939) Communication 1-1 CANbus SocketCAN CAN 2.0A/2.0B Galvanic Isolation SAE J1939 SAE J1939CAN bus H L ISOLATION API Sample Code By using GUI or Command base test utility the user can easily verify modules Test Utility Provides C/C++/C# sample code to speed up program integration Platform Support API can be used in Windows, Linux and QNX. Other than x86 system, a cross-compiler service for ARM system is also available.
  • 60.
    60 Model Name EMPL-G2P1EMPL-G2P2 EGPL-G2P1 ESPL-G4P1 Module Type mPCIe to dual Isolated PoE Module mPCIe to dual Isolated PoE+ Module M.2 to dual Isolated PoE Module PCIe to four isolated PoE/PoE+ Module Key Features 1. Supports dual isolated GbE LAN ports 2. Two independent PSE channels 3. Supports 12V~24V power input via 4pin header or DC-Jack 4. Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port 5. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 1.7KV HiPOT protection 6. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. Supports dual isolated GbE LAN ports 2. Two independent PSE channels 3. Supports 19V~24V power input via 4pin header 4. Complies with IEEE 802.3at, up to 25.5W at 52V per PoE port 5. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 1.7KV HiPOT protection 6. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. Supports dual isolated GbE LAN ports 2. Two independent PSE channels 3. Supports 12V~24V power input via 4pin header or DC-Jack 4. Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port. 5. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 1.7KV HiPOT protection 6. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. Supports four isolated GbE LAN ports 2. Four independent PSE channels 3. Complies with IEEE 802.3af, up to 15.4W at 48V per PoE port 4. Complies with IEEE 802.3at, up to 25.5W at 54V per PoE port 5. Supports 12V~24V power input via 6pin PCIE-ATX 6. Supplies total power up to 75W 7. Complies with EN61000-4-5 2kV Surge protection 8. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection Form-Factor mPCIe mPCIe M.2 2280 Standard PCIe Input I/F PCI Express 2.1 PCI Express 2.1 PCI Express 2.1 x 1 PCI Express 2.1 Input Connector mPCIe mPCIe M.2 B-M PCIe x 4 Output I/F PoE x 2 PoE+ x 2 PoE x 2 PoE/PoE+ x 4 Output Connector RJ45 x 2 RJ45 x 2 RJ45 x 2 RJ45 x 4 Dimension (WxLxH/mm) 30 x 50.9 x 7.6 30 x 50.9 x 7.6 22 x 80 x 7.1 169.55 x 111.15 x 19.6 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPL-G2P1-C1 (Mounting hole, 4pin header) EMPL-G2P1-W1 (Mounting hole, 4pin header) EMPL-G2P1-C2 (Bracket, 4pin header) EMPL-G2P1-W2 (Bracket, 4pin header) EMPL-G2P1-C3 (Mounting hole, DC Jack ) EMPL-G2P1-W3 (Mounting hole, DC Jack) EMPL-G2P1-C4 (Bracket, DC Jack) EMPL-G2P1-W4(Bracket, DC Jack) EMPL-G2P2-C1 (Mounting hole, 4pin header) EMPL-G2P2-W1 (Mounting hole, 4pin header) EMPL-G2P2-C2 (Bracket, 4pin header) EMPL-G2P2-W2 (Bracket, 4pin header) EGPL-G2P1-C1 (Mounting hole, 4pin header) EGPL-G2P1-W1 (Mounting hole, 4pin heade) EGPL-G2P1-C2 (Bracket, 4pin heade) EGPL-G2P1-W2 (Bracket, 4pin header) EGPL-G2P1-C3 (Mounting hole) EGPL-G2P1-W3 (Mounting hole, DC Jack) EGPL-G2P1-C4 (Bracket, DC Jack) EGPL-G2P1-W4 (Bracket, DC Jack) ESPL-G4P1-C1 ESPL-G4P1-W1 The Industrial-grade Power over Ethernet (PoE) series complies with IEEE 802.3af and 802.3at, ensuring reliable power and data transfer. These expansion cards feature isolated, wide temperature design and are certified to withstand HiPOT and surge occurrences, making it the optimal choice for operation in extreme conditions. 1-2 Power over Ethernet (PoE) Complete Form factor ž Compact and easily integrated form factors: PCIe / mPCIe / M.2 2280 Flexible Expansion ž Supports 12~24V power input via internal 4 pin header or external DC Jack ž Supports alternative fixed approach of mounting hole or bracket for daughter board Industrial Design ž Supports wide temperature -40° ~ +85°C ž Complies with EN61000-4-2 (ESD) Air up to 15kV, Contact up to 8kV ž Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 HiPOT protection ž Complies with EN61000-4-5 Surge protection
  • 61.
    61Product specifications aresubject to change without prior notice. Model Name EMPL-G101 EMPL-G201 EMPL-G102 EMPL-G202 Module Type mPCIe to single isolated GbE LAN Module mPCIe to dual isolated GbE mPCIe to single isolated GbE LAN horizontal Module mPCIe to dual isolated GbE LAN horizontal Module Key Features 1. Single isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Supports mounting terminal or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Supports mounting terminal or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Single isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe mPCIe mPCIe Input I/F PCI Express 2.1 PCI Express 2.1 PCI Express 2.1 PCI Express 2.1 Input Connector mPCIe mPCIe mPCIe mPCIe Output I/F GbE LAN x 1 GbE LAN x 2 GbE LAN x 1 GbE LAN x 2 Output Connector RJ45 x 1 RJ45 x 2 RJ45 x 1 RJ45 x 2 Dimension (WxLxH/mm) 30 x 50.9 x 7.6 30 x 50.9 x 7.6 30 x 50.9 x 5.8 30 x 50.9 x 5.8 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPL-G101-C1 EMPL-G101-W1 EMPL-G101-C2 (with bracket) EMPL-G101-W2 (with bracket) EMPL-G201-C1 EMPL-G201-W1 EMPL-G201-C2 (with bracket) EMPL-G201-W2 (with bracket) EMPL-G102-C1 (Terminal mounting hole, Standard Temp.) EMPL-G102-W1 (Terminal mounting hole , Wide Temp.) EMPL-G102-C2 (Bracket, Standard Temp.) EMPL-G102-W2 (Bracket, Wide Temp.) EMPL-G202-C1 (Terminal mounting hole, Standard Temp.) EMPL-G202-W1 (Terminal mounting hole , Wide Temp.) EMPL-G202-C2 (Bracket, Standard Temp.) EMPL-G202-W2 (Bracket, Wide Temp.) mPCIe and M.2 based GbE LAN cards using Intel Ethernet chip provide high performance 10/100/1000 Mbps network connectivity with an isolation design, and supports a wide temperature range in order to enhance system security and reliability. Small form factor with flexible daughter board can be suitable for smaller industrial computer by using alternative terminal mounting hole of bracket. 1-3 GbE LAN Model Name EGPL-G101 EGPL-G201 EGPL-G102 EGPL-G202 Module Type M.2 to single isolated GbE LAN Module M.2 to dual isolated GbE LAN Module M.2 to single isolated GbE LAN Module M.2 to dual isolated GbE LAN Module Key Features 1. Single isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Single isolated GbE LAN port 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible and small daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC 1. Dual isolated GbE LAN ports 2. Complies with EN61000-4-5 2kV Surge protection 3. Complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 5. Flexible and small daughter board with cable to fit into different system 6. Optional terminal mounting hole or bracket for daughter board 7. Industrial temperature -40 ºC to 85 ºC Form-Factor M.2 2280 M.2 2280 M.2 2242 M.2 2242 Input I/F PCI Express 2.1 x 1 PCI Express 2.1 PCI Express 2.1 x 1 PCI Express 2.1 x 1 Input Connector M.2 B-M M.2 B-M M.2 B-M M.2 B-M Output I/F Gbe LAN x 1 GbE LAN x 2 Gbe LAN x 1 GbE LAN x 2 Output Connector RJ45 x 1 RJ45 x 2 RJ45 x 1 RJ45 x 2 Dimension (WxLxH/mm) 22 x 80 x 7.1 22 x 80 x 7.1 22 x 42 x 9.15 22 x 42 x 9.15 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EGPL-G101-C1 EGPL-G101-W1 EGPL-G101-C2 (with bracket) EGPL-G101-W2 (with bracket) EGPL-G201-C1 EGPL-G201-W1 EGPL-G201-C2 (with bracket) EGPL-G201-W2 (with bracket) EGPL-G102-C1 EGPL-G102-W1 EGPL-G202-C1 EGPL-G202-W1
  • 62.
    62 Model Name EMP2-X202EMP2-X402 EMP2-X203 EMP2-X403 Module Type mPCIe to dual RS-422/485 Module mPCIe to four RS-422/485 Module mPCIe to dual RS-232 Module mPCIe to four RS-232 Module Key Features 1. PCIe 2.0 compliant. RS-422/485 mode configurable by switch. Supports 485HD(Half Duplex) and 485FD (Full Duplex) 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable. 4. Termination Resistor by jumper setting. 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 compliant. RS-422/485 mode configurable by switch. Supports 485HD(Half Duplex) and 485FD (Full Duplex) 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable 4. Termination Resistor by jumper setting 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 16550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable 4. Supports CTS/RTS hardware flow control 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 16550 compatible. 256-byte FIFOs 3. Flexible design with DB-9 connectors and cable 4. Supports CTS/RTS hardware flow control 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe mPCIe mPCIe Input I/F PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 Input Connector mPCIe mPCIe mPCIe mPCIe Output I/F RS-422/485 x 2 RS-422/485 x 4 RS-232 x 2 RS-232 x 4 Output Connector DB-9 x 2 DB-9 x 4 DB-9 x 2 DB-9 x 4 Dimension (WxLxH/mm) 30 x 50.9 x 8.2 30 x 50.9 x 8.2 30 x 50.9 x 6.7 30 x 50.9 x 6.7 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation EMP2-X202-W1 EMP2-X402-W1 EMP2-X203-W1 EMP2-X403-W1 Model Name EMP2-X404 EMP2-X801 EMU2-X1S1 EMU2-X2S1 Module Type mPCIe to four RS-232/422/485 Module mPCIe to eight RS-232/422/485 Module USB to single Isolated RS-232 Module USB to dual Isolated RS-232 Module Key Features 1. PCIe 2.0 compliant. RS-232/422/485 mode configurable by software 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Full RS-232 functions with DB9 connector 4. Termination resistor enabled/disabled by DIP switch 5. RI/5V/12V output switched by Jumper 6. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 compliant. RS-232/422/485 mode configurable by software 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Flexible design with cable and daughter board x 8 (with DB-9 connectors) 4. Termination Resistor and 5V/12V output by jumper setting on daughterboard 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Industrial temperature -40 ºC to 85 ºC 1. USB specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 512-byte FIFOs 3. Full RS232 functions with DB9 connector 4. Supports port-to-port and port-to- computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 5. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 6. Power LED, UART TX/RX access LED 7. Supports 3rd  mounting hole and USB Pin header for out-of-minicard installation 8. Industrial temperature -40 ºC to 85 ºC 1. USB specification Rev. 2.0 compliant 2. Up to 1 Mbps serial data rate. 512-byte FIFOs 3. Full RS232 functions with DB9 connector 4. Supports port-to-port and port-to- computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 5. Complies with EN61000-4-2 (ESD) Air- 15kV, Contact-8kV 6. Power LED, UART TX/RX access LED 7. Supports 3rd  mounting hole and USB Pin header for out-of-minicard installation 8. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe mPCIe mPCIe Input I/F PCI Express 2.0 PCI Express 2.0 USB 2.0 USB 2.0 Input Connector mPCIe mPCIe mPCIe or 5Pin Header mPCIe or 5Pin Header Output I/F RS-232/422/485 x 4 RS-232/422/485 x 8 RS-232 x 1 RS-232 x 2 Output Connector DB-9 x 4 DB-9 x 8 DB-9 x 1 DB-9 x 2 Dimension (WxLxH/mm) 30 x 50.9 x 6.1 30 x 50.9 x 6.1 30 x 50.9 x 6.1 30 x 50.9 x 6.1 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation EMP2-X404-W1 EMP2-X801-W1 EMU2-X1S1-W1 EMU2-X2S1-W1 Various mPCIe-expanded serial cards provide the combination of 2/4/8 ports RS232/RS422/RS485 with PCIe or USB input and ISOLATION/ ESD provides efficient system expansions. Software switches that can help switch the serial port RS232/RS422/485 without the need to open system chassis. 1-4 Serial Port
  • 63.
    63Product specifications aresubject to change without prior notice. Model Name EMP2-X4S1 EMP2-X4S2 EGP2-X401 Module Type mPCIe to four Isolated RS-485 Module mPCIe to dual Isolated RS-422 & RS-485 Module M.2 to four RS-232/422/485 Module Key Features 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 10 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Supports port-to-computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Termination Resistor by switch setting 6. Industrial temperature -40 ºC to 85 ºC 1. PCI-Express specification Rev. 2.0 compliant 2. Up to 10 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Supports port-to-computer isolation, complies with IEC 60950-1:2005 + A1: 2009 + A2:2013 2.5kV HiPOT protection 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. Termination Resistor by switch setting 6. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 compliant. RS-232/422/485 mode configurable by software 2. Up to 25 Mbps serial data rate. 16C550 compatible. 256-byte FIFOs 3. Alternative vertical or horizontal connector 4. Full RS-232 functions with DB9 connector 5. Termination resistor enabled/disabled by DIP switch 6. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 7. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe M.2 2242 Input I/F PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 x 1 Input Connector mPCIe mPCIe M.2 B-M Output I/F RS-485 x 4 RS-422 x 2, RS-485 x 2 RS-232/422/485 x 4 Output Connector DB-9 x 4 DB-9 x 4 DB-9 x 4 Dimension (WxLxH/mm) 30 x 50.9 x 12.55 30 x 50.9 x 12.55 Vertical : 22 x 42 x 6.45 Horizontal : 22 x 42 x 7.65 Operating Temperature Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation EMP2-X4S1-W1 EMP2-X4S2-W1 EGP2-x401-W1 (Vertical connector) EGP2-x401-W2 (Horizontal connector) Model Name EMUI-0D01 Module Type USB to 32bit Digital I/O Module Key Features 1. 32bit digital I/O in 4 ports(each port 8bit) 2. Programmable I/O 3. Selectable VCCIO 3.3V or 5V by DIP switch 4. Buffered I/O (Output 5V, 32mA source, 32mA sink) (Output 3.3V, 24mA source, 24mA sink) 5. 4 external interrupts with rising/falling edge on port D 6. Keep configuration after hardware reboot 7. Supports 3rd mounting hole and USB Pin header for out-of-minicard installation 8. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 9. Industrial temperature(-40 ºC to 85 ºC) operation Form-Factor mPCIe Input I/F USB 2.0 Input Connector mPCIe or 5Pin Header Output I/F 32bit Digital I/O Output Connector 40pin 1.25mm (40DP-1.25 ) with DB37 male cable Dimension (WxLxH/mm) 30 x 50.9 x 8.2 Operating Temperature Wide temp : -40°~85°C Order Infomation EMUI-0D01-W1 1-5 DIO Digital I/O (Digital Input and Output). Digital Inputs allow a host system to detect logic states, and Digital Outputs allow a host system to output logic states. Innodisk digital input/output expansion cards aim to fulfil the IoT communication needs of industrial systems. We provide API, which supports Windows and Linux as well as test utilities and sample codes. Users can quickly verify the functionality of the card and easily integrate it into their applications. The Utility Console Programmable DIO Configurable Input / Output Status Setting Supports External Interrupt Input Status Change Notification
  • 64.
    64 Innodisk provides RAID(Redundant Array of Independent Disks) modules to combine multiple types of embedded flash for the purposes of data redundancy or capacity aggregation. Model Name EMSS-32R1 EMPS-32R1 EGSS-32R1 Module Type mPCIe to dual SATA III RAID module mPCIe to dual SATA III RAID module M.2 2242 to SATA RAID module Key Features 1. Supports SATA to dual SATA III Port Multiplier 2. Supports H/W RAID 0/1 over SATA 3. optional USB 2.0 to dual SATA III 4. Industrial temperature -40 ºC to 85 ºC 1. PCIe to dual SATA III ports 2. Supports AHCI, Port-Multiplier 3. Supports Hardware RAID 0, RAID1 4. Industrial temperature -40 ºC to 85 ºC 1. Supports SATA to dual SATA III Port Multiplier 2. Supports H/W RAID 0/1 over SATA 3. Industrial temperature -40 ºC to 85 ºC Form-Factor mSATA mPCIe M.2 2242 Input I/F SATA III PCI Express 2.0 SATA III Input Connector mPCIe mPCIe M.2 B-M Output I/F SATA III SATA III SATA III Output Connector SATA 7 Pin x 2 SATA 7 Pin x 2 SATA 7 Pin x 2 Dimension (WxLxH/mm) 29.8 x 50.8 x 11.5 30.0 x 50.9 x 10.7 22.0 x 42.0 x 10.8 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMSS-32R1-C1 EMSS-32R1-W1 EMPS-32R1-C1 EMPS-32R1-W1 EGSS-32R1-C1 EGSS-32R1-W1 Model Name E2SS-32R1 E2SS-32R2 ELPS-32R1 Module Type 2.5" SSD to dual mSATA RAID module 2.5" SSD to dual M.2 RAID Module PCIe x 4 to dual M.2 RAID Module Key Features 1. 2.5” SSD to dual mSATA slots 2. Supports SATA III to SATA III port multiplier 3. Supports H/W RAID 0/1 over SATA 4. Excellent data transfer speed 1. 2.5” SSD to dual M.2 slots. 2. Supports M.2 Key-B 2242/2260/2280 3. Supports SATA III to SATA III Port Multiplier. 4. Supports H/W RAID 0/1 over SATA 5. Excellent data transfer speed 1. PCIe x 4 to dual M.2 ports. 2. Supports M.2 Key-B 2242/2260/2280/22110 3. Support wide temp 4. Supports AHCI, Port-Multiplier. 5. Supports Native Command Queuing 6. Support Hardware RAID 0, RAID 1 Form-Factor 2.5" SSD 2.5" SSD Low Profile PCIe Input I/F SATA III SATA III PCI Express 2.0 x 2 Input Connector SATA 7+15 Pin SATA 7+15 Pin PCIe x 4 Output I/F SATA III SATA III SATA III Output Connector mSATA x 2 M.2 Key-B x 2 M.2 Key-B x 2 Dimension (WxLxH/mm) 69.85 x 100.1 x 11.0 69.85 x 100.1 x 11.0 130.35 x 68.9 x 12.0 Operating Temperature STD temp : 0°~70°C STD temp : 0°~70°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation E2SS-32R1-C1 E2SS-32R2-C1 ELPS-32R1-C1 ELPS-32R1-W1 Disk Array
  • 65.
    65Product specifications aresubject to change without prior notice. iRAID Simplifying the configuration and management of innodisk’s RAID controller Innodisk’s iRAID is a Redundant Array of Independent Disks (RAID) management tool that enables system integrators to configure, monitor, and manage RAID 0 and RAID 1 storage configurations on Solid State Drives (SSDs). When used in combination with innodisk’s RAID cards and compatible SSDs, iRAID becomes a powerful monitoring tool that provides detailed Self-Monitoring, and Reporting Technology information (SMART info). We provide RAID card for embedded flash modules in standard PCIe, 2.5" and minicard form factor, alongside the software "iRAID" dedicated to the management and configuration of RAID volume. Features • Monitor RAID status • Change RAID mode • Get S.M.A.R.T information • Notification by Email • Supports Windows and Linux Model Name EMPV-1201 EMPV-1202 EGPV-1101 Module Type mPCIe to dual VGA & HDMI(DVI) module mPCIe to VGA & 18/24 bit LVDS module M.2 to to HDMI or DVI & Single/Dual Channel LVDS Module Key Features 1. mPCIe to dual VGA & HDMI Graphic Card. 2. VGA Output: 1920x1080, up to 75Hz vertical rate. 3. HDMI/DVI up to 1080p, Ultra low power consumption. 4. Optional VGA/HDMI/DVI cable 5. 90º, 180º, and 270º rotation of on-screen images 6. Industrial temperature -40 ºC to 85 ºC 1. VGA Output up to 1920x1080, up to 75Hz vertical rate 2. LVDS resolution supports up to 1600 x 1200 3. EMPV-1202-C1 supports 18/24 bit JEIDA LVDS 4. EMPV-1202-C2 supports 24 bit VESA LVDS 5. Allow for 90º, 180º, and 270º rotation of on-screen images. 6. Industrial temperature -40 ºC to 85 ºC 1. Support display output of HDMI 1.4 or DVI-D, single/ dual 24bit LVDS channel 2. Single HDMI/DVI-D display resolution up to 4K UHD (3840x2160@30p) 3. Dual LVDS display resolution up to FHD (1920x1080@60p) 4. HW video decoder supports multiple formats H264AVCDIVXXVIDMPEG-4MPEG-2 5. Built-in 256MB DDR 3 memory. 6. Industrial temperature -40 ºC to 85 ºC Form-Factor mPCIe mPCIe M.2 2280 Input I/F PCI Express 1.0 PCI Express 1.0 PCI Express 2.0 x 2 Input Connector mPCIe mPCIe M.2 B-M Output I/F VGA x 2, HDMI x 1(Optional DVI x 1) VGA, 18/24 bit LVDS HDMI or DVI-D x 1 , Single & Dual LVDS Output Connector 40pin 1.25mm x 2 (40DP-1.25) 40pin 1.25mm x 1 (40DP-1.25) 20 pin x 1(HDMI), 20 pin x 2 (LVDS) Dimensions(W*L*H/mm) 31.5 x 50.9 x 8.2 30.0 x 50.9 x 8.2 30.0 x 50.9 x 8.2 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPV-1201-C1 EMPV-1201-W1 EMPV-1202-C1, EMPV-1202-W1 EMPV-1202-C2, EMPV-1202-W2 EGPV-1101-C1, EGPV-1101-W1 EGPV-1101-C2, EGPV-1101-W2 1TB 1TB 1TB 1TB 1TB iRAID Innodisk’s embedded graphic card features a 2D graphic engine and supports resolutions up to 1920 x 1080. With a fanless design, our mPCIe graphic cards can operate at temperatures ranging from -40°C to 85°C. With support for both Windows and Linux drivers, Innodisk's Display Cards are suitable for a wide variety of industrial platforms. Display Card
  • 66.
    66 Innodisk specializes inwide range of storage interface including PCIe/SATA/USB/PATA. Our modules allow system integrator to expand or convert those interfaces in embedded system. Model Name EMPU-3401 ELPS-3201 ESPS-3401 Module Type mPCIe to four USB 3.0 module PCIe x 4 to dual M.2 Module PCIe to four SATA III card Key Features 1. PCI Express 2.0 to 4 x USB ports with SuperSpeed (5Gbps) data rate 2. Independent 1.5A overcurrent protection (OCP) for each port 3. Compliant with xHCI 1.0, USB 3.0 Rev 1.0 4. Supports USB Battery Charging Specification Revision 1.2 5. Industrial temperature -40 ºC to 85 ºC 1. PCIe x 4 to dual M.2 ports 2. Supports M.2 Key-B 2242/2260/2280/22110 3. Supports AHCI, Port-Multiplier 4. Supports Native Command Queuing 5. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 to four SATA III ports 2. Supports AHCI, Port-Multiplier 3. Low power consumption Form-Factor mPCIe Standard PCIe Standard PCIe Input I/F PCI Express 2.0 PCI Express 2.0 x 2 PCI Express 2.0 Input Connector mPCIe PCIe x 4 PCIe x 1 Output I/F USB 3.0 SATA III SATA III Output Connector 19 Pin box header x 2 M.2 Key-B x 2 SATA 7 Pin x 4, mSATA x 1 Dimension (WxLxH/mm) 30.0 x 50.9 x 8.45 130.35 x 68.9 x 12.75 72.1 x 69.8 x 8.3 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Order Infomation EMPU-3401-C1 EMPU-3401-W1 ELPS-3201-C1 ELPS-3201-W1 ESPS-3401-C1 Model Name EMPS-3201 EMPS-3401 EGPS-3401 EMPU-3201 Module Type mPCIe to dual SATA III module mPCIe to four SATA III module M.2 3042 to four SATA module mPCIe to dual USB 3.0 module Key Features 1. PCIe 2.0 to dual SATA III ports 2. Low power consumption 3. Supports AHCI, Port-Multiplier 4. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 to four SATA III ports 2. Supports AHCI, Port-Multiplier 3. Low power consumption 4. Industrial temperature -40 ºC to 85 ºC 1. PCIe 2.0 to four SATAIII ports 2. Supports AHCI, Port-Multiplier 3. Low power consumption 1. Compliant with PCI Express Base Specification Revision 2.0 2. Compliant with Universal Serial Bus 3.0 Specification Revision 1.0 3. Supports 2 downstream USB 3.0 ports 4. Complies with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 5. 30µ golden finger, 3 year warranty. Form-Factor mPCIe mPCIe M.2 3042 mPCIe Input I/F PCI Express 2.0 PCI Express 2.0 PCI Express 2.0 x 1 PCI Express 2.0 Input Connector mPCIe mPCIe M.2 B-M mPCIe Output I/F SATA III SATA III SATA III USB 3.0 Output Connector SATA 7 Pin x 2 SATA 7 Pin x 4 SATA 7 Pin x 4 19 Pin box header x 1 Dimension (WxLxH/mm) 30.0 x 50.9 x 10.7 30.0 x 50.9 x 10.9 30 x 42 x 10.4 30.0 x 50.9 x 8.45 Operating Temperature STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C Wide temp : -40°~85°C STD temp : 0°~70°C STD temp : 0°~70°C Wide temp : -40°~85°C Order Infomation EMPS-3201-C1 EMPS-3201-W1 EMPS-3401-C1 EMPS-3401-W1 EGPS-3401-C1 EMPU-3201-C1 EMPU-3201-W1 Storage
  • 67.
    67Product specifications aresubject to change without prior notice. Model Name ESXS-2301 ESXS-2302 ELPP-0101 ELPP-0102 EMXX-0101 EMXX-0102 Module Type Multipurpose PCIe to mSATA & M.2 card (Backside mSATA ) Multipurpose PCIe to mSATA & M.2 card (Backside mPCIe ) PCIe x 1 to mPCIe Module PCIe to M.2 Module mPCIe to M.2 A-E key module mPCIe to M.2 B key module Key Features 1. Supports low profile/ standard PCIe form factor 2. Supports external SATA III and USB 2.0 signal to mSATA & M.2 2242/2260/2280 slot. (Front side) 3. Supports mSATA converted from PCIe signal(Backside) 1. Supports low profile/ standard PCIe form factor 2. Supports external SATA III and USB 2.0 signal to mSATA & M.2 242/2260/ 2280(Front Side) 3. PCIe to mPCIe pass-through design (BackSide) 1. PCI-Express specification Rev. 2.0 compliant 2. PCIe x1 to mPCIe pass-through design 1. PCI-Express specification Rev. 3.0 compliant 2. PCIe x4 to M.2 pass-through design 3. Supports M.2 Key-M 2221/ 2230/2242/2260/ 2280/22110 4. Low profile PCI Express form factor 5. Industrial temperature -40 ºC to 85 ºC 1. PCIe and USB signal pass-through design 2. Supports M.2 A-E key wireless module such as 3G, 4G, WLAN, WWAN, Bluetooth 3. Supports M.2 2230/2242 form factor 4. Supports M.2 PCIe Lane #0 & Lane 1 by pin header setting 5. Industrial temperature -40 ºC to 85 ºC 1. Support M.2 2230/2242 B key form factor 2. Compliant with PCI Express Base Specification 3. Compliant with Universal Serial Bus 2.0 Specification 4. Compliant with SATA III Specification 5. Optional NANO SIM slot on the back side 6. Industrial temperature -40 ºC to 85 ºC Form-Factor Standard PCIe Standard PCIe Low profile PCIe Low profile PCIe mPCIe mPCIe Input I/F PCI Express 1.0, SATA II, USB 2.0 PCI Express 1.0, SATA II, USB 2.0 PCI Express 2.0 PCI Express 3.0 PCI Express , USB 2.0 PCI Express, USB 2.0, SATA Input Connector PCIe x 1 PCIe x 1 PCIe x 1 PCIe x 4 mPCIe mPCIe Output I/F USB 2.0, SATA III(frontside) SATA II(backside) USB 2.0, SATA III(frontside) PCI Express 1.0(backside) PCI Express 2.0 PCI Express 3.0 PCI Express , USB 2.0 PCI Express , USB 2.0, SATA Output Connector mSATA x 2 (Front and Back) M.2 x 1(2242/2260/2280) mPCIe x 1(backside), mSATA x 1 M.2 x 1(2242/2260/2280) mPCIe x 1 M.2 Key-M M.2 Key-A-E M.2 Key B Dimensions(W*L*H/mm) 110.0 x 68.9 x 12.3 110.0 x 68.9 x 12.3 72.1 x 68.9 x 10.2 143.3 x 68.9 x 5.65 30 x 54.4 x 8.15 30 x 54.4 x 6.4 Operating Temperature STD temp : 0°~70°C STD temp : 0°~70°C STD temp : 0°~70°C Wide temp : -40°~85°C Wide temp : -40°~85°C Wide temp : -40°~85°C Order Infomation ESXS-2301-C1 ESXS-2302-C1 ELPP-0101-C2 ELPP-0102-W1 EMXX-0101-W1 (M.2 Key-A) EMXX-0101-W2 (M.2 Key-E) EMXX-0101-W1 EMXX-0101-W2 (SIM slot included) Innodisk provides flash storage with different interfaces and form factors. In order to help customers, we also design the signal converter for testing purposes. The customer can test different types of embedded flash modules with one card. Testing Tool Product Overview Form Factor Output PCIe SATA PATA USB POE VGA Display LAN CAN BUS DIO Serial 232/422.. mPCIe (mSATA) Input PCIe EMPS-3401 EMPS-3201 EMPS-32R1 EMPU-3401 EMPU-3201 EMPL-G2P1 EMPL-G2P2 EMPV-1201 EMPV-1202 EMPL-G101 EMPL-G201 EMPL-G102 EMPL-G202 EMP2-X801 EMP2-X402 EMP2-X403 EMP2-X404 EMP2-X4S1 EMP2-X4S2 SATA EMSS-32R1 USB EMUI-0D01 EMUC-B202 EMU2-X1S1 EMU2-X1S2 PCIe Standard Input PCIe ESPS-3401 ELPS-3201 ELPS-32R1 ELPS-32R1 SATA USB M.2 (NGFF) Input PCIe EGPS-3401 EGPL-G2P1 EGPV-1101 EGPL-G101 EGPL-G201 EGPL-G102 EGPL-G202 EGP2-X401 SATA EGSS-32R1 USB 2.5" Input SATA E2SS-32R1 E2SS-32R2 PATA
  • 68.
    68Copyright © 2019Jan. Innodisk Corporation. All rights reserved. 8CATALOG-001 For more warranty details, please contact the Innodisk Sales Department or visit our website: www.innodisk.com Headquarters Innodisk Corporation 5F., No.237, Sec. 1, Datong Rd., Xizhi Dist., New Taipei City, 221, Taiwan T +886-2-7703-3000 F +886-2-7703-3555 E [email protected] Branch Offices Japan K.I Bldg 2F/4F, 1-1-14, Nihonbashiningyocho Chuo-ku, Tokyo 103-0013 Japan T +81-3-6667-0161 F +81-3-6667-0162 E [email protected] USA 42996 Osgood Road, Fremont, CA 94539 USA T +1-510-770-9421 F +1-510-770-9424 E [email protected] 9 Timber Ln, Marlboro NJ 07746 T +1-732-8530455 F +1-732-7846401 China 807, 8 Floor, Building B, Hengyue Center, Dengliang Road, Nanshan District, Shenzhen, China T +86-0755-2167-3689 +86-0755-2167-3690 F +86-0755-2167-3691 E [email protected] Shanghai T +86-021-315-93340 Beijing T +86-010-82458120 Chengdu T +86-28-66320052 Europe Insulindelaan 115A, 5642CV, Eindhoven The Netherlands T +31-(0)40 3045 400 F +31-(0)40 3045 419 E [email protected] T +86-021-315-93341 Our Vision Absolute Integration™ Absolute Integration™ is our envisioned path that moves toward a more interconnected world. “To us, integration is not merely the combination of hardware, software and firmware; it is a philosophy that assimilates all relevant elements to create an optimal solution.”