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MICRO-HEAT
EXCHANGERS
Zubair Ahmed
GNITC
μ
• An Heat exchanger in which
fluid flows in a confined space
(tubes or cavity) whose
dimensions are less than
micrometer ( < 1 mm ) .
DEFINITION
• Compact size
• High heat transfer coefficients
(10,000 – 35,000 W/m2 k )
h = Nu * k / D
• High surface are to volume
ratio
( 20,000 – 30,000 m2/m3 )
• Lower costs due to less
material being used in
fabrication
• Light Weight
WHY??
Same classification as
conventional macro-scale heat
exchangers
• Parallel Flow
• Counter Flow
• Cross Flow
TYPES
• Conventional Equation validFACT THAT
Studied by
• CFD ( Computational Fluid Dynamics ) Approach
• Experimental Approach
CFD APPROACH
Energy equation
Momentum equation
Continuity equation
Energy equation for wall
Applying Boundary Equations
WE DETERMINE
Effectiveness
Pumping Power
ΔPt = ΔPh +ΔPc = (Phi –Pho) + (Pci – Pco )Pressure Loss
• Obtain inlet and outlet temperatures of hot and cold
fluid
• Obtain log mean temperature difference
• Calculate overall heat transfer coefficient
EXPERIMENTAL
• Reynolds number
• Pressure drop
• Then the performance index is calculated
ANALYSIS
What goes in making a successful μHEX
• Nanofluids ( water + alumina ) heat capacity, heat
transfer coeff.
• Heat transfer coefficient is varying along the lenght
• impact of gravity on the fluid through the microchannel
heat exchanger was found to be small
• The heat transfer in microstructure heat exchangers can be
by the hydraulic diameter of microchannels
• Enhancement can also be made by changing the design from
microchannels to more complex geometries.
• Relatively high pressure losses, high pump work
• Variable cross-section reduces pressure losses
• Chemical Etching
• LIGA ( lithography , moulding ,
electroplatin)
• Diffusion Bonding
HOW TO MAKE
• Chemical etching is a process by which
a strong acid or base is used to remove
material to shape microchannels.
• directional material removal rate
dependency are required
• Potassium Hydroxide or Hydrogen
Fluoride
CHEMICAL
ETCHING
• Diffusion bonding is a welding process
by which two surfaces are bonded
together under high temperature and
mechanical pressure in a vacuum or
non-oxygen environment
• 0.5 - 0.8 times the melting
temperature for the material
DIFFUSI0N
BONDING
• high pressure loss
• wall roughness
• Inadequate heat absorption
• High manufacturing cost
• Slower production
OBSTACLES
THANK YOU
Questions??

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Microheat Exchangers

  • 2. • An Heat exchanger in which fluid flows in a confined space (tubes or cavity) whose dimensions are less than micrometer ( < 1 mm ) . DEFINITION
  • 3. • Compact size • High heat transfer coefficients (10,000 – 35,000 W/m2 k ) h = Nu * k / D • High surface are to volume ratio ( 20,000 – 30,000 m2/m3 ) • Lower costs due to less material being used in fabrication • Light Weight WHY??
  • 4. Same classification as conventional macro-scale heat exchangers • Parallel Flow • Counter Flow • Cross Flow TYPES
  • 5. • Conventional Equation validFACT THAT Studied by • CFD ( Computational Fluid Dynamics ) Approach • Experimental Approach
  • 7. Continuity equation Energy equation for wall Applying Boundary Equations
  • 8. WE DETERMINE Effectiveness Pumping Power ΔPt = ΔPh +ΔPc = (Phi –Pho) + (Pci – Pco )Pressure Loss
  • 9. • Obtain inlet and outlet temperatures of hot and cold fluid • Obtain log mean temperature difference • Calculate overall heat transfer coefficient EXPERIMENTAL
  • 10. • Reynolds number • Pressure drop • Then the performance index is calculated
  • 11. ANALYSIS What goes in making a successful μHEX
  • 12. • Nanofluids ( water + alumina ) heat capacity, heat transfer coeff. • Heat transfer coefficient is varying along the lenght • impact of gravity on the fluid through the microchannel heat exchanger was found to be small • The heat transfer in microstructure heat exchangers can be by the hydraulic diameter of microchannels • Enhancement can also be made by changing the design from microchannels to more complex geometries. • Relatively high pressure losses, high pump work • Variable cross-section reduces pressure losses
  • 13. • Chemical Etching • LIGA ( lithography , moulding , electroplatin) • Diffusion Bonding HOW TO MAKE
  • 14. • Chemical etching is a process by which a strong acid or base is used to remove material to shape microchannels. • directional material removal rate dependency are required • Potassium Hydroxide or Hydrogen Fluoride CHEMICAL ETCHING
  • 15. • Diffusion bonding is a welding process by which two surfaces are bonded together under high temperature and mechanical pressure in a vacuum or non-oxygen environment • 0.5 - 0.8 times the melting temperature for the material DIFFUSI0N BONDING
  • 16. • high pressure loss • wall roughness • Inadequate heat absorption • High manufacturing cost • Slower production OBSTACLES