Walk-in Drive | Bangalore ITPL | 18th April - Mechanical Design Engineer - Semiconductor Domain

Position Summary

The Mechanical Engineer – Core Design plays a key role in the design and development of semiconductor equipment, mechanical modules, sheet-metal structures, precision assemblies, and complex subsystems. The role requires strong expertise in UG NX, GD&T, Sheet Metal, Tolerance Stack-up, Semiconductor Fabrication Processes, Material Selection, SOM, and FEA (Structural & Thermal). This engineer will lead concept creation, detailed design, validation, and cross-functional collaboration to deliver high-quality mechanical solutions.

Key Responsibilities

• Core Mechanical Design: Create detailed 3D models and assemblies using UG NX, develop innovative concepts, apply DFM/DFA principles, and conduct trade-off analysis.
• GD&T & Tolerance Engineering: Apply ASME Y14.5 standards, conduct 2D/3D tolerance stack-ups, and validate critical tolerances.
• Sheet Metal & Machined Component Design: Design enclosures, brackets, frames, and apply sheet-metal design rules including bend allowances and manufacturability.
• Semiconductor Fabrication Process Knowledge: Understand vacuum design, plasma interaction, thermal loads, contamination control, and process module interfaces.
• Material Selection & SOM: Select materials based on mechanical, thermal, chemical, and vacuum criteria; develop SOM documentation and risk analysis.
• FEA – Structural & Thermal: Perform structural/thermal analysis, evaluate static/dynamic loads, perform modal studies, and validate heat dissipation.
• Cross-Functional Collaboration: Work with electrical, systems, manufacturing, supply chain, and reliability teams; drive design reviews.
• Testing, Validation & Release: Support prototype builds, perform functional testing, implement ECOs, and release designs through PLM tools.

Required Technical Skills

• UG NX (Expert Level)
• GD&T (ASME Y14.5)
• Sheet Metal Design and Drafting
• Tolerance Stack-up (Worst Case & Statistical)
• Semiconductor Fabrication Process Knowledge
• Material Selection for Vacuum & Cleanroom Applications
• Structural & Thermal FEA (ANSYS/Abaqus)
• SOM Documentation Knowledge
• DFM/DFA Application
• PLM Tools (Teamcenter/Windchill)

Professional Skills

• Strong communication and presentation abilities.
• Ability to lead technical discussions and decisions.
• Analytical problem-solving and root-cause analysis capability.
• Mentorship experience with junior engineers.

Education

Bachelor’s or master’s degree in mechanical engineering or related field.

Experience Range

6–12 years of hands-on experience in mechanical design engineering, preferably in semiconductor equipment, high-tech capital machinery, robotics, or precision systems.