Advanced Power

Electronics Corp. AP4435GH/J-HF-3

P-channel Enhancement-mode Power MOSFET

Simple Drive Requirement

D
Fast Switching Characteristics BV DSS -30V
Low On-Resistance RDS(ON) 20mΩ
G
RoHS-compliant, halogen-free ID -20A
S

Description
G
Advanced Power MOSFETs from APEC provide the designer with the best D
S TO-252 (H)
combination of fast switching, low on-resistance and cost-effectiveness.
The AP4435GH-HF-3 is in the TO-252 package which is widely preferred for
commercial and industrial surface mount applications such as medium-power
DC/DC converters. The through-hole TO-251 version (AP4435GJ-HF-3) is
available where a small PCB footprint is required.
G
D
S TO-251 (J)

Absolute Maximum Ratings

Symbol Parameter Rating Units
VDS Drain-Source Voltage -30 V
VGS Gate-Source Voltage ±20 V
3
ID at TC=25°C Continuous Drain Current -40 A
3
ID at TC=100°C Continuous Drain Current -25 A
1
IDM Pulsed Drain Current -150 A
PD at TC=25°C Total Power Dissipation 44.6 W
Linear Derating Factor 0.36 W/°C
TSTG Storage Temperature Range -55 to 150 °C
TJ Operating Junction Temperature Range -55 to 150 °C

Thermal Data
Symbol Parameter Value Unit
Rthj-c Maximum Thermal Resistance, Junction-case 2.8 °C/W
Rthj-a Maximum Thermal Resistance, Junction-ambient(PCB mount)3 62.5 °C/W
Rthj-a Maximum Thermal Resistance, Junction-ambient 110 °C/W

Ordering Information
AP4435GH-HF-3TR RoHS-compliant halogen-free TO-252 shipped on tape and reel (3000 pcs/reel)

AP4435GJ-HF-3TB RoHS-compliant halogen-free TO-251 shipped in tubes (80pcs/tube)

©2010 Advanced Power Electronics Corp. USA 200907154-3 1/6

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 Advanced Power
Electronics Corp. AP4435GH/J-HF-3
Electrical Specifications at Tj=25°C (unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=-250uA -30 - - V
∆ BV DSS/∆Tj Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=-1mA - -0.02 - V/°C
RDS(ON) Static Drain-Source On-Resistance2 VGS=-10V, ID=-26A - - 20 mΩ
VGS=-4.5V, ID=-16A - - 36 mΩ
VGS(th) Gate Threshold Voltage VDS=VGS, ID=-250uA -1 - -3 V
gfs Forward Transconductance VDS=-10V, ID=-26A - 31 - S
IDSS Drain-Source Leakage Current VDS=-30V, VGS=0V - - -1 uA
o
Drain-Source Leakage Current (T j=125 C) VDS=-24V, VGS=0V - - -250 uA
IGSS Gate-Source Leakage VGS=±20V, VDS=0V - - ±100 nA
2
Qg Total Gate Charge ID=-26A - 16.5 32 nC
Qgs Gate-Source Charge VDS=-25V - 2.7 - nC
Qgd Gate-Drain ("Miller") Charge VGS=-4.5V - 11 - nC
2
td(on) Turn-on Delay Time VDS=-15V - 7.5 - ns
tr Rise Time ID=-26A - 64 - ns
td(off) Turn-off Delay Time RG=3.3Ω , VGS=-10V - 24 - ns
tf Fall Time RD=0.58Ω - 92 - ns
Ciss Input Capacitance VGS=0V - 1160 1970 pF
Coss Output Capacitance VDS=-25V - 195 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 175 - pF
Rg Gate Resistance f=1.0MHz - 5 17 Ω

Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
2
VSD Forward On Voltage IS=-26A, VGS=0V - - -1.3 V
2
trr Reverse Recovery Time IS=-10A, VGS=0V, - 25 - ns
Qrr Reverse Recovery Charge dI/dt=100A/µs - 15 - nC
Notes:
[Link] width limited by maximum junction temperature.
[Link] test - pulse width < 300µs , duty cycle < 2%
2
[Link] mounted on 1 in copper pad of FR4 board,

THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION.

USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED.
APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED
HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN.

©2010 Advanced Power Electronics Corp. USA 2/6

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 Advanced Power
Electronics Corp. AP4435GH/J-HF-3
Typical Electrical Characteristics
100 80

T C = 25 o C -10V o
T C = 150 C -10V
-7.0V -7.0V
80 -6.0V -6.0V

-ID , Drain Current (A)

-ID , Drain Current (A)

60
-5.0V -5.0V
V G = - 4 .0 V V G = - 4 .0 V
60

40

40

20

20

0 0
0 1 2 3 4 5 6 0 2 4 6 8

-V DS , Drain-to-Source Voltage (V) -V DS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

30 1.8

I D = - 16 A
I D = - 26 A
T C =25°C
V G =-10V
26
Normalized RDS(ON)

1.4
RDS(ON) (mΩ )

22

1.0

18

14 0.6
2 4 6 8 10 -50 0 50 100 150

-V GS , Gate-to-Source Voltage (V) o

T j , Junction Temperature ( C)

Fig 3. On-Resistance vs. Gate Voltage Fig 4. Normalized On-Resistance

vs. Junction Temperature
26.0 2.0

19.5 1.5
Normalized -VGS(th) (V)
-IS(A)

13.0 1.0

T j =150 o C T j =25 o C

6.5 0.5

0.0 0.0
0 0.2 0.4 0.6 0.8 1 1.2 1.4 -50 0 50 100 150

-V SD , Source-to-Drain Voltage (V) T j , Junction Temperature ( o C)

Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage vs.

Reverse Diode Junction Temperature

©2010 Advanced Power Electronics Corp. USA 3/6

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 Advanced Power
Electronics Corp. AP4435GH/J-HF-3
Typical Electrical Characteristics (cont.)
f=1.0MHz
10 2000

I D = -26 A
V DS = -25 V
-VGS , Gate to Source Voltage (V)

8 1600

6 1200
C iss

C (pF)
4 800

2 400

C oss
C rss
0 0
0 10 20 30 40 1 5 9 13 17 21 25 29

Q G , Total Gate Charge (nC) -V DS , Drain-to-Source Voltage (V)

Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics

1000 1
Normalized Thermal Response (Rthjc)

Duty factor=0.5

0.2
100
-ID (A)

0.1
100us 0.1

0.05

PDM
10 t
0.02
T
1ms 0.01

T c =25 o C 10ms Duty factor = t/T

Peak Tj = PDM x Rthjc + T C

Single Pulse 100ms Single Pulse

DC
1 0.01
0.1 1 10 100 0.00001 0.0001 0.001 0.01 0.1 1

-V DS , Drain-to-Source Voltage (V) t , Pulse Width (s)

Fig 9. Maximum Safe Operating Area Fig 10. Effective Transient Thermal Impedance

VDS VG
90%
QG
-4.5V

QGS QGD

10%
VGS

td(on) tr td(off)tf Charge Q

Fig 11. Switching Time Waveforms Fig 12. Gate Charge Waveform

©2010 Advanced Power Electronics Corp. USA 4/6

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 Advanced Power
Electronics Corp. AP4435GH/J-HF-3
Package Dimensions: TO-252

D Millimeters
SYMBOLS
MIN NOM MAX
D1 A2 1.80 2.30 2.80
A3 0.40 0.50 0.60
B1 0.40 0.70 1.00
E2 D 6.00 6.50 7.00
D1 4.80 5.35 5.90
E3 3.50 4.00 4.50
E3 F 2.20 2.63 3.05
E1 F1 0.50 0.85 1.20
E1 5.10 5.70 6.30
E2 0.50 1.10 1.80
e -- 2.30 --
C 0.35 0.50 0.65

B1 F1 F

e e 1. All dimensions are in millimeters.

2. Dimensions do not include mold protrusions.

A2 R : 0.127~0.381

A3 (0.1mm C

Marking Information: TO-252

Laser Marking
Product: AP9435

Package code
GH = RoHS-compliant halogen-free TO-252
9435GH

YWWSSS Date/lot code (YWWSSS)

Y: Last digit of the year
WW: Work week
SSS: Lot code sequence

©2010 Advanced Power Electronics Corp. USA 5/6

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 Advanced Power
Electronics Corp. AP4435GH/J-HF-3
Package Dimensions: TO-251

D Millimeters
A SYMBOLS
c1 MIN NOM MAX
D1 A 2.20 2.30 2.40
E2 A1 0.90 1.20 1.50
B1 0.40 0.60 0.80
B2 0.60 0.85 1.05
E1 E
c 0.40 0.50 0.60
c1 0.40 0.50 0.60
D 6.40 6.60 6.80
D1 4.80 5.20 5.50
A1
E 6.70 7.00 7.30
B2
E1 5.40 5.60 5.80
F E2 1.30 1.50 1.70
B1
e ---- 2.30 ----
F 7.00 8.30 9.60

c 1. All dimensions are in millimeters.

2. Dimensions do not include mold protrusions.
e e

Marking Information: TO-251

Product: AP9435
Package Code
9435GJ
GJ = RoHS-compliant halogen-free TO-251
YWWSSS Date Code (YWWSSS)
Y : Last digit of the year
WW : Work week
SSS : Lot code sequence

©2010 Advanced Power Electronics Corp. USA 6/6

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