Max 232

SLLS047L − FEBRUARY 1989 − REVISED MARCH 2004
Meets or Exceeds TIA/EIA-232-F and ITU
MAX232 . . . D, DW, N, OR NS PACKAGE
MAX232I . . . D, DW, OR N PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
VS+
C1−
C2+
C2−
VS−
T2OUT
R2IN
VCC
GND
T1OUT
R1IN
R1OUT
T1IN
T2IN
R2OUT
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1
Recommendation V.28
Operates From a Single 5-V Power Supply
With 1.0-F Charge-Pump Capacitors
Operates Up To 120 kbit/s
Two Drivers and Two Receivers
±30-V Input Levels
Low Supply Current . . . 8 mA Typical
ESD Protection Exceeds JESD 22
− 2000-V Human-Body Model (A114-A)
Upgrade With Improved ESD (15-kV HBM)
and 0.1-F Charge-Pump Capacitors is
Available With the MAX202
Applications
− TIA/EIA-232-F, Battery-Powered Systems,
Terminals, Modems, and Computers
description/ordering information
The MAX232 is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/EIA-232-F
voltage levels from a single 5-V supply. Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.
These receivers have a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs.
Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels. The driver, receiver, and
voltage-generator functions are available as cells in the Texas Instruments LinASIC library.
ORDERING INFORMATION
TA PACKAGE† ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (N) Tube of 25 MAX232N MAX232N
SOIC (D)
Tube of 40 MAX232D
MAX232
0°C to 70°C
Reel of 2500 MAX232DR
SOIC (DW)
Tube of 40 MAX232DW
MAX232
Reel of 2000 MAX232DWR
SOP (NS) Reel of 2000 MAX232NSR MAX232
PDIP (N) Tube of 25 MAX232IN MAX232IN
SOIC (D)
Tube of 40 MAX232ID
MAX232I
−40°C to 85°C
Reel of 2500 MAX232IDR
40 85 SOIC (DW)
Tube of 40 MAX232IDW
MAX232I
Reel of 2000 MAX232IDWR
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design
guidelines are available at www.ti.com/sc/package.
LinASIC is a trademark of Texas Instruments.

!# $%! '#( Copyright  2004, Texas Instruments Incorporated
'! ! $#!! $# )# # #* #
'' +,( '! $!#- '# #!#, !'#
#- $##(

Function Tables
EACH DRIVER
INPUT
TIN
OUTPUT
TOUT
L H
H L
H = high level, L = low
level
EACH RECEIVER
INPUT
RIN
OUTPUT
ROUT
L H
H L
H = high level, L = low
level
logic diagram (positive logic)
11
14
T1IN T1OUT
10
7
T2IN T2OUT
12
13
R1OUT R1IN
9
8
R2OUT R2IN
2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Input supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
Positive output supply voltage range, VS+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.3 V to 15 V
Negative output supply voltage range, VS− . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to −15 V
Input voltage range, VI: Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V
Output voltage range, VO: T1OUT, T2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VS− − 0.3 V to VS+ + 0.3 V
R1OUT, R2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V
Short-circuit duration: T1OUT, T2OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θJA (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 57°C/W
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage (T1IN,T2IN) 2 V
VIL Low-level input voltage (T1IN, T2IN) 0.8 V
R1IN, R2IN Receiver input voltage ±30 V
MAX232 0 70
TA Operating free-air temperature
°C
MAX232I −40 85
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYP‡ MAX UNIT
ICC Supply current
VCC = 5.5 V,
TA = 25°C
All outputs open,
8 10 mA
‡ All typical values are at VCC = 5 V and TA = 25°C.
NOTE 4: Test conditions are C1−C4 = 1 μF at VCC = 5 V ± 0.5 V.

DRIVER SECTION
temperature range (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VOH High-level output voltage T1OUT, T2OUT RL = 3 kΩ to GND 5 7 V
VOL Low-level output voltage‡ T1OUT, T2OUT RL = 3 kΩ to GND −7 −5 V
ro Output resistance T1OUT, T2OUT VS+ = VS− = 0, VO = ±2 V 300 Ω
IOS§ Short-circuit output current T1OUT, T2OUT VCC = 5.5 V, VO = 0 ±10 mA
IIS Short-circuit input current T1IN, T2IN VI = 0 200 μA
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage
levels only.
§ Not more than one output should be shorted at a time.
switching characteristics, VCC = 5 V, TA = 25°C (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Driver slew rate
RL = 3 kΩ to 7 kΩ,
See Figure 2
30 V/μs
SR(t) Driver transition region slew rate See Figure 3 3 V/μs
Data rate One TOUT switching 120 kbit/s
RECEIVER SECTION
temperature range (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT
VOH High-level output voltage R1OUT, R2OUT IOH = −1 mA 3.5 V
VOL Low-level output voltage‡ R1OUT, R2OUT IOL = 3.2 mA 0.4 V
VIT+
Receiver positive-going input
threshold voltage
R1IN, R2IN VCC = 5 V, TA = 25°C 1.7 2.4 V
VIT−
Receiver negative-going input
threshold voltage
R1IN, R2IN VCC = 5 V, TA = 25°C 0.8 1.2 V
Vhys Input hysteresis voltage R1IN, R2IN VCC = 5 V 0.2 0.5 1 V
ri Receiver input resistance R1IN, R2IN VCC = 5, TA = 25°C 3 5 7 kΩ
† All typical values are at VCC = 5 V, TA = 25°C.
‡ The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic voltage
levels only.
switching characteristics, VCC = 5 V, TA = 25°C (see Note 4 and Figure 1)
PARAMETER TYP UNIT
tPLH(R) Receiver propagation delay time, low- to high-level output 500 ns
tPHL(R) Receiver propagation delay time, high- to low-level output 500 ns

PARAMETER MEASUREMENT INFORMATION
3 V
0 V
VOH
90%
50% 10%
1.5 V
≤10 ns
VCC
R1IN
or
R2IN
R1OUT
or
R2OUT
RL = 1.3 kΩ
See Note C
CL = 50 pF
(see Note B)
TEST CIRCUIT
≤10 ns
Pulse
Generator
(see Note A)
Input
Output
tPHL
tPLH
1.5 V
VOL
10%
90%
50%
500 ns
WAVEFORMS
NOTES: A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
B. CL includes probe and jig capacitance.
C. All diodes are 1N3064 or equivalent.
Figure 1. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements

PARAMETER MEASUREMENT INFORMATION
T1IN or T2IN T1OUT or T2OUT
90%
50%
Pulse
Generator
(see Note A)
TEST CIRCUIT
≤10 ns ≤10 ns
3 V
90%
90%
20 μs
CL = 10 pF
(see Note B)
TEST CIRCUIT
≤10 ns ≤10 ns
Input
Output
tPHL
tPLH
3 V
0 V
VOH
VOL
10%
90%
50%
5 μs
WAVEFORMS
10%
RL
90%
10%
90%
10%
t tTLH THL
SR
0.8 (VOH – VOL)
tTLH
or
0.8 (VOL – VOH)
tTHL
NOTES: A. The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
B. CL includes probe and jig capacitance.
EIA-232 Output
Figure 2. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-μs Input)
EIA-232 Output
−3 V
3 V
−3 V
3 kΩ
1.5 V 10%
WAVEFORMS
1.5 V
10%
VOH
VOL
t tTLH THL
CL = 2.5 nF
Pulse
Generator
(see Note A)
Input
Output
SR
6 V
tTHL or tTLH
NOTE A: The pulse generator has the following characteristics: ZO = 50 Ω, duty cycle ≤ 50%.
Figure 3. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-μs Input)

APPLICATION INFORMATION
5 V
16
VCC
+
−
1 μF VS+
0 V
15
1 μF
1 μF
8.5 V
−8.5 V
+
1 μF
VS−
2
6
14
7
13
8
C1+
C1−
C2+
C2−
1
3
4
5
11
10
12
9
GND
EIA-232 Output
EIA-232 Output
EIA-232 Input
EIA-232 Input
CBYPASS = 1 μF
C1
C2
From CMOS or TTL
To CMOS or TTL
C3†
C4
† C3 can be connected to VCC or GND.
NOTES: A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be
connected as shown. In addition to the 1-μF capacitors shown, the MAX202 can operate with 0.1-μF capacitors.
Figure 4. Typical Operating Circuit

PACKAGING INFORMATION
Orderable Device Status (1) Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
MAX232D ACTIVE SOIC D 16 40 Green (RoHS
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX232DE4 ACTIVE SOIC D 16 40 Green (RoHS
no Sb/Br)
MAX232DR ACTIVE SOIC D 16 2500 Green (RoHS
no Sb/Br)
MAX232DRE4 ACTIVE SOIC D 16 2500 Green (RoHS
no Sb/Br)
MAX232DW ACTIVE SOIC DW 16 40 Green (RoHS
no Sb/Br)
MAX232DWE4 ACTIVE SOIC DW 16 40 Green (RoHS
no Sb/Br)
MAX232DWR ACTIVE SOIC DW 16 2000 Green (RoHS
no Sb/Br)
MAX232DWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
no Sb/Br)
MAX232ID ACTIVE SOIC D 16 40 Green (RoHS
no Sb/Br)
MAX232IDE4 ACTIVE SOIC D 16 40 Green (RoHS
no Sb/Br)
MAX232IDR ACTIVE SOIC D 16 2500 Green (RoHS
no Sb/Br)
MAX232IDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
no Sb/Br)
MAX232IDW ACTIVE SOIC DW 16 40 Green (RoHS
no Sb/Br)
MAX232IDWE4 ACTIVE SOIC DW 16 40 Green (RoHS
no Sb/Br)
MAX232IDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
no Sb/Br)
MAX232IDWR ACTIVE SOIC DW 16 2000 Green (RoHS
no Sb/Br)
MAX232IDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
no Sb/Br)
MAX232IDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
no Sb/Br)
MAX232IN ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
MAX232INE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
MAX232N ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
MAX232NE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS)
MAX232NSR ACTIVE SO NS 16 2000 Green (RoHS
no Sb/Br)
MAX232NSRE4 ACTIVE SO NS 16 2000 Green (RoHS
no Sb/Br)
(1) The marketing status values are defined as follows:
PACKAGE OPTION ADDENDUM
www.ti.com 18-Jul-2006
Addendum-Page 1

PACKAGE OPTION ADDENDUM
www.ti.com 18-Jul-2006
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS no Sb/Br): TI defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2

IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI’s terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
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TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
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Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products Applications
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Microcontrollers microcontroller.ti.com Security www.ti.com/security
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Post Office Box 655303 Dallas, Texas 75265
Copyright  2006, Texas Instruments Incorporated

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