Slide preparation methods in mineralogy

Slide preparation methods in mineralogy

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  SUBMITTED BY: NEERAJ SHARMA ROLLNO.:CUHP18ENV16SUBMITTED TO : DR. ANURAG LIND
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  PURPOSE OF SLIDEPREPARATION IN MINERALOGY  Classification of rocks  Identification and mapping of minerals , dating or exploration  Analysis: major and trace elements , textural studies , isotopic composition  Studies of fluid inclusion  Studies of microfossil  Studies of rock fabrics e.g. porosity and permeability  Studies of texture and age of bones / teeth
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  SPECIMEN TYPES Specimen typescan be split into 4 groups 1. Thin section (30µm ) (+cover glasses)-for examination in transmitted light or electron microscope/probe 2. Polished thin section-for examination in transmitted /reflected light or electron microscope/probe 3. Thick sections (100µm) – for examination in reflected light or electron microscope/ probe 4. Polished blocks /mounts-for examination in reflected light or electron microscope/probe Specimen type 1,2,3 all have special requirements from a materialographic point of view .Differences between the three types are characterized by surface finishing and specimen thickness. Specimen type 4 is a more conventional materialographic specimen in term of requirements
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  The same mineralogical material will havesimilar preparation methods across the four different specimen types
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  1. Rock saws: automatic machine with clamping and diamond saw blades 2.Grinding machine: 2 grinding discs made of cast iron between 15cm and 30cm
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  3. Polishing machines:semi automatic polishing machines , polishing discs 4.Polarization microscope:
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  Production of thinsection is a multistep process which require highly specialized equipment 1) Sampling from larger section Thin section preparation
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  2. Cutting ofa specimen to 20*30*8.0mm Thin section preparation
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  Thin section preparation 3.Grinding or lapping of the specimen to complete planes
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  4. Grinding ofglass slide to complete planes and a well defined thickness Thin section preparation
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  5. Cementing thespecimen to a glass slide Thin section preparation
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  6. Cutting offsurplus specimen material to thickness of 0.5-2.0mm Thin section preparation
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  7. Grinding ofthin sections to a thickness of 80µm Thin section preparation
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  8. Grinding orlapping of a thin section to a final thickness of section +resin 30µm Thin section preparation
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  9. Polishing ofthin section removing approximately 10µm Thin section preparation