The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.

Key Responsibilities

Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.
GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.
Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.
Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.
Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.
FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.
Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.
Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.

Required Technical Skills

UG NX (Expert Level)
GD&T (ASME Y14.5)
Sheet Metal Design and Drafting
Tolerance Stack-up (Worst Case & Statistical)
Semiconductor Fabrication Process Knowledge
Material Selection for Vacuum & Cleanroom Applications
Structural & Thermal FEA (ANSYS/Abaqus)
SOM Documentation Knowledge
DFM/DFA Application
PLM Tools (Teamcenter/Windchill)

Professional Skills

Strong communication and presentation abilities.
Ability to lead technical discussions and decisions.
Analytical problem-solving and root-cause analysis capability.
Mentorship experience with junior engineers.

Education

Bachelor’s or master’s degree in mechanical engineering or related field.

Experience Range

6–12 years of hands-on experience in mechanical design engineering, preferably in semiconductor equipment, high-tech capital machinery, robotics, or precision systems.

Qualifications

Bachelor’s or master’s degree in mechanical engineering or related field.

Highlights

Key role in semiconductor equipment design
Expertise in UG NX and GD&T
6-12 years of relevant experience required
Collaboration with cross-functional teams
Bachelor’s or master’s degree in mechanical engineering