Product Service Manual - Level Ii: Service Manual For Benq: G702Ad P/N: TBD Applicable For All Regions
Product Service Manual - Level Ii: Service Manual For Benq: G702Ad P/N: TBD Applicable For All Regions
P/N: TBD
Version: 001
Date:2009/08/05
Notice:
- For RO to input specific “Legal Requirement” in specific NS regarding to responsibility and liability
statements.
- Please check BenQ’s eSupport web site, http://esupport.benq.com, to ensure that you have the most
recent version of this manual.
-1-
Content Index
2 Introduction .................................................................................................. 4
2.1. RoHS (2002/95/EC) Requirements...................................................................... 4
2.2. Safety Notice........................................................................................................ 4
2.3. Compliance Statement......................................................................................... 4
2.4. General Descriptions ........................................................................................... 4
2.5. Related Service Information................................................................................. 4
3 Product Overview......................................................................................... 5
3.1. Specification......................................................................................................... 5
3.2. Customer Acceptance ........................................................................................ 17
-2-
Abbreviations & Acronyms
This manual contains information about maintenance and service of BenQ products. Use this
manual to perform diagnostics tests, troubleshoot problems, and align the BenQ product.
1.1. Trademark
The following terms are trademarks of BenQ Corporation:
BenQ
Importance
Only trained service personnel who are familiar with this BenQ Product shall perform
service or maintenance to it. Before performing any maintenance or service, the
engineer MUST read the “Safety Note”.
-3-
2 Introduction
This section contains general service information, please read through carefully. It should be
stored for easy access place for quick reference.
-4-
3 Product Overview
3.1. Specification
3.1.1 Introduction
This specification describes G702AD, which is a 17” analog interface color TFT LCD monitor. The
monitor supports up to 1280*1024 pixel resolution and refresh rate of 75 Hz. The independent 6
bits R, G, B colors are capable of displaying 16M colors. The features summary is shown below,
*All panel spec. in service manual definition depends on the variance of panel source.
Feature items Specifications Remark
Panel supplier & module name AUO M170EG01 V.G
Screen diagonal 17” 337.920*270.366(mm)
Display Format SXGA(1280x1024)
Pixel Pitch 0.264*0.264
Viewing Angle (@ Contrast Ratio = 10) 85/85/80/80 (L/R/U/D) Typical
Analog interface with Scaling supported Yes
DVI interface with Scaling supported No
Video interface with Scaling supported No
Number of Display Colors supported 16.2M(with Hi-FRC)
1000 (typ.) 600(min)
Contrast Ratio 10000(type DCR)
Luminance 250 (typ.) 200(min)
AC power input Yes 90-264 V, 47~63Hz
DC power input (with AC power adapter) No
≤ 1W (off state)
DPMS supported Yes ≤ 2W (sleep state)
-5-
3.1.2 Operational Specification
-6-
Note-1: The pin assignment of 15-pin D-sub connector is as below,
1 5
6 10
11 15
-7-
3.1.2.6 Support Timings
Input Timing Actual Output
Horizontal Dot Clock Actual display OK N.A Remark
Vertical
Resolution Frequency Frequency Resolution
Frequency (Hz)
(KHz) (MHz)
640x350 31.47(P) 70.08(N) 25.17 1280x943 √ DOS
720x400 31.47(N) 70.08(P) 28.32 1280x1024 √ DOS
640x480 31.47(N) 60.00(N) 25.18 1280x1024 √ DOS
640x480 35.00(N) 67.00(N) 30.24 1280x1024 √ Macintosh
640x480 37.86(N) 72.80(N) 31.5 1280x1024 √ VESA
640x480 37.50(N) 75.00(N) 31.5 1280x1024 √ VESA
800x600 37.88(P) 60.32(P) 40.00 1280x1024 √ VESA
800x600 48.08(P) 72.19(P) 50.00 1280x1024 √ VESA
*800x600 46.86(P) 75.00(P) 49.50 1280x1024 √ VESA
832X624 49.72(N) 74.55(N) 57.29 1280x1024 √ Macintosh
1024x768 48.36(N) 60.00(N) 65.00 1280x1024 √ VESA
1024x768 56.48(N) 70.10(N) 75.00 1280x1024 √ VESA
1024x768 60.02(P) 75.00(P) 78.75 1280x1024 √ VESA
1024X768 60.24(N) 74.93(N) 80.00 1280x1024 √ Macintosh
1152x864 67.50(P) 75.00(P) 108.00 1280x1024 √ VESA
1152x870 68.68(N) 75.06(N) 100.00 1280x1024 √ Macintosh
1152x900 61.80(N) 66.00(N) 94.50 1280x1024 √ SUN 66
1152x900 71.81(N) 76.14(N) 108.00 1280x1024 √ SUN
√ CVT 0.83MA
1152x720 44.86(N) 60.00(P) 66.75 1280x1024
DVT 16:10
1280x768 47.396(P) 60.0(N) 68.25 1280x1024 √ CVT 0.98M9
R
1280x960 60.0 60 108 1280x1024 √ VESA
1280x1024 64.00(P) 60.00(P) 108.00 1280x1024 √ VESA
1280x1024 75.83(N) 71.53(N) 128.00 1280x1024 √ IBM1
1280x1024 80.00(P) 75.00(P) 135.00 1280x1024 √ VESA
1280x1024 81.18(N) 76.16(N) 135.09 1280x1024 √ SPARC2
Note-3: “P”, “N” stands for “Positive”, “Negative” polarity of incoming H-sync/V-sync (input timing).
-8-
3.1.3 Operational & Functional Specification
3.1.3.4 Environment
Item Condition Spec OK NA Remark
Operating 0 ~ +40 ℃ √
Temperature
Non-operating -20 ~ +60 ℃ √
Non-
Operating 10 ~ 90% √
condensing
Humidity
Non-
Non-operating 10 ~ 90% √
condensing
Without
Operating 0~3048m(10000ft) √
Altitude packing
Non-operating 0~12,192m (40,000ft) √ With packing
-9-
3.1.3.5 Transportation
Item Condition Spec OK NA Remark
(1) Sine wave
5~200Hz 1.5G, 1
octave/min, 15 min dwell
on each resonant
frequency, all primary
axis, one sweep (30 min
minimum) per
orientation, total of 90+
min.
(2) Random
5 ~100 Hz, 0 dB/Oct.
0.015 g2/Hz
100 ~200 Hz, -6 dB/Oct.
200 Hz, 0.0038 g2/Hz
(1) Vibration Package, Non-Operating Equivalent to 1.47 Grms, √
All primary axis, 20 min
per- orientation, total is
60 min.
(3) Procedure:
Confirmed sample with
appearance and function
ready
before testing then
compare with after test
record as brightness,
uniformity and contrast
ratio. Perform random
vibration after sine-wave
vibration test.
Test Spectrum:
20 Hz 0.0185(g2/Hz)
200Hz 0.0185(g2/Hz)
Unpackaged, Non-
(2) Unpackaged Vibration Duration : 5 Minutes √
Operating Axis : 3 axis
( Horizontal and Vertical
axis ,Z axis)
91 cm Height (MP stage)
(3) Drop Package, Non-Operating (1 corner, 3 edges, 6 √
faces)
Waveform: half sine
Faces: 6 sides/ per
Wooden package, Non- orientation
(4) Shock Operating 3 shocks. √
Duration: <3ms
Velocity accelerate: 75g
- 10 -
3.1.3.6 Electrostatic Discharge Requirements
Item Condition Spec OK NA Remark
Contact: 8KV
Electrostatic Discharge IEC801-2 standard
Air: 15KV
3.1.3.7 EMC
Item Condition Spec OK NA Remark
Band 1 < 10 V/m
Electric √
Band 2 < 1 V/m
TCO03
Band 1 < 200nT
Magnetic √
Band 2 < 25nT
FCC part 15J class B After Mass production
under 1dBuv for constant
EMI measure. Besides DNSF √
EN55022 class B and VCCI class-2 are
optional.
3.1.3.8 Reliability
Item Condition Spec OK NA Remark
MTBF Prediction 60,000 hr
CCFL Life time 50,000 Hours
- 11 -
[msec] Rising + Falling - 5 9
Red x 0.61 0.64 0.67
Red y 0.31 0.34 0.37
Color / Chromaticity Green x 0.26 0.29 0.32
Coordinates (CIE) Green y 0.58 0.61 0.64
Blue x 0.11 0.14 0.17
Blue y 0.04 0.07 0.10
Color Coordinates (CIE) White x 0.28 0.31 0.34
White White y 0.3 0.33 0.36
[%] 9 points
Luminance Uniformity 75 80
measurement
White Luminance @ [cd/m2]
200 250 -
CCFL 7.5mA (center)
Crosstalk (in 75Hz) [%] 1.5
* The test methods for the above items definition, please refer to the relative panel specification.
- 12 -
Phase √
Bluish
Reddish
Color Normal √
User: Separate R/G/B
adjustment
OSD Lock √
OSD Horizontal position
OSD Position √
OSD Vertical position
OSD Time From 5 sec to 30sec √
8 languages /14
Language √
languages
Recall Recall All √
Standard / Dynamic /
Mode √
Movie / Photo/sRGB
D-sub
Input Select √
DVI
Sharpness √
Display Information For input timing √
Volume √
Mute √
Hot key for Brightness √
Hot key for Contrast √
Hot key for Volume √
Hot key for Input Select √
Hot key for Mode √
The detailed firmware functions’ specification, please refer to C212 S/W spec. document.
3.1.6.1 Dimension
Item Condition Spec OK N.A Remark
Bezel opening 339.81x272.24 mm √
Monitor without Stand W x H x D mm 369.75x322.7x60.5mm √
Monitor with Stand W x H x D mm 369.8x370.25x137.8m √
Carton Box (outside) L x W x H mm 452(L)*450(W)*128(H) √
Tilt: -5 ~ +20 degree
Tilt and Swivel range √
Swivel: 0 degree
- 13 -
3.1.6.2 Weight
Item Condition Spec OK N.A Remark
Monitor (Net) 3.4 Kg √
Monitor with packing
4.5Kg √
(Gross)
3.1.6.3 Plastic
Item Condition Spec OK N.A Remark
Flammability >ABS<,94-HB √
Heat deflection To ABS 65 ℃ √
UV stability ABS Delta E < 8.0 √
Resin MPRII: ABS √
Bezel texture MT-
Texture MT-11010 √ 11000
Button painting
Color BCS-Y7054A √
T8110C
3.1.6.4 Carton
Item Condition Spec OK N.A Remark
Color Kraft √
Material C Flute √
Compression strength 200 KGF √
Burst Strength 16 KGF/cm2 √
Stacked quantity 16Layers √
- 14 -
3.1.7.2 Carton Specification
Product:
Dimension w/o Base Dimension w/ Base
Net Weight (Kg) Gross Weight (Kg)
W*H*D (mm) W*H*D (mm)
3.8Kg 5.7Kg 369.81x322.7x60.5mm 369x370.3x137.31 mm
Package:
Carton Interior Dimension (mm) Carton External Dimension (mm)
L*W*H L*W*H
448(L)x415(W)x100(H) 456(L)x423(W)x114(H)
3.1.8 Certification
Item Condition Spec OK N.A Remark
ISO14000
Green design API Doc. 715-C49 √ Requirement
Blue Angel German Standard √
E-2000 Switzerland √
Environment EPA USA Standard √
TCO’99 √
TCO’03 √
Green Mark √
Microsoft Windows PC98/99 √
DPMS VESA √
PC-Monitor
DDC 2B Version 1.3 √
USB External √
rd
UL (USA) UL60950 3 edition √
CAN/CSA-C22.2 No.
CSA (Canada) √
60950
Nordic / D.N.S.F EN60950 √
FIMKO EN60950 √
CE Mark 73/23/EEC √
Safety CB IEC60950 √
CB EN60950 √
EN60950 /
TUV/GS √
EK1-ITB 2000:2003
CCC (China) CB4943 √
GOST EN60950 √
SASO IEC60950 √
EMC CE Mark 89/336/EEC √
- 15 -
FCC (USA) FCC Part 15 B √
EN55022 Class B √
CISPR 22 Class B √
VCCI (Japan) VCCI Class B √
BSMI (Taiwan) CNS 13438 √
C-Tick (Australia) AS/ NZS CISPR22 √
DHHS (21 CFR) USA X- Ray Standard √
DNHW √
X- Ray Requirement
German X- Ray
PTB √
standard
TUV / Ergo √
Ergonomics ISO 13406-2 √
prEN50279 √
- 16 -
3.2. Customer Acceptance
3.2.1. SCOPE
This document establishes the general workmanship standards and functional
acceptance criteria for LCD color monitor model G702AD Produced by BenQ
Corporation.
.
3.2.2. PURPOSE
The purpose of this publication is to define a procedure for inspection of the LCD
monitor by means of a customer acceptance test, the method of evaluation of defects
and rules for specifying acceptance levels.
3.2.3. APPLICATION
The "Customer Acceptance Criteria" is applicable to the inspection of the LCD monitor,
completely packed and ready for dispatch to customers. Unless otherwise specified, the
customer acceptance inspection should be conducted at manufacturer's site.
3.2.4. DEFINITION
The "Customer Acceptance Criteria" is the document defining the process of examining,
testing or otherwise comparing the product with a given set of specified technical,
esthetic and workmanship requirements leading to an evaluation of the "degree of
fitness for use", including possible personal injury or property damage for the user of
the product.
Critical defect
A critical defect is a defect that judgment and experience indicate is likely to result in
hazardous or unsafe conditions for individuals using, maintaining or depending upon the
product.
Major defect
A major defect is a defect, other than critical, that is likely to result in failure, or to reduce
materially the usability of the product for its intended purpose.
Minor defect
A minor defect is a defect that is not likely to reduce materially the usability of the
product for its intended purpose, or is a departure from established standards having
little bearing on the effective use of operation of the product.
- 17 -
3.2.6. CLASSIFICATION OF DEFECTIVES
A defective is a product which contains one or more defects. The defective will be
classified into following classes.
Critical defective
A critical defective contains one or more critical and may also contain major and/or minor
defects.
Major defective
A major defective contains one or more defects and may also contain minor defects but
contains no critical defect.
Minor defective
A minor defective contains one or more minor defects but contains no critical and major
defects.
When a critical defect is found, this must be reported immediately upon detection, the lot
or batch shall be rejected and further shipments shall be held up pending instructions
from the responsible person in relevant organization.
The evaluation must be within the limits of the product specification and, for not specified
characteristics, be related to the design model, limit samples or judgment of a jury of
experts. Faults must be demonstrable.
- 18 -
3.2.10. TEST CONDITIONS
Unless otherwise prescribed, the test conditions are as follows:
No Description Class
1 Packing
1.1 Wrong packing material Major
1.2 Carton damaged(over 6cm dia).wet, badly taped or stapled, product will not arrive Minor
in good condition at customer
1.3 Carton damaged(3cm to 6cm dia), badly taped or stapled , product will arrive in Minor
good condition at customer
1.4 Wrong marking of trade mark Major
1.5 Wrong marking of model number Major
1.6 Wrong serial # marking on carton Major
1.7 Product wrongly placed in box ( upside down ) Major
1.8 Broken polyfoam or PU foam Major
1.9 Broken packing bag Major
1.10 Wrong size or poor printing for artwork/character Major
1.11 Bar-code wrong, missing, or damaged Major
1.12 Label on box missing or damaged Major
1.13 Strange object in the box Major
1.14 Unit not corresponding to model stated on external label Major
1.15 Superficial breaking 5 ~ 10 cm dia Minor
2 Accessories
2.1 Missing accessory parts Major
2.2 Wrong Accessory parts Major
3 Appearance of product
3.1 Incorrect color of cabinet Major
3.2 Incorrect color of tilt/swivel base Major
3.3 Wrong logo or name plate Major
3.4 Poor print of logo or name plate Major
- 19 -
No Description Class
3.5 Label on product Wrong or missing Major
3.6 Scratched or dirty but legible spec. label Minor
3.7 GAP between LCD and front bezel is over 2.0 mm Major
3.8 Dot/area discolor over 1mm dia. in front or over 2mm dia. in other areas Major
3.9 Cabinet warped, sagged or bulging >0.5% of surface length Major
3.10 Cabinet warped, sagged or bulging noticeable but <0.5% of surface length Minor
3.11 Sharp stud or edge, which can cause damage not safe Major
3.12 Finishing of piece parts will not arrived in good condition at the customer Major
3.13 Cabinet step ( between housing and bezel ) >1.0mm , < 1.5mm Minor
3.14 Cabinet step ( between housing and bezel ) >1.5mm Major
3.15 Wiring or fixing cord comes out of cabinet or jammed Major
3.16 Auxiliary material used during production not removed Major
3.17 Cabinet parts come loose during normal handling, not safe Critical
3.18 Cabinet parts come loose during normal handling, but safe Major
3.19 Tilt/swivel too flexible/not working Major
3.20 Tilt/swivel stiff Minor
3.21 Dirty front bezel and housing can’t remove Major
3.22 Dirty front bezel and housing removable easily Minor
3.20 Sticker or loose user control switch which will not function correctly Major
3.21 Missing knob or switch, not safe Critical
3.23 Missing knob or switch, but safe Major
3.24 Poor functional user controls in mechanical Major
3.25 Unreadable printing of user controls label Major
3.26 Rubber foot missing Major
3.27 LED wrong material or missing Major
3.28 LED sagged >1.0mm or bulging>0.5mm Minor
3.29 Wrong S/N between spec. label and monitor display Major
4 AC power and signal cable
4.1 AC power or connector not correct or damaged, not safe Critical
4.2 AC power or connector not correct or damaged, but safe Major
4.3 Signal cable contact pin dirty Minor
4.4 Signal cable plug dirty or surface damaged, but safe Minor
4.5 Cable crack Major
4.6 Cable scratch ( wire not exposed ), or dirty Major
No Description Class
4.7 AC-DC adapter no function Minor
4.8 Signal cable contact pin dirty Major
5 Interior of the product
5.1 Use Non-QVL ( Qualify vendor list )component Major
5.2 Wrong parts, broken component, but safe Major
5.3 Foreign material
Conductive (Has potential to short circuit) Major
Non-conductive (Moveable) Minor
5.4 Missing hardware, component or screw, stripped screw Major
5.5 Loose hardware/screw or insufficient torque Major
5.6 Poor wire routing, which is no concerned on EMI Minor
5.7 Cold soldering/loose connections (Electrical) Major
5.8 Wires and mechanical structure do not meet UL/CSA or TUV Critical
5.9 Wrong parts, broken component, not safe Critical
- 20 -
5.10 Component burn Critical
1. TEST PATTERN
2. SPECIFICATIONS
3. OPERATIONAL INSPECTION CRITERIA
- 21 -
3.2.13.2. Video performance
Item Condition Spec OK N.A Remark
Max. support Pixel rate 140M √
1280x1024 1280x1024@ 75Hz
Max. Resolution √ (max. support
timing)
< 6.25ns
Rise time + Fall time (50% of minimum pixel √
clock period)
Settling Time after <5% final full-scale
√
overshoot /undershoot value
<12% of step function
Overshoot/Undershoot voltage level over the √
full voltage range
- 22 -
4 Level 1 Cosmetic / Appearance / Alignment Service
- 23 -
4.1.2 Firmware Upgrade Procedure
Step 1:
Un-zip Port95nt and install into your computer.
Step 2:
Un-zip ISP application tool (RTDTool)
Step 3:
Select “IIC”and “RTD2122”, press “ISP” button to execute firmware program application.
- 24 -
Step 4:
Press “64K” button to load *H00* file, press “64~128” button to load *H01* file and press “128~160”
button to load *.hex* file from your computer.
- 25 -
Step 5:
Select red frame ( total 5 points) option and execute lightning button to start upgrade firmware
to the monitor.
- 26 -
Note: you can change program speed bar to meet your equipment speed if program firmware fail.
- 27 -
4.1.3 EDID Upgrade Procedure
- 28 -
Step 2: Click “Open File” and select “VGA” or “HDMI” EDID file
- 29 -
Step 4: If write EDID is successful, it shows ”Write EDID OK …”
And then, click “Read EDID” button to check if successful or not.
- 30 -
4.2. Alignment procedure (for function adjustment)
A. Preparation:
1. Setup input timing to any preset modes or patterns.
2. Enter factory mode (press “Menu” & “Auto” & “Power” buttons at the same time to turn
on monitor).
3. Move cursor into “Burn-in Mode” tag and select “On” to enable burn-in mode.
4. Power off the monitor, remove the input source and then power on again.
5. Setup unit and keep it warm up for at least 30 minutes.
6. Setup input timing ICL-605(1280x1024@75Hz), 32-Grays pattern.
7. Setup unit and keep it warm up at least 30 minutes.
B. Timing adjustment:
1. Enter factory setting area (press “ENTER”, “MENU” and then press “SOFTPOWER”).
2. Check the settings to following values:
Contrast = 50
Brightness = 90
Color = Normal
Language = English
Then, turn off the monitor power.
3. Turn on power enter user area.
- 31 -
C. ADC calibration (Auto color balance adjustment)
~~Analog only, it is not required for DVI-D input source
1. Setup input timing ICL-605( 1280x1024@75Hz ), pattern 42(5-Mosaic pattern with white
color block) with Analog signals from Chroma video pattern generator. (it depends on Scaler
IC supplier’s recommendation)
2. Enter factory mode (press “Menu” & “Auto” & “Power” buttons at the same time to turn on
monitor).
3. Move cursor into “Burn-in Mode” tag and select “On” to enable burn-in mode.
4. Close OSD menu then press “+” button for auto color adjustment. (This procedure will get
optimal gain/offset(clamp) values)
5. Checking if the picture is ok, or reject this monitor and check its circuit board or wire/cable
connection.
- 32 -
E. Writing EDID file:
1. Setup a PC with DDC card.
2. Connect PC to monitor with a D-sub signal cable.
3. Please refer to the C212 for the correct EDID file.
4. Runs the writing program to write the analog EDID data into EEPROM for analog input (ie. 15-
pin D-sub).
5. Repeat step 4 and write the digital EDID data into EEPROM for DVI-D input (ie. 24-pin DVI-D).
6. Read both EEPROM data and confirm it to match with the C212 definition.
(Note: The DVI-D input may not operation correctly if the digital EDID data do not exist.)
F. Command definition:
PC Host will send 0x7C IIC slave address and then following 4 bytes command
Byte Byte
I2C Send Command 1 2 Byte3 Byte4 OK N.A. Note
Write Contrast to MCU RAM CA 55 Data cksum √ Write data to MCU RAM
Write Brightness to MCU RAM CA 56 Data cksum √ and update the related
register to refresh the
Write Red Gain to MCU RAM CA 57 Data cksum √
screen immediately.
Write Green Gain to MCU RAM CA 58 Data cksum √ Don’t store data to
Write Blue Gain to MCU RAM CA 59 Data cksum √ EEPROM.
Set brightness default of
PWM( may not match
OSD)
Write Brightness default CA 9C Data cksum √ <Note H>
Read Contrast from MCU RAM C3 55 XX cksum √
Read Brightness from MCU RAM C3 56 XX cksum √
Read Red Gain from MCU RAM by
color index C3 57 XX cksum √
Read Green Gain from MCU RAM by
color index C3 58 XX cksum √ Base on current color
Read Blue Gain from MCU RAM by index to read back the
color index C3 59 XX cksum √ right gain value.
Read F/W version from MCU’s Please see <Note F> for
constant definition C3 5A XX cksum √ detail implementation
Read panel vender from MCU’s Please see <Note G> for
constant definition C3 5B XX cksum √ detail implementation
Reply EDID(analog if
Read Product ID C3 5C XX cksum √ dual inputs) address 0A
Set brightness default of
PWM( may not match
OSD)
Read Brightness default C3 9C XX cksum √ <Note H>
Write C1 (Bluish) R-Gain Data to
EEPROM AA 3C Data cksum √
Write C1 (Bluish) G-Gain Data to
EEPROM AA 3D Data cksum √
Write C1 (Bluish) B-Gain Data to
EEPROM AA 3E Data cksum √
- 33 -
Write C2 (sRGB) R-Gain Data to
EEPROM AA 4C Data cksum √
Write C2 (sRGB) G-Gain Data to
EEPROM AA 4D Data cksum √
Write C2 (sRGB) B-Gain Data to
EEPROM AA 4E Data cksum √
Write C3 (Reddish) R-Gain Data to
EEPROM AA 5C Data cksum √
Write C3 (Reddish) G-Gain Data to
EEPROM AA 5D Data cksum √
Write C3 (Reddish) B-Gain Data to
EEPROM AA 5E Data cksum √
Write User R-Gain Data to EEPROM AA 6C Data cksum √
Write User G-Gain Data to EEPROM AA 6D Data cksum √
Write User B-Gain Data to EEPROM AA 6E Data cksum √
Write sRGB R-Gain Data to EEPROM AA 7C Data cksum √ Reserved for some
Write sRGB G-Gain Data to EEPROM AA 7D Data cksum √ model have extra color
Write sRGB B-Gain Data to EEPROM AA 7E Data cksum √ temperature
Write Contrast to EEPROM AA 92 Data cksum √
Write Brightness to EEPROM AA 93 Data cksum √
1=C1/9300/Bluish,
2=C2/6500/sRGB/,
3=C3/5800/Reddish,
Write C/T index to EEPROM AA 94 1~4 cksum √ 4=User, 5=sRGB
Write OSD-Hpos to EEPROM AA 95 Data cksum √
Write OSD-Vpos to EEPROM AA 96 Data cksum √
0=EN, 1=ES, 2=FR,
3=DE,
For excluding BenQ model 4=簡中, 5=繁中
Write Language to EEPROM AA 97 0~7 cksum √ (Also Update MCU RAM)
0=DE, 1=EN, 2=ES,
For BenQ model 3=FR, 4=IT, 5=JA, 6=繁
Write Language to EEPROM (For 中, 7=簡中
Asia) AA 97 0~7 cksum √
(Change Language type
first)
0=EN, 6=French,
7=Deutsch, 8=Italian,
9=Spanish,
0A=Hungarian,
0B=Serbian,
0C=Russian, 0D=Dutch,
0E=Polish, 0F=Czech,
10=Swedish,
For BenQ model 11=Portugese,
Write Language to EEPROM (For 12=Romanian
Europe) AA 97 6~12 cksum √ (Also Update MCU RAM)
- 35 -
Read sRGB R-Gain data from
EEPROM A3 7C XX cksum √
Read sRGB G-Gain data from
EEPROM A3 7D XX cksum √ Reserved for some
Read sRGB B-Gain data from model have extra color
EEPROM A3 7E XX cksum √ temperature
Read Contrast from EEPROM A3 92 XX cksum √
Read Brightness from EEPROM A3 93 XX cksum √
1=C1/9300/Bluish,
2=C2/6500/Normal/,
3=C3/5800/Reddish,
Read C/T index from EEPROM A3 94 XX cksum √ 4=User, 5=SRGB
Read OSD-Hpos EEPROM A3 95 XX cksum √
Read OSD-Vpos from EEPROM A3 96 XX cksum √
0=DE, 1=EN, 2=ES,
3=FR, 4=IT, 5=JA, 6=繁
中, 7=簡中
For excluding BenQ model
Read Language from EEPROM A3 97 XX cksum √ (Also Update MCU RAM)
0=DE, 1=EN, 2=ES,
For BenQ model 3=FR, 4=IT, 5=JA, 6=繁
Read Language to EEPROM (For 中, 7=簡中
Asia) A3 97 0~7 cksum √
0=EN, 6=French,
7=Deutsch, 8=Italian,
9=Spanish,
0A=Hungarian,
0B=Serbian,
0C=Russian, 0D=Dutch,
0E=Polish, 0F=Czech,
For BenQ model 10=Swedish,
Read Language to EEPROM (For 11=Portugese,
Europe) A3 97 6~12 cksum √ 12=Romanian
Read OSD Timer from EEPROM A3 98 XX cksum √
Read Volume from EEPROM A3 99 XX cksum √
For model with Gamma
curve selection function
0: By-pass
1: Enable
Read Gamma index from EEPROM A3 9A XX cksum √
Set brightness default of
PWM( may not match
OSD)
Read EEPROM brightness default A3 9C XX cksum √ <Note H>
Read OSD Transparency from
EEPROM A3 9E XX cksum √
Read OSD Rotation from EEPROM A3 9F XX cksum √
Read URL setting from EEPROM A3 A0 XX cksum √ Range: 0~2
Read OSD/OSM setting from 0: OSD
EEPROM A3 A1 XX cksum √ 1: OSM
- 36 -
Read First Auto setting from 0: Disable first auto
EEPROM A3 A2 XX cksum √ 1: Enable first auto
Read “Factory Page Language” 0: English
setting from EEPROM A3 A3 XX cksum √ 5: Japanese
Change Color Temp. to
C1/9300K/Bluish CC 01 XX cksum √
Change Color Temp. to
C2/6500K/sRGB CC 02 XX cksum √
Change Color Temp. to Change C/T immediately.
C3/5800K/Reddish CC 03 XX cksum √ And store C/T index to
Change Color Temp. to User CC 04 XX cksum √ EEPROM.
Change Color Temp. to sRGB CC 05 XX cksum √ Reserved
Change Input Source to D-Sub CD 01 XX cksum √
Change Input Source to DVI CD 02 XX cksum √
On burn in mode CE 01 XX cksum √ Store data to EEPROM
XX* = Non “1” value
Off burn in mode CE XX* XX cksum √ Store data to EEPROM
Monitor is forced power saving CF 01 XX cksum √
Monitor wake up from power saving CF XX* XX cksum √ XX* = Non “1” value
Change Sense-Eye mode to Standard C0 00 XX cksum √
Change Sense-Eye
Change Sense-Eye mode to Movie1 C0 01 XX cksum √ mode immediately. And
Change Sense-Eye mode to Movie2 C0 02 XX cksum √ store the index to
Change Sense-Eye mode to Photo C0 03 XX cksum √ EEPROM.
Set luminance sensor mode to Off C1 00 XX cksum √
Set luminance sensor mode to Bright C1 01 XX cksum √ Change luminance
Set luminance sensor mode to sensor mode
Moderate C1 02 XX cksum √ immediately. And store
Set luminance sensor mode to Dim C1 03 XX cksum √ the index to EEPROM.
User mode to factory mode 1A 5A XX cksum √
Auto Color (Offset1, Offset2, Gain) 1B 5A XX cksum √
Copy EDID Serial number to For specified “Industry
EEPROM 1C 5A XX cksum √ Customer” model.
Factory mode to User mode 1E 5A XX cksum √
Clear user mode and factory recall 1F 5A XX cksum √ Store data to EEPROM
Write EDID data to MCU DDC RAM 55 NA NA NA √ For MTV312 MCU type
Copy DDC RAM data to EEPROM BB NA NA NA √ For MTV312 MCU type
Drive WP pin to low to enable write
DDC IC 55 NA NA NA √ For stand alone DDC IC
Drive WP pin to high to disenable
write function BB NA NA NA √ For stand alone DDC IC
For input signal with
Switch DDC bus to DVI-A DDC IC 44 NA NA NA √ multi-input source
For input signal with
Switch DDC bus to DVI-D DDC IC 33 NA NA NA √ multi-input source
Read ADC R-Offset1-Low byte AE 13 Data cksum √ For debug only
Read ADC G-Offset1-Low byte AE 14 Data cksum √ For debug only
Read ADC B-Offset1-Low byte AE 15 Data cksum √ For debug only
Read ADC R-Offset1-High byte AE 16 Data cksum √ For debug only
- 37 -
Read ADC G-Offset1-High byte AE 17 Data cksum √ For debug only
Read ADC B-Offset1-High byte AE 18 Data cksum √ For debug only
Read ADC R-Offset2-Low byte AE 23 Data cksum √ For debug only
Read ADC G-Offset2-Low byte AE 24 Data cksum √ For debug only
Read ADC B-Offset2-Low byte AE 25 Data cksum √ For debug only
Read ADC R-Offset2-High byte AE 26 Data cksum √ For debug only
Read ADC G-Offset2-High byte AE 27 Data cksum √ For debug only
Read ADC B-Offset2-High byte AE 28 Data cksum √ For debug only
Read ADC R-Gain-Low byte AE 33 Data cksum √ For debug only
Read ADC G-Gain-Low byte AE 34 Data cksum √ For debug only
Read ADC B-Gain-Low byte AE 35 Data cksum √ For debug only
Read ADC R-Gain-High byte AE 36 Data cksum √ For debug only
Read ADC G-Gain-High byte AE 37 Data cksum √ For debug only
Read ADC B-Gain-High byte AE 38 Data cksum √ For debug only
Write ADC R-Offset2-Low byte AF 13 XX cksum √ For debug only
Write ADC G-Offset2-Low byte AF 14 XX cksum √ For debug only
Write ADC B-Offset2-Low byte AF 15 XX cksum √ For debug only
Write ADC R-Offset2-High byte AF 16 XX cksum √ For debug only
Write ADC G-Offset2-High byte AF 17 XX cksum √ For debug only
Write ADC B-Offset2-High byte AF 18 XX cksum √ For debug only
Write ADC R-Offset2-Low byte AF 23 XX cksum √ For debug only
Write ADC G-Offset2-Low byte AF 24 XX cksum √ For debug only
Write ADC B-Offset2-Low byte AF 25 XX cksum √ For debug only
Write ADC R-Offset2-High byte AF 26 XX cksum √ For debug only
Write ADC G-Offset2-High byte AF 27 XX cksum √ For debug only
Write ADC B-Offset2-High byte AF 28 XX cksum √ For debug only
Write ADC R-Gain-Low byte AF 33 XX cksum √ For debug only
Write ADC G-Gain-Low byte AF 34 XX cksum √ For debug only
Write ADC B-Gain-Low byte AF 35 XX cksum √ For debug only
Write ADC R-Gain-High byte AF 36 XX cksum √ For debug only
Write ADC G-Gain-High byte AF 37 XX cksum √ For debug only
Write ADC B-Gain-High byte AF 38 XX cksum √ For debug only
8 bytes command—(6E,
51, 84, 03, FF, 00, 00, For DDC/CI capability
IIC Slave address 6E 7C command cksum) √ model
EEPROM Bank R/W (For Debug using only, not for Production Line Write EEPROM directly)
Addr
Read EEPROM Bank 0 B0 ess XX cksum √
Addr
Read EEPROM Bank 1 B1 ess XX cksum √
Addr (For 24C08 type)
Read EEPROM Bank 2 B2 ess XX cksum √ HDCP key area
Addr (For 24C08 type)
Read EEPROM Bank 3 B3 ess XX cksum √ HDCP key area
Addr
Read EEPROM Bank 4 B4 ess XX cksum √ (For 24C16 type)
- 38 -
Addr
Read EEPROM Bank 5 B5 ess XX cksum √ (For 24C16 type)
Addr (For 24C16 type)
Read EEPROM Bank 6 B6 ess XX cksum √
Addr (For 24C16 type)
Read EEPROM Bank 7 B7 ess XX cksum √ HDCP key area
Addr
Write EEPROM Bank 0 B8 ess Data cksum √
Addr
Write EEPROM Bank 1 B9 ess Data cksum √
Addr (For 24C08 type)
Write EEPROM Bank 2 BA ess Data cksum √ HDCP key area
Addr (For 24C08 type)
Write EEPROM Bank 3 BB ess Data cksum √ HDCP key area
Addr
Write EEPROM Bank 4 BC ess Data cksum √ (For 24C16 type)
Addr
Write EEPROM Bank 5 BD ess Data cksum √ (For 24C16 type)
Addr (For 24C16 type)
Write EEPROM Bank 6 BE ess Data cksum √ HDCP key area
Addr (For 24C16 type)
Write EEPROM Bank 7 BF ess Data cksum √ HDCP key area
<Note E>
DDC/CI command IIC command
Command code for DDC/CI mode change to IIC alignment mode
Byte1 Byte2 Byte3 Byte4 Byte5 Byte6 Byte7 Byte8
0x6E 0x51 0x84 0x03 0xff 0x00 0x00 checksum
Description:
1. For DDC/CI supported model, its default IIC slave address is set to 0x6E, not 0x7C. So the above
command words must be issued before doing IIC alignment procedure. It is to inform MCU that
change IIC slave address from 0x6E to 0x7C.
- 39 -
G. Wire Dressing - Assembly note
Step 1: connect power board and interface board and insert LVDS
Step 2: place power board and interface board into the main-shielding.
- 40 -
Step 4: take one front-bezel and place the keypad on the bezel
Step 6: place main-shielding on the panel and connect LVDS into the panel
- 41 -
Step 7: place 4 pcs of AL-tapes on the four sides of main-shielding to protect EMI and add 2 pcs
of tapes to fix the wires
-Add 90x40mm AL-tape to top_left of BKT -Add 90x25mm AL-tape to Top_right of BKT
-Add 90x25mm AL-tape to left BKT -Add 90x25mm AL-tape to right BKT
Add two metal springs and one gasket between bottom side of main bracket for EMI
solution.
- 42 -
Step 8 : connect the wire of keypad into the interface board and fix the wire using tape.
Step 12: finally, attached photos are the final front and back views of G702AD
- 43 -
5 Level 2 Disassembly /Assembly Circuit Board and Standard Parts
Replacement
5.1. Exploded View
5 8 20 9 10 11 12
23
22
24
17 18
21 25
13 14 15
16
19
7
1 2 3 4 6
- 44 -
Item P/N Description Q'TY
1 6K.0BV01.021 ASSY BEZEL AUO Y7054A G700 1
2 3D.09401.001 SPG JACK BD SUS301 0.1T V907 1
3 5E.0BV03.001 PCBA CTRL BD G700 MI 1
4 5F.LU7B0.021 LCDM17 M170EG01-VG0D/0E Z/GAUO 1
5 3H.04054.071 TAPE ADHESIVE 35*25 BLK 7651F 3
6 3H.04054.321 TAPE ADHESIVE 35*12*0.21 BLK 1
7 4G.0BP03.001 TAPE AL+MYLAR 275*40*0.08 1
8 5K.0BV02.001 LVDS FFC 208MM ANALOG G700 1
9 5E.0BV02.004 PCBA SPS BD G702AD MI AUO V7 1
10 5E.0BV01.011 PCBA IF BD MI G702AD AUO V7 1
11 4G.0BH09.001 TAPE AL RIGHT 90*25*0.08 G900W 3
12 4G.L0G07.001 FOIL AL 90*40 Q9T3 1
13 4B.L2H12.012 CVR AC-SOCKET ABS V0 2007FPB 1
14 6K.0BV09.003 ASSY SHD AUO ANALOG G700 1
15 6K.0BV03.051 ASSY RC AUO DSUB 7054A G702AD 1
16 4B.0BV03.011 COLUMN FRONT ABS 7054A G700 1
17 6K.0BV10.001 ASSY HINGE-2 G700 1
18 4B.0BV02.011 COLUMN REAR ABS 7054A G700 1
19 6K.0BV06.011 ASSY BASE W/P 7054A G700 1
20 8F.00273.6R0 SCRW TAP PH W/FL M3*6L C-ZN 5
21 8F.205B4.019 #SCRW MACH STEEL HEX #4-40 NI 4
22 8F.5A356.8R0 SCRW MACH FH M4*8L B-ZN NYL 2
23 8F.EA524.6R0 SCRW TAP FH M3*6L NI 1
24 8F.WA314.8R0 SCRW TAP CAP M3*1.34P*8L B-ZN 1
25 8F.XA326.100 SCRW TAP FLAT M4*10L B-ZN 4
* This Service BOM is subject to change. Please check it on eSupport and SPO system before
service parts order release.
- 45 -
5.2. Disassembly /Assembly
The static-free
Put the monitor on the static-free
1 pad must be
working table. pad
cleanned.
electronic
Disassembling the Signal Torque:1.2±0.3k
2 screwdriver
Cable. g
("+")
electronic
Unscrew the screws of the Torque:6.0±1.0k
4 screwdriver
backboard (1) g
("+")
- 46 -
electronic
Unscrew the screws of the
5 screwdriver Torque:5±1.0kg
backboard (2)
("+")
Disassembling the
7
backboard from BZL.
- 47 -
Torque:5±0.6kg
Remark:MODEL
ASE/SBA must be
electronic
unscrew four
11 Unscrew the screw screwdriver
("+") screws,MODEL
A4E/S4E must be
unscrew two
screws
Torque:6-8kg
Remark:MODEL
ASE/ASE must be
electronic
unscrew two
12 Unscrew the screw screwdriver
("+") screws,MODEL
SBA/S4E must be
unscrew three
screws
- 48 -
5.3. Main-Shielding Position
- 49 -
5.4. Packing
- 50 -
5.5. Block diagram
I. Introduction:
The G702AD is a 17” SXGA (1280x1024) , 16.7M colors(R, G, B 6-bit data+HiFRC data) TFT
LCD monitor. It’s a D-SUB interface LCD monitor with a 15 pins D-sub signal cable. It’s compliant
with VESA specification to offer a smart power management and power saving function. It also
offers OSD menu for users to control the adjustable items and get some information about this
monitor, and the best function is to offer users an easy method to set all adjustable items well just
by pressing one key, we called it “Auto key” which can auto adjusting all controlled items.
G702AD also offer DDC2 function to meet VESA standard.
Inverter
Power
Interface board
Control board
AC power in D-Sub
- 51 -
5.6. Trouble Shooting Guide
5.6.1 No Display or display is unstable:
Y
Power off Turn on power
N
N Check all of wire, then
Does cable plugs in connector?
turn on power switch
again
Y
N
Does power stable? Check Power Board
N
Is LED light green/orange? Check control BD
Y
N
Is LED status normal? Check RTD2120L (U5)
or replace it
Y
Replace panel
- 52 -
5.6.2 BUTTON Function:
Yes
No
Is control BD connecting? Plug control BD then retry
Yes
Yes
Is button switch normally? Replace control BD then retry
No
Replace Control BD
Is OSD working??
No
Check Interface BD
N
Is control BD working? Replace control BD
Y
Check interface BD
- 53 -
5.6.4 Power no work troubleshooting
- 54 -
5.6.4.2 AC/DC converter
- 55 -
5.6.4.3 Inverter
Panel lamp
no work
Yes
Yes
Check BL_ON,
BRT_ADJ No Check wires, I/F BD
OK?
Yes
Check IC801
Replace IC801
frequency, output No
components
OK?
Yes
Replace components
- 56 -
5.7. Circuit Operation Theory
Realtek Clock
2120 Generator
SXGA
1280×1024
165MHz Reltek LCM
D-SUB ADC RTD 2025LH
IIC Keypad
(b) IC introduction:
1.) DDC (Display Data Channel) function: We use DDC IC to support DDC/2B function. DDC
data is stored in 24C02(EEPROM). Those data related to LCD monitor specification. PC
can read them by “SDA” and “SCL” serial communication for I²C communication for
DDC2B.
2.) RTD2025LH IC: There are triple ADC, LVDS transmitter, TMDS receiver, Scaling, and
OSD functions in the RTD2025LH IC. Scaling IC is revolutionary scaling engine, capable
of expanding any source resolution to a highly uniform and sharp image, combined with
the critically proven integrated 8 bit triple-ADC and patented Rapid-lock digital clock
recovery system. It also support detect mode and DPMS control.
3.) Realtek 2120: To stored the source code which is accessed by MCU to run program.
4.) EEPROM: We use 24C04 to store all the adjustable data and user settings and use
24C02 to store D-SUB EDID data.
- 57 -
A-3) Control board introduction:
There are 6 keys for user's control which includes “Power”, “Enter”, “Up/Plus”, “Down/Minus” ,
“Menu/Exit”, and “iKey” . The following descriptions are the introduction of these keys.
Feedback
Isolation
Fig.1
- 58 -
#1 EMI Filter
This circuit (fig. 2) is designed to inhibit electrical and magnetic interference for meeting FCC, VDE,
VCCI standard requirements.
L4
C603
1000P M
C604
1000P M
1
L601
20MH
C601
0.1U M
L3 N1
R602
680K
R601 R603
680K 680K
2
NTC 8OHM
TR601
t
1
L2
F601
250V 2A
L1 TP601 TP602
Fig. 2
- 59 -
#2 Rectifier and filter
AC Voltage (90-264V) is rectified and filtered by BD601, C605 (See Fig 3) and the DC Output
voltage is 1.4*(AC input). (See Fig.3)
BD601
2
2KBP06M-LF
~
E6
4 - + 1
1
3
+ C605
N2 100U 450V
2
Fig. 3
T601
2000uH
1 10
R607 C609
68K 0.001U J
D601
A K 3
UF4007-LF
7
6
Va D602
K A 5
UF4007-LF
1
C611
+ 10U 50V
2
4 8
IC601
TOP258PN 筿筿GND
5 4
S D
6
S
7 2
S C
8 1
S M
R605
12.1K F
Fig. 4
- 60 -
#4 Rectifier and filter
D702 and C701are to produce DC output (See Fig.5)
T601 D705
2000uH +17VSW UG4D-E3/73
1 10 A K
K
D706 ZD701
UG4D-E3/73 BZV55C15
A K R721
100 J
A
3
R713
C704 C705 R702 330
1000P K 1000P K 10 D701
7
C
2 D702
SB360-LF
Q701
2SC1213A
B +5VS L701
2.7U
6 A K
E
5 D701
N.A
A K
1
+ C701 + C702
1000U 1000U
16V 16V
2
2
9
4 8
筿筿GND
Fig. 5
- 61 -
#5 PWM Controller
The PWM controller TOP258PN implements a standard current mode architecture. With an
internal structure operating at a fixed 40KHz. Where the switch time is dictated by the peak
current set-point. When the current set-point falls below a given value. The output power
demand diminishes, the IC automatically enters the so-called skip cycle mode and provides
excellent efficiency.
C615
1000P M
BD601
2
2KBP06M-LF
~
T601
E6 2000uH +17VSW
4 - + 1 1 10
R607 C609
~ 68K 0.001U J
D601
1
E7
3
+ C605 A K 3
N2 100U 450V
2 R612
100 UF4007-LF
7
E8 2
6
Va D602
K A 5
UF4007-LF
1
C611
+ 10U 50V
2
4 8
IC601
TOP258PN 筿筿GND
5 4
S D JR1
4
6 IC602 R705
S PC123FY 1J00F 1K F
3
7 2
S C
P05
8 1 R704
S M
68
Fig. 6
- 62 -
#6 Feedback circuit
PC123 is a photo-coupler and KA431 is a shunt regulation. They are used to detect the
output voltage change and be the primary and secondary isolation. When output voltage
changes, the feedback voltage will be compared and duty cycle will be decided to control the
correct output voltage. (See Fig.7)
JR1
1
IC602 R705
PC123FY1J00F 1K F
R711
2
2.2
R703
R704 0 R712
68 11K F
C714
4700P K
R606
4.7 J R706 R707
3.3K F 10K F
K
C713 IC703 R
C711 N.A KA431AZTA_NL
K
1
0.1U K
A
C607 BZV55-C9V1 C608 + + C710
0.1U M ZD601 47U 50V 47U 50V R R714
R708 10K F
2
IC702 10K F
A
A
KA431AZT A_NL
Fig. 7
- 63 -
FULL BRIDGE Configuration
R835
5.1K F
Q808
3
4
C805 5
0.1U M 6
8
7
2
C827 C828
2.2U K 2.2U K
R837
1
10K
T801
. 7
4
5
6
.
R838
1
10K C817
10PF J
2 1
2
7 3
C806 8
0.1U M 6 8
5
R833
5.1K F
4
3
Q810
+17V
Fig. 1
Feed-back Circuit
R846
1K F
ISEN1 R846
ISEN R802 ISEN1
J
10 F
K A
D802
C830 R825 R827 BAV99
0.033U K 365 F 10K
Fig. 2
Fig. 2 shows the feedback circuit consists of a lamp, C846, D802, R825, R827 and C830.
With the lamp current through D809, a half sin-waveform voltage signal is produced. We
may get the Maximum value through R825/R827/C837.
After OZ9933 gets the feedback voltage signal from PIN14, the duty of the PWM driver
outputs is decided.
- 64 -
Appendix 1 – Screw List / Torque
- 65 -
SPECIAL SCREW TORQUE SPEC.
MOUNTING TORQUE HOLE SIZE Screw
ITEM P/N DESCRIPTION
MATERIAL (KG-CM) (MM) Head
1 8F.00274.8R0 SCREW FPH TAP M3*8L NI Plastic 5.0±1.0 ∅2.35±0.05 #2
2 8F.00003.143 SCRW TAP PAN #4-40*3/8 Aluminum 3.3±0.3 ∅2.6±0.03 #2
3 8F.VG434.4R0 SCRW TAP PAN F/WSH M3*4L C-ZN METAL No thread:8~10
Have thread:6~8 ∅2.68±0.03 #2
Aluminum:4~5
4 8F.1A356.100 SCRW MACH PAN M4*10L B-ZN NYLO Metal
11.0±1.0 M4*0.7 #2
SCREW D-SUB
- 66 -
Appendix 2--Physical Dimension Front View and Side view
Fig. 1 Physical Dimension Front View and Side view
- 67 -
Fig. 2 Appearance Description
- 68 -