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DSA00498970

This document provides information on the MBRD1035CTL Schottky power rectifier diode, including its: 1) Key features such as oxide passivation, guardring stress protection, and low forward voltage drop. 2) Maximum ratings for peak reverse voltage, average and peak forward current, and operating temperatures. 3) Thermal characteristics including junction to case and ambient thermal resistances. 4) Electrical characteristics including instantaneous forward voltage, maximum reverse current, and typical/maximum forward characteristics curves.

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José Orozco
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© © All Rights Reserved
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0% found this document useful (0 votes)
29 views6 pages

DSA00498970

This document provides information on the MBRD1035CTL Schottky power rectifier diode, including its: 1) Key features such as oxide passivation, guardring stress protection, and low forward voltage drop. 2) Maximum ratings for peak reverse voltage, average and peak forward current, and operating temperatures. 3) Thermal characteristics including junction to case and ambient thermal resistances. 4) Electrical characteristics including instantaneous forward voltage, maximum reverse current, and typical/maximum forward characteristics curves.

Uploaded by

José Orozco
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd

MBRD1035CTL

SWITCHMODE
Schottky Power Rectifier
DPAK Power Surface Mount Package
. . . employing the Schottky Barrier principle in a large area [Link]
metal−to−silicon power diode. State of the art geometry features
epitaxial construction with oxide passivation and metal overlay SCHOTTKY BARRIER
contact. Ideally suited for low voltage, high frequency switching
power supplies, free wheeling diode and polarity protection diodes. RECTIFIER
• Highly Stable Oxide Passivated Junction 10 AMPERES
• Guardring for Stress Protection 35 VOLTS
• Matched Dual Die Construction −
May be Paralleled for High Current Output
• High dv/dt Capability 1
4
• Short Heat Sink Tap Manufactured − Not Sheared 3
• Very Low Forward Voltage Drop
• Epoxy Meets UL 94, V−0 @ 0.125 in
• Pb−Free Package May be Available. The G−Suffix Denotes a 4
Pb−Free Lead Finish
1
Mechanical Characteristics: 3
• Case: Epoxy, Molded DPAK
• Weight: 0.4 gram (approximately) CASE 369A
• Finish: All External Surfaces Corrosion Resistant and Terminal PLASTIC

Leads are Readily Solderable


• Lead and Mounting Surface Temperature for Soldering Purposes: MARKING DIAGRAM
260°C Max. for 10 Seconds
• Shipped in 75 units per plastic tube
• Available in 16 mm Tape and Reel, 2500 units per Reel, B1035CL
Add “T4’’ to Suffix part #
• Marking: B1035CL

B1035CL = Device Code

ORDERING INFORMATION

Device Package Shipping†

MBRD1035CTL DPAK 75 Units/Rail

MBRD1035CTLT4 DPAK 2500/Tape & Reel

MBRD1035CTLT4G DPAK 2500/Tape & Reel

†For information on tape and reel specifications,


including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.

 Semiconductor Components Industries, LLC, 2003 1 Publication Order Number:


November, 2003 − Rev. 2 MBRD1035CTL/D
MBRD1035CTL

MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage VRRM 35 Volts
Working Peak Reverse Voltage VRWM
DC Blocking Voltage VR

Average Rectified Forward Current Per Leg IO 5.0 Amps


(At Rated VR, TC = 115°C) Per Package 10

Peak Repetitive Forward Current Per Leg IFRM 10 Amps


(At Rated VR, Square Wave, 20 kHz, TC = 115°C)
Non−Repetitive Peak Surge Current Per Package IFSM 50 Amps
(Surge applied at rated load conditions, halfwave, single phase, 60 Hz)
Storage / Operating Case Temperature Tstg, Tc −55 to +125 °C
Operating Junction Temperature TJ −55 to +125 °C
Voltage Rate of Change (Rated VR, TJ = 25°C) dv/dt 10,000 V/s

THERMAL CHARACTERISTICS
Thermal Resistance − Junction to Case Per Leg RJC 2.43 °C/W
Thermal Resistance − Junction to Ambient (Note 1) Per Leg RJA 68 °C/W
ELECTRICAL CHARACTERISTICS
Maximum Instantaneous Forward Voltage (Note 2) VF Volts
see Figure 2 Per Leg
IF = 5 Amps, TJ = 25°C 0.47
IF = 5 Amps, TJ = 100°C 0.41
0.56
IF = 10 Amps, TJ = 25°C
0.55
IF = 10 Amps, TJ = 100°C
Maximum Instantaneous Reverse Current (Note 2) IR mA
see Figure 4 Per Leg
(VR = 35 V, TJ = 25°C) 2.0
(VR = 35 V, TJ = 100°C) 30
0.20
(VR = 17.5 V, TJ = 25°C)
5.0
(VR = 17.5 V, TJ = 100°C)
1. Rating applies when using minimum pad size, FR4 PC Board
2. Pulse Test: Pulse Width ≤ 250 s, Duty Cycle ≤ 2.0%.

[Link]
2
MBRD1035CTL

TYPICAL CHARACTERISTICS
I F, INSTANTANEOUS FORWARD CURRENT (AMPS)

I F, INSTANTANEOUS FORWARD CURRENT (AMPS)


100 100

TJ = 125°C
10 10 TJ = 125°C
TJ = 100°C

TJ = 25°C

1.0 TJ = − 40°C TJ = 25°C


1.0

TJ = 100°C

0.1 0.1
0.10 0.30 0.50 0.70 0.90 1.10 0.10 0.30 0.50 0.70 0.90 1.10
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE (VOLTS)

Figure 1. Typical Forward Voltage Per Leg Figure 2. Maximum Forward Voltage Per Leg

1E+0 1E+0
I R , MAXIMUM REVERSE CURRENT (AMPS)
I R , REVERSE CURRENT (AMPS)

100E−3 100E−3
TJ = 125°C TJ = 125°C

10E−3 10E−3

1E−3 TJ = 100°C 1E−3 TJ = 100°C

100E−6 TJ = 25°C 100E−6


TJ = 25°C
10E−6 10E−6

1E−6 1E−6
0 10 20 30 35 0 10 20 30 35
VR, REVERSE VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS)

Figure 3. Typical Reverse Current Per Leg Figure 4. Maximum Reverse Current Per Leg

[Link]
3
MBRD1035CTL

PFO , AVERAGE POWER DISSIPATION (WATTS)


8.0 4.0
I O , AVERAGE FORWARD CURRENT (AMPS) dc SQUARE WAVE
7.0 3.5
SQUARE WAVE (50% DUTY CYCLE) dc
6.0 (50% DUTY CYCLE) 3.0
Ipk/Io = 
5.0 2.5
Ipk/Io =  Ipk/Io = 5
4.0 2.0 Ipk/Io = 10
Ipk/Io = 5
3.0 1.5 Ipk/Io = 20
Ipk/Io = 10
2.0 1.0
Ipk/Io = 20
1.0 0.5
freq = 20 kHz
0 0
0 20 40 60 80 100 120 140 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0
TL, LEAD TEMPERATURE (°C) IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating Per Leg Figure 6. Forward Power Dissipation Per Leg

TJ , DERATED OPERATING TEMPERATURE ( ° C)


1000 125
TJ = 25°C RJA = 2.43°C/W
115
RJA = 25°C/W
C, CAPACITANCE (pF)

105
RJA = 48°C/W
100 95
RJA = 67.5°C/W
85

RJA = 84°C/W
75

10 65
0 5 10 15 20 25 0 5 10 15 20 25 30 35

VR, REVERSE VOLTAGE (VOLTS) VR, DC REVERSE VOLTAGE (VOLTS)

Figure 7. Capacitance Per Leg Figure 8. Typical Operating Temperature


Derating Per Leg *

* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.

[Link]
4
MBRD1035CTL

r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)


1.0
50%(DUTY CYCLE)

20%
10%

0.1 5.0%

2.0%
1.0%
SINGLE PULSE Rtjl(t) = Rtjl • r(t)

0.01
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000
t, TIME (s)
Figure 9. Thermal Response Junction to Case (Per Leg)
r (t) , TRANSIENT THERMAL RESISTANCE (NORMALIZED)

1.0E+00
50% (DUTY CYCLE)
20%
10%
1.0E−01
5.0%
2.0%

1.0E−02
1.0%

1.0E−03
SINGLE PULSE
Rtjl(t) = Rtjl • r(t)

1.0E−04
0.00001 0.0001 0.001 0.01 0.1 1.0 10 100 1000 10000
t, TIME (s)
Figure 10. Thermal Response Junction to Ambient (Per Leg)

[Link]
5
MBRD1035CTL

PACKAGE DIMENSIONS

DPAK
PLASTIC
CASE 369A−13
ISSUE AB NOTES:
−T− SEATING 1. DIMENSIONING AND TOLERANCING PER ANSI
PLANE Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
B C
INCHES MILLIMETERS
V R E DIM MIN MAX MIN MAX
A 0.235 0.250 5.97 6.35
B 0.250 0.265 6.35 6.73
4 C 0.086 0.094 2.19 2.38
Z D 0.027 0.035 0.69 0.88
A E 0.033 0.040 0.84 1.01
S F 0.037 0.047 0.94 1.19
1 2 3 G 0.180 BSC 4.58 BSC
U H 0.034 0.040 0.87 1.01
K J 0.018 0.023 0.46 0.58
K 0.102 0.114 2.60 2.89
L 0.090 BSC 2.29 BSC
F J R 0.175 0.215 4.45 5.46
L S 0.020 0.050 0.51 1.27
H U 0.020 −−− 0.51 −−−
V 0.030 0.050 0.77 1.27
D 2 PL Z 0.138 −−− 3.51 −−−
G 0.13 (0.005) M T STYLE 3:
PIN 1. ANODE
2. CATHODE
SOLDERING FOOTPRINT* 3. ANODE
4. CATHODE
6.20 3.0
0.244 0.118
2.58
0.101

5.80 1.6 6.172


0.228 0.063 0.243

SCALE 3:1 inches


mm 

Figure 11. DPAK


*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION


LITERATURE FULFILLMENT: N. American Technical Support: 800−282−9855 Toll Free ON Semiconductor Website: [Link]
Literature Distribution Center for ON Semiconductor USA/Canada
P.O. Box 5163, Denver, Colorado 80217 USA Order Literature: [Link]
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 For additional information, please contact your
Email: orderlit@[Link] Phone: 81−3−5773−3850 local Sales Representative.

[Link] MBRD1035CTL/D
6

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