Doc No: EIL/TS/TSG/013

Rev No : <00>
Date: 09-06-2018

PCB Fault
Analysis Guide
EXIDE INVERTERZ
MAGIC
(On Component Level)

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Doc No: EIL/TS/TSG/013
Rev No : <00>
Date: 09-06-2018
Problems & It’s Corrective Action

Sl. Corrective Acton at Component Level

Problem/ Condition
No. Responsible Components Location of PCB
All Protection Show/
1 NTC 10K [TNT10052] CN9
Over Temperature
BUZZER 5V DC PCB MOUNT
BUZ1
HDP1206X
RESISTOR CHIP 1.8K 1% 0805 R59
2 Buzzer Not Beep TRANSISTOR CHIP BC847 SOT-23 Q16
CAP LEADED EL 47UF 25V 20% GR
C26
85ºC, 2
RESISTOR CHIP 470E 1% 0805 R4
RESISTOR LEADED 68K 1/4W 1%
R44, R45, R46, R48, R69
MFR
DIODE CHIP SM4007 MINIMELF D11, D12, D14, D15
NTC 10K [TNT10052] NTC1
TRIMPOT 10K HORIZONTAL (3386) R51
IC LEADED 4N35N11 U5
RESISTOR CHIP 22K 1% 0805 R43
3 Mains Not Sense CAP MLC 4700PF 50V 10% 2.54MM C28
RESISTOR CHIP 1K 1% 0805 R49
DIODE CHIP LL4148 SOD-80C
D17
PACKAGE
RESISTOR CHIP 10K 1% 0805 R47, R64
CAP CHIP 0.1UF 50V 10% 0805 X7R C14
IC LEADED PC81700CE / HCPL-817-
U3
00CE
RESISTOR CHIP 120K 1% 0805 R70
RESISTOR CHIP 1.8K 1% 0805 R60
4 Fan Not Run TRANSISTOR NPN (TCD8050D) Q15
DIODE CHIP SM4007 MINIMELF D16
TRANSZORB 1N6282A (+1.5KE30A) R10
DIODE CHIP SM4007 MINIMELF D2, D7
5 Humming
RESISTOR CHIP 8.2K 1% 0805 R12, R24
MOSFET STP80NF55-08 TO-220 Q1, Q3, Q7, Q9
6 MOSFET Burnt MOSFET STP80NF55-08 TO-220 Q1, Q3, Q7, Q9
MOSFET STP80NF55-08 TO-220 Q1, Q3, Q7, Q9
TRANSZORB 1N6282A (+1.5KE30A) R10
DIODE CHIP SM4007 MINIMELF D2, D7
7 NLC High DIODE AXIAL LEADED UF5408 D3, D5
RESISTOR CHIP 1K 1% 0805 R5
RESISTOR CHIP 180K 1% 0805 R26
RESISTOR LEADED 22E 1/4W 1% R3

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Doc No: EIL/TS/TSG/013
Rev No : <00>
Date: 09-06-2018
CAP LEADED EL 4700UF 35V C5
8 Not ON
IC CHIP STM8S903K3T6 (SQ 900) IC4
RESISTOR CHIP 1.8K 1% 0805 R41, R65
IC CHIP STM8S903K3T6 (SQ 900) IC4
9 Output Not Show RELAY 7AMP 12VDC PCB MOUNTED RL1, RL2
DIODE CHIP SM4007 MINIMELF D9, D10
TRANSISTOR CHIP BC847 SOT-23 Q14, Q17
RESISTOR CHIP 220E 1% 0805 R29
RESISTOR CHIP 3.3K 1% 0805 R25
RESISTOR CHIP 47K 1%/0805 R20
IC CHIP LM358ADR (TI)/LM358ADT
10 Overload Trip IC1
(ST) SO
CAP CHIP 0.22UF 50V 10% 0805 X7R C8
CAP CHIP 0.1UF 50V 10% 0805 X7R C9
IC CHIP STM8S903K3T6 (SQ 900) IC4
MOSFET STP80NF55-08 TO-220 Q1, Q3, Q7, Q9
DIODE AXIAL LEADED 1N4148 D4, D8
TRANSISTOR CHIP BC847 SOT-23 Q16, Q19
CHIP CAP 47NF/0.047UF 50V 0805
C3
11 Short Circuit X7R
TRANSISTOR LEADED BC547 TO-92
Q6, Q12
TRIANGUL
RESISTOR CHIP 4.7K 1% 0805 R50
RESISTOR LEADED 22E 1/4W 1%
R17
MFR

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Doc No: EIL/TS/TSG/013
Rev No : <00>
Date: 09-06-2018
Component Layout of MAGIC 800/875/1125VA Power Card

Precautions:
1) Temperature Controlled Iron should be used.
2) Power Card should be holding with Single Heat Sink.

3) Antistatic Tweezer should be used for replacement of SMD components

4) Leakage Current should be Zero at repairing stage.

5) Contact of Soldering bit should not be for longer duration with Component during repairing.

6) Desoldering Pump should be for hole opening of PCB.

7) Good quality solder must be used for repairing purpose.

8) A card after repairing should be thoroughly cleaned by antistatic brush and thinner.

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