Embedded Linux -
TMS320DM8148 Hardware
Session II
Hardware Overview
• Davinci Video Processor
• Highly Integrated, programmable platforms
• Target applications like
– HD Video Conferencing
– Skype Endpoints
– Video Surveillance DVRs
– IP Netcams
– Digital Signage Media Players
– Mobile Medical Imaging
– Network Projectors
– Home Audio & Video Equipments
Hardware Architecture
Processor – Overview
• High Performance Davinci Video Processors
– Up-to 1GHz ARM Cortex-A8 Core
– Up-to 750MHz C674x VLIW DSP
– Up-to 6000MIPS and 450 MFLOPS
– Fully software compatible with C67x & C64x
ARM Cortex-A8 Core
• ARMv7 Architecture
– Superscalar Processor Core
– Neon Multimedia Architecture
– Supports Integer & Floating point
– Jazelle RCT Execution Environment
• ARM Cortex-A8 Memory Architecture
– 32KB of Instruction & Data Caches
– 512KB of L2 Cache
– 64KB of RAM, 48KB of Boot ROM
VLIW DSP
• 64 Bit General Purpose Registers
• Six Arithmetic Logic Units
• Two Multiply Functional Units
– IEEE Floating Point Multiply
– Fixed point Multiply Support
• Memory Architecture
– 32KB of L1P RAM / Cache
– 32KB of L1D RAM / Cache
– 256KB of L2 Unified Mapped RAM
Internal Memory
• System Memory Management Unit
• 128 KB of On Chip Memory Controller (OCMC)
RAM.
Imaging Sub System
• Imaging Subsystem ( ISS )
– Camera Sensor Connection
• Parallel Camera Connection for RAW ( Upto 16Bit)
• BT.656 & BT.1120 ( 8 and 16 Bit )
– Image Sensor Interface ( ISIF )
• Handles Image & Video Data from Sensor
– Resizer
• Resizing the image from 1/16x to 8x
• Able to generates Two Different Resizing Outputs
concurrently
HDVICP v2
• High Definition Video Image Co Processing
– Encode, Decode, Transcode operations
– H.264
– MPEG-2
– VC-1
– MPEG-4
– SP/ASP
– JPEG / MJPEG
Media Controller
• Controls the blocks
– HDVPSS
– HDVICP2
– ISS
SGX 3D Graphics Engine
• Graphics Engine
– Delivers up to 25 Mpoly / sec
– Universal Scalable Shader Engine
– Direct 3D Mobile
– OpenGL ES 1.1 and 2.0
– OpenVG 1.0
– OpenMax
– Advanced Geometry DMA Driven
– Programmable HQ Image Anti-Aliasing
Video Capture
• Two 165MHz, 2-Channel HD Video Capture
Modules
– One 16/24 bit HD Input or Dual 8 Bit SD Input
Channels
– One 8/16/24 Bit input and one 8 Bit only Input
Channels
Video Display Outputs
• Two 165-MHz HD Video Display Outputs
– One 16, 24, 30 Bit Output and One 16 or 24 Bit Output
– Composite or S-Video Analog Output
– Macrovision Support Available
– Digital HDMI 1.3 Transmitter with integrated PHY
– Advanced Video Processing Features
• Scan Conversion
• Format Conversion
• Rate Conversion
– Three Graphics Layers & Compositors
DDR2/DDR3 SDRAM
• Supports up to DDR2-800 and DDR3-1066
• Supports up to 8 Devices
• Total Addressable Space – 2GB
• Dynamic Memory Mapping
– Programmable Multi-Zone Memory mapping &
interleaving
– Enables Efficient 2D Block Addresses
– Optimized Interleaved Access
GPMC
• General Purpose Memory Controller
– 8 or 16 Multiplexed Address and Data Bus
– 512MB of Address Space divided among 8 chip
selects
– Direct interface to NOR, NAND Flash, SRAM,
Pseudo-RAM
– Error Location Modules
– Flexible Asynchronous Protocol for interface to
FPGA, CPLD, ASIC and so forth.
Peripherals
• Dual Port 10/100/1000 Ethernet
– IEEE 802.3 Complaint
– MII/RMII/GMII/RGMII Media Independent Interfaces
– Management Data IO Module
– Reset Isolation
– IEEE 1588 Time Stamping and Industrial Ethernet
Protocols
• Dual USB 2.0 with Integrated PHY
– USB 2.0 High & Full Speed Clients
– USB 2.0 High, Full & Low Speed Hosts & USB OTGs
Peripherals
• One PCI Express 2.0 port
– With Integrated PHY
– Single Port with One Lane at 5.o GT/s
– Configurable as Root Complex & Endpoint
• Eight 32 Bit General Purpose Timer
• One System Watch Dog Timer
• Six Configurable UARTs
– UART0 with modem controls
– Supports up to 3.6864 Mbps UART0/1/2
– Supports up to 12 Mbps UART3/4/5
– SIR, MIR, FIR ( 4.0 MBAUD )
Peripherals
• Four Serial Peripheral Interfaces
– Each with four Chip Selects
• Three MMC/SD/SDIO Interfaces
– Supports upto 1 / 4 / 8 bit modes
• Dual Controller Area Network Modules
– CAN Version 2 Part A, B
• Four Integrated Circuits ( I2C ) Ports
• Six Multi Channel Audio Serial Ports
• Multi Channel Buffered Serial Ports
Peripherals
• Serial ATA
– 3.0 Gbps with Integrated PHY
– Hardware Assisted Native Command Queuing from up
to 32 Entries
– Supports Port Multiplier and Command based
switching
• Real Time Clock
– One Time for Periodic Interrupt Generation
• Up to 128 General Purpose IO (GPIO) pins
• One spin lock module with up to 128 Hardware
semaphores
Peripherals
• Mailbox Module with 12 Mailboxes
• On Chip ARM ROM Bootloader( RBL )
• Power, Reset and Clock Management
– Multiple Independent Core Power Domains
– Multiple Independent Core Votage Domains
– Support for Three operating for each voltage
domains
– Clock enable & disable control for Subsystems &
peripherals
Peripherals
• Embedded Trace Buffer
– 32KB of ETB
– 5 pin interface for Debug
• IEEE 1149.1 JTAG Compatible
• 684 pin BGA 0.8 mm Ball pitch with Via
Channel
• 45 nm CMOS Technology
• 1.8 and 3.3 Volts Dual Voltage buffers for
General IOs

TMS20DM8148 Embedded Linux Session II

  • 1.
    Embedded Linux - TMS320DM8148Hardware Session II
  • 2.
    Hardware Overview • DavinciVideo Processor • Highly Integrated, programmable platforms • Target applications like – HD Video Conferencing – Skype Endpoints – Video Surveillance DVRs – IP Netcams – Digital Signage Media Players – Mobile Medical Imaging – Network Projectors – Home Audio & Video Equipments
  • 3.
  • 4.
    Processor – Overview •High Performance Davinci Video Processors – Up-to 1GHz ARM Cortex-A8 Core – Up-to 750MHz C674x VLIW DSP – Up-to 6000MIPS and 450 MFLOPS – Fully software compatible with C67x & C64x
  • 5.
    ARM Cortex-A8 Core •ARMv7 Architecture – Superscalar Processor Core – Neon Multimedia Architecture – Supports Integer & Floating point – Jazelle RCT Execution Environment • ARM Cortex-A8 Memory Architecture – 32KB of Instruction & Data Caches – 512KB of L2 Cache – 64KB of RAM, 48KB of Boot ROM
  • 6.
    VLIW DSP • 64Bit General Purpose Registers • Six Arithmetic Logic Units • Two Multiply Functional Units – IEEE Floating Point Multiply – Fixed point Multiply Support • Memory Architecture – 32KB of L1P RAM / Cache – 32KB of L1D RAM / Cache – 256KB of L2 Unified Mapped RAM
  • 7.
    Internal Memory • SystemMemory Management Unit • 128 KB of On Chip Memory Controller (OCMC) RAM.
  • 8.
    Imaging Sub System •Imaging Subsystem ( ISS ) – Camera Sensor Connection • Parallel Camera Connection for RAW ( Upto 16Bit) • BT.656 & BT.1120 ( 8 and 16 Bit ) – Image Sensor Interface ( ISIF ) • Handles Image & Video Data from Sensor – Resizer • Resizing the image from 1/16x to 8x • Able to generates Two Different Resizing Outputs concurrently
  • 9.
    HDVICP v2 • HighDefinition Video Image Co Processing – Encode, Decode, Transcode operations – H.264 – MPEG-2 – VC-1 – MPEG-4 – SP/ASP – JPEG / MJPEG
  • 10.
    Media Controller • Controlsthe blocks – HDVPSS – HDVICP2 – ISS
  • 11.
    SGX 3D GraphicsEngine • Graphics Engine – Delivers up to 25 Mpoly / sec – Universal Scalable Shader Engine – Direct 3D Mobile – OpenGL ES 1.1 and 2.0 – OpenVG 1.0 – OpenMax – Advanced Geometry DMA Driven – Programmable HQ Image Anti-Aliasing
  • 12.
    Video Capture • Two165MHz, 2-Channel HD Video Capture Modules – One 16/24 bit HD Input or Dual 8 Bit SD Input Channels – One 8/16/24 Bit input and one 8 Bit only Input Channels
  • 13.
    Video Display Outputs •Two 165-MHz HD Video Display Outputs – One 16, 24, 30 Bit Output and One 16 or 24 Bit Output – Composite or S-Video Analog Output – Macrovision Support Available – Digital HDMI 1.3 Transmitter with integrated PHY – Advanced Video Processing Features • Scan Conversion • Format Conversion • Rate Conversion – Three Graphics Layers & Compositors
  • 14.
    DDR2/DDR3 SDRAM • Supportsup to DDR2-800 and DDR3-1066 • Supports up to 8 Devices • Total Addressable Space – 2GB • Dynamic Memory Mapping – Programmable Multi-Zone Memory mapping & interleaving – Enables Efficient 2D Block Addresses – Optimized Interleaved Access
  • 15.
    GPMC • General PurposeMemory Controller – 8 or 16 Multiplexed Address and Data Bus – 512MB of Address Space divided among 8 chip selects – Direct interface to NOR, NAND Flash, SRAM, Pseudo-RAM – Error Location Modules – Flexible Asynchronous Protocol for interface to FPGA, CPLD, ASIC and so forth.
  • 16.
    Peripherals • Dual Port10/100/1000 Ethernet – IEEE 802.3 Complaint – MII/RMII/GMII/RGMII Media Independent Interfaces – Management Data IO Module – Reset Isolation – IEEE 1588 Time Stamping and Industrial Ethernet Protocols • Dual USB 2.0 with Integrated PHY – USB 2.0 High & Full Speed Clients – USB 2.0 High, Full & Low Speed Hosts & USB OTGs
  • 17.
    Peripherals • One PCIExpress 2.0 port – With Integrated PHY – Single Port with One Lane at 5.o GT/s – Configurable as Root Complex & Endpoint • Eight 32 Bit General Purpose Timer • One System Watch Dog Timer • Six Configurable UARTs – UART0 with modem controls – Supports up to 3.6864 Mbps UART0/1/2 – Supports up to 12 Mbps UART3/4/5 – SIR, MIR, FIR ( 4.0 MBAUD )
  • 18.
    Peripherals • Four SerialPeripheral Interfaces – Each with four Chip Selects • Three MMC/SD/SDIO Interfaces – Supports upto 1 / 4 / 8 bit modes • Dual Controller Area Network Modules – CAN Version 2 Part A, B • Four Integrated Circuits ( I2C ) Ports • Six Multi Channel Audio Serial Ports • Multi Channel Buffered Serial Ports
  • 19.
    Peripherals • Serial ATA –3.0 Gbps with Integrated PHY – Hardware Assisted Native Command Queuing from up to 32 Entries – Supports Port Multiplier and Command based switching • Real Time Clock – One Time for Periodic Interrupt Generation • Up to 128 General Purpose IO (GPIO) pins • One spin lock module with up to 128 Hardware semaphores
  • 20.
    Peripherals • Mailbox Modulewith 12 Mailboxes • On Chip ARM ROM Bootloader( RBL ) • Power, Reset and Clock Management – Multiple Independent Core Power Domains – Multiple Independent Core Votage Domains – Support for Three operating for each voltage domains – Clock enable & disable control for Subsystems & peripherals
  • 21.
    Peripherals • Embedded TraceBuffer – 32KB of ETB – 5 pin interface for Debug • IEEE 1149.1 JTAG Compatible • 684 pin BGA 0.8 mm Ball pitch with Via Channel • 45 nm CMOS Technology • 1.8 and 3.3 Volts Dual Voltage buffers for General IOs