Lesson 5a

Lesson 5a

• 1.
  Lesson 5a Unit 2:Computer Systems
• 2.
  Learning Objectives • DifferentiateIntel and AMD CPU models • Understand technologies for improving performance, such as architecture, multitasking, multiprocessing, multi-core, and cache • Describe other CPU features such as clock speed, overclocking, power management, and VT • Describe characteristics and CPU compatibility of processor sockets • Identify the components used for cooling (heat sinks and fans and liquid cooling systems)
• 3.
  Overview of CPUs •Intel CPU Ranges – Core – Pentium – Celeron – Atom – Xeon • ARM • AMD CPU Ranges – Athlon – Phenom – Sempron – Turion – AMD Fusion (A series) – AMD F – Opteron
• 4.
  Manufacturing Process • Dopingprocess to create millions of transistors on silicon wafer • Feature size measured in microns or nanometers • More features being added on-die
• 5.
  CPU Architectures • Fetch –Control Unit fetches the next instruction in sequence from system memory to the pipeline • Decode – The control unit decodes each instruction in turn and... • Execute – ...either executes it itself or passes it to the Arithmetic Logic Unit (ALU) or Floating Point Unit (FPU) for execution • Writeback – The result of the executed instruction is written back to a register or to system memory – A register is a temporary storage area available to the different units within the CPU
• 6.
  HyperThreading • Multitasking meansexecuting multiple applications (threads) • Superscalar pipelining used to manage instruction throughput • Simultaneous Multithreading / HyperThreading execute multiple instructions per clock cycle • OS thinks it is working with 2 (or more) CPUs • HyperThreading used on P4, then dropped, but is now being reintroduced on Core 2 and Core i7 chips • Microcode improvements – MMX – 3D-Now! – SSE / SSE2 / SSE3 / SSE4
• 7.
  Multiprocessing and Multicore •Multiprocessing makes multiple CPUs available – Utilize multiple CPUs with separate sockets (SMP) – Multi-core CPUs (CMP) • SMP support depends on OS and version Cores Intel AMD 2 Core Duo, Core 2 Duo, Core i3, i5, Xeon, Celeron, Pentium D X2 models of Athlon 64, Sempron, Turion 64, Phenom, Phenom II, and Opteron 3 X3 models of Athlon II, Phenom, Phenom II 4 Core 2 Quad, Core i5, i7, Xeon X4 models of Athlon II, Phenom, Phenom II, and Opteron 6 Opteron, Phenom II 8+ Xeon Opteron
• 8.
  Other Architectural Features •Instruction sets (32-bit versus 64-bit) – x86 / IA-32 / x86-32 – IA-64 – AMD64 / EM64T • Cache • Addressing
• 9.
  Other CPU Features •Clock speed • Power management (throttling) • Virtualization • Malware protection (XD / NX) • Integrated GPU
• 10.
  Intel Sockets andSlots Designation Type Release Date Supported CPU Ranges Supported Memory Socket T (775 pins) LGA 2004 Later Pentium 4s and Core 2 DDR2/DDR3 Socket B (1366 pins) LGA 2008 Core i7 (Nehalem) DDR3 (triple- channel) Socket H (1156 pins) LGA 2009 Core i3/5/7 (Nehalem) DDR3 (dual- channel) Socket H2 (1155 pins) LGA 2011 Core i3/5/7 (Sandy Bridge / Ivy Bridge) DDR3 (dual- channel)
• 11.
  AMD Sockets Designation Type Release Date SupportedCPU Ranges Supported Memory Socket 940 (940 pins) PGA 2003 Athlon 64 FX DDR (Dual- channel) Socket AM2 (940 pins) PGA 2006 Athlon 64 (FX, X2) / Phenom Xx DDR2 (Dual- channel) Socket AM2+ (940 pins) PGA 2007 Socket F (1207 pins) LGA 2006 Athlon 64 FX DDR2 (Dual- channel) Socket AM3 (941 pins) PGA 2009 Athlon II / Phenom II DDR2/DDR3 (Dual-channel) Socket AM3+ (942 pins) PGA 2011 Socket FM1 (905 pins) PGA 2011 A series / Athlon II DDR3 (Dual- channel)
• 12.
  Cooling Systems • Activeversus passive • Heatsink / thermal compound • Fan – Power connectors – Shrouds / baffles • Heat pipe / spreader • Liquid cooling
• 13.
  Removing a CPU •Heatsink / fan / cooling device • Remove CPU – ZIF socket – Slot – LGA • Motherboard – Locate and remove screws – Slide motherboard from case
• 14.
  Installing or Upgradinga CPU • Check compatibility • Locate pin 1 – Bevel – White dot – Spur – Printed mark • Insert CPU • Replace heatsink/fan assembly
• 15.
  Review • Differentiate Inteland AMD CPU models • Understand technologies for improving performance, such as architecture, multitasking, multiprocessing, multi-core, and cache • Describe other CPU features such as clock speed, overclocking, power management, and VT • Describe characteristics and CPU compatibility of processor sockets • Identify the components used for cooling (heat sinks and fans and liquid cooling systems)